molex i’i 1.25 mmE‘yi‘ SMTEIEW 3*79 1.25mm PITCH WIRE TO BOARD SMT CONNECTOR ESUZUKI K.TOJO MSASAO
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TITLE:
PanelMate 1.25MM PITCH WIRE TO BOARD
SMT CONN.
製品仕様書
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変更
REVISED
118534
17/06/23 S.NAKAMURA
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
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REV.
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DESIGN CONTROL
J
STATUS
WRITTEN
BY:
E.SUZUKI
CHECKED
BY:
K.TOJO
APPROVED
BY:
M.SASAO
DATE: YR/MO/DAY
2004/04/15
DOCUMENT NUMBER
PS-51146-010
FILE NAME
PS-51146-010.docx
SHEET
1 OF 17
EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
211. 適用範囲 SCOPE
本仕様書は、 殿 に納入する
1.25 mmッチ SMT基板 コネク について規定する。
This specification covers the 1.25mm PITCH WIRE TO BOARD SMT CONNECTOR series
2. 製品名称及び型番 PRODUCT NAME AND PART NUMBER
Product Name
Part Number
リセ ターミナル
Receptacle Terminal (AWG #28-30)
50641-8***
リセ ターミナル
Receptacle Terminal (AWG #30-32)
50753-8***
リセ ハウジング
Receptacle Housing
51146-**00
プラグ アセンブリ
Plug Assembly (H=1.85)
53780-**19
プラグ アセンブリ エンボス梱包品
Embossed tape packaging of
Plug Assembly (H=1.85)
53780-**70
*:図面参照 Refer to the drawing.
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
3. 定格及び適用電線 RATINGS AND APPLICABLE WIRES
Item
Standard
最大許容電圧
Allowable Voltage (MAX.)
125 V
[ AC (実効値 rms) / DC ]
最大許容電流 及び 用電線
Allowable Current ( MAX. )
And Applicable wires
AWG#28
1.0A
被覆外径:φ0.9mm MAX.
Insulation O.D. (MAX.)
AWG#30
1.0A
AWG#32
1.0A
被覆外径:φ0.55mm MAX.
Insulation O.D. (MAX.)
使用温度範囲*1*2*3
Ambient Temperature Range
-40°C ~ + 105°C
低温において氷結しないこと Not freeze in low temperature
保管条件
Storage Condition
温度
Temperature
-10°C ~ + 50°C
湿度
Humidity
85%R.H.以下(但し結露しないこと
85%R.H. MAX. (No condensation)
期間
Terms
出荷後6ヶ月(未開封の場合)
For 6 months after shipping (Unopened package)
*1 : 板実装後の無通電状態は、使用温度範囲が適用されます。
Non-operating connectors after reflow must follow the operating temperature range condition.
*2 : 電による温度上昇分を含む。
This includes the terminal temperature rise generated by conducting electricity.
*3 : 合電線も本使用温度範囲を満足すること。
Applicable wires must also meet the specified temperature range.
molex 4,1_ Efi B‘N‘ifi: Electrical performance
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4. 性能 PERFORMANCE
4-1. 的性能 Electrical performance
Item
Test Condition
Requirement
4-1-1
Contact
Resistance
コネクタを嵌合させ、開放電圧 20mV以下、短絡電流
10mA以下 て測定する。(JIS C5402-2-1)
Mate connectors and measured by dry circuit, 20mV
MAX., 10mA MAX.
(JIS C5402-2-1)
20 milliohms MAX.
4-1-2
Insulation
Resistance
コネクタを嵌合させ、隣接するターミナル間及び
タ-ミナル、アース間に、DC 500V印加し測定する
(JIS C5402-3-1/MIL-STD-202 験法 302)
Mate connectors and apply 500V DC between adjacent
terminal or ground.
(JIS C5402-3-1/MIL-STD-202 Method 302)
100 Megohms MIN.
4-1-3
Dielectric
Strength
コネクタを嵌合させ、隣接するタ-ミナル間及び
タ-ミナル、アース間に、AC 250V (実効値)
1分間 印加する。
(JIS C5402-4-1/MIL-STD-202 験法 301)
Mate connectors and apply 250V AC(rms) for 1 minute
between adjacent terminal or ground.
(JIS C5402-4-1/MIL-STD-202 Method 301)
製品機能を損な
異常なきこと
No Damage
on function
4-1-4
圧着部接触抵抗
Contact
Resistance
on Crimped
Portion
ターミナルに適合電線を圧着し、開放電圧20mV以下、
短絡電流 10mA以下 にて測定する。
Crimp the applicable wire to the terminal, measured by
dry circuit, 20mV MAX., 10mA MAX.
5 milliohms MAX.
molex W
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4-2. 械的性能 Mechanical Performance
Item
Test Condition
Requirement
4-2-1
挿入力及び抜去
Insertion and
Withdrawal Force
毎分25±3mmの速さで挿入、抜去を行う
Insert and withdraw connectors at the speed
rate of 25±3mm/minute.
挿入力
Insertion
Force
2.1N{0.22kgf}
/CKT.MAX.
抜去力
Withdrawal
Force
0.2N{0.02kgf}
/CKT.MIN.
4-2-2
圧着部引張強度
Crimping
Pull out Force
圧着されたターミナルを治具に
固定し、電線を軸方向に
毎分25±3mmの速さで引張る。
(JIS C5402-16-4)
Fix the crimped terminal to the jig, apply
axial pull out force on the wire at the speed
rate of 25±3 mm/minute.
(JIS C5402-16-4)
AWG.#28
9.8 N { 1.0 kgf } MIN.
AWG.#30
4.9 N { 0.5 kgf } MIN.
AWG.#32
2.9 N { 0.3 kgf } MIN.
4-2-3
圧着端子挿入力
Crimp Terminal
Insertion Force
圧着されたターミナルをハウジングに挿入する。
Insert the crimped terminal into the housing.
4.9 N { 0.5 kgf } MAX.
4-2-4
圧着端子保持力
Crimp Terminal
Retention Force
ハウジングに装着した圧着されたターミナルを
毎分 25±3mm の速さで引張る。
Apply axial pull out force at the
speed rate of 25±3 mm/minute on the crimped terminal
assembled in the housing.
4.9 N { 0.5 kgf } MIN.
4-2-5
HDR端子保持力
Header Terminal
Retention Force
ハウジングに装着されたターミナル
毎分 25±3mm の速さで軸方向に引張る。
Apply axial pull out force at the speed rate of
25±3mm/minute on the terminal assembled
in the housing.
2.0 N { 0.2 kgf } MIN.
molex 473. (7) Environmental Performance and Others
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
4-3. の他 Environmental Performance and Others
Item
Test Condition
Requirement
4-3-1
繰り返し挿抜
Repeated
Insertion /
Withdrawal
1分間 10回以下の速さで挿入、抜去を
30回繰返す。
Insert and withdraw connectors 30 cycles
repeatedly by rate of less than 10 cycles per
minute.
Contact
Resistance
40 milliohms MAX.
4-3-2
Temperature Rise
コネクタを嵌合させ、全ての圧着端子を直列
に接続し最大許容電流で熱平衡に達した時の
温度上昇を測定する。 (UL498)
Mate connectors and all crimp terminals shall
be connected in a direct series.
The temperature rise shall be measured
when the terminal reaches terminal
equilibrium allowable current.
(UL498)
Temperature
Rise
30 °C MAX.
4-3-3
Vibration
コネクタを嵌合させ、DC 1mA 通電状態に
て、嵌合軸を含む互いに垂直な 3方向
引割合 105510 Hz/、全振幅 1.5mm
の振動を各2時間 加える。(ケーブルは固定
すること)
(JIS C 60068-2-6/MIL-STD-202 試験法
201)
Mate connectors and subject to the following
vibration conditions, for a period of 2 hours in
each of 3 mutually perpendicular axes,
passing DC 1mA during the test.
(Fix the cable at test.)
Amplitude : 1.5mm P-P
Frequency : 10~55~10 Hz in 1 minute.
Duration : 2 hours in each X.Y.Z.axes.
(JIS C 60068-2-6/MIL-STD-202 Method 201)
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
Discontinuity
1.0 micro second
MAX.
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-4
Mechanical Shock
コネクタを嵌合させ、DC 1mA 通電状態に
て、テストパルス半周期、嵌合軸を含む互
いに垂直な 6方向 490m/s { 50G }、作
用時間11msの衝撃を各3回、合計18回加え
る。
(JIS C60068-2-27/MIL-STD-202 試験法
213)
Mate connectors and subject to the
following shock conditions. 3 shocks shall
be applied along 3 mutually perpendicular
axes, passing DC 1 mA current during the
test.
(Total of 18 shocks)
Test pulse : Half Sine
Peak value : 490 m/s2 (50 G)
Duration : 11 ms
(JIS C60068-2-27/MIL-STD-202
Method 213)
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
Discontinuity
1.0 micro second
MAX.
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-5
Heat Resistance
コネクタを嵌合させ、105±2°C 雰囲気中に
1000時間放置後取り出し、12時間室温に
放置する。
(JIS C60068-2-2/MIL-STD-202 試験法 108)
Mate connectors and expose to 105±2 for
1000 hours. Upon completion of the exposure
period, the test specimens shall be
conditioned at ambient room conditions for
1 to 2 hours , after which the specified
measurements shall be performed.
(JIS C60068-2-2/MIL-STD-202 Method 108)
Appearance
製品機能を損なう
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX
4-3-6
Cold Resistance
コネクタを嵌合させ、40±3°C 雰囲気中に
96時間 放置後取り出し12時間 温に
放置する。(JIS C60068-2-1)
Mate connectors and expose to -40±3°C for
96 hours. Upon completion of the exposure
period, the test specimens shall be
conditioned at ambient room conditions for
1 to 2 hours, after which the specified
measurements shall be performed.
(JIS C60068-2-1)
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
4-3-7
湿
Humidity
コネクタを嵌合させ、60±2°C相対湿度
90~95 の雰囲気中に 96時間 放置後
取り出し、12時間 室温に放置する。
(JIS C60068-2-78/MIL-STD-202 試験法 103)
Mate connectors and expose to 60±2°C,
relative humidity 90 to 95% for 96 hours.
Upon completion of the exposure period,
the test specimens shall be conditioned
at ambient room conditions for 1 to 2 hours,
after which the specified measurements shall
be performed.
(JIS C60068-2-78/MIL-STD-202 Method 103)
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
Insulation
Resistance
10 Megohms MIN.
Dielectric
Strength
4-1-3項満足のこと
Must meet 4-1-3
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-8
温度サイクル
Temperature
Cycling
コネクタを嵌合させ、 55±3°C30分、
+105±2°C30分。これを1サイクルとし、
5サイクル繰返す。
但し、温度移行時間は 5分以内 とする。
試験後12時間 室温に放置する。
(JIS C60068-2-14)
Mate connectors and subject to the following
conditions for 5 cycles. Upon completion of the
exposure period, the test specimens shall be
conditioned at ambient room conditions for
1 to 2 hours, after which the specified
measurements shall be performed.
5 cycles of :
a) 55±3°C 30 minutes
b) +105±2°C 30 minutes
(JIS C60068-2-14)
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
4-3-9
Salt Spray
コネクタを嵌合させ、35±2°C にて 5±1%
重量比の塩水を 48±4時間噴霧し、試験後
常温で水洗いした後、室温で乾燥させる。
(JIS C60068-2-11/MIL-STD-202 試験法101)
Mate connectors and expose to the following
salt mist conditions. Upon completion of the
exposure period, salt deposits shall be removed
by a gentle wash or dip in running water, after
which the specified measurements shall be
performed.
NaCl solution
Concentration : 5±1 %
Spray time : 48±4 hours
Ambient temperature : 35±2 °C
(JIS 60068-2-11/MIL-STD-202 Method 101)
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-10
亜硫酸ガス
SO2 Gas
コネクタを嵌合させ、40±2°Cにて
50±5ppm亜硫酸ガス中に24時間放置
する。
Mated connectors and expose to the
conditions
of 50±5ppm SO2 gas ambient
temperature
40±2°C for 24 hours.
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
4-3-11
耐アンモニア性
NH3 Gas
コネクタを嵌合させ、濃度28%アンモ
ニア水を入れた容器中に40分間放置す
る。
1Lに対して25mLの割合)
Mated connectors and expose to the
conditions of NH3 gas evaporating from
28% NH3 solution for 40 minutes.
(Rate is 25ml per 1L)
Appearance
製品機能を損な
異常なきこと
No Damage
on function
Contact
Resistance
40 milliohms MAX.
molex Reflow by IR Reflow Machine Reflow by Manual So‘dering iron 571. fiflfi'ffiklfiflg Dimensions and materia‘s of product.
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-12
はんだ付け性
Solderability
ターミナルまたはピンをフラックスに浸
し、端子先端よ0.5mm迄、
245±5°Cはんだに3±0.5秒浸す。
Dip terminal or pin into flux, and immerse
the area up to 0.5mm from the tip of the
terminal into solder molten at 245±5°C
for 3±0.5 sec.
濡れ性
Solder
Wetting
ピンホールや
隙間なく浸漬面
95%以上
95% of immersed
area must show
no voids, pin
holes.
4-3-13
はんだ耐熱性
Resistance to
Soldering Heat
赤外線リフロー
(Reflow by IR Reflow Machine)
6項の奨温度プロファイル条件にてリ
フローを行う。
Using the reflow profile condition below
paragraph 6, the product was reflowed.
Appearance
端子ガタ、割れ
異常なきこと
No Damage
手はんだ時
(Reflow by Manual Soldering iron)
端子先端、金具先端より0.5mmの位置
まで、370~400°Cはんだゴテにて
最大5秒加熱する。但し、異常な加圧のな
いこと。
Using a soldering iron (370~400°C for 5
seconds MAX.) heat up the area 0.5mm
from the tip of the solder tails and fitting
nails. However, do not apply excessive
pressure to either the terminals or fitting
nails.
5. 外観形状、寸法及び材質 PRODUCT SHAPE, DIMENSIONS AND MATERIALS
5-1. 品寸法及び材質 Dimensions and materials of product.
図面参照 Refer to the drawing.
molex TEMPERATURE CONDITION GRAPH
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
6. リフロー条件 REFLOW CONDITION
温度条件グラフ
TEMPERATURE CONDITION GRAPH
(はんだ接合部の基板表面にて測定)
(Temperature is measured at the soldering area on the surface of PWB)
注記:本リフロー条件に関しては、リフロー装置及び基板などにより条件が異なりますの
事前に実装評価(リフロー評価) の御確認を御願い致します。
端子テール部、ネイル部が変色する場合が御座いますが、はんだ付け性には問題ありません。
NOTE : Please check the mount condition (reflow soldering condition) by your own devices
beforehand, because the condition changes by the soldering devices, printed wiring boards (PWB),
and so on. Although tail of terminal and nail may discolors, a solderability does not have a problem.
250+5/-0°C 以下(ピーク温度)
250+5/-0°C MAX (PEAK TEMP.)
20~40(230°C以上)
20~40sec. (230°C MIN.)
90~120
予熱:150~200°C
90~120sec.
リフロー回数1
Pre-heat150~200°C
MAX.
molex
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EN-037(2015-11 rev.1)
PRODUCT SPECIFICATION
7. 注記 NOTES.
1. 本製品のプラスチック部に黒点、気泡等が確認される場合や色合いが異なる場合(経年変化によるハウジング
の変色を含む)が御座いますが、製品性能に影響は御座いません。
There is no influence in the product performance though the black spot or bubble etc. might be confirmed to
the plastic part of this product and the shade might be different (discoloration by secular distortion etc.).
2. 本製品のハウジング及びメッキ表面に多少の傷が確認される場合がありますが、
製品性能に問題御座いません。
A few scratches may be confirmed to the surface of the housing and the plating of this product, however,
There is no problem in the product performance.
3. 本製品のプラスチック部が紫外線により変色する場合がありますが、製品性能には問題御座いません。
Discoloration of the plastic part of this product can result from exposure to ultraviolet light.
There is no problem in the product performance.
4. 推奨保管条件での保管をお願い致します。
Please store the products under recommended storage condition.
5. 本製品を結露・水濡れが発生する環境でのご使用の場合は、適切な防滴処置をお願い致します。
結露・水濡れにより、回路間で絶縁不良を起こす可能性が御座います
When this product is used at a place where exposure to water could be expected, please handle with
appropriate care to avoid damage from water.
There is a possibility of causing insulated malfunction between the circuits.
6. コネクタの性能を損なう恐れがある為、コネクタの洗浄は、行わないでください。
Please do not conduct any washing process on the connectors because it may damage
the product’s function.
7. 本製品をご使用時に取り付けられた電線・プリント基板の共振や、機器の回転構造や可動部分の動作
によりコネクタ嵌合部(接点部)が常に動いてしまう状態での御使用は避けてください。
接触部の摺動磨耗等による 接触不良の原因となります 従って、機器内で電線・プリント基板を固定し、
共振を抑える等の処置をお願い致します。
Please do not use the connectors in a condition where the wire, PWB, or the contact area is experiencing a
sympathetic vibration of wires and PWB, and constant movement of devices.
This may cause a defect in the contact due to the contact area being worn down. Therefore, please fix
wires and PWB on the chassis, and reduces sympathetic vibration.
8. コネクタ嵌合状態で基板の持ち運び等コネクタに負荷が掛かる作業は行わないようにしてください。
コネクタ破損等の原因となる場合が御座います。
Please do not do work that the load hangs in the connectors like the carrying of the substrate etc. with the
connectors engages. There is a case where it causes the connectors damage etc.
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PanelMate 1.25MM PITCH WIRE TO BOARD
SMT CONN.
製品仕様書
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PRODUCT SPECIFICATION
9. 嵌合後、コネクタピッチ方向、スパン方向及び回転方向への負荷がかかるような動作またはセットは
しないでください。コネクタ破壊やはんだクラックを引き起こします。
After mated the connectors, please do not allow the PWBs to apply pressure on the connectors in either the
pitch direction, the span direction or rotational direction. It may cause damage to the connectors and may crack
the soldering.
10. 本製品及び加工工程品(仕掛品)や加工品(ハーネス等)の梱包及び輸送・保管時にはコネクタに負荷が
加わらないようご注意ください。変形、破損などの原因となり、コネクタの性能不良の原因となります。
Please try to prevent any external forces or shock from being applied to the connectors while the cable
assembly is in process, when it is being packaged, or while it is in transportation. This may cause deformation
and damage to the connectors and cause a defect in the product’s performance.
11. 本製品をご使用時には、1PIN当りの定格以上の電流を複数の回路に分岐しての使用は避けてください。
When using this product, please ensure that the specification for rated current per circuit is followed. Do not
allow the sum of the current used on several circuits to exceed the maximum allowable current.
12. 活電状態の電気回路で、挿入、抜去ができることを前提に作られておりません。
スパーク等による危険の発生、性能不良につながりますので、活電状態での挿入、抜去はしないでください。
This product is not designed for the mating and unmating of the connectors to be performed under the condition
of an active electrical circuit. It may cause a spark and product defect if the connectors are mated and unmated
in this way.
13. コネクタに適用できる電線は、原則として錫メッキつき付軟銅撚り線です。
その他の電線の使用については別途ご確認ください。
The applicable wire for this connectors, in principle, is tin-plated copper stranded wire. Please consult us and
evaluate it in advance when using other wires.
14. コネクタに外力が加わらないようにクリアランスをあけた筐体構造にしてください。
Please keep enough clearance between connectors and chassis of your application in order not to apply
pressure on the connectors.
15. 具等を使用して圧着端子を抜いた場合には、ランスが変形し強度が低下し端子を再装着後の端子保持力が極
端に低下します。そのため、圧着端子のリペアの際には新しいハウジングを必ず使用してください。
When extracting a crimp terminal from the housing using a jig, it may deform the housing lance and therefore
reduce the terminal retention force enormously after re-inserting of the terminal. Therefore, please ensure to
use a new housing after repairing the crimp terminals.
16. ハーネス加工品及びコネクタ嵌合後の電線の引き回しの際、引張りによる力が加わりますと、接点部、
結線部(圧着部)やロック部(端子ロック部)が損傷を受け、接触不良の原因となります
電線の引回し配線をされる場合、コネクタに無理な外力が加わらないように、電線に緩みを持たせ、余裕を持
たせる処置をしてください。
The cable assembly should not have a constant stress or pulling force applied on it when it is in the mated
condition. This phenomenon may damage the contact area or wiring area (crimping).
Therefore, when designing the wire positioning, please ensure that there is enough length of wire to avoid
stress on the connectors.
molex
LANGUAGE
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TITLE:
PanelMate 1.25MM PITCH WIRE TO BOARD
SMT CONN.
製品仕様書
J
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
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PRODUCT SPECIFICATION
17. 線はまとめて軽くつかみ、リセプタクル ウジングの両サイドに指を添え、ゆっくり軸方向にまっすぐに
引き抜いてください。
また、斜めにこじりながら抜くことは避けてください。コネクタを破損させる恐れが御座います。
Please hold wires all together lightly, put the fingers on both sides of the receptacle housing and withdraw it
slowly, axially and straightly.
Also, please do not pull out obliquely while prying. There is a risk of damaging the connector.
18. 圧着高さ、状態、適用電線等の詳細は、弊社圧着仕様書CS-50641, CS-50753を参照願います。
The details refer to CS-50641, CS-50753 such as crimping satisfied height, state & applicable wire.
19. 嵌合後、コネクタピッチ方向、スパン方向及び回転方向への負荷がかかるような動作またはセットはしないで
ください。コネクタ破壊やはんだクラックを引き起こします。
After mating, please do not take a connector pace direction, a span direction and load to the
rotator direction. It causes connector destruction and the solder crack.
20. ハウジングのロック部やランス部などの可動部、及び端子を故意に変形させないでください。
製品性能が満足出来ない原因となります。
Do not deform the movable part as lock part and lance part of Plug. HS'G and terminals on purpose. It would
lead to product failure.
21. んだ実装部の未はんだは、ターミナル脱落、ピン間ショート、ターミナル座屈、またコネクタ基板からの外
れが懸念されます。従って全てのターミナルテール部及び、ネイル部にはんだ付けを行ってください。
If you leave any soldering area on this product open, there may be the possibility of a missing terminal short
circuiting between pins, terminal buckling or the potential for the connectors to come off of the PWB. Therefore,
please solder all of the terminals and fitting nails on the PWB.
22. 実装機によってコネクタに負荷が加わると変形、破損する場合がありますので事前にご確認ください。
If there is accidental contact with the connectors while it is going through the reflow machine, there may be
deformation or damage caused to the connectors. Please check to prevent this.
23. 装性能(平坦度)は、実装基板の反りの影響を含まないものと致します。基板の反りはコネクタ両端部を基
準とし、コネクタ中央部にて Max0.02mmとしてください。
The mounting specification for coplanarity does not include the influence of warpage of the PWB. The warpage
of the PWB should be a maximum of 0.02mm if measuring from one connectors edge to the other.
24. 梱包品の推奨保管条件を超えた場合は外観、はんだ付け性を確認の上ご使用ください。
Please use it after confirming externals and soldering when the storage condition of packing goods is over
recommended storage condition.
25. 基板実装前後に端子及びネイルに触らないでください。
Please do not touch the terminals and fitting nails before or after mounted the connectors onto the PWB.
26. 基板実装後に基板を直接積み重ねない様に注意してください。
Please do not stack the PWB directly after mounted the connectors on it.
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27. 実装後において手はんだコテによるリペアを行なう際は、必ず仕様書掲載の条件以内で行なってください。
条件を超えて実施した場合、端子の抜け、接点ギャップの変化、モールドの変形、溶融等が原因により
破損の原因になります。
Please conduct it under the condition of the specifications when repairing by hand soldering iron after mounting.
In the case of practicing beyond the condition, the backlash, the change in the contact gap, the deformation of
the mold and the melting, etc. may cause damage.
28. はんだコテによる手修正を行なう際、過度のはんだやフラックスを使用しないでください。はんだ上がりや
フラックス上がりにより接触、機能不良に至る場合が御座います。
When conducting manual repairs using a soldering iron, please do not use more solder and flux than needed.
This may cause solder wicking and flux wicking issues, and it will eventually cause a contact defect and
functional issues.
39. コネクタのみで基板を支えることは避け、コネクタ以外での基板固定対策を行ってください。
Please do not use the connectors alone to provide mechanical support for the PWB.
Please ensure that there is a fixed structure on the phone chassis or other component support for the PWB.
30. 本製品の平坦度については、実装前での保証のみであり、実装中および実装後での平坦度については、
保証の限りではありません。
Coplanarity is assured only before mounting.
There is no guarantee of coplanarity after mounting and in the reflow.
31. 弊社の推奨基板パターン寸法を変更して設計を行なう際は、致命的な不良の原因にもなりますので
あらかじめご相談ください。
In the case of changing our recommended board pattern size and designing, please consult in advance
because it may cause a fatal defect.
32. 本品の一般性能確認はガラスエポキシ基板にて実施していますので、フレキシブル基板等の特殊な基板へ
実装してご使用の際は、別途ご相談願います。
It is necessary to consult separately when mount product on a special PWB or FPC.
33. 嵌合は極力嵌合軸に沿って平行に行ってください。その際、リセハウジングとプラグの外壁同士を合せる様
に位置決めした後に押し込み、コネクタ同士が突き当たる(完全嵌合位置)まで真っ直ぐ押し込んでくださ
い。斜めの嵌合になる場合は10°以下の角度でリセハウジングとプラグの外壁同士を軽く当て、位置決めし
た後に嵌合してください。尚、コネクタ同士を過度に傾けた状態で嵌合を行いますと、ハウジングが破壊す
る恐れが有りますのでこのような嵌合はお避けください
Please do the mating as much as possible to along to mating axis. At this time, positioning each side of
external faces of receptacle housing and plug and push to mating until both connectors strikes each other
(complete mating position). In the case of diagonal mating, touch with external faces with receptacle housing
and plug under the angle of 10°lightly, and push to mating in order to avoid the connector break.
34. リフロー条件によっては端子メッキ部にヨリ等が発生する場合がありますが、製品性能には影響ありません。
There is no influence in the product performance though the twist might be generated in the terminal plating
part according to the reflow condition.
molex
LANGUAGE
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ENGLISH
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TITLE:
PanelMate 1.25MM PITCH WIRE TO BOARD
SMT CONN.
製品仕様書
J
SEE SHEET 1 OF 17
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC
TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
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PRODUCT SPECIFICATION
35. リフロー条件によっては樹脂部に変色が発生する場合がありますが、製品性能には影響ありません。
There is no influence in the product performance though discoloration might be generated in the resin
according to the reflow condition.
36. リフロー後、はんだ付け部に変色が見られることがありますが、製品性能に影響はありません。
Although there might be some discoloration seen on the soldering tail after reflow, this will not influence the
product’s performance.
37. 本製品は赤外線リフローでの実装を想定しています。N2リフローで実装した場合、リフロー後、はんだ上がり
を生じる恐れがあります。N2フローでの実装をお考えの場合、別途評価が必要になります。
Please investigate the mounting condition (reflow soldering condition) on your own devices beforehand.
The mounting conditions may change due to the soldering temperature, soldering paste, IR reflow machine,
Nitrogen reflow machine, and the type of PWB. The different mounting conditions may have an influence on the
product’s performance.
8. 環境指令への適合 COMPLIANCE WITH ENVIRONMENTAL DIRECTIVE
ELV及びRoHS適合品
ELV and RoHS Compliant
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REV.
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED BY :
A
RELEASED
2004/04/15
J2004-3825
E.SUZUKI
K.TOJO
B
REVISED
2005/01/13
J2005-1988
E.SUZUKI
K.TOJO
C
REVISED
2006/05/01
J2006-3404
H.YAJIMA
M.TANAKA
D
REVISED
2008/03/13
J2008-3262
Y.AOYAGI
N.UKITA
E
REVISED
2015/10/20
J2016-0360
T.AKAIKE
K.ASAKAWA
F
REVISED
2016/09/12
106139
Q.HE
S.AKIYAMA
G
REVISED
2016/09/12
108349
Q.HE
S.AKIYAMA
H
REVISED
2016/09/14
108425
K.OMORI
S.AKIYAMA
J
REVISED
2017/6/27
118534
S.NAKAMURA
K.MURAKAMI