TPIS 1S 1385 Preliminary Datasheet by MikroElektronika

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Infrared Sensing Soluons
Product Specicaon
CaliPileTM
TPiS 1S 1385 / 5029
The TPiS 1S 1385 is the most compact thermopile sensor with integrated signal
processing within the CaliPileTM product range. It features a wide eld of view
and a low power consumption. The technology of a high sensitive thermopile
combined with a smart data treatment allows for much more than the tradi-
tional temperature measurement of remote objects. Once congured via the
I2C interface an interrupt output can be used to monitor motion, presence or
an over-temperature of remote objects.
One typical application are very thin battery operated devices which have to
be waked-up only when presence of a human has been discovered in a small
distance of up to 3m. The whole device can be designed very thin since no
optical components such as Fresnel-lenses are required for that application.
Features
4.4×2.6×1.75 mm3ceramic
SMD package
High sensitivity thermopile with
120eld-of-view
Integrated 50 µW low-power sig-
nal processing
I2C interface, hardware-
congurable address
Calibration data for ambient and
object temperature sensing
Interrupt function for presence,
motion, over-temperature and
more
Applications
Optimal to wake-up battery op-
erated thin devices
Near-eld human presence
sensing
Far-eld human motion detec-
tion (with lens)
Short-range temperature mea-
surement
Fast remote over-temperature
protection
Contents
1 Dimensions and Connections 3
2 Optical Characteristics 4
3 Absolute Maximum Ratings 5
4 Device Characteristics 5
5 I2C Interface Characteristics 7
5.1 START and STOP conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2 Clocklowextension.......................................... 8
5.3 SlaveAddress............................................. 8
5.4 Protocol diagram description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5.5 GeneralCall.............................................. 8
5.6 Reading Data from the Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.7 Writing Data to Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.8 ReadingEEPROM ........................................... 10
6 Data processing characteristics 11
6.1 Control and Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.2 Control Register Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
7 Internal processing overview 16
7.1 Object and Ambient Temperatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.2 Presence detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.3 Motiondetection ........................................... 17
7.4 Ambient temperature shock detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.5 Object temperature over or under limit detection . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.6 Hysteresis............................................... 19
8 Temperature Measurement 20
8.1 EEPROMcontent ........................................... 20
8.2 EEPROMDetails............................................ 20
8.3 Calculation of the Ambient Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8.4 Calculation of the Object Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
9 Integration instructions and recommendations 23
9.1 Position................................................ 23
9.2 Wiringpatterns............................................ 23
9.3 Footprint ............................................... 23
9.4 Re-owsoldering........................................... 23
10 Packaging Specication 25
10.1 General Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
10.2CarrierTape.............................................. 25
11 Statements 27
11.1Patents ................................................ 27
11.2Quality ................................................ 27
11.3RoHS ................................................. 27
11.4LiabilityPolicy............................................. 27
11.5Copyright............................................... 27
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TPiS 1S 1385 / 5029 18/11/2016- Preliminary
1 Dimensions and Connections
Figure 1: Mechanical Dimensions (in mm). The active pixel size A is 0.56 ×0.56 mm2.
4,4
`
0,15
2,5
`
0,1
3,3
`
0,1
0,9
1,75
-0,2
0,25
+
0,33 Optical Distance
A
0,4
`
0,05
0,45
`
0,15
0,4 (2x)
0,25 (4x)
Index mark (0,25 SQ)
0,75
1,55 Glop top
The optical distance in gure 1 is the effective distance between the chip active area and the lter top taking
into account the refraction in the optical light path.
Figure 2: Pin Conguration. A short description is given in table 1.
A0
A1
VSS
VSS
INT
SCL
SDA
VDD
INT
SCL
SDA
VDD
A0
A1
VSS
VSS
Table 1: Pin descriptions. Further explanations follow in this document.
Pin Symbol Pin Name and short Functional Description. Pin Type
A0,A1 Address Inputs A0, A1: Setting the last 2 bits of the slave address. Setting a
pin to GND corresponds to 0. Setting a pin to VDD corresponds to a 1. The
device address with both pins set to GND is 0xC.
Input
VSS Ground: The ground (GND) reference for the power supply should be set to
the host ground.
Power
VDD Power Supply: The power supply for the device. Typical operating voltage is
3.3V
Power
SDA Serial Data: The I2C bidirectional data line. Open-drain driven and requires
pull-up resistors to min. 1.8V
Input/Output
SCL Serial Clock Input: The I2C clock input for the data line. Up to 400 kHz are
possible. The host must support clock stretching.
Input/Output
INT Interrupt Output: The open drain / active low Interrupt output to indicate a
detected event. Reading the chip register out resets this output.
Output
3
Relative Signal [a. u.] 90 Angle of Incidence [degree] 100 Transmlmnce ["ln] Wavelength [um] EKCELITAS TECHNOLOGIESIE
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2 Optical Characteristics
Table 2: Optical characteristics
Parameter Symbol Min Typ Max Unit Remarks / Conditions
Field of View FOV 120 at 50 % intensity
Optical Axis 10 0 10
Figure 3: Typical FoV measurement-result
0,00
0,10
0,20
0,30
0,40
0,50
0,60
0,70
0,80
0,90
1,00
-90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
Relative Signal [a. u.]
Angle of Incidence [degree]
Table 3: Filter properties
Parameter Symbol Min Typ Max Unit Remarks / Conditions
Average Filter Transmittance TA75 >77 %7.5µm <λ<13.5µm
Average Filter Transmittance TA<0.5%λ<5µm
Cut-on Wavelength λ(5%) 5.2 5.5 5.8µm at 25 C
Figure 4: Filter transmittance, typical curve
0
10
20
30
40
50
60
70
80
90
100
3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
Transmittance [%]
Wavelength m]
4
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3 Absolute Maximum Ratings
Table 4: Maximum Ratings
Parameter Symbol Min Max Unit Remarks / Conditions
Operating Temperature T020 85 C Electrical parameters may vary from specied
values in accordance with their temperature de-
pendence
Storage Temperature Ts40 100 C Avoid storage in humid environment
Supply Voltage VDD 0.3 3.6V
Current to any pin 100 100 mA One pin at a time
4 Device Characteristics
Device characteristics are given at 25 C ambient temperature unless stated otherwise.
Table 5: Power Supply
Parameter Symbol Min Typ Max Unit Remarks / Conditions
Operating Voltage VDD 2.6 3.3 3.6V
Supply Current IDD 15 µA VDD=3.3V
Table 6: Thermopile
Parameter Symbol Min Typ Max Unit Remarks / Conditions
Sensitive Area A 0.31 mm2Absorber 0.56 ×0.56 mm2
Sensitivity counts/T400 counts/K Tobj=40 C
Noise(peak-peak) 8counts Tobj=40 C
Time constant τ30 ms
Resolution 17 Bits
Sensitivity 0.7 0.8 0.9µV/count
Offset 64 000 64 500 65 000 counts
Max. Object Temp. Tobjmax 120 C Full FOV, >99 %
The TPiS 1S 1385 temperature measurement is specied for a full eld-of-view coverage by a black body with
more than 99 % emissivity.
Table 7: Ambient temperature sensor (PTAT)
Parameter Symbol Min Typ Max Unit Remarks / Conditions
Resolution 15 Bits
Slope 170 counts/K20 C to 85 C
Range 20 90 C
Linearity 5 5 %20 C to 85 C
Offset 11 000 13 500 16 000 counts
Noise(peak-peak) 5counts
5
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Figure 5: Typical temperature dependence of the raw thermopile output
-250
-200
-150
-100
-50
0
50
100
150
200
-50 0 50 100 150 200
Tobj[°C]
Tamb[°C]
U=130000 counts
U=120000 counts
U=110000 counts
U=100000 counts
U= 90000 counts
U= 80000 counts
U= 70000 counts
U= 60000 counts
U= 50000 counts
U= 40000 counts
U= 30000 counts
U= 20000 counts
U= 10000 counts
U= 0 counts
Figure 5 shows calculated thermopile raw data U=TPobject as a function of the ambient temperature and
object temperature based on typical characteristics of TPiS 1S 1385 . The ASIC typically features a wider dynamic
range as compared to the specied values in table 6 and 7. Values out of our specications are not guaranteed.
The calculation of a temperature has to be performed on the host system and is described in section 8.
Table 8: Digital Interface (SCL, SDA, INT, A0, A1)
Parameter Symbol Min Typ Max Unit Remarks / Conditions
Input low voltage VI L - - 0.6V
Input high voltage VI H 1.5- - V
Output low voltage VO L 0.2- - V
Output high voltage VO H - - VI2CV Open Drain
Input leakage current ILI 1-1µA VI=VD D /2
Output leakage current ILO - - 1µA VO=VD D
SCL Frequency FS C L - - 400 kHz
SCL high time TH I G H 200 - - ns
SCL low time TLOW 0.2-90* µs *Slave clock stretching
refresh time - - 3ms
6
mm. i c-bus.org SDA SCL P smp Condition SDA SCL START :ondman STOP common E CELITAS TECHNOLOGIES:
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5 I2C Interface Characteristics
An I2C serial interface is provided to read out the sensors data and for read and write access of conguration and
status registers and to obtain calibration data from the EEPROM.
The following chapters give detailed instructions to understand and to operate the I2C interface of the CaliPileTM .
For the complete I2C specications (version 2.1) refer to: 2.
The SCL is a bidirectional input and output used as synchronization clock for serial communication. The SDA
is a bidirectional data input and output for serial communication. The SCL and SDA outputs operate as open drain
outputs only. External pull-up resistors are required. The pull-up resistor does all the work of driving the signal
line high. All devices attached to the bus may only drive the SDA and SCL lines low.
The I2C interface allows connection of a master device (MD) and one or more slave devices (SD). The CaliPileTM can
be operated as a SD only. The MD provides the clock signals and initiates the communication transfer by selecting
a SD through a slave address (SA) and only the SD, which recognizes the SA should acknowledge (ACK), the rest of
SDs should remain silent.
The general data transfer format is illustrated in gure 6
Figure 6: Illustration of voltages during I2C communication
S
Start Condition
R/W#
Read = 1 / Write# = 0
(N)ACK
(Not) Acknowledge; ACK = 0 , NACK = 1
P
Stop Condition
SDA
SCL
S
slave addr
P
1-7
8
9
1-7
8
9
1-7
8
9
ACK
ACK
ACK
DATA
5.1 START and STOP conditions
Figure 7: START and STOP Condition
SDA
SCL
S
START condition
STOP condition
P
Two unique bus situations dene a message START and STOP condition which is shown in gure 7.
1. A high to low transition of the SDAT line while SCLK is high indicates a message START condition.
2. A low to high transition of the SDAT line while SCLK is high denes a message STOP condition. START and
STOP conditions are always generated by the bus master. After a START condition the bus is considered to
be busy. The bus becomes idle again after certain time following a STOP condition or after both the SCLK
and SDAT lines remain high for more than tHIGH:MAX.
7
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5.2 Clock low extension
Figure 8: Clock low extension
SDA
SCL
Low extension
TLOW = 90μs max.
The CaliPileTM may need some time to process received data or may not be ready yet to send the next byte.
In this case the SD can pull the SCL clock low to extend the low period of SCL and to signal to the master that it
should wait (see gure 8). Once the clock is released the master can proceed with the next byte.
5.3 Slave Address
After power up the CaliPileTM responds to the General Call Address (0x00) only. Upon receipt of a general call, it
loads its slave address from EEPROM (ESA<7:0>). The slave address stored in the EEPROM consists of 7 address
bits (6:0) and 1 address control bit (7). If the address control bit is set, the slave address read from the EEPROM
is merged with the information from the slave address select pins A1 and A0.
Table 9: Examples for the interplay between conguration pins and the EEPROM
ESA<7:0> <A1:A0> state I2C slave address
1000 1111 H:L 000 1110
1000 1100 H:L 000 1110
1000 1100 L:H 000 1101
0000 1100 L:H 000 1100
1ABC DEFG Y:Z ABC DEYZ
0ABC DEFG Y:Z ABC DEFG
Some examples are given in table 9. The CaliPileTM in the standard conguration has enabled conguration
pins. The standard EEPROM content is 1000 1100. The standard slave address is therefore dec12 or 000 1100 in
binary representation when the address input pins A1,A0 are both connected to ground. Pulling A0 to a high level
for example will result in the slave address dec13 or 000 1101.
5.4 Protocol diagram description
In the following chapters, the communication protocol will be illustrated with diagrams. Figure 9 describes the
meaning of those diagrams.
5.5 General Call
In order to re-fresh the slave address from EEPROM the MD has to send a general call (0x00) followed by the reload
command (0x04). The slave may require up to 300 µs for copying the slave address from EEPROM information
into the register.
8
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Figure 9: Protocol diagram description
S
Start Condition
Rd
Read (bit value of 1)
Wr
Write (bit value of 0)
A
ACK = Acknowledge (bit value of 0)
A
NACK = Not Acknowledge (bit value of 1)
P
Stop Condition
Master-to-Slave
Slave-to-Master
Continuation of Protocoll
Data Byte
S
Slave Address
Rd
A
Register Address
A
P
1
7
1
1
8
1
1
A
1
8
Figure 10: General call format
S
0x00
Wr
Rd
A
0x04
A
P
1
7
1
1
8
1
1
5.6 Reading Data from the Register
Each register can be read through the I2C bus interface. The address information following Slave address points
to the register to be read. The SD may require some time to load the data into the serial interface and therefore
apply "clock stretching" after reception of the address byte. Once the data is ready for transmission to the MD,
clock-stretching will be released and the MD can clock out the data byte.
The address pointer on the SD will be automatically incremented to prepare for the next data byte to be
fetched for transmission. The SD may apply "clock stretching" again to enforce a waiting time, before the next
data byte is ready for transmission. The address pointer will wrap around to 0 once it exceeds address 63.
Reading of data can be interrupted by the MD at any time by generating a stop or a new start condition or a
"not acknowledge". This is illustrated in gure 11.
Figure 11: Register read format
S
Slave Address
Wr
A
Register Address
A
1
7
1
1
8
1
1
1
7
P
8
A
Data [Adr+2]
Data [Adr+N-1]
A
Data [Adr+N]
A
8
8
8
8
1
1
1
1
1
Sr
Slave Address
Rd
Data [Adr]
A
1
1
A
A
Data [Adr+1]
5.7 Writing Data to Register
Each register can be written to through the I2C bus interface. The address information following the Slave address
species the location, where the next data byte is written to. The SD may require some time to write the data
into the registers on chip and therefore apply "clock stretching" after reception of the data byte. Once the data
is stored in the register, the slave will increment the address pointer and prepare for the next data byte to be
received. The address pointer will wrap around when it exceeds 63.
Writing of data can be interrupted at any time by generating a stop or a new start condition or a "not acknowl-
edge". This is illustrated in gure 12.
If the address points to a non-writable register, the register content remains unchanged.
9
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Figure 12: Register write format
Data [Adr]
S
Slave Address
Wr
A
Register Address
A
1
7
1
1
8
1
1
1
8
P
Data [Adr+1]
A
8
Data [Adr+2]
Data [Adr+3]
A
Data [Adr+N]
A
8
8
8
8
1
1
1
1
1
Data [Adr+N-1]
A
A
A
5.8 Reading EEPROM
A dedicated EEPROM control register (ECR) is provided to control access mode and to allow testing of EEPROM dur-
ing production. Prior to reading EEPROM memory via I2C interface the control byte needs to be set accordingly.
It is of importance to congure the EEPROM control register correctly as specied to ensure correct operation. In
order to enable EEPROM reading, the ECR must be set to 0x80 as depicted in gure 13.
Figure 13: Conguring register for EEPROM readout
Wr
ECR (0x80)
S
Slave Address
A
Reg. Address (0x1F)
A
P
A
1
7
1
1
8
1
8
1
1
Note: Conguring the ECR for EEPROM read access causes increase of the supply current during EEPROM
read operation until ECR will be set to 0x00 again.
Once the ECR has been setup correctly for read operation, the EEPROM cells can be addressed and read as
drawn to gure 14.
Figure 14: Reading EEPROM
S
Slave Address
Wr
A
Register Address
A
1
7
1
1
8
1
1
1
7
P
8
A
Data [Adr+2]
Data [Adr+N-1]
A
Data [Adr+N]
A
8
8
8
8
1
1
1
1
1
Sr
Slave Address
Rd
Data [Adr]
A
1
1
A
A
Data [Adr+1]
The address information following the Slave address points to the EEPROM memory location to be read. The
SD may require some time to load the data into the serial interface and therefore apply "clock stretching" after
reception of the address byte. Once the data is ready for transmission to the MD, clock stretching will be released
and the MD can clock out the data byte.
The address pointer on the SD will be automatically incremented to prepare for the next data byte to be
fetched for transmission. The SD may apply "clock stretching" again to enforce a waiting time, before the next
data byte is ready for transmission. The address pointer will wrap around to 0 once it exceeds address 63.
The EEPROM control register must be congured to 0x00 after the end of the EEPROM read operation to bring
the supply current back to normal (lower) level.
10
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6 Data processing characteristics
6.1 Control and Status Registers
Table 10: Register content
Register # Description Size[bit] Access
0 reserved 8 -
1-2,3[7] TPobject 17 Read
3[6:0],4 TPambient 15 Read
5-7[7:4] TPObjLP1 20 Read
7[3:0]-9 TPObjLP2 20 Read
10-11 TPambLP3 16 Read
12-14 TPObjLP2 frozen 24 Read
15 TPpresence 8 Read
16 TPmotion 8 Read
17 TPamb shock 8 Read
18[7:0] Interrupt Status 8 Read(Autoclear)
19[7:0] Chip Status 8 Read
20[3:0] SLP1 4 Write/Read
20[7:4] SLP2 4 Write/Read
21[3:0] SLP3 4 Write/Read
21[7:4] reserved 4 -
22 TPpresence threshold 8 Write/Read
23 TPmotion threshold 8 Write/Read
24 TPamb shock threshold 8 Write/Read
25[4:0] Interrupt Mask Register 5 Write/Read
25[7:5] reserved 3 -
26[1:0] Cycle time for Motion differentiation 2 Write/Read
26[3:2] SRC select for presence determination 2 Write/Read
26[4] TPOT direction 1 Write/Read
26[7:5] reserved 3 -
27[7:0] Timer interrupt 8 Write/Read
28,29 TPOT threshold 16 Write/Read
30 reserved 8 -
31 EEPROM control 8 Write/Read
62:32 EEPROM content 248 Read
63 Slave address 8 Read
The control and status registers in table 10 give access to the variables of the integrated CaliPileTM ASIC. Details
on the registers are given in the following section 6.2.
While some registers contain computed values other contain parameters to control the functionality of the
chip which is described in section 7.
The register control values are undened after power-up and require an initialization procedure for
a well-dened operation of the CaliPileTM .
11
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6.2 Control Register Details
TPobject
Register #1[7:0] Register #2[7:0] Register #3[7]
76543210765432107- - - - - - -
Contains the 17 bit TPobject raw ADC value in digits. This represents the current signal of the thermopile sensor
element.
TPambient
Register #3[6:0] Register #4[7:0]
- 654321076543210
Contains the 15 bit TPambient raw value in digits. This represents the current signal of the ambient temperature
sensor (PTAT).
TPobjectLP1
Register #5[7:0] Register #6[7:0] Register #7[7:4]
76543210765432107654- - - -
Contains the 20 bit TPobjLP1 value in digits. This represents the low-pass-ltered value of the TPobject signal. To
compare it with the 17 bit wide TPobject divide the value by 23= 8. The lter time constant for this lter stage can
be set with SLP1.
TPobjectLP2
Register #7[3:0] Register #8[7:0] Register #9[7:0]
- - - - 32107654321076543210
Contains the 20 bit TPobjLP2 value in digits. This represents the low-pass-ltered value of the TPobject signal. To
compare it with the 17 bit wide TPobject divide the value by 23= 8. The lter time constant for this lter stage can
be set with SLP2.
TPambLP3
Register #10[7:0] Register #11[7:0]
7654321076543210
Contains the 16 bit TPambLP3 value in digits. This represents the low-pass-ltered value of the TPambient signal. To
compare it with the 15 bit wide TPambient divide the value by 21= 2. The lter time constant for this lter stage
can be set with SLP3.
TPobjectLP2 frozen
Register #12[7:0] Register #13[7:0] Register #14[7:0]
765432107654321076543210
Contains the 24 bit TPobjLP2 frozen value in digits. This represents the low-pass-ltered value of the TPobject signal
when motion was detected. To compare it with the 17 bit wide TPobject divide the value by 27= 128. See
section 7.3 for more details on the motion detection algorithm.
TPpresence
Register #15[7:0]
76543210
Contains the 8 bit TPpresence value in digits. It is the unsigned difference between two values which combination is
steered with the "source select". The sign of the value is contained in the "chip status". See section 7.2 for details.
12
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TPmotion
Register #16[7:0]
76543210
Contains the 8 bit TPmotion value in digits. It is the unsigned difference between two consecutive values of
TPobjectLP1. The sign of the value is contained in the "chip status". The interval is steered with the "cycle time". See
section 7.3 for details.
TPamb shock
Register #17[7:0]
76543210
Contains the 8 bit TPamb shock value in digits. It is the unsigned difference between TPambient and TPambL1. The sign
of the value is contained in the "chip status". See section 7.4 for details.
Interrupt status
Register #18[7:5] sign Register #18[4:0] ag
76543210
TPpresence TPmotion TPamb shock TPOT TPpresence TPmotion TPamb shock timer
Each fullled interrupt condition between the last readout and the current one is stored here. See also "Chip
status" for the current status of the interrupt conditions. Reading this register clears the register (setting it to
0x00) and resets the physical interrupt output (release to high).
Sign is the sign bit to the corresponding unsigned 8 bit values when the interrupt condition of the corre-
sponding interrupt calculation branches (see section 7) was fullled since the last readout of that register. A 0
represents a positive value and a 1a negative value.
Flag Contains a 1when a condition of the corresponding interrupt calculation branches was fullled since
the last readout of that register.
Timer Contains a 1when at least one period of the timer passed since the last readout of that register.
Chip status
Register #19[7:5] sign Register #19[4:0] ag
76543210
TPpresence TPmotion TPamb shock TPOT TPpresence TPmotion TPamb shock timer
Sign is the sign bit to the corresponding unsigned 8 bit values. A 0represents a positive value and a 1a
negative value.
Flag represents the status of the corresponding interrupt calculation branches (see section 7). A 1represents
a full-lled condition for the interrupt.
Timer represents a ag toggling with the double frequency of the "timer interrupt".
This register is masked by the "Interrupt Mask" register to evaluate the condition for the physical interrupt
output pin at the CaliPileTM .
Low pass time constants SLP
Register #20[7:4] LP2 Register #20[3:0] LP1
76543210
reserved Register #21[3:0] LP3
- - - - 3 2 1 0
Contains the time constants for the three low-pass lters LP1, LP2 and LP3 (see section 7). The possible settings
and the corresponding values are denoted in table 11.
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Table 11: Low pass settings for LP1, LP2 and LP3
fcut off[Hz] 1/(2πf )[s] select code [hex] select code [bin]
6.4×1010.25 D 1101
3.2×1010.50 C 1100
1.5×1011B 1011
7.9×1022A 1010
3.9×10249 1001
1.9×10288 1000
9.9×10316 5 0101
4.9×10332 4 0100
2.5×10364 3 0011
1.2×103128 2 0010
6.2×104256 1 0001
3.1×104512 0 0000
TPpresence threshold
Register #22[7:0]
76543210
Contains the unsigned 8 bit threshold value for TPpresence in digits. Once the TPpresence signal exceeds this thresh-
old the corresponding presence ag will be set in the "chip status" register. See section 7.2 for details.
TPmotion threshold
Register #23[7:0]
76543210
Contains the unsigned 8 bit threshold value for TPmotion in digits. Once the TPmotion signal exceeds this threshold
the corresponding presence ag will be set in the "chip status" register. See section 7.3 for details.
TPamb shock threshold
Register #24[7:0]
76543210
Contains the unsigned 8 bit threshold value for TPamb shock in digits. Once the TPamb shock signal exceeds this
threshold the corresponding presence ag will be set in the "chip status" register. See section 7.4 for details.
Interrupt Mask
reserved Register #25[4:0]
- - - 4 3 2 1 0
- - - TPOT TPpresence TPmotion TPamb shock timer
Contains the 5 bit mask value to activate the external interrupt output INT pin based on ve different possible
sources in the "chip status" register.
The INT pin will be activated only if the corresponding mask ag inside the interrupt mask register is set to 1
and the corresponding interrupt occurs as signaled in the "chip status" register.
Bit[4]: set to 1 activates the INT pin if the TPOT ag in register "chip status" has been set
Bit[3]: set to 1 activates the INT pin if the TPpresence ag in register "chip status" has been set
Bit[2]: set to 1 activates the INT pin if the TPmotion ag in register "chip status" has been set
Bit[1]: set to 1 activates the INT pin if the TPamb shock ag in register "chip status" has been set
Bit[0]: set to 1 activates the INT pin if the timer ag in register "chip status" has been set
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If more than one mask bit has been set the INT pin will be activated for whatever ag in the chip status
register comes rst (OR condition). The INT output will remain active until the host micro-controller reads the
"interrupt status" register. Interrupts are set when conditions change from inactive (0) to active (1).
Interrupt Mask
Register #26
reserved TPOT dir [3:2] SRC select [1:0] cycle time
- - - 4 3 2 1 0
TPOT dir allows to select in which direction TPobject has to cross the TPOT threshold to create an interrupt.
If 1, an interrupt is created if TPobject exceeds the TPOT threshold.
If 0, an interrupt is created if TPobject falls below the TPOT threshold.
SRC select allows to switch the signal sources to be used for the TPpresence calculation as explained further in
section 7.2. Possible values are
00 = TPobject TPobjLP2
01 = TPobjLP1 TPobjLP2
10 = TPobject TPobjLP2 frozen
11 = TPobjLP1 TPobjLP2 frozen
Cycle time is the time between these two consecutive TPobjLP1 points to determine TPmotion. This is explained
further in section 7.3. Possible values are
00 = 30 ms
01 = 60 ms
10 = 120 ms
11 = 140 ms
Timer interrupt
Register #27[7:0]
76543210
Contains a timer overrun value from 30 ms up to 7.7s in steps of 30 ms.
Timer interval =(1 + Timer interrupt) ·30 ms
TPOT threshold
Register #28[7:0] Register #29[7:0]
7654321076543210
Contains the 16 bit TPOT threshold value in digits. To compare this value to the 17 bit wide TPobject please multiply
this value by a factor of 21= 2. More details are depicted in section 7.5.
EEPROM control register
Register #31[7:0]
76543210
Contains the EEPROM control bits. Set it to 0x80 in order to read the EEPROM through the register. It should be
set to 0x00 in case of no access to the EEPROM. For more details please refer to section 5.8.
15
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7 Internal processing overview
In order to explore the complex functionalities of our CaliPileTM products, we recommend to obtain one
of our Demonstration Kits. Please ask our local representative for further advice.
Figure 15: A schematic overview on the internal processing paths and variables
TPobject
LP1
LP2
TPambient
LP3
TPobject
TPobjLP1
TPobjLP2
TPpresence
SLP1
cycle time dt
TPpresence flag
TPmotion
TPmotion flag
TPambient
TPambLP3
TPamb_shock
TPpresence treshold
TPmotion treshold
TPamb shock treshold
SLP3
SRC_select
interrupt
interrupt
mask
register
TPOT flag
+
TPOT treshold
ABS
TPOT direction
timer flag
+
+
TPamb_shock flag
source
select
2 of 4
SLP2
ABS
Tobj_LP1t- Tobj_LP1t-1
TPobjLP2 frozen
ABS
The Sketch 15 gives an overview on the internal CaliPileTM data processing algorithms. The CaliPileTM contains
all functions required to allow an external micro-controller to detect activity and presence. The parameters which
should lead for example to a wake-up of the host micro-controller can be programmed and adapted on the y.
The algorithm is based on various lter calculations of the sensor signals TPobject and TPambient, their differences
and time derivatives.
The CaliPileTM offers 4 basic functions which are "presence detection", "motion detection", "ambient temper-
ature shock detection" and "over temperature detection". Those functions can be selected by the host micro-
controller as an interrupt source for wakeup. The parameters used to calculate the current state of "presence",
"motion" or "shock" can be changed by the host controller through control registers. This allows the host con-
troller to stay in sleep mode for most of the time and only be activated once the CaliPileTM detects a change which
requires intervention.
7.1 Object and Ambient Temperatures
TPobject and TPambient are the ADC raw data from the thermopile and the internal temperature reference PTAT.
To calculate the actual object temperature and ambient temperature a calculation is required on the host sys-
tem based on the calibration constants from the CaliPileTM s EEPROM. Details are described in section 8. All other
functionalities of the chip do not require an explicit knowledge of the actual temperatures as only relative changes
are being processed. This allows a continuous operation of the CaliPileTM at a low power power consumption.
7.2 Presence detection
Presence detection is accomplished by observing the difference between two user selectable signal paths which
will be calculated from the thermopile raw signal TPobject (see chart 16). In order to select the optimal application
specic solution for presence detection, four signal path combinations are available for selection.
16
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Figure 16: Presence detection algorithm chart
𝑇𝑃𝑜 𝑏𝑗 𝐿𝑃1
LP1
LP2
Source
select
2 of 4
-
𝑇𝑃𝑜 𝑏𝑗 𝑒 𝑐𝑡
𝑆𝐿𝑃2
𝑆𝐿𝑃1
ABS
𝑇𝑃𝑜 𝑏𝑗 𝐿𝑃2
𝑇𝑃𝑜𝑏𝑗 𝐿𝑃2_𝑓𝑟𝑜𝑧𝑒𝑛
𝑆𝑅𝐶_𝑠𝑒𝑙𝑒𝑐𝑡
𝑇𝑃
𝑝𝑟𝑒𝑠𝑒𝑛 𝑐𝑒 𝑡𝑟𝑒𝑠𝑜𝑙𝑑
𝑇𝑃
𝑝𝑟𝑒𝑠𝑒𝑛𝑐𝑒
𝑇𝑃
𝑝𝑟𝑒𝑠𝑒𝑛 𝑐𝑒 𝑓𝑙𝑎𝑔
+
The original TPobject data as provided by the thermopile, two signals, which have been processed by low pass
lters LP1 and LP2 with different user programmable time constants (SLP1 ,SLP2).
TPobjLP1(x)=TPobject(x)·SLP1 +TPobjLP1(x1)·(1SLP1)
TPobjLP2(x)=TPobject(x)·SLP2 +TPobjLP2(x1)·(1SLP2)
The signal TPObjLP2 frozen which is the TPObjLP2 output, that was saved at the moment the last motion event was
detected.
Thus various calculations for presence detection are possible and can be adapted to the actual conditions
e.g.:
TPpresence =TPobject TPobjLP2
TPpresence =TPobjLP1 TPobjLP2
TPpresence =TPobject TPobjLP2 frozen
TPpresence =TPobjLP1 TPobjLP2 frozen
The difference of those two selected signals paths is then compared with a programmable threshold TPpresence threshold.
The TPpresence ag is set once the difference of the two signals exceeds the threshold.
Recommended settings to start the evaluation with are:
variable value meaning
SLP1 bin 1011 1 s
SLP2 bin 1000 8 s
SRC select bin 01 TPobjLP1 TPobjLP2
TPpresence threshold dec 50 ±50 counts
Interrupt Mask bin 0000 1000 TPpresence
Other register values are not important for that parameter set.
7.3 Motion detection
Motion detection is accomplished by observing the difference between two consecutive samples of TPobjLP1 with
a programmable time interval d t . This is comparable to the 1st derivative of TPobjLP1.
TPmotion =
dTPobjLP1
d t
The difference of the two signals paths is then compared with a programmable threshold TPmotion threshold.
The TPmotion ag is set once the difference exceeds the threshold. This is illustrated in gure 17.
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Figure 17: Motion detection algorithm chart
-
|| ABS
+
𝑇𝑃𝑜𝑏𝑗 𝐿𝑃1(𝑡)
𝑇𝑃𝑜 𝑏𝑗 𝐿𝑃1(𝑡 1)
𝑇𝑃𝑚 𝑜𝑡𝑖𝑜𝑛
𝑇𝑃𝑚 𝑜𝑡𝑖𝑜𝑛 𝑓𝑙𝑎𝑔
𝑇𝑃𝑚 𝑜𝑡𝑖𝑜𝑛 𝑡𝑟𝑒𝑠𝑜𝑙𝑑
At the moment the TPmotion ag is set, the current value of TPobjLP2 will be saved as TPobjLP2 frozen for further
use in the presence detection algorithm.
Recommended settings to start the evaluation with are:
variable value meaning
SLP1 bin 1100 0.5s
cycle time bin 10 120 ms
TPmotion threshold dec 10 ±10 counts
Interrupt Mask bin 0000 0100 TPmotion
Other register values are not important for that parameter set.
It should be noticed that motion detection requires a fast change in the signal. It is thus suitable for small
eld-of-views in case of large distances to the sensor. To reduce the eld-of-view of a sensor apply lens or aperture
optics.
7.4 Ambient temperature shock detection
Figure 18: Ambient Temperature shock detection algorithm chart
+
-
|| ABS
𝑇𝑃𝑎 𝑚𝑏𝑖𝑒𝑛 𝑡
𝑇𝑃𝑎𝑚𝑏 _𝑠ℎ𝑜𝑐𝑘
𝑇𝑃𝑎𝑚𝑏 _𝑠𝑜𝑐𝑘 𝑓𝑙𝑎𝑔
𝑇𝑃𝑎 𝑚𝑏 _𝑠𝑜𝑐𝑘 𝑡𝑟𝑒𝑠ℎ𝑜𝑙𝑑
LP3
𝑆𝐿𝑃3
𝑇𝑃𝑎 𝑚𝑏 _𝐿𝑃3
As shown in gure 18 the ambient temperature shock detection is accomplished by observing the differ-
ence between TPambient and the low pass ltered TPamb LP3. The difference of the two signals will then compared
with a programmable threshold TPamb shock threshold. The TPamb shock ag is set once the difference exceeds the
threshold to indicate a sudden change in the ambient temperature.
Recommended settings to start the evaluation with are:
variable value meaning
SLP3 bin 1010 2 s
TPamb shock threshold dec 10 ±10 counts
Interrupt Mask bin 0000 0010 TPamb shock
Other register values are not important for that parameter set.
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Figure 19: Object temperature over or under limit detection algorithm chart
𝑇𝑃𝑜𝑏𝑗 (16 𝑏𝑖𝑡)
𝑇𝑃𝑂𝑇 𝑡𝑟𝑒𝑠ℎ𝑜𝑙𝑑
𝑇𝑃𝑂𝑇 𝑓𝑙𝑎𝑔
𝑇𝑃𝑂𝑇 𝑑𝑖𝑟𝑒𝑐𝑡𝑖𝑜𝑛
7.5 Object temperature over or under limit detection
The TPobject raw data is compared against the value specied in the object temperature threshold TPOTthreshold.
This is illustrated in gure 19. An event is generated whenever the object temperature crosses the threshold. The
user can select by the use of the corresponding control registers, the condition which should lead to an interrupt:
Exceeding the limit or falling below the limit.
The interrupt is cleared when the micro-controller reads the interrupt status register. A new interrupt can
only be generated with a new event (object temperature crosses the threshold).
To ensure correct system start up, the over temperature ag is set and the interrupt output is switched active
after the device has been powered up. This feature is achieved with an on chip power on reset.
Note that TPobject is the thermopile raw value which does not necessarily correspond to one xed
object temperature. This is specially the case when the ambient temperature changes. See also gure 5
for an illustration. To determine TPobject and/or a threshold for a given object temperature, refer to section 8.
7.6 Hysteresis
The calculations for TPpresence TPmotion and TPamb shock apply a hysteresis of 12.5% of the actual threshold value.
The minimum hysteresis value is xed to 5 counts. That means that the actual value must fall below the threshold
by 12.5% of the threshold or at least by 5counts in order to change the corresponding "chip status" bit to 0.
For the object temperature over/under limit detection TPOT threshold there is a xed hysteresis of 64 counts
built into the threshold comparator. This is large enough to suppress the noise on the signals and to prevent false
or frequent triggering of the corresponding ags if the signal is close to the threshold. It may lead to confusion
when for example extremely small amplitudes are being evaluated which in turn require small thresholds.
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8 Temperature Measurement
8.1 EEPROM content
Table 12: EEPROM content
Register# EEPROM# Name Description Content Example
32 0 PROTOCOL EEPROM Protocol number 3
33,34 1,2CHKSUM Checksum of all EEPROM contents excluding
cell 1,2
-
35 .. 40 3 .. 8reserved reserved -
41 9 LOOKUP# Identier for look-up-table 1
42,43 10,11 PTAT25 Tamb output in digits at 25 C13 500
44,45 12,13 M PTAT slope [digits/K]×100 17 200
46,47 14,15 U0TP offset, U032768 31 732
48,49 16,17 UOUT1 TP output for TOBJ1 at 25 C, Uou t /2 35 250
50 18 TOBJ1 TOBJ value in C for UOUT1 40
51 .. 62 19 .. 30 reserved reserved -
63 31 SLAVE ADD I2C slave address with external addressing bit 140
8.2 EEPROM Details
PROTOCOL
Register #32[7:0]
76543210
Contains the 8 bit EEPROM Protocol number as an unique identier. The default protocol number is 3.
CHSUM
Register #33[7:0] Register #34[7:0]
7654321076543210
Contains the 16 bit checksum in digits. The checksum is computed as a sum of all EEPROM cells excluding the
checksum cells themselves (cell# 1,2).
LOOKUP#
Register #41[7:0]
76543210
Contains the 8 bit look-up-table identier which denes the functional behaviour of that specic device. The
default value for that product type is 1. For details please refer to section 8.4.
PTAT25
Register #42[6:0] Register #43[7:0]
- 654321076543210
Contains the 15 bit TPambient value of the internal PTAT in digits at an ambient temperature of 25 C. The rst bit
is unused and always 0. A typical value is 13 500 counts. For details please refer to section 8.3.
M
Register #44[7:0] Register #45[7:0]
7654321076543210
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Contains the 16 bit slope value of the internal PTAT in digits per Kelvin scaled by a factor of 100.
M=RegVal/100
A typical slope is 172 counts/K. For details please refer to section 8.3.
U0
Register #46[7:0] Register #47[7:0]
7654321076543210
Contains the 16 bit TPobject offset value of the thermopile subtracted by 32 768 counts.
U0=RegVal + 32768
A typical offset is 64 500 counts. For details please refer to section 8.4.
UOUT1
Register #48[7:0] Register #49[7:0]
7654321076543210
Contains the 16 bit TPobject value of the thermopile divided by a factor of 2when facing a black body with a
temperature of TOBJ1 at an ambient temperature of 25 C.
UOUT1 =RegVal ·2
A typical value is 70 500 counts. For details please refer to section 8.4.
TOBJ1
Register #50[7:0]
76543210
Contains the 8 bit value in C for the black body giving the response of UOUT1. A typical value is 40 C. For details
please refer to section 8.4.
SLAVE ADD
Register #63
[7] [6:0]
76543210
ADD PIN I2C base address
Contains the 7 bit I2C base address which is completed by the A0,A1 external pin settings when ADD PIN is set to
1. For details please refer to section 5.3.
8.3 Calculation of the Ambient Temperature
For a correct object temperature calculation the ambient temperature must be known. The temperature should
be calculated in Kelvin and not C. To calculate the ambient temperature out of TPambient the following formula
can be applied.
Tamb[K] = (25 + 273.15)+(TPambient PTAT25) ·(1/M)
using the calibration constants PTAT25 and M from the EEPROM.
The inverse to calculate an expected PTAT value for a given temperature Tamb is given by
TPambient[counts] = [Tamb (25 + 273.15)]·M+PTAT25
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8.4 Calculation of the Object Temperature
The thermopile output signal TPobject is not only depending on the objects temperature but also on the ambient
temperature Tamb as demonstrated in gure 5. To obtain the object temperature Tobj calculate
Tobject[K] = F"TPobject U0
k+f(Tamb)#
where Tamb is obtained as discussed in section 8.3. kis a scaling/calibration factor given by
k=Uout1 U0
[f(Tobj1)f(25 + 273.15)]
and contains the emissivity of the object as well as the eld-of-view coverage factor Θ. Since our devices are
calibrated for a full FOV coverage (Θ=1) and an object emissivity of nearly = 1, this factor has to be scaled
properly to adjust for a different object property in the application by
k7−k·(·Θ)
with and Θin the range of 0to 1.f(x) is in the simplest case an exponential with the exponent dened by the
identier LOOKUP#.
f(x)=x3.8if LOOKUP# = 1
Its reverse function F(x) is then
F(x)=3.8
xif LOOKUP# = 1
Moreover U0,Uout1 and Tobj1 are calibration parameters from the EEPROM.
To predict a thermopile output based on the object temperature Tobject and ambient temperature Tamb calcu-
late
TPobject[counts] = k·f(Tobject)f(Tamb)+U0
Since exponents and roots are heavy operations to be performed on a micro-controller based system, we
recommend to implement f(x) as a lookup table. An implementation in Object-Clanguage can be provided
upon request. You may contact our local representative for more details.
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9 Integration instructions and recommendations
9.1 Position
In order to obtain the highest possible performance it is possible to operate the sensor without a (protecting) front
window. To measure a temperature based on Excelitas calibration constants no window between the sensor and
the object must be used. Excelitas calibration values are only valid when the bare sensor is exposed to the object.
As the device is equipped with a highly sensitive infra-red detector. It is sensitive any source of heat, direct
or indirect. For a proper temperature measurement the device must be at the same temperature as the ambient.
Sudden temperature changes will directly affect the behaviour of the internal calculations such as motion, pres-
ence and over-/under-temperature recognition. While slow variations of the sensor and ambient temperature
may be tolerated for a proper function of the motion and presence features, a drift in the ambient temperature
needs to be compensated for the over-/under-temperature feature as mentioned in the corresponding section.
This device is equipped with a highly sensitive ADC and integrated circuits. Common rules of electronics
integration apply. We recommend to place strong EMI sources far apart and/or to shield those.
9.2 Wiring patterns
In general, the wiring must be chosen such that crosstalk and interference to/from the bus lines is minimized.
The bus lines are most susceptible to crosstalk and interference at the high levels because of the relatively high
impedance of the pull-up devices.
If the length of the bus line on a PCB or ribbon cable exceeds 5cm and includes the VDD and VSS lines, the
wiring pattern must be:
SDA - VDD - VSS - SCL
and only if the VSS line is included we recommend
SDA - VSS - SCL
as a pattern. THese wiring patterns also result in identical capacitive loads for the SDA and SCL lines. The VSS
and VDD lines can be omitted if a PCB with a VSS and/or VDD layer is used.
If the bus lines are twisted-pairs, each bus line must be twisted with a VSS return. Alternatively, the SCL line
can be twisted with a VSS return, and the SDA line twisted with a VDD return. In the latter case, capacitors must
be used to decouple the VDD line to the VSS line at both ends of the twisted pairs.
If the bus lines are shielded (shield connected to VSS), interference will be minimized. However, the shielded
cable must have low capacitive coupling between the SDA and SCL lines to minimize crosstalk.
9.3 Footprint
Recommended pad dimensions are shown in the drawing 20.
9.4 Re-ow soldering
The SMD package allows for automated pick-and-place procedures combined with a lead-free automated re-ow
soldering process. A typical lead-free soldering prole is shown in the graph 21.
23
2.95 2,60 SCL INT SDA A0 A1 V88 V88 2.0 mg Ed m; 300 EL 2325....» an Tlme [s] EKCELITAS
P r o d u c t S p e c i f i c a t i o n
Excelitas Technologies GmbH & Co. KG
Wenzel-Jaksch-Str. 31
65199 Wiesbaden Germany
Tel.: +49 (0)611 492 0
Fax.: +49 (0) 611 492 177 www.excelitas.com
TPiS 1S 1385 / 5029 18/11/2016- Preliminary
Figure 20: Recommended pad dimensions
2.60
2.95
4.40
5.75
0.20
0.20
0.35
Figure 21: Typical lead free soldering prole.
0
50
100
150
200
250
300
0 30 60 90 120 150 180 210 240 270 300 330
Temperature [°C]
Time [s]
<2.5 °C/s
Peak Temperature
240 - 260 °C
Reflow Zone
time above ~217 °C
typical 60 - 75 s
Soaking Zone
typical 60 - 90 s
Pre-heating Zone
2 - 4 min max
24
O\®\OOOOO EKCELITAS EEEEEEEEEEEEE
P r o d u c t S p e c i f i c a t i o n
Excelitas Technologies GmbH & Co. KG
Wenzel-Jaksch-Str. 31
65199 Wiesbaden Germany
Tel.: +49 (0)611 492 0
Fax.: +49 (0) 611 492 177 www.excelitas.com
TPiS 1S 1385 / 5029 18/11/2016- Preliminary
10 Packaging Specication
10.1 General Information
The Excelitas Technologies Tape and Reel packing system protects the product from mechanical and electrical
damage and is designed for automatic pick-and-place equipment.
The Tape and Reel packing system consists of a Carrier Tape sealed with a protective Cover Tape to hold the
devices in place. The devices are loaded with leads down, into the carrier pockets. The tape is wound onto a
plastic reel for labelling and packing for shipment. The conductive carrier tape, and antistatic coated transparent
cover tape and reel provide ESD protection. Information labels, ESD labels and bar-code Labels (optional) are
placed on each reel. Each real is inserted into a separate moisture barrier bag.
Excelitas Technologiestape and reel specications are in conformance with the EIA Standard 481 Taping of
Surface-Mount Components for Automatic Placement.
10.2 Carrier Tape
Figure 22 shows the basic outline and dimension labels of the carrier tape. Typically, the carrier tape is constructed
from conductive Polystyrene (IV). The Reel size is 7inches with a maximum quantity per reel of 3000 pieces.
Figure 22: Tape and reel specications. Package dimensions are given in table 13
P0
F
P2
P1 A0
B0
K0
D0
D1
W
t
2:1
Table 13: Dimensions in [mm]
Device A0 B0 B1 K0 F P1 W PO P2 D0 D1 T
4.4×2.6 3.0 5.0 5.5 2.5 5.5 4.0 12 4.0 2.0 1.5 1.5 0.3
25
humidity indicator card el EKCELITAS rEcHNoLoclzsw
P r o d u c t S p e c i f i c a t i o n
Excelitas Technologies GmbH & Co. KG
Wenzel-Jaksch-Str. 31
65199 Wiesbaden Germany
Tel.: +49 (0)611 492 0
Fax.: +49 (0) 611 492 177 www.excelitas.com
TPiS 1S 1385 / 5029 18/11/2016- Preliminary
Figure 23: Packaging specications
humidity indicator card
ESD cauon label
white paper tape
(to hold the desiccant)
1 unit desiccant
lled reel
part number label
ESD cauon label
moisture sensive label
moisture barrier bag
part number label
moisture sensive label
ESD cauon label
part number label cover with bubble pack
QA acceptance
seal label
brown tape
label with logo
and RoHS label
26
EKCELITAS TECHNOLOGIES:
P r o d u c t S p e c i f i c a t i o n
Excelitas Technologies GmbH & Co. KG
Wenzel-Jaksch-Str. 31
65199 Wiesbaden Germany
Tel.: +49 (0)611 492 0
Fax.: +49 (0) 611 492 177 www.excelitas.com
TPiS 1S 1385 / 5029 18/11/2016- Preliminary
11 Statements
11.1 Patents
For several features of the CaliPileTM patents are pending.
11.2 Quality
Excelitas Technologies is an ISO 9001 certied manufacturer. All devices employing PCB assemblies are manufac-
tured according IPC-A-610 guidelines.
11.3 RoHS
This sensor is a lead-free component and complies with the current RoHS regulations, especially with existing
road-maps of lead-free soldering.
11.4 Liability Policy
The contents of this document are subject to change without notice and customers should consult with Excelitas
Technologies sales representatives before ordering. Customers considering the use of Excelitas Technologies ther-
mopile devices in applications where failure may cause personal injury or property damage, or where extremely
high levels of reliability are demanded, are requested to discuss their concerns with Excelitas Technologies sales
representatives before such use. The Companys responsibility for damages will be limited to the repair or re-
placement of defective product. As with any semiconductor device, thermopile sensors or modules have a certain
inherent rate of failure. To protect against injury, damage or loss from such failures, customers are advised to
incorporate appropriate safety design measures into their product.
11.5 Copyright
This document and the product to which it relates are protected by copyright law from unauthorized reproduction.
Notice to U.S. Government End Users The Software and Documentation are "Commercial Items", as that term is
dened at 48 C.F.R. 2.101, consisting of "Commercial Computer Software" and "Commercial Computer Software
Documentation," as such terms are used in 48 C.F.R. 12.212 or 48 C.F.R. 227.7202, as applicable. Consistent with
48 C.F.R. 12.212 or 48 C.F.R. 227.7202-1 through 227.7202-4, as applicable, the Commercial Computer Software
and Commercial Computer Software Documentation are being licensed to the U.S. Government end users (a) only
as Commercial Items and (b) with only those rights as are granted to all other end users pursuant to the terms
and conditions herein. Unpublished rights reserved under the copyright laws of the United States.
27

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