54102, 53885 Series Performance Spec Datasheet by Molex

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molex 0.5mm If“)? Eifiifigfififi 3*79
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TITLE:
0.5 BOARD TO BOARD CONNECTOR (Hgt=2.5mm)
製品仕様書
B
変更
REVISED
J2015-0392
2014/10/01 Y.SATO06
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
J
STATUS
WRITTEN
BY:
M.NABEI
CHECKED
BY:
K.TOYODA
APPROVED
BY:
N.UKITA
DATE: YR/MO/DAY
2006/09/28
DOCUMENT NUMBER
PS-54102-011
FILE NAME
PS-54102-011_B.docx
SHEET
1 OF 14
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
1. 適用範囲 SCOPE
本仕様書は、 殿 に納入する
0.5 mm ピッ 基板対基板 コネク について規定する。
This product specification covers the performance requirements for 0.5 mm PITCH BOARD TO BOARD CONNECTOR series.
2. 製品名称及び型番 PRODUCT NAME AND PART NUMBER
Product Name
Part Number
リセプタクル ハウジング ッセンブリ
Receptacle Housing Assembly
54102-***3
54102-*** エンボス梱包品
Embossed Tape Package For 54102-***3
54102-***4
プラグ ハウジング アッセンブリ
Plug Housing Assembly
53885***1
53885-***1 エンボス梱包品
Embossed Tape Package For 53885-***1
53885***8
: 図面参照 Refer to the drawing.
3.定 RATINGS
Item
Standard
最大許容電圧
Rated Voltage (MAXIMUM)
50 V
[ AC (実効値 rms) / DC ]
最大許容電流
Rated Current (MAXIMUM)
0.5A
使用温度範囲
Operating Temperature Range
-40°C +105°C *1
*1:通電による温度上昇分を含む。
This includes the terminal temperature rise generated by conducting electricity.
molex 4,1_ ififi’flflfifi E‘ectrica‘ Periormance 4,2 3‘] 32 E Mechanica‘ Periormance
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PRODUCT SPECIFICATION
4. PERFORMANCE
4-1. 電気的性能 Electrical Performance
Item
Test Condition
Requirement
4-1-1
Contact Resistance
コネクタを嵌合させ、開放電 20mV 以下、
短絡電流 10mA以下 にて測定する。
(JIS C5402 5.4)
Mate connectors, measured at the open circuit voltage
20mV MAXIMUM and short circuit 10mA MAXIMUM.
(JIS C5402 5.4)
40 milliohm MAXIMUM
4-1-2
Insulation Resistance
コネクタを嵌合させ、隣接するターミナル間に、
DC 500V を印加し測定する。
(JIS C5402 5.2/MIL-STD-202 験法 302)
Mate connectors, measured by applying DC 500V
between adjacent terminal.
(JIS C5402 5.2/MIL-STD-202 Method 302)
100 Megohm MINIMUM
4-1-3
Dielectric Strength
コネクタを嵌合させ、隣接するタ-ミナル間に、
AC[rms] 500V [実効値] 1分間 印加する。
(JIS C5402 5.1/MIL-STD-202 験法 301)
Mate connectors, apply 500V AC[rms] for
1 minute between adjacent terminal.
(JIS C5402 5.1/MIL-STD-202 Method 301)
異状なきこと
No Breakdown
4-2. 械的性能 Mechanical Performance
Item
Test Condition
Requirement
4-2-1
挿入力及び抜去
Insertion and
Withdrawal Force
毎分 25±3mm の速さで挿入、抜去を行う
Insert and withdraw connectors at the speed rate of
25+/-3mm/minute.
第6項参照
Refer to paragraph 6
4-2-2
ターミナル保持
Terminal / Housing
Retention Force
ハウジングに装着されたターミナルを毎分 25±3mm
の速さで引張る。尚、PLUG側コネクタはオーバーモ
ールド品の為、PLUG TERM.外の測定とする
Pull the terminal mated with the housing at the speed of
25+/-3mm/minute.
The connector on the side of the plug is overmolded.
Therefore, measure the retention force except Plug Term.
0.49N {0.05 kgf}
MINIMUM
molex 473. f 0) 1m Environmental Periormance and Others
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PRODUCT SPECIFICATION
4-3.そ Environmental Performance and Others
Item
Test Condition
Requirement
4-3-1
繰返し挿抜
Repeated Insertion /
Withdrawal
無通電状態にて1分間 10回以下 さで
挿入、抜去を 30 繰返す。
When mated up to 30 cycles repeatedly by the
rate of 10 cycles per minute in the power-off
state.
Contact
Resistance
80 milliohm
MAXIMUM
4-3-2
Temperature Rise
コネクタを嵌合させ、最大許容電流を
通電し、コネクタの温度上昇分を測定す
る。
(UL 498)
Mate connectors, measure the temperature rise
of contact when the maximum AC rated
current is passed.
(UL 498)
Temperature
Rise
30 °C MAXIMUM
4-3-3
Vibration
コネクタを嵌合させ、DC 1mA 通電状態に
て、嵌合軸を含む互いに垂直な3に掃
引割合 105510 Hz/分、全振幅 1.5mm
の振動を各2時間加える。
(JIS C 60068-2-6 /MIL-STD-202
201)
Mate connectors, add to each 2 hours with
ratio sweep 10-55-10 Hz per minute and
total amplitude 1.5 mm vibration at 3
directions mutually vertical including fitting
axis in DC 1 mA electricity state.
(JIS C 60068-2-6 /MIL-STD-202 Method 201)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm
MAXIMUM
Discontinuity
1.0 microsec.
MAXIMUM
4-3-4
Mechanical
Shock
コネクタを嵌合させ、DC 1mA 通電状態に
て、嵌合軸を含む互いに垂直な 6方向
490m/s { 50G } 衝撃を作用時間11ミリ秒
で各3 加える。
(JIS C60068-2-27/MIL-STD-202
試験法 213)
Mate connectors, add to each 3 times with
impact of 490m/s2{50G} on action time 11
milliseconds at 6 directions mutually
vertical including fitting axis in DC 1 mA
electricity state.
(JIS C60068-2-27/MIL-STD-202
Method 213)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm
MAXIMUM
Discontinuity
1.0 microsec.
MAXIMUM
molex
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PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-5
Heat Resistance
コネクタを嵌合させ、85±2°C 雰囲気中
96時間 放置後取り出し、12時間
温に放置する。
(JIS C60068-2-2/MIL-STD-202 試験法
108)
Mate connectors, exposing for 96 hours in
the atmosphere of 85+/-2 degree C. After
the test, allowed to stand at room
temperature for 1 to 2 hours before
checking functionality.
(JIS C60068-2-2/MIL-STD-202 Method 108)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm
MAXIMUM
4-3-6
Cold Resistance
コネクタを嵌合させ、25±3°C
雰囲気中に 96時間 放置後取り出し
12時間 室温に放置する。
(JIS C60068-2-1)
Mate connectors, exposing -25+/-3 degree
C for 96 hours. Upon completion of the
exposure period, the test specimens shall
be conditioned at ambient room conditions
for 1 to 2 hours, after which the specified
measurements shall be performed.
(JIS C60068-2-1)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm
MAXIMUM
4-3-7
湿
Humidity
コネクタを嵌合させ、40±2°C
相対湿度 9095 の雰囲気中に
96時間 放置後取り出し12時間
室温に放置する
(JIS C60068-2-3/MIL-STD-202 試験法
103)
Mate connectors, exposing for 96 hours in
an atmosphere of 40+/-2 degree C,
relative humidity 90 to 95%. After the test,
allowed to stand at room temperature for
1 to 2 hours before checking functionality.
(JIS C60068-2-3/MIL-STD-202 Method 103)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm
MAXIMUM
Dielectric
Strength
4-1-3 満足のこと
Must meet 4-1-3
Insulation
Resistance
100 Megohm
MINIMUM
molex HIS 06006872714)
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PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-8
温度サイクル
Temperature
Cycling
コネクタを嵌合させ、–55°C30分、
+85°C30分これを1サイクルとし
5サイクル繰返す。
但し、温度移行時間は5分以内とする。
試験後12時間室温に放置する。
(JIS C60068-2-14)
Mate connectors, exposing to 85+/-2 degree
C and -55+/-3 degree C temperature
extremes for 30 minutes each including a
0-5 minutes transition time. The
above-mentioned condition is repeated 5
cycles. After the test, allowed to stand at the
room temperature for 1 to 2 hours before
checking functionality.
(JIS C60068-2-14)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAXIMUM
4-3-9
Salt Spray
コネクタを嵌合させ、35±2°C にて
5±1% 重量比 塩水を 48±4時間 噴霧し、
試験後常温で水洗いした後、室温で乾燥させ
る。
(JIS C60068-2-11/MIL-STD-202 試 験 法
101)
Mate connectors, exposing to the
atmosphere where salt mist is diffused in.
Other condition is written below.
NaCl solution : 5+/-1% by weight
Temperature : 35+/-2 degree C
Duration : 48 hours
After the test, they should be washed well
by water and dried at room temperature
before checking functionality.
(JIS C60068-2-11/MIL-STD-202 Method 101)
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm MAXIMUM
4-3-10
亜硫酸ガス
SO2 Gas
コネクタを嵌合させ、40±2°C にて
50±5ppm 亜硫酸ガス中に 24時間 放置
する。
Mate connectors, exposing to the
atmosphere is written below.
Gas Concentration : SO2=50+/-5ppm
Temperature : 40+/-2 degree C
Duration : 24h
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohm
MAXIMUM
molex W ¥$EEIB§ Se‘dering iron method
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-11
耐アンモニア性
NH3 Gas
コネクタを嵌合させ、濃度 28%
アンモニア水を入れた容器中 40分間
放置する。
( 1L 対して 25mL の割合 )
40 minutes exposure to NH3 gas
evaporating from 28% Ammonia solution.
Appearance
異状なきこと
No Damage
Contact
Resistance
80 milliohms MAX.
4-3-12
半田付け性
Solderability
端子先端より 0.3mm金具先端より 0.3mm
245±3 3±0.5
浸す。
Soldering Time : 3±0.5 seconds.
Solder Temperature : 245±3
0.3mm from terminal tip
0.3mm from fitting nail tip
濡れ性
Solder
Wetting
浸漬面積の95%以上
95% of immersed
area must show no voids,
no pin holes.
4-3-13
半田耐熱性
Resistance to
Soldering Heat
外線リフロー Infrared Reflow Method
7項参照 2回リフロー実施
Refer to the paragraph 7
2 times reflow enforcement
Appearance
端子ガタ、割れ
異状なきこと
No Damage
半田時 Soldering iron method
端子先端より 0.3mm 、金具先端より
0.3mm の位置まで 370400
半田ゴテにて 最大5 加熱する。
(Soldering iron method)
Soldering time : 5 sec. MAX.
Solder Temperature : 370400
0.3mm from terminal tip
0.3mm from fitting nail tip
( ) :参考規格 Reference Standard
{ } :参考単位 Reference Unit
molex
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
5.外観形状、寸法及び材質 PRODUCT SHAPE, DIMENSIONS AND MATERIALS
図面参照 Refer to the drawing.
6.挿入力及び抜去 INSERTION/WITHDRAWAL FORCE
硬質基板に実装したコネクタを垂直に挿抜するときの挿入力及び抜去力を示します。
These Insertion/withdrawal forces are based on vertical mating/un-mating, with both Plug/Receptacle on rigid PWB’s.
Number of
Circuit
単位
UNIT
挿入力(最大値
Insertion (MAXIMUM)
抜去力(最小値
Withdrawal (MINIMUM)
初回
1st
6回目
6th
30回目
30th
初回
1st
6回目
6th
30回目
30th
16
N
{kgf}
39.2
{4.0}
39.2
{4.0}
39.2
{4.0}
5.49
{0.56}
3.92
{0.40}
3.92
{0.40}
20
N
{kgf}
49.0
{5.0}
49.0
{5.0}
49.0
{5.0}
6.86
{0.70}
4.90
{0.50}
4.90
{0.50}
30
N
{kgf}
49.0
{5.0}
49.0
{5.0}
49.0
{5.0}
6.86
{0.70}
4.90
{0.50}
4.90
{0.50}
40
N
{kgf}
49.0
{5.0}
49.0
{5.0}
49.0
{5.0}
6.86
{0.70}
4.90
{0.50}
4.90
{0.50}
50
N
{kgf}
49.0
{5.0}
49.0
{5.0}
49.0
{5.0}
6.86
{0.70}
4.90
{0.50}
4.90
{0.50}
60
N
{kgf}
49.0
{5.0}
49.0
{5.0}
49.0
{5.0}
6.86
{0.70}
4.90
{0.50}
4.90
{0.50}
70
N
{kgf}
49.0
{5.0}
49.0
{5.0}
49.0
{5.0}
6.86
{0.70}
4.90
{0.50}
4.90
{0.50}
molex 90~ 120 sec. > TEMPERATURE CONDITION GRAPH
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
【7.赤外線リフロー条件 INFRARED REFLOW CONDITION
250+5
-0 (ピーク温)
250+5
-0 (PEAK TEMP.)
230℃以上
230 MIN.
2040
2040 sec.
90120
90120 sec.
(予熱:150200)
(Pre-heat150200)
温度条件グラフ
TEMPERATURE CONDITION GRAPH
半田接合部の基板表面にて測
(Temperature is measured at the soldering area on the surface of the P.W. Board.)
注記:本リフロー条件に関しては、温度プロファイル、半田ペースト、大気、N2リフロー、基板などによ
り条件が異なりますので事前に実装評価(リフロー評価) を必ず実施願います。実装条件によっては、
製品性能に影響を及ぼす場合があります。
NOTE: Please investigate the mounting condition (reflow soldering condition) on your own devices
beforehand. The mounting conditions may change due to the soldering temperature, soldering paste,
air reflow machine, Nitrogen reflow machine, and the type of P.W. Board.
The different mounting conditions may have an influence on the product’s performance.
molex
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PRODUCT SPECIFICATION
【8.取り扱い上の注意事項 INSTRUCTION UPON USAGE
[嵌合]
嵌合は極力嵌合軸に沿って平行に行って下さい。(図-1)
その際、リセハウジングとプラグの外壁同士を合せる様に位置決めした後に押し込み嵌合して下さい。
斜めの嵌合になる場合は10°以下の角度でリセハウジングとプラグの外壁同士を軽く当て、位置決めした
後に嵌合して下さい。(図-2)
尚、コネクタ同士を過度に傾けた状態で嵌合を行いますと、ハウジングが破壊する恐れが有りますので
このような嵌合はお避け下さい。(図-3)
Please mate the connector with parallel manner. (Figure-1)
Please locate the inside wall of rec. housing and plug before mating.
In the case of skew mating, please do not mate the connector at more than 10°lead
in angle . (Figure-2)
Please do not mate connector at an angle as this manner, because the housing might be broken.
(Figure-3)
[抜去]
抜去は極力嵌合軸に沿って平行に行って下さい。(図-1)
または、左右に少しずつ振りながら行って下さい。(図-4)
(過度のこじり抜去には注意して下さい。)(図-5)
Please extract the connector with parallel manner. (Figure-1),
or swing them right to left slightly. (Figure-4)
(Please take care of excess twist extraction.) (Figure-5)
molex :I <2 vereij="">
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PRODUCT SPECIFICATION
Fig.5 Un-mating with one strong rotation (can damage connector)
Fig.3 Mating with aligning plug inside wall to receptacle inside wall (Not preferred)
Fig.2 Mating with aligning plug outside wall to receptacle inside wall
Fig.1 Mating & Un-mating vertically (Ideal)
Fig.4 Un-mating by shaking back and forth
Best
Acceptable
Not Good
Best
Not Good
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PRODUCT SPECIFICATION
【9.その他 注意事項 OTHERS
1. 本製品の樹脂部に黒点、ウエルド部の線、多少の傷が確認される事がありますが、製品性能には影響ご
ざいません。
Although this product may have a small black mark, a weld line or a scratch on the housing, these will not
have any influence on the products performance.
2. 成形品の色相に多少の違いを生じる場合がありますが、製品性能には影響ありません。
There may be slight differences in the housing coloring, but there will be no influence on the product’s
performance.
3. 基板実装前後に端子に触らないでください。
Please do not touch the terminals before or after reflowing the connector onto the P.W. Board.
4. 実装性能(平坦度)は、実装基板の反りの影響を含まないものと致します。
基板の反りはコネクタ両端部を基準とし、コネクタ中央部にて Max0.02mmして下さい
The mounting specification for coplanarity does not include the influence of warpage of the P.W.Board.
The warpage of the P.W. Board should be a maximum of 0.02mm if measuring from one connector edge
to the other.
5. 本製品の一般性能確認はリジット基板にて実施しております。
フレキシブル基板等の特殊な基板へ実装する場合は、事前に実装確認等を行った上でご使用願います。
The product performance was tested using rigid P.W. Board. In case the product needs to be reflowed
onto flexible circuit board, please conduct a reflow test on the flexible circuit board in advance.
6. フレキシブル基板に実装する場合は、基板の変形を防止するため、補強板のご使用をお勧めします。
Please apply capton when you mount the connector onto FFC/FPC to prevent deformation of FPC.
7. 一枚の基板にコネクタを複数実装する場合は、嵌合相手側はそれぞれ個別の基板に実装して
ご使用を願います。
There should not be more than one Board to board connection between two separate P.W. Boards.
When mounting several board to board connectors between parallel P.W. Boards,
please ensure to separate each mated board to board connector by using separate P.W. Boards.
8. リフロー条件によっては、樹脂部の変色や端子めっき部にヨリが発生する場合がありますが、
製品性能に影響はございません。
Depending on the reflow conditions, there may be the possibility of a color change in the housing.
However, this color change does not have any effect on the products performance.
9. リフロー後、半田付け部に変色が見られることがありますが、製品性能に影響はありません。
Although there might be some discoloration seen on the soldering tail after reflow,
this will not influence the products performance.
molex
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
0.5 BOARD TO BOARD CONNECTOR (Hgt=2.5mm)
製品仕様書
B
SEE SHEET 1 OF 14
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-54102-011
FILE NAME
PS-54102-011_B.docx
SHEET
12 OF 14
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
10. 本製品は端子先端部にカット面がある為、端子先端部の実装性(板への半田付け性)
端子側面・後側に比べて悪くなります。
しかし、側面及び後側においてフィレットが形成されていれば、機能及び強度に問題はありません。
Because this product has a cutoff area on the tip of the terminal, the solderability performance in this area
is not as good as compared to the side/back of the terminal. However, by building a good soldering fillet
at the side/back of the terminal, there will be no issue on either the product function or the P.W. Board
retention force.
11. 半田実装部の未半田は、ターミナル脱落、ピン間ショート、ターミナル座屈、またコネクタの基板から
の外れが懸念されます。従って全てのターミナルテール部に半田付けを行って下さい。
If you leave any soldering area on this product open, there may be the possibility of a missing terminal
short circuiting between pins, terminal buckling or the potential for the connector to come off of the P.W.
Boards. Therefore, please solder all of the terminals on the printed circuit board.
12. 実装機によってコネクタに負荷が加わると変形、破損する場合がありますので事前にご確認下さい。
If there is accidental contact with the connector while it is going through the reflow machine, there may be
deformation or damage caused to the connector. Please check to prevent this.
13. 実装後において半田ごてによるリペアーを行なう際は、必ず仕様書掲載の条件以内で行なって下さい。
条件を超えて実施した場合、端子の抜け、接点ギャップの変化、モールドの変形、溶融等、破損の原因
溶融等、破損の原因になります。
When you need to repair the connector after reflow by using a solder iron, please perform under the
conditions of this product specification.
14. 半田ごてによる手修正を行なう際、過度の半田やフラックスを使用しないで下さい。
半田上がりやフラックス上がりにより接触、機能不良に至る場合があります。
When conducting manual repairs using a soldering iron, please do not use more solder and flux than
needed.This may cause solder wicking and flux wicking issues, and it will eventually cause a contact
defect and functional issues.
15. 嵌合の際、嵌合が不十分にならないようにご注意下さい。また、セットへの組み込み後も、
振動、衝撃等で嵌合の浮きが発生しないような状態にて使用してください。
After mating, complete mating shall be confirmed.
Please consider to take measure to hold the mated connectors with chassis against shock or vibration.
16. 嵌合後、コネクタピッチ方向、スパン方向及び回転方向への負荷がかかるような動作またはセットは
しないでください。コネクタ破壊やはんだクラックを引き起こします
After mated the connector, please do not allow the P.W. Boards to apply pressure on
the connector in either the pitch direction or the span direction. It may cause damage to the connector
and may crack the soldering.
molex
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
0.5 BOARD TO BOARD CONNECTOR (Hgt=2.5mm)
製品仕様書
B
SEE SHEET 1 OF 14
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-54102-011
FILE NAME
PS-54102-011_B.docx
SHEET
13 OF 14
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
17. 本製品をご使用時に取り付けられた電線・プリント基板の共振や、機器の回転構造や可動部分の動作に
よりコネクタ嵌合部(接点部)が常に動いてしまう状態での御使用は避けて下さい
接触部の摺動磨耗等による接触不良の原因となります。
従って、機器内で電線・プリント基板を固定し、共振を抑える等の処置をお願い致します。
Please do not use the connector in a condition where the wire, the P.W. Board, or the contact area is
experiencing a sympathetic vibration of wires and P.W. Board, and constant movement of devices. This
may cause a defect in the contact due to the contact area being worn down. Therefore, please fix wires
and P.W. Board on the chassis, and reduces sympathetic vibration.
18. コネクタの性能を損なう恐れがある為、コネクタの洗浄は、行わないで下さい。
Please do not conduct any “washing process” on the connector
because it may damage the product’s function.
19. コネクタのみで基板を支えることは避け、コネクタ以外での基板固定対策を行ってください。
Please do not use the connector alone to provide mechanical support for the P.W. Board.
20. コネクタに外力が加わらないようにクリアランスをあけた筐体構造にして下さい。
Please keep enough clearance between connector and chassis of your application in order not to apply
pressure on the connector.
21. 活電状態の電気回路で、挿入、抜去ができることを前提に作られていません。スパーク等による危険の
発生、性能不良につながりますので、活電状態での挿入、抜去はしないで下さい。
This product is not designed for the mating and unmating of the connectors to be performed under the
condition of an active electrical circuit. It may cause a spark and product defect if the connectors are
mated and unmated in this way.
molex
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE:
0.5 BOARD TO BOARD CONNECTOR (Hgt=2.5mm)
製品仕様書
B
SEE SHEET 1 OF 14
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-54102-011
FILE NAME
PS-54102-011_B.docx
SHEET
14 OF 14
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED BY :
A
RELEASED
'06/09/28
J2007-0946
M.NABEI
K.TOYODA
B
REVISED
2014/10/01
J2015-0392
Y.SATO06
T.ASAKAWA

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