This is information on a product in full production.
January 2014 DocID13566 Rev 3 1/11
T1635H, T1650H
High temperature 16 A Snubberless™ Triacs
Datasheet - production data
Features
Medium current Triac
150 °C max. Tj turn-off commutation
Low thermal resistance with clip bonding
Very high 3 quadrants commutation capability
Packages are RoHS (2002/95/EC) compliant
UL certified (ref. file E81734)
Applications
Especially designed to operate in high power
density or universal motor applications such as
vacuum cleaner and washing machine drum
motor, these 16 A Triacs provide a very high
switching capability up to junction temperatures of
150 °C.
The heatsink can be reduced, compared to
traditional Triacs, according to the high
performance at given junction temperatures.
Description
Available in through-hole or surface mount
packages, the T1635H and T1650H Triac series
are suitable for general purpose mains power ac
switching.
By using an internal ceramic pad, the T16xxH-6I
provides voltage insulation (rated at 2500 V rms).
TM: Snubberless is a trademark of STMicroelectronics
A2
A2
A2
A1
A1
G
G
A2
A2
A2
A1
A1
G
G
D²PAK
T16xxH-6G
TO-220AB insulated
T16xxH-6I
TO-220AB
T16xxH-6T
Table 1. Device summary
Symbol Value Unit
IT(RMS) 16 A
VDRM/VRRM 600 V
IGT 35 or 50 mA
www.st.com
Characteristics T1635H, T1650H
2/11 DocID13566 Rev 3
1 Characteristics
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
IT(RMS) On-state rms current (full sine wave) D2PAK, TO-220AB Tc = 130 °C 16 A
TO-220AB Ins Tc = 113 °C
ITSM Non repetitive surge peak on-state
current (full cycle, Tj initial = 25 °C)
F = 50 Hz t = 20 ms 160 A
F = 60 Hz t = 16.7 ms 168
I²tI
²t Value for fusing tp = 10 ms 169 A²s
dI/dt Critical rate of rise of on-state current
IG = 2 x IGT, tr 100 ns F = 120 Hz Tj = 150 °C 50 A/µs
VDSM/VRSM Non repetitive surge peak off-state
voltage tp = 10 ms Tj = 25 °C VDRM/VRRM
+ 100 V
IGM Peak gate current tp = 20 µs Tj = 150 °C 4 A
PG(AV) Average gate power dissipation Tj = 150 °C 1 W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 150 °C
Table 3. Electrical characteristics (Tj = 25 °C, unless otherwise specified)
Symbol Test conditions Quadrant Value Unit
T1635H T1650H
IGT (1)
VD = 12 V, RL = 33 ΩI - II - III MAX. 35 50 mA
VGT I - II - III MAX. 1.0 V
VGD VD = VDRM, RL = 3.3 k I - II - III MIN. 0.15 V
IH (2) IT = 500 mA MAX. 35 75 mA
ILIG = 1.2 IGT
I - III MAX. 50 90 mA
II 80 110
dV/dt (2) VD = 67% VDRM, gate open, Tj = 150 °C MIN. 1000 1500 V/µs
(dI/dt)c (2) Without snubber, Tj = 150 °C MIN. 21 28 A/ms
1. minimum IGT is guaranteed at 20% of IGT max.
2. for both polarities of A2 referenced to A1.
DocID13566 Rev 3 3/11
T1635H, T1650H Characteristics
11
Table 4. Static characteristics
Symbol Test conditions Value Unit
VT (1) ITM = 23 A, tp = 380 µs Tj = 25 °C MAX. 1.5 V
Vt0 (1) Threshold voltage Tj = 150 °C MAX. 0.80 V
Rd (1) Dynamic resistance Tj = 150 °C MAX. 23 m
IDRM
IRRM(2)
VDRM = VRRM
Tj = 25 °C MAX. 5 µA
Tj = 150 °C MAX. 4.1
mAVD/VR = 400 V (at peak mains voltage) Tj = 150 °C MAX. 3.5
VD/VR = 200 V (at peak mains voltage) Tj = 150 °C MAX. 3.0
1. for both polarities of A2 referenced to A1
2. tp = 380 µs.
Table 5. Thermal resistance
Symbol Parameter Value Unit
Rth(j-c) Junction to case (AC) D2PAK / TO-220AB 1.15
°C/W
TO-220AB Ins 2.1
Rth(j-a) Junction to ambient S = 1 cm2D2PAK 45
TO-220AB / TO-220AB Ins 60
UH n ‘ 2 3 : s a 1 a a mu 1213141516 0 15 5n 75 um «25 150 u :5 an 75 mo 125 19a «as-n: mE-nz mm mama mm mm: mm: mun
Characteristics T1635H, T1650H
4/11 DocID13566 Rev 3
Figure 1. Maximum power dissipation versus
on-state rms current (full cycle) Figure 2. On-state rms current versus case
temperature (full cycle)
0
2
4
6
8
10
12
14
16
18
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
P(W)
=180 °
180°
I
T(RMS)
(A)
I
T(RMS)
(A)
0
2
4
6
8
10
12
14
16
18
0 25 50 75 100 125 150
D²PAK
TO-220AB
TO220AB ins
T
C
(°C)
Figure 3. On-state rms current versus ambient
temperature Figure 4. Relative variation of thermal
impedance versus pulse duration
I
T(RMS)
(A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0 25 50 75 100 125 150
TO220AB ins
TO-220AB
Epoxy printed circuit board FR4,
copper thickness = 35 µm
T
amb
(°C)
= 180
°
D²PAK
S
CU
=1 cm²
1.0E-02
1.0E-01
1.0E+00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
K=[Z
th
/R
th
]
Z
th(j-a)
Z
th(j-c)
tP(s)
Figure 5. On-state characteristics
(maximum values) Figure 6. Surge peak on-state current versus
number of cycles
1
10
100
1000
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5
I
TM
(A)
T
j
=25 °C
T
j
=150 °C
T
j
max. :
V
t0
= 0.80 V
R
d
= 23 m
Ω
V
TM
(V)
0
20
40
60
80
100
120
140
160
180
1 10 100 1000
I
TSM
(A)
Non repetitive
Tjinitial=25 °C
Repetitive
Tc=110 °C
One cycle
t=20ms
Number of cycles
om mm 1.00 mm a n.‘ 1.0 mu mm)
DocID13566 Rev 3 5/11
T1635H, T1650H Characteristics
11
Figure 7. Non-repetitive surge peak on-state
current for a sinusoidal pulse Figure 8. Relative variation of IGT,IH, IL vs
junction temperature(typical values)
100
1000
10000
0.01 0.10 1.00 10.00
I
TSM
(A), I²t (A²s)
Tj initial=25 °C
dI/dt limitation: 50 A/µs
I
TSM
I²t
t
P
(ms)
width t < 10 ms and corresponding value of I t
p
2
0.0
0.5
1.0
1.5
2.0
2.5
-40 -20 0 20 40 60 80 100 120 140 160
I
GT
,I
H
,I
L
[T
j
]/I
GT
,I
H
,I
L
[T
j
=25°C]
IGT
IH& IL
T
j
(°C)
Figure 9. Relative variation of critical rate of
decrease of main current (dI/dt)c versus
reapplied (dV/dt)c
Figure 10. Relative variation of critical rate of
decrease of main current versus junction
temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0.1 1.0 10.0 100.0
(dI/dt)
c
[(dV/dt)
c
] / Specified (dI/dt)
c
(dV/dt)
C
(V/µs)
typical values
Figure 11. Leakage current versus junction
temperature for different values of blocking
voltage (typical values)
Figure 12. Variation of thermal resistance
junction to ambient versus copper surface
under tab
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
50 75 100 125 150
I
DRM
/I
RRM
(µA)
VDRM=VRRM=400 VVDRM=VRRM=400 V
VDRM=VRRM=600 VVDRM=VRRM=600 V
VDRM=VRRM=200 VVDRM=VRRM=200 V
T
j
(°C)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
D²PAK
S
CU
(cm²)
Epoxy printed circuit board FR4,
copper thickness = 35 µm
Package information T1635H, T1650H
6/11 DocID13566 Rev 3
2 Package information
Epoxy meets UL94, V0
Lead-free package
Recommended torque: 0.4 to 0.6 N·m
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 13. TO-220AB dimension definitions
C
b2
c2
F
Ø I
L
A
a1
a2
B
e
b1
I4
l3
l2
c1
M
DocID13566 Rev 3 7/11
T1635H, T1650H Package information
11
Table 6. TO-220AB dimension values
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 15.20 15.90 0.598 0.625
a1 3.75 0.147
a2 13.00 14.00 0.511 0.551
B 10.00 10.40 0.393 0.409
b1 0.61 0.88 0.024 0.034
b2 1.23 1.32 0.048 0.051
C 4.40 4.60 0.173 0.181
c1 0.49 0.70 0.019 0.027
c2 2.40 2.72 0.094 0.107
e 2.40 2.70 0.094 0.106
F 6.20 6.60 0.244 0.259
ØI 3.75 3.85 0.147 0.151
I4 15.80 16.40 16.80 0.622 0.646 0.661
L 2.65 2.95 0.104 0.116
l2 1.14 1.70 0.044 0.066
l3 1.14 1.70 0.044 0.066
M 2.60 0.102
Package information T1635H, T1650H
8/11 DocID13566 Rev 3
Figure 14. PAK dimension definitions
G
L
L3
L2
B
B2
E
2mm min.
FLAT ZONE
A
C2
D
R
A2
V2
C
A1
DocID13566 Rev 3 9/11
T1635H, T1650H Package information
11
Figure 15. PAK footprint
Table 7. D²PAK dimension values
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 4.30 4.60 0.169 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.70 0.93 0.027 0.037
B2 1.25 1.40 0.048 0.055
C 0.45 0.60 0.017 0.024
C2 1.21 1.36 0.047 0.054
D 8.95 9.35 0.352 0.368
E 10.00 10.28 0.393 0.405
G 4.88 5.28 0.192 0.208
L 15.00 15.85 0.590 0.624
L2 1.27 1.40 0.050 0.055
L3 1.40 1.75 0.055 0.069
R 0.40 0.016
V2 0°
16.90
12.2
9.75 3.50
5.08
1.60
2.54
Triac series Package
Ordering information T1635H, T1650H
10/11 DocID13566 Rev 3
3 Ordering information
Figure 16. Ordering information scheme
4 Revision history
Table 8. Ordering information
Order code Marking Package Weight Base qty Delivery mode
T16xxH-6G T16xxH 6G D2PAK 1.5 g 50 Tube
T16xxH-6G-TR T16xxH 6G D2PAK 1.5 g 1000 Tape and reel
T16xxH-6T T16xxH 6T TO-220AB 2.3 g 50 Tube
T16xxH-6I T16xxH 6I TO-220AB Ins 2.3 g 50 Tube
T 16 xx H - 6 y -TR
Triac series
Current
Sensitivity
Package
16 = 16 A
35 = 35 mA
50 = 50 mA
G = D2PA K
High temperature
Voltage
Packing
6 = 600 V
T = TO-220AB
I = TO-220AB Ins
Blank = Tube (D2PAK, TO-220AB)
-TR = Tape and reel (D2PAK)
Table 9. Document revision history
Date Revision Changes
29-May-2007 1 First issue.
20-Sep-2011 2 Updated: Features, Description and Figure 2.
31-Jan-2014 3 Updated Figure 2, Figure 3, Figure 4, Table 2 and
Table 5.
DocID13566 Rev 3 11/11
T1635H, T1650H
11
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS
OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT
PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY
DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2014 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com