MCP413x,415x,423x,425x Datasheet by Microchip Technology

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© 2008 Microchip Technology Inc. DS22060B-page 1
MCP413X/415X/423X/425X
Features
Single or Dual Resistor Network options
Potentiometer or Rheostat configuration options
Resistor Network Resolution
- 7-bit: 128 Resistors (129 Steps)
- 8-bit: 256 Resistors (257 Steps)
•R
AB Resistances options of:
-5k
-10k
-50k
- 100 k
Zero Scale to Full-Scale Wiper operation
Low Wiper Resistance: 75 (typical)
Low Tempco:
- Absolute (Rheostat): 50 ppm typical
(0°C to 70°C)
- Ratiometric (Potentiometer): 15 ppm typical
SPI Serial Interface (10 MHz, modes 0,0 & 1,1)
- High-Speed Read/Writes to wiper registers
- SDI/SDO multiplexing (MCP41X1 only)
Resistor Network Terminal Disconnect Feature
via:
- Shutdown pin (SHDN)
- Terminal Control (TCON) Register
Brown-out reset protection (1.5V typical)
Serial Interface Inactive current (2.5 uA typical)
High-Voltage Tolerant Digital Inputs: Up to 12.5V
Supports Split Rail Applications
Internal weak pull-up on all digital inputs
Wide Operating Voltage:
- 2.7V to 5.5V - Device Characteristics
Specified
- 1.8V to 5.5V - Device Operation
Wide Bandwidth (-3 dB) Operation:
- 2 MHz (typical) for 5.0 k device
Extended temperature range (-40°C to +125°C)
Description
The MCP41XX and MCP42XX devices offer a wide
range of product offerings using an SPI interface. This
family of devices support 7-bit and 8-bit resistor
networks, and Potentiometer and Rheostat pinouts.
Package Types (top view)
1
2
3
45
6
7
8
P0W
P0B
P0A
VSS
VDD
MCP41X1
Single Potentiometer
PDIP, SOIC, MSOP
CS
SDI/SDO
SCK
1
2
3
45
6
7
8
P0B
SDO
P0W
V
DD
MCP41X2
Single Rheostat
PDIP, SOIC, MSOP
1
2
3
411
12
13
14
SHDN
SDO
WP
VDD
MCP42X1 Dual Potentiometers
PDIP, SOIC, TSSOP
5
6
78
9
10
P0W
P0B
P0A
P1A
P1W
P1B
V
SS
CS
SDI
SCK
VSS
CS
SDI
SCK
4x4 QFN*
1
2
3
47
8
9
10
SDO
VDD
MCP42X2 Dual Rheostat
MSOP, DFN
56
P0B
P0W
P1W
P1B
VSS
CS
SDI
SCK
3x3 DFN*
SDI/SDO
SCK
VSS
P0B
P0W
1
2
3
4
8
7
6
5P0A
CS
EP
9
3x3 DFN*
SDI
SCK
VSS
SDO
P0B
1
2
3
4
8
7
6
5P0W
VDD
CS
EP
9
VDD
3x3 DFN*
SDI
SCK
VSS
SDO
P0B
1
2
3
4
10
9
8
7P0W
CS
EP
11
VDD
56
P1B P1W
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2
VSS
VSS
SCK WP
NC
P1B
P0B
P1W
P1A
P0A
P0W
CS
VDD
SDO
SHDN
SDI EP
16
1
15 14 13
3
4
12
11
10
9
5678
17
7/8-Bit Single/Dual SPI Digital POT with Volatile Memory
MCP413X/415X/423X/425X
DS22060B-page 2 © 2008 Microchip Technology Inc.
Device Block Diagram
Device Features
Device
# of POTs
Wiper
Configuration
Control
Interface
Memory
Type
WiperLock
Technology
POR Wiper
Setting
Resistance (typical)
# of Steps
VDD
Operating
Range (2)
RAB Options (k)
Wiper
- RW
()
MCP4131 (3) 1 Potentiometer
(1) SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 129 1.8V to 5.5V
MCP4132 (3) 1 Rheostat SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 129 1.8V to 5.5V
MCP4141 1Potentiometer
(1) SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 129 2.7V to 5.5V
MCP4142 1Rheostat SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 129 2.7V to 5.5V
MCP4151 (3) 1 Potentiometer
(1) SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 257 1.8V to 5.5V
MCP4152 (3) 1 Rheostat SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 257 1.8V to 5.5V
MCP4161 1Potentiometer
(1) SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 257 2.7V to 5.5V
MCP4162 1Rheostat SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 257 2.7V to 5.5V
MCP4231 (3) 2 Potentiometer
(1) SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 129 1.8V to 5.5V
MCP4232 (3) 2 Rheostat SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 129 1.8V to 5.5V
MCP4241 2Potentiometer
(1) SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 129 2.7V to 5.5V
MCP4242 2Rheostat SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 129 2.7V to 5.5V
MCP4251 (3) 2 Potentiometer
(1) SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 257 1.8V to 5.5V
MCP4252 (3) 2 Rheostat SPI RAM No Mid-Scale 5.0, 10.0, 50.0, 100.0 75 257 1.8V to 5.5V
MCP4261 2Potentiometer
(1) SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 257 2.7V to 5.5V
MCP4262 2Rheostat SPI EE Yes NV Wiper 5.0, 10.0, 50.0, 100.0 75 257 2.7V to 5.5V
Note 1: Floating either terminal (A or B) allows the device to be used as a Rheostat (variable resistor).
2: Analog characteristics only tested from 2.7V to 5.5V unless otherwise noted.
3: Please check Microchip web site for device release and availability.
Power-up/
Brown-out
Control
VDD
VSS
SPI Serial
Interface
Module &
Control
Logic
(WiperLock™
Technology)
Resistor
Network 0
(Pot 0)
Wiper 0
& TCON
Register
Resistor
Network 1
(Pot 1)
Wiper 1
& TCON
Register
CS
SCK
SDI
SDO
NC
SHDN
Memory (4x9)
Wiper0
Wiper1
TCON
STATUS
P0A
P0W
P0B
P1A
P1W
P1B
For Dual Resistor Network
Devices Only
For Dual Potentiometer
Devices Only
© 2008 Microchip Technology Inc. DS22060B-page 3
MCP413X/415X/423X/425X
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on VDD with respect to VSS ............... -0.6V to +7.0V
Voltage on CS, SCK, SDI, SDI/SDO, and
SHDN with respect to VSS ...................................... -0.6V to 12.5V
Voltage on all other pins (PxA, PxW, PxB, and
SDO) with respect to VSS ............................ -0.3V to VDD + 0.3V
Input clamp current, IIK
(VI < 0, VI > VDD, VI > VPP ON HV pins) ......................±20 mA
Output clamp current, IOK
(VO < 0 or VO > VDD) ..................................................±20 mA
Maximum output current sunk by any Output pin
......................................................................................25 mA
Maximum output current sourced by any Output pin
......................................................................................25 mA
Maximum current out of VSS pin .................................100 mA
Maximum current into VDD pin ....................................100 mA
Maximum current into PXA, PXW & PXB pins ............±2.5 mA
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
.....................................................................-40°C to +125°C
Total power dissipation (Note 1) ................................400 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins .................................. 4 kV (HBM),
.......................................................................... 300V (MM)
Maximum Junction Temperature (TJ) ......................... +150°C
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Note 1: Power dissipation is calculated as follows:
Pdis = VDD x {IDD - IOH} + {(VDD-VOH) x IOH} + (VOl x IOL)
VDD VBOR V‘H VDD
MCP413X/415X/423X/425X
DS22060B-page 4 © 2008 Microchip Technology Inc.
AC/DC CHARACTERISTICS
DC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C TA +125°C (extended)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Supply Voltage VDD 2.7 — 5.5 V
1.8 2.7 V Serial Interface only.
CS, SDI, SDO,
SCK, SHDN pin
Voltage Range
VHV V
SS 12.5V V VDD
4.5V
The CS pin will be at one
of three input levels
(VIL, VIH or VIHH). (Note 6)
VSS —V
DD +
8.0V
VV
DD <
4.5V
VDD Start Voltage
to ensure Wiper
Reset
VBOR 1.65 V RAM retention voltage (VRAM) < VBOR
VDD Rise Rate to
ensure Power-on
Reset
VDDRR (Note 9)V/ms
Delay after device
exits the reset
state
(VDD > VBOR)
TBORD —1020µs
Supply Current
(Note 10)
IDD 450 µA Serial Interface Active,
VDD = 5.5V, CS = VIL, SCK @ 5 MHz,
write all 0’s to volatile Wiper 0 (address
0h)
2.5 5 µA Serial Interface Inactive,
CS = VIH, VDD = 5.5V
0.55 1 mA Serial Interface Active,
VDD = 5.5V, CS = VIHH,
SCK @ 5 MHz,
decrement volatile Wiper 0 (address 0h)
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
© 2008 Microchip Technology Inc. DS22060B-page 5
MCP413X/415X/423X/425X
Resistance
(± 20%)
RAB 4.0 5 6.0 k-502 devices (Note 1)
8.0 10 12.0 k-103 devices (Note 1)
40.0 50 60.0 k-503 devices (Note 1)
80.0 100 120.0 k-104 devices (Note 1)
Resolution N 257 Taps 8-bit No Missing Codes
129 Taps 7-bit No Missing Codes
Step Resistance RS —R
AB /
(256)
8-bit Note 6
—R
AB /
(128)
7-bit Note 6
Nominal
Resistance Match
|RAB0 - RAB1|
/ RAB
0.2 1.25 % MCP42X1 devices only
|RBW0 - RBW1|
/ RBW
—0.251.5 %MCP42X2 devices only,
Code = Full-Scale
Wiper Resistance
(Note 3, Note 4)
RW 75 160 VDD = 5.5 V, IW = 2.0 mA, code = 00h
75 300 VDD = 2.7 V, IW = 2.0 mA, code = 00h
Nominal
Resistance
Temp c o
ΔRAB/ΔT 50 ppm/°C TA = -20°C to +70°C
100 ppm/°C TA = -40°C to +85°C
150 ppm/°C TA = -40°C to +125°C
Ratiometeric
Temp c o
ΔVWB/ΔT 15 ppm/°C Code = Midscale (80h or 40h)
Resistor Terminal
Input Voltage
Range (Terminals
A, B and W)
VA,VW,VBVSS —V
DD VNote 5, Note 6
Maximum current
through A, W or B
IW——2.5mANote 6, Worst case current through
wiper when wiper is either Full-Scale or
Zero Scale.
Leakage current
into A, W or B
IWL —100nAMCP4XX1 PxA = PxW = PxB = VSS
—100nAMCP4XX2 PxB = PxW = VSS
AC/DC CHARACTERISTICS (CONTINUED)
DC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C TA +125°C (extended)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
MCP413X/415X/423X/425X
DS22060B-page 6 © 2008 Microchip Technology Inc.
Full-Scale Error
(MCP4XX1 only)
(8-bit code =
100h,
7-bit code = 80h)
VWFSE -6.0 -0.1 LSb 5 k 8-bit 3.0V VDD 5.5V
-4.0 -0.1 LSb 7-bit 3.0V VDD 5.5V
-3.5 -0.1 LSb 10 k 8-bit 3.0V VDD 5.5V
-2.0 -0.1 LSb 7-bit 3.0V VDD 5.5V
-0.8 -0.1 LSb 50 k 8-bit 3.0V VDD 5.5V
-0.5 -0.1 LSb 7-bit 3.0V VDD 5.5V
-0.5 -0.1 LSb 100 k 8-bit 3.0V VDD 5.5V
-0.5 -0.1 LSb 7-bit 3.0V VDD 5.5V
Zero-Scale Error
(MCP4XX1 only)
(8-bit code = 00h,
7-bit code = 00h)
VWZSE —+0.1+6.0LSb5k 8-bit 3.0V VDD 5.5V
+0.1 +3.0 LSb 7-bit 3.0V VDD 5.5V
+0.1 +3.5 LSb 10 k 8-bit 3.0V VDD 5.5V
+0.1 +2.0 LSb 7-bit 3.0V VDD 5.5V
+0.1 +0.8 LSb 50 k 8-bit 3.0V VDD 5.5V
+0.1 +0.5 LSb 7-bit 3.0V VDD 5.5V
+0.1 +0.5 LSb 100 k 8-bit 3.0V VDD 5.5V
+0.1 +0.5 LSb 7-bit 3.0V VDD 5.5V
Potentiometer
Integral
Non-linearity
INL -1 ±0.5 +1 LSb 8-bit 3.0V VDD 5.5V
MCP4XX1 devices only
(Note 2)
-0.5 ±0.25 +0.5 LSb 7-bit
Potentiometer
Differential
Non-linearity
DNL -0.5 ±0.25 +0.5 LSb 8-bit 3.0V VDD 5.5V
MCP4XX1 devices only
(Note 2)
-0.25 ±0.125 +0.25 LSb 7-bit
Bandwidth -3 dB
(See Figure 2-64,
load = 30 pF)
BW 2 MHz 5 k8-bit Code = 80h
2 MHz 7-bit Code = 40h
—1MHz10k8-bit Code = 80h
1 MHz 7-bit Code = 40h
—200kHz50k8-bit Code = 80h
200 kHz 7-bit Code = 40h
—100kHz100k8-bit Code = 80h
100 kHz 7-bit Code = 40h
AC/DC CHARACTERISTICS (CONTINUED)
DC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C TA +125°C (extended)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
© 2008 Microchip Technology Inc. DS22060B-page 7
MCP413X/415X/423X/425X
Rheostat Integral
Non-linearity
MCP41X1
(Note 4, Note 8)
MCP4XX2
devices only
(Note 4)
R-INL -1.5 ±0.5 +1.5 LSb 5 k8-bit 5.5V, IW = 900 µA
-8.25 +4.5 +8.25 LSb 3.0V, IW = 480 µA
(Note 7)
Section 2.0 1.8V
-1.125 ±0.5 +1.125 LSb 7-bit 5.5V, IW = 900 µA
-6.0 +4.5 +6.0 LSb 3.0V, IW = 480 µA
(Note 7)
Section 2.0 1.8V
-1.5 ±0.5 +1.5 LSb 10 k8-bit 5.5V, IW = 450 µA
-5.5 +2.5 +5.5 LSb 3.0V, IW = 240 µA
(Note 7)
Section 2.0 1.8V
-1.125 ±0.5 +1.125 LSb 7-bit 5.5V, IW = 450 µA
-4.0 +2.5 +4.0 LSb 3.0V, IW = 240 µA
(Note 7)
Section 2.0 1.8V
-1.5 ±0.5 +1.5 LSb 50 k8-bit 5.5V, IW = 90 µA
-2.0 +1 +2.0 LSb 3.0V, IW = 48 µA
(Note 7)
Section 2.0 1.8V
-1.125 ±0.5 +1.125 LSb 7-bit 5.5V, IW = 90 µA
-1.5 +1 +1.5 LSb 3.0V, IW = 48 µA
(Note 7)
Section 2.0 1.8V
-1.0 ±0.5 +1.0 LSb 100 k8-bit 5.5V, IW = 45 µA
-1.5 +0.25 +1.5 LSb 3.0V, IW = 24 µA
(Note 7)
Section 2.0 1.8V
-0.8 ±0.5 +0.8 LSb 7-bit 5.5V, IW = 45 µA
-1.125 +0.25 +1.125 LSb 3.0V, IW = 24 µA
(Note 7)
Section 2.0 1.8v
AC/DC CHARACTERISTICS (CONTINUED)
DC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C TA +125°C (extended)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
MCP413X/415X/423X/425X
DS22060B-page 8 © 2008 Microchip Technology Inc.
Rheostat
Differential
Non-linearity
MCP41X1
(Note 4, Note 8)
MCP4XX2
devices only
(Note 4)
R-DNL -0.5 ±0.25 +0.5 LSb 5 k8-bit 5.5V, IW = 900 µA
-1.0 +0.5 +1.0 LSb 3.0V (Note 7)
Section 2.0 1.8V
-0.375 ±0.25 +0.375 LSb 7-bit 5.5V, IW = 900 µA
-0.75 +0.5 +0.75 LSb 3.0V (Note 7)
Section 2.0 1.8V
-0.5 ±0.25 +0.5 LSb 10 k8-bit 5.5V, IW = 450 µA
-1.0 +0.25 +1.0 LSb 3.0V (Note 7)
Section 2.0 1.8V
-0.375 ±0.25 +0.375 LSb 7-bit 5.5V, IW = 450 µA
-0.75 +0.5 +0.75 LSb 3.0V (Note 7)
Section 2.0 1.8V
-0.5 ±0.25 +0.5 LSb 50 k8-bit 5.5V, IW = 90 µA
-0.5 ±0.25 +0.5 LSb 3.0V (Note 7)
Section 2.0 1.8V
-0.375 ±0.25 +0.375 LSb 7-bit 5.5V, IW = 90 µA
-0.375 ±0.25 +0.375 LSb 3.0V (Note 7)
Section 2.0 1.8V
-0.5 ±0.25 +0.5 LSb 100 k8-bit 5.5V, IW = 45 µA
-0.5 ±0.25 +0.5 LSb 3.0V (Note 7)
Section 2.0 1.8V
-0.375 ±0.25 +0.375 LSb 7-bit 5.5V, IW = 45 µA
-0.375 ±0.25 +0.375 LSb 3.0V (Note 7)
1.8V
Capacitance (PA)C
AW 75 pF f =1 MHz, Code = Full-Scale
Capacitance (Pw)C
W 120 pF f =1 MHz, Code = Full-Scale
Capacitance (PB)C
BW 75 pF f =1 MHz, Code = Full-Scale
AC/DC CHARACTERISTICS (CONTINUED)
DC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C TA +125°C (extended)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
© 2008 Microchip Technology Inc. DS22060B-page 9
MCP413X/415X/423X/425X
Digital Inputs/Outputs (CS, SDI, SDO, SCK, SHDN)
Schmitt Trigger
High Input
Threshold
VIH 0.45 VDD —— V2.7V VDD 5.5V
(Allows 2.7V Digital VDD with
5V Analog VDD)
0.5 VDD —— V1.8V VDD 2.7V
Schmitt Trigger
Low Input
Threshold
VIL — 0.2VDD V
Hysteresis of
Schmitt Trigger
Inputs
VHYS —0.1V
DD —V
High Voltage Limit VMAX ——12.5
(6) V Pin can tolerate VMAX or less.
Output Low
Voltage (SDO)
VOL V
SS —0.3V
DD VI
OL = 5 mA, VDD = 5.5V
VSS —0.3V
DD VI
OL = 1 mA, VDD = 1.8V
Output High
Voltage (SDO)
VOH 0.7VDDV
DD VI
OH = -2.5 mA, VDD = 5.5V
0.7VDDV
DD VI
OL = -1 mA, VDD = 1.8V
Weak Pull-up /
Pull-down Current
IPU 1.75 mA Internal VDD pull-up, VIHH pull-down,
VDD = 5.5V, VCS = 12.5V
—170µACS
pin, VDD = 5.5V, VCS = 3V
CS Pull-up /
Pull-down
Resistance
RCS —16kVDD = 5.5V, VCS = 3V
Input Leakage
Current
IIL -1 1 µA VIN = VDD and VIN = VSS
Pin Capacitance CIN, COUT —10pFf
C = 20 MHz
RAM (Wiper) Value
Value Range N 0h 1FFh hex 8-bit device
0h 1FFh hex 7-bit device
POR/BOR Value N 80h hex 8-bit device
40h hex 7-bit device
AC/DC CHARACTERISTICS (CONTINUED)
DC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C TA +125°C (extended)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
MCP413X/415X/423X/425X
DS22060B-page 10 © 2008 Microchip Technology Inc.
Power Requirements
Power Supply
Sensitivity
(MCP41X2 and
MCP42X2 only)
PSS 0.0015 0.0035 %/% 8-bit VDD = 2.7V to 5.5V,
VA = 2.7V, Code = 80h
0.0015 0.0035 %/% 7-bit VDD = 2.7V to 5.5V,
VA = 2.7V, Code = 40h
AC/DC CHARACTERISTICS (CONTINUED)
DC Characteristics
Standard Operating Conditions (unless otherwise specified)
Operating Temperature –40°C TA +125°C (extended)
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to 5.5V, 5 k, 10 k, 50 k, 100 k devices.
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: Resistance is defined as the resistance between terminal A to terminal B.
2: INL and DNL are measured at VW with VA = VDD and VB = VSS.
3: MCP4XX1 only.
4: MCP4XX2 only, includes VWZSE and VWFSE.
5: Resistor terminals A, W and B’s polarity with respect to each other is not restricted.
6: This specification by design.
7: Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
8: The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and
then tested.
9: POR/BOR is not rate dependent.
10: Supply current is independent of current through the resistor network.
© 2008 Microchip Technology Inc. DS22060B-page 11
MCP413X/415X/423X/425X
1.1 SPI Mode Timing Waveforms and Requirements
FIGURE 1-1: SPI Timing Waveform (Mode = 11).
TABLE 1-1: SPI REQUIREMENTS (MODE = 11)
# Characteristic Symbol Min Max Units Conditions
SCK Input Frequency FSCK —10MHzV
DD = 2.7V to 5.5V
—1MHzV
DD = 1.8V to 2.7V
70 CS Active (VIL or VIHH) to SCK input TcsA2scH 60 ns
71 SCK input high time TscH 45 ns VDD = 2.7V to 5.5V
500 ns VDD = 1.8V to 2.7V
72 SCK input low time TscL 45 ns VDD = 2.7V to 5.5V
500 ns VDD = 1.8V to 2.7V
73 Setup time of SDI input to SCK edge TDIV2scH 10 — ns
74 Hold time of SDI input from SCK edge TscH2DIL20ns
77 CS Inactive (VIH) to SDO output hi-impedance TcsH2DOZ 50 ns Note 1
80 SDO data output valid after SCK edge TscL2DOV 70 ns VDD = 2.7V to 5.5V
170 ns VDD = 1.8V to 2.7V
83 CS Inactive (VIH) after SCK edge TscH2csI 100 ns VDD = 2.7V to 5.5V
1msV
DD = 1.8V to 2.7V
84 Hold time of CS Inactive (VIH) to
CS Active (VIL or VIHH)
TcsA2csI 50 ns
Note 1: This specification by design.
CS
SCK
SDO
SDI
70
71
72
73
74
75, 76 77
78
79
80
MSb LSb
BIT6 - - - - - -1
MSb IN BIT6 - - - -1 LSb IN
83
84
VIH
VIL
VIHH VIH
53 AL 3 82 «4‘
MCP413X/415X/423X/425X
DS22060B-page 12 © 2008 Microchip Technology Inc.
FIGURE 1-2: SPI Timing Waveform (Mode = 00).
TABLE 1-2: SPI REQUIREMENTS (MODE = 00)
# Characteristic Symbol Min Max Units Conditions
SCK Input Frequency FSCK —10MHzV
DD = 2.7V to 5.5V
—1MHzV
DD = 1.8V to 2.7V
70 CS Active (VIL or VIHH) to SCK input TcsA2scH 60 ns
71 SCK input high time TscH 45 ns VDD = 2.7V to 5.5V
500 ns VDD = 1.8V to 2.7V
72 SCK input low time TscL 45 ns VDD = 2.7V to 5.5V
500 ns VDD = 1.8V to 2.7V
73 Setup time of SDI input to SCK edge TDIV2scH 10 — ns
74 Hold time of SDI input from SCK edge TscH2DIL20ns
77 CS Inactive (VIH) to SDO output hi-impedance TcsH2DOZ— 50nsNote 1
80 SDO data output valid after SCK edge TscL2DOV— 70nsV
DD = 2.7V to 5.5V
170 ns VDD = 1.8V to 2.7V
82 SDO data output valid after
CS Active (VIL or VIHH)
TssL2doV 70 ns
83 CS Inactive (VIH) after SCK edge TscH2csI 100 ns VDD = 2.7V to 5.5V
1msV
DD = 1.8V to 2.7V
84 Hold time of CS Inactive (VIH) to
CS Active (VIL or VIHH)
TcsA2csI 50 ns
Note 1: This specification by design.
CS
SCK
SDO
SDI
70
71 72
82
74
75, 76
MSb BIT6 - - - - - -1 LSb
77
MSb IN BIT6 - - - -1 LSb IN
80
83
84
73
VIH
VIL
VIHH VIH
V‘L V‘HH V‘L V‘HH V‘L V‘HH
© 2008 Microchip Technology Inc. DS22060B-page 13
MCP413X/415X/423X/425X
TABLE 1-3: SPI REQUIREMENTS FOR SDI/SDO MULTIPLEXED (READ OPERATION ONLY) (2)
Characteristic Symbol Min Max Units Conditions
SCK Input Frequency FSCK —250kHzV
DD = 2.7V to 5.5V
CS Active (VIL or VIHH) to SCK input TcsA2scH 60 ns
SCK input high time TscH 1.8 us
SCK input low time TscL 1.8 ns
Setup time of SDI input to SCK edge TDIV2scH 40 — ns
Hold time of SDI input from SCK edge TscH2DIL40ns
CS Inactive (VIH) to SDO output hi-impedance TcsH2DOZ 50 ns Note 1
SDO data output valid after SCK edge TscL2DOV—1.6us
SDO data output valid after
CS Active (VIL or VIHH)
TssL2doV 50 ns
CS Inactive (VIH) after SCK edge TscH2csI 100 ns
Hold time of CS Inactive (VIH) to
CS Active (VIL or VIHH)
TcsA2csI 50 ns
Note 1: This specification by design.
2: This table is for the devices where the SPI’s SDI and SDO pins are multiplexed (SDI/SDO) and a Read
command is issued. This is NOT required for SDI/SDO operation with the Increment, Decrement, or Write
commands. This data rate can be increased by having external pull-up resistors to increase the rising
edges of each bit.
MCP413X/415X/423X/425X
DS22060B-page 14 © 2008 Microchip Technology Inc.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS =GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA-40 +125 °C
Operating Temperature Range TA-40 +125 °C
Storage Temperature Range TA-65 +150 °C
Thermal Package Resistances
Thermal Resistance, 8L-DFN (3x3) θJA 84.5 — °C/W
Thermal Resistance, 8L-MSOP θJA —211°C/W
Thermal Resistance, 8L-PDIP θJA 89.3 — °C/W
Thermal Resistance, 8L-SOIC θJA 149.5 — °C/W
Thermal Resistance, 10L-DFN (3x3) θJA —57°C/W
Thermal Resistance, 10L-MSOP θJA —211°C/W
Thermal Resistance, 14L-PDIP θJA —70°C/W
Thermal Resistance, 14L-SOIC θJA 95.3 — °C/W
Thermal Resistance, 14L-TSSOP θJA —100°C/W
Thermal Resistance, 16L-QFN θJA —47°C/W
© 2008 Microchip Technology Inc. DS22060B-page 15
MCP413X/415X/423X/425X
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-1: Device Current (IDD) vs. SPI
Frequency (fSCK) and Ambient Temperature
(VDD = 2.7V and 5.5V).
FIGURE 2-2: Device Current (ISHDN) and
VDD. (CS = VDD) vs. Ambient Temperature.
FIGURE 2-3: CS Pull-up/Pull-down
Resistance (RCS) and Current (ICS) vs. CS Input
Voltage (VCS) (VDD = 5.5V).
FIGURE 2-4: CS High Input Entry/Exit
Threshold vs. Ambient Temperature and VDD.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
50
100
150
200
250
300
350
400
450
500
550
600
650
0.00 2.00 4.00 6.00 8.00 10.00 12.00
fSCK (MHz)
Operating Current (I DD) (µA)
2.7V -40°C
2.7V 25°C
2.7V 85°C
2.7V 125°C
5.5V -40°C
5.5V 25°C
5.5V 85°C
5.5V 125°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
-40 25 85 125
Ambient Temperature (°C)
Standby Current (Istby) (µA)
5.5V
2.7V
0
50
100
150
200
250
2345678910
VCS (V)
RCS (kOhms)
-1000
-800
-600
-400
-200
0
200
400
600
800
1000
ICS (µA)
ICS
RCS
0
2
4
6
8
10
12
-40-20 0 20406080100120
Ambient Temperature (°C)
CS VPP Threshold (V)
2.7V Exit
5.5V Exit
2.7V Entry
5.5V Entry
I“: I“: I I I‘ I in H E \ 6? P“ mHH \ mm‘ *Z“: :I‘ 7' ‘ ‘ ' “Jpn“... J \\ \ \\ \H \\ \\ v 9*: ‘17 r L
MCP413X/415X/423X/425X
DS22060B-page 16 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-5: 5k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-6: 5k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-7: 5k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
FIGURE 2-8: 5k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-9: 5k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-10: 5k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
)
-40C DNL 25C DNL 85C DNL 125C DNL
)
0
500
1000
1500
2000
2500
0 64 128 192 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
)
W
)
-40C DNL 25C DNL 85C DNL 125C DNL
0
500
1000
1500
2000
2500
0 64 128 192 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-2
18
38
58
78
98
118
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
© 2008 Microchip Technology Inc. DS22060B-page 17
MCP413X/415X/423X/425X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-11: 5k
Ω
– Nominal Resistance
(
Ω
) vs. Ambient Temperature and VDD.FIGURE 2-12: 5k
Ω
– RWB (
Ω
) vs. Wiper
Setting and Ambient Temperature.
5050
5100
5150
5200
5250
5300
-40 0 40 80 120
Ambient Temperature (°C)
Nominal Resistance (R AB
)
(Ohms)
2.7V
5.5V
1.8V
0
1000
2000
3000
4000
5000
6000
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
RWB (Ohms)
-40°C
25°C
85°C
125°C
MCP413X/415X/423X/425X
DS22060B-page 18 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-13: 5k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-14: 5k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-15: 5k
Ω
– Power-Up Wiper
Response Time (20 ms/Div).
FIGURE 2-16: 5k
Ω
– Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-17: 5k
Ω
– Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
‘IH
© 2008 Microchip Technology Inc. DS22060B-page 19
MCP413X/415X/423X/425X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-18: 10 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-19: 10 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-20: 10 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
FIGURE 2-21: 10 k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-22: 10 k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-23: 10 k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
20
40
60
80
100
120
0 25 50 75 100 125 150 175 200 225 250
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
20
60
100
140
180
220
260
300
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
0
500
1000
1500
2000
2500
3000
3500
4000
0 64 128 192 256
Wiper Setting (decimal)
Wiper Resistance
(RW)(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
20
40
60
80
100
120
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-1
-0.5
0
0.5
1
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C85°C
125°C
20
60
100
140
180
220
260
300
0 25 50 75 100 125 150 175 200 225 250
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-2
-1
0
1
2
3
4
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL RW
-40°C
25°C85°C
125°C
0
500
1000
1500
2000
2500
3000
3500
4000
0 64 128 192 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-2
8
18
28
38
48
58
68
78
88
98
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
iHi§
MCP413X/415X/423X/425X
DS22060B-page 20 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-24: 10 k
Ω
– Nominal Resistance
(
Ω
) vs. Ambient Temperature and VDD.FIGURE 2-25: 10 k
Ω
– RWB (
Ω
) vs. Wiper
Setting and Ambient Temperature.
9850
9900
9950
10000
10050
10100
10150
10200
10250
10300
-40 0 40 80 120
Ambient Temperature (°C)
Nominal Resistance (R AB
)
(Ohms)
2.7V
5.5V
1.8V
0
2000
4000
6000
8000
10000
12000
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
RWB (Ohms)
-40°C
25°C
85°C
125°C
© 2008 Microchip Technology Inc. DS22060B-page 21
MCP413X/415X/423X/425X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-26: 10 k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-27: 10 k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-28: 10 k
Ω
– Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-29: 10 k
Ω
– Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
67/ .
MCP413X/415X/423X/425X
DS22060B-page 22 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-30: 50 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-31: 50 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-32: 50 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
FIGURE 2-33: 50 k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-34: 50 k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-35: 50 k
Ω
Rheo Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
20
40
60
80
100
120
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W)
(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
20
60
100
140
180
220
260
300
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W)
(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
0
1000
2000
3000
4000
5000
6000
7000
8000
9000
10000
11000
12000
13000
14000
15000
064128192256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.5
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
0.5
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
20
40
60
80
100
120
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W)
(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
20
60
100
140
180
220
260
300
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-1
-0.75
-0.5
-0.25
0
0.25
0.5
0.75
1
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
0
1000
2000
3000
4000
5000
6000
7000
8000
9000
10000
11000
12000
13000
14000
15000
0 25 50 75 100 125 150 175 200 225 250
Wiper Setting (decimal)
Wiper Resistance (Rw)
(ohms)
-1.5
3.5
8.5
13.5
18.5
23.5
28.5
33.5
38.5
43.5
48.5
53.5
58.5
63.5
68.5
73.5
78.5
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
© 2008 Microchip Technology Inc. DS22060B-page 23
MCP413X/415X/423X/425X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-36: 50 k
Ω
– Nominal Resistance
(
Ω
) vs. Ambient Temperature and VDD.FIGURE 2-37: 50 k
Ω
– RWB (
Ω
) vs. Wiper
Setting and Ambient Temperature.
49000
49500
50000
50500
51000
51500
52000
52500
-40 0 40 80 120
Ambient Temperature (°C)
Nominal Resistance (R AB
)
(Ohms)
2.7V
1.8V
5.5V
0
10000
20000
30000
40000
50000
60000
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
RWB (Ohms)
-40°C
25°C
85°C
125°C
MCP413X/415X/423X/425X
DS22060B-page 24 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-38: 50 k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-39: 50 k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-40: 50 k
Ω
– Low-Voltage
Increment Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-41: 50 k
Ω
– Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
HO H. HI )XHM H“ Ill AM. HI "0H 9« DUI [all V OH HO OH /2‘0H
© 2008 Microchip Technology Inc. DS22060B-page 25
MCP413X/415X/423X/425X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-42: 100 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-43: 100 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-44: 100 k
Ω
Pot Mode – RW (
Ω
),
INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
FIGURE 2-45: 100 k
Ω
Rheo Mode – RW
(
Ω
), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 5.5V).
FIGURE 2-46: 100 k
Ω
Rheo Mode – RW
(
Ω
), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 3.0V).
FIGURE 2-47: 100 k
Ω
Rheo Mode – RW
(
Ω
), INL (LSb), DNL (LSb) vs. Wiper Setting and
Ambient Temperature (VDD = 1.8V).
20
40
60
80
100
120
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.2
-0.1
0
0.1
0.2
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
20
60
100
140
180
220
260
300
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.2
-0.15
-0.1
-0.05
0
0.05
0.1
0.15
0.2
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C
85°C
125°C
0
5000
10000
15000
20000
25000
0 64 128 192 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.35
-0.25
-0.15
-0.05
0.05
0.15
0.25
0.35
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
20
40
60
80
100
120
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C85°C
125°C
20
60
100
140
180
220
260
300
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Wiper Resistance (Rw)
(ohms)
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
-40°C
25°C85°C
125°C
0
5000
10000
15000
20000
25000
0 64 128 192 256
Wiper Setting (decimal)
Wiper Resistance (R W
)
(ohms)
-1
4
9
14
19
24
29
34
39
44
49
54
59
Error (LSb)
-40C Rw 25C Rw 85C Rw 125C Rw
-40C INL 25C INL 85C INL 125C INL
-40C DNL 25C DNL 85C DNL 125C DNL
INL
DNL
RW
Note: Refer to AN1080 for additional informa-
tion on the characteristics of the wiper
resistance (RW) with respect to device
voltage and wiper setting value.
(K
MCP413X/415X/423X/425X
DS22060B-page 26 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-48: 100 k
Ω
– Nominal
Resistance (
Ω
) vs. Ambient Temperature and
VDD.
FIGURE 2-49: 100 k
Ω
– RWB (
Ω
) vs. Wiper
Setting and Ambient Temperature.
98500
99000
99500
100000
100500
101000
101500
102000
102500
103000
103500
-40 0 40 80 120
Ambient Temperature (°C)
Nominal Resistance (R AB
)
(Ohms)
2.7V
5.5V
1.8V
0
20000
40000
60000
80000
100000
120000
0 32 64 96 128 160 192 224 256
Wiper Setting (decimal)
Rwb (Ohms)
-40°C
25°C
85°C
125°C
© 2008 Microchip Technology Inc. DS22060B-page 27
MCP413X/415X/423X/425X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-50: 100 k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 5.5V)
(1 µs/Div).
FIGURE 2-51: 100 k
Ω
– Low-Voltage
Decrement Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-52: 100 k
Ω
– Low-Voltage
Increment Wiper Settling Time (VDD = 2.7V)
(1 µs/Div).
FIGURE 2-53: 100 k
Ω
– Power-Up Wiper
Response Time (1 µs/Div).
MCP413X/415X/423X/425X
DS22060B-page 28 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-54: Resistor Network 0 to
Resistor Network 1 RAB (5 k
Ω
) Mismatch vs. VDD
and Temperature.
FIGURE 2-55: Resistor Network 0 to
Resistor Network 1 RAB (10 k
Ω
) Mismatch vs.
VDD and Temperature.
FIGURE 2-56: Resistor Network 0 to
Resistor Network 1 RAB (50 k
Ω
) Mismatch vs.
VDD and Temperature.
FIGURE 2-57: Resistor Network 0 to
Resistor Network 1 RAB (100 k
Ω
) Mismatch vs.
VDD and Temperature.
0
0.01
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
0.1
-40 0 40 80 120
Temperature (°C)
%
5.5V
3.0V
-0.04
-0.03
-0.02
-0.01
0
0.01
0.02
0.03
0.04
-40 0 40 80 120
Temperature (°C)
%
5.5V
3.0V
0
0.02
0.04
0.06
0.08
0.1
0.12
-40 0 40 80 120
Temperature (°C)
%
5.5V
3.0V
-0.03
-0.02
-0.01
0
0.01
0.02
0.03
0.04
0.05
-40 10 60 110
Temperature (°C)
%
5.5V
3.0V
© 2008 Microchip Technology Inc. DS22060B-page 29
MCP413X/415X/423X/425X
Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V.
FIGURE 2-58: VIH (SDI, SCK, CS, and
SHDN) vs. VDD and Temperature.
FIGURE 2-59: VIL (SDI, SCK, CS, and
SHDN) vs. VDD and Temperature.
FIGURE 2-60: IOH (SDO) vs. VDD and
Temperature.
FIGURE 2-61: IOL (SDO) vs. VDD and
Temperature.
1
1.2
1.4
1.6
1.8
2
2.2
2.4
-40 0 40 80 120
Temperature (°C)
VIH (V)
5.5V
2.7V
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
-40 0 40 80 120
Temperature (°C)
VIL (V)
5.5V
2.7V
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
-40 0 40 80 120
Temperature (°C)
IOH (mA)
5.5V
2.7V
0
5
10
15
20
25
30
35
40
45
50
-40 0 40 80 120
Temperature (°C)
IOL (mA)
5.5V
2.7V
WW HPEQL
MCP413X/415X/423X/425X
DS22060B-page 30 © 2008 Microchip Technology Inc.
Note: Unless otherwise indicated, TA = +25°C,
VDD = 5V, VSS = 0V.
FIGURE 2-62: POR/BOR Trip point vs. VDD
and Temperature.
FIGURE 2-63: SCK Input Frequency vs.
Voltage and Temperature.
2.1 Test Circuits
FIGURE 2-64: -3 db Gain vs. Frequency
Test.
0
0.2
0.4
0.6
0.8
1
1.2
-40 0 40 80 120
Temperature (°C)
VDD (V)
2.7V
5.5V
12.0
12.5
13.0
13.5
14.0
14.5
15.0
-40 0 40 80 120
Temperature (°C)
fsck (MHz)
2.7V
5.5V
+
-
VOUT
2.5V DC
+5V
A
B
W
Offset
GND
VIN
© 2008 Microchip Technology Inc. DS22060B-page 31
MCP413X/415X/423X/425X
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Ta b l e 3 - 1.
Additional descriptions of the device pins follows.
TABLE 3-1: PINOUT DESCRIPTION FOR THE MCP413X/415X/423X/425X
Pin
Weak
Pull-up/
down (2)
Standard Function
Single Dual
Symbol I/O Buffer
Type
Rheo Pot (1) Rheo Pot
8L 8L 10L 14L 16L
111116CS I HV w/ST “smart” SPI Chip Select Input
2 2 2 2 1 SCK I HV w/ST “smart” SPI Clock Input
3 3 3 2 SDI I HV w/ST “smart” SPI Serial Data Input
3 SDI/SDO I/O HV w/ST “smart” SPI Serial Data Input/Output
(Note 1, Note 3)
44443, 4V
SS P Ground
5 5 5 P1B A Analog No Potentiometer 1 Terminal B
6 6 6 P1W A Analog No Potentiometer 1 Wiper Terminal
7 7 P1A A Analog No Potentiometer 1 Terminal A
5 8 8 P0A A Analog No Potentiometer 0 Terminal A
5 6 7 9 9 P0W A Analog No Potentiometer 0 Wiper Terminal
6 7 8 10 10 P0B A Analog No Potentiometer 0 Terminal B
12 13 SHDN I HV w/ST “smart” Hardware Shutdown
7 9 13 14 SDO O O No SPI Serial Data Out
8 8 10 14 15 VDD P Positive Power Supply Input
11 11,12 NC No Connection
9 9 11 17 EP Exposed Pad (Note 4)
Legend: HV w/ST = High Voltage tolerant input (with Schmidtt trigger input)
A = Analog pins (Potentiometer terminals) I = digital input (high Z)
O = digital output I/O = Input / Output
P = Power
Note 1: The 8-lead Single Potentiometer devices are pin limited so the SDO pin is multiplexed with the SDI pin
(SDI/SDO pin). After the Address/Command (first 6-bits) are received, If a valid Read command has been
requested, the SDO pin starts driving the requested read data onto the SDI/SDO pin.
2: The pin’s “smart” pull-up shuts off while the pin is forced low. This is done to reduce the standby and
shutdown current.
3: The SDO is an open drain output, which uses the internal “smart” pull-up. The SDI input data rate can be
at the maximum SPI frequency. the SDO output data rate will be limited by the “speed” of the pull-up,
customers can increase the rate with external pull-up resistors.
4: The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively
connected to the die substrate, and therefore should be unconnected or connected to the same ground as
the device’s VSS pin.
MCP413X/415X/423X/425X
DS22060B-page 32 © 2008 Microchip Technology Inc.
3.1 Chip Select (CS)
The CS pin is the serial interface’s chip select input.
Forcing the CS pin to VIL enables the serial commands.
Forcing the CS pin to VIHH enables the high-voltage
serial commands.
3.2 Serial Data In (SDI)
The SDI pin is the serial interfaces Serial Data In pin.
This pin is connected to the Host Controllers SDO pin.
3.3 Serial Data In / Serial Data Out
(SDI/SDO)
On the MCP41X1 devices, pin-out limitations do not
allow for individual SDI and SDO pins. On these
devices, the SDI and SDO pins are multiplexed.
The MCP41X1 serial interface knows when the pin
needs to change from being an input (SDI) to being an
output (SDO). The Host Controller’s SDO pin must be
properly protected from a drive conflict.
3.4 Ground (VSS)
The VSS pin is the device ground reference.
3.5 Potentiometer Terminal B
The terminal B pin is connected to the internal
potentiometers terminal B.
The potentiometer’s terminal B is the fixed connection
to the Zero Scale wiper value of the digital
potentiometer. This corresponds to a wiper value of
0x00 for both 7-bit and 8-bit devices.
The terminal B pin does not have a polarity relative to
the terminal W or A pins. The terminal B pin can
support both positive and negative current. The voltage
on terminal B must be between VSS and VDD.
MCP42XX devices have two terminal B pins, one for
each resistor network.
3.6 Potentiometer Wiper (W) Terminal
The terminal W pin is connected to the internal
potentiometer’s terminal W (the wiper). The wiper
terminal is the adjustable terminal of the digital
potentiometer. The terminal W pin does not have a
polarity relative to terminals A or B pins. The terminal
W pin can support both positive and negative current.
The voltage on terminal W must be between VSS and
VDD.
MCP42XX devices have two terminal W pins, one for
each resistor network.
3.7 Potentiometer Terminal A
The terminal A pin is available on the MCP4XX1
devices, and is connected to the internal
potentiometer’s terminal A.
The potentiometers terminal A is the fixed connection
to the Full-Scale wiper value of the digital
potentiometer. This corresponds to a wiper value of
0x100 for 8-bit devices or 0x80 for 7-bit devices.
The terminal A pin does not have a polarity relative to
the terminal W or B pins. The terminal A pin can
support both positive and negative current. The voltage
on terminal A must be between VSS and VDD.
The terminal A pin is not available on the MCP4XX2
devices, and the internally terminal A signal is floating.
MCP42X1 devices have two terminal A pins, one for
each resistor network.
3.8 Shutdown (SHDN)
The SHDN pin is used to force the resistor network
terminals into the hardware shutdown state.
3.9 Serial Data Out (SDO)
The SDO pin is the serial interfaces Serial Data Out pin.
This pin is connected to the Host Controllers SDI pin.
This pin allows the Host Controller to read the digital
potentiometers registers, or monitor the state of the
command error bit.
3.10 Positive Power Supply Input (VDD)
The VDD pin is the device’s positive power supply input.
The input power supply is relative to VSS.
While the device VDD < Vmin (2.7V), the electrical
performance of the device may not meet the data sheet
specifications.
3.11 No Connection (NC)
These pins are not internally connected and should be
either connected to VDD or VSS to reduce possible
noise coupling.
3.12 Exposed Pad (EP)
This pad is conductively connected to the device's
substrate. This pad should be tied to the same potential
as the VSS pin (or left unconnected). This pad could be
used to assist as a heat sink for the device when
connected to a PCB heat sink.
00h Vola‘ile Wiper 0
© 2008 Microchip Technology Inc. DS22060B-page 33
MCP413X/415X/423X/425X
4.0 FUNCTIONAL OVERVIEW
This Data Sheet covers a family of thirty-two Digital
Potentiometer and Rheostat devices that will be
referred to as MCP4XXX. The MCP4XX1 devices are
the Potentiometer configuration, while the MCP4XX2
devices are the Rheostat configuration.
As the Device Block Diagram shows, there are four
main functional blocks. These are:
POR/BOR Operation
Memory Map
Resistor Network
Serial Interface (SPI)
The POR/BOR operation and the Memory Map are
discussed in this section and the Resistor Network and
SPI operation are described in their own sections. The
Device Commands commands are discussed in
Section 7.0.
4.1 POR/BOR Operation
The Power-on Reset is the case where the device is
having power applied to it from VSS. The Brown-out
Reset occurs when a device had power applied to it,
and that power (voltage) drops below the specified
range.
The devices RAM retention voltage (VRAM) is lower
than the POR/BOR voltage trip point (VPOR/VBOR). The
maximum VPOR/VBOR voltage is less then 1.8V.
When VPOR/VBOR < VDD < 2.7V, the electrical
performance may not meet the data sheet
specifications. In this region, the device is capable of
incrementing, decrementing, reading and writing to its
volatile memory if the proper serial command is
executed.
4.1.1 POWER-ON RESET
When the device powers up, the device VDD will cross
the VPOR/VBOR voltage. Once the VDD voltage crosses
the VPOR/VBOR voltage the following happens:
Volatile wiper register is loaded with the default
wiper value
The TCON register is loaded it’s default value
The device is capable of digital operation
4.1.2 BROWN-OUT RESET
When the device powers down, the device VDD will
cross the VPOR/VBOR voltage.
Once the VDD voltage decreases below the VPOR/VBOR
voltage the following happens:
Serial Interface is disabled
If the VDD voltage decreases below the VRAM voltage
the following happens:
Volatile wiper registers may become corrupted
TCON register may become corrupted
As the voltage recovers above the VPOR/VBOR voltage
see Section 4.1.1 “Power-on Reset”.
Serial commands not completed due to a brown-out
condition may cause the memory location to become
corrupted.
4.2 Memory Map
The device memory is 16 locations that are 9-bits wide
(16x9 bits). This memory space contains four volatile
locations (see Table 4-1).
TABLE 4-1: MEMORY MAP
4.2.1 VOLATILE MEMORY (RAM)
There are four Volatile Memory locations. These are:
Volatile Wiper 0
Volatile Wiper 1
(Dual Resistor Network devices only)
Status Register
Terminal Control (TCON) Register
The volatile memory starts functioning at the RAM
retention voltage (VRAM).
Address Function Memory Type
00h Volatile Wiper 0 RAM
01h Volatile Wiper 1 RAM
02h Reserved
03h Reserved —
04h Volatile TCON Register RAM
05h Status Register RAM
06h-0Fh Reserved
MCP413X/415X/423X/425X
DS22060B-page 34 © 2008 Microchip Technology Inc.
4.2.1.1 Status (STATUS) Register
This register contains 5 status bits. These bits show the
state of the Shutdown bit. The STATUS register can be
accessed via the READ commands. Register 4-1
describes each STATUS register bit.
The STATUS register is placed at Address 05h.
REGISTER 4-1: STATUS REGISTER
R-1 R-1 R-1 R-1 R-0 R-x R-x R-x R-x
D8:D5 RESV RESV RESV SHDN RESV
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 8-5 D8:D5: Reserved. Forced to “1”
bit 4-2 RESV: Reserved
bit 1 SHDN: Hardware Shutdown pin Status bit (Refer to Section 5.3 “Shutdown” for further information)
This bit indicates if the Hardware shutdown pin (SHDN) is low. A hardware shutdown disconnects the
Terminal A and forces the wiper (Terminal W) to Terminal B (see Figure 5-2). While the device is in Hard-
ware Shutdown (the SHDN pin is low) the serial interface is operational so the STATUS register may be
read.
1 = MCP4XXX is in the Hardware Shutdown state
0 = MCP4XXX is NOT in the Hardware Shutdown state
bit 0 RESV: Reserved
© 2008 Microchip Technology Inc. DS22060B-page 35
MCP413X/415X/423X/425X
4.2.1.2 Terminal Control (TCON) Register
This register contains 8 control bits. Four bits are for
Wiper 0, and four bits are for Wiper 1. Register 4-2
describes each bit of the TCON register.
The state of each resistor network terminal connection
is individually controlled. That is, each terminal
connection (A, B and W) can be individually connected/
disconnected from the resistor network. This allows the
system to minimize the currents through the digital
potentiometer.
The value that is written to this register will appear on
the resistor network terminals when the serial
command has completed.
On a POR/BOR this register is loaded with 1FFh
(9-bits), for all terminals connected. The Host
Controller needs to detect the POR/BOR event and
then update the Volatile TCON register value.
MCP413X/415X/423X/425X
DS22060B-page 36 © 2008 Microchip Technology Inc.
REGISTER 4-2: TCON BITS (1, 2)
R-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1 R/W-1
D8 R1HW R1A R1W R1B R0HW R0A R0W R0B
bit 8 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 8 D8: Reserved. Forced to “1”
bit 7 R1HW: Resistor 1 Hardware Configuration Control bit
This bit forces Resistor 1 into the “shutdown” configuration of the Hardware pin
1 = Resistor 1 is NOT forced to the hardware pin “shutdown” configuration
0 = Resistor 1 is forced to the hardware pin “shutdown” configuration
bit 6 R1A: Resistor 1 Terminal A (P1A pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Terminal A to the Resistor 1 Network
1 = P1A pin is connected to the Resistor 1 Network
0 = P1A pin is disconnected from the Resistor 1 Network
bit 5 R1W: Resistor 1 Wiper (P1W pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Wiper to the Resistor 1 Network
1 = P1W pin is connected to the Resistor 1 Network
0 = P1W pin is disconnected from the Resistor 1 Network
bit 4 R1B: Resistor 1 Terminal B (P1B pin) Connect Control bit
This bit connects/disconnects the Resistor 1 Terminal B to the Resistor 1 Network
1 = P1B pin is connected to the Resistor 1 Network
0 = P1B pin is disconnected from the Resistor 1 Network
bit 3 R0HW: Resistor 0 Hardware Configuration Control bit
This bit forces Resistor 0 into the “shutdown” configuration of the Hardware pin
1 = Resistor 0 is NOT forced to the hardware pin “shutdown” configuration
0 = Resistor 0 is forced to the hardware pin “shutdown” configuration
bit 2 R0A: Resistor 0 Terminal A (P0A pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Terminal A to the Resistor 0 Network
1 = P0A pin is connected to the Resistor 0 Network
0 = P0A pin is disconnected from the Resistor 0 Network
bit 1 R0W: Resistor 0 Wiper (P0W pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Wiper to the Resistor 0 Network
1 = P0W pin is connected to the Resistor 0 Network
0 = P0W pin is disconnected from the Resistor 0 Network
bit 0 R0B: Resistor 0 Terminal B (P0B pin) Connect Control bit
This bit connects/disconnects the Resistor 0 Terminal B to the Resistor 0 Network
1 = P0B pin is connected to the Resistor 0 Network
0 = P0B pin is disconnected from the Resistor 0 Network
Note 1: The hardware SHDN pin (when active) overrides the state of these bits. When the SHDN pin returns to the
inactive state, the TCON register will control the state of the terminals. The SHDN pin does not modify the
state of the TCON bits.
2: These bits do not affect the wiper register values.
© 2008 Microchip Technology Inc. DS22060B-page 37
MCP413X/415X/423X/425X
5.0 RESISTOR NETWORK
The Resistor Network has either 7-bit or 8-bit
resolution. Each Resistor Network allows zero scale to
full-scale connections. Figure 5-1 shows a block
diagram for the resistive network of a device.
The Resistor Network is made up of several parts.
These include:
Resistor Ladder
•Wiper
Shutdown (Terminal Connections)
Devices have either one or two resistor networks,
These are referred to as Pot 0 and Pot 1.
FIGURE 5-1: Resistor Block Diagram.
5.1 Resistor Ladder Module
The resistor ladder is a series of equal value resistors
(RS) with a connection point (tap) between the two
resistors. The total number of resistors in the series
(ladder) determines the RAB resistance (see
Figure 5-1). The end points of the resistor ladder are
connected to analog switches which are connected to
the device Terminal A and Terminal B pins. The RAB
(and RS) resistance has small variations over voltage
and temperature.
For an 8-bit device, there are 256 resistors in a string
between terminal A and terminal B. The wiper can be
set to tap onto any of these 256 resistors thus providing
257 possible settings (including terminal A and
terminal B).
For a 7-bit device, there are 128 resistors in a string
between terminal A and terminal B. The wiper can be
set to tap onto any of these 128 resistors thus providing
129 possible settings (including terminal A and
terminal B).
Equation 5-1 shows the calculation for the step
resistance.
EQUATION 5-1: RS CALCULATION
RS
A
RS
RS
RS
B
257
256
255
1
0
RW (1)
W
(01h)
Analog Mux
RW (1) (00h)
RW (1) (FEh)
RW (1) (FFh)
RW (1) (100h)
Note 1: The wiper resistance is dependent on
several factors including, wiper code,
device VDD, Terminal voltages (on A, B,
and W), and temperature.
Also for the same conditions, each tap
selection resistance has a small variation.
This RW variation has greater effects on
some specifications (such as INL) for the
smaller resistance devices (5.0 k)
compared to larger resistance devices
(100.0 k).
RAB
8-Bit
N =
128
127
126
1
0
(01h)
(00h)
(7Eh)
(7Fh)
(80h)
7-Bit
N =
RS
RAB
256()
-------------=
RS
RAB
128()
--------------=
8-bit Device
7-bit Device
3FFh SFFh Reserved (FuHrScale (W : A))‘
MCP413X/415X/423X/425X
DS22060B-page 38 © 2008 Microchip Technology Inc.
5.2 Wiper
Each tap point (between the RS resistors) is a
connection point for an analog switch. The opposite
side of the analog switch is connected to a common
signal which is connected to the Terminal W (Wiper)
pin.
A value in the volatile wiper register selects which
analog switch to close, connecting the W terminal to
the selected node of the resistor ladder.
The wiper can connect directly to Terminal B or to
Terminal A. A zero-scale connections, connects the
Terminal W (wiper) to Terminal B (wiper setting of
000h). A full-scale connections, connects the Terminal
W (wiper) to Terminal A (wiper setting of 100h or 80h).
In these configurations the only resistance between the
Terminal W and the other Terminal (A or B) is that of the
analog switches.
A wiper setting value greater than full-scale (wiper
setting of 100h for 8-bit device or 80h for 7-bit devices)
will also be a Full-Scale setting (Terminal W (wiper)
connected to Terminal A). Ta b l e 5-1 illustrates the full
wiper setting map.
Equation 5-2 illustrates the calculation used to deter-
mine the resistance between the wiper and terminal B.
EQUATION 5-2: RWB CALCULATION
TABLE 5-1: VOLATILE WIPER VALUE VS.
WIPER POSITION MAP
A POR/BOR event will load the Volatile Wiper register
value with the default value. Table 5-2 shows the
default values offered. Custom POR/BOR options are
available. Contact the local Microchip Sales Office.
TABLE 5-2: DEFAULT FACTORY
SETTINGS SELECTION
Wiper Setting Properties
7-bit Pot 8-bit Pot
3FFh
081h
3FFh
101h
Reserved (Full-Scale (W = A)),
Increment and Decrement
commands ignored
080h 100h Full-Scale (W = A),
Increment commands ignored
07Fh
041h
0FFh
081
W = N
040h 080h W = N (Mid-Scale)
03Fh
001h
07Fh
001
W = N
000h 000h Zero Scale (W = B)
Decrement command ignored
RWB
RABN
256()
--------------R
W
+=
N = 0 to 256 (decimal)
RWB
RABN
128()
--------------R
W
+=
N = 0 to 128 (decimal)
8-bit Device
7-bit Device
Resistance
Code
Typical
RAB Value
Default POR
Wiper Setting
Wiper Code
8-bit 7-bit
-502 5.0 kMid-scale 80h 40h
-103 10.0 kMid-scale 80h 40h
-503 50.0 kMid-scale 80h 40h
-104 100.0 kMid-scale 80h 40h
} M fl nr/Lgéé H
© 2008 Microchip Technology Inc. DS22060B-page 39
MCP413X/415X/423X/425X
5.3 Shutdown
Shutdown is used to minimize the device’s current
consumption. The MCP4XXX has two methods to
achieve this. These are:
Hardware Shutdown Pin (SHDN)
Terminal Control Register (TCON)
The Hardware Shutdown pin is backwards compatible
with the MCP42XXX devices.
5.3.1 HARDWARE SHUTDOWN PIN
(SHDN)
The SHDN pin is available on the dual potentiometer
devices. When the SHDN pin is forced active (VIL):
The P0A and P1A terminals are disconnected
The P0W and P1W terminals are simultaneously
connect to the P0B and P1B terminals,
respectively (see Figure 5-2)
The Serial Interface is NOT disabled, and all
Serial Interface activity is executed
The Hardware Shutdown pin mode does NOT corrupt
the values in the Volatile Wiper Registers nor the
TCON register. When the Shutdown mode is exited
(SHDN pin is inactive (VIH)):
The device returns to the Wiper setting specified
by the Volatile Wiper value
The TCON register bits return to controlling the
terminal connection state
FIGURE 5-2: Hardware Shutdown
Resistor Network Configuration.
5.3.2 TERMINAL CONTROL REGISTER
(TCON)
The Terminal Control (TCON) register is a volatile
register used to configure the connection of each
resistor network terminal pin (A, B, and W) to the
Resistor Network. This register is shown in
Register 4-2.
The RxHW bits forces the selected resistor network
into the same state as the SHDN pin. Alternate
low-power configurations may be achieved with the
RxA, RxW, and RxB bits.
5.3.3 INTERACTION OF SHDN PIN AND
TCON REGISTER
Figure 5-3 shows how the SHDN pin signal and the
RxHW bit signal interact to control the hardware
shutdown of each resistor network (independently).
Using the TCON bits allows each resistor network (Pot
0 and Pot 1) to be individually “shutdown” while the
hardware pin forces both resistor networks to be “shut-
down” at the same time.
FIGURE 5-3: RxHW bit and SHDN pin
Interaction.
A
B
W
Resistor Network
Note: When the RxHW bit forces the resistor
network into the hardware SHDN state,
the state of the TCON register RxA, RxW,
and RxB bits is overridden (ignored).
When the state of the RxHW bit no longer
forces the resistor network into the hard-
ware SHDN state, the TCON register RxA,
RxW, and RxB bits return to controlling the
terminal connection state. In other words,
the RxHW bit does not corrupt the state of
the RxA, RxW, and RxB bits.
SHDN (from pin)
RxHW
(from TCON register)
To Pot x Hardware
Shutdown Control
MCP413X/415X/423X/425X
DS22060B-page 40 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS22060B-page 41
MCP413X/415X/423X/425X
6.0 SERIAL INTERFACE (SPI)
The MCP4XXX devices support the SPI serial protocol.
This SPI operates in the slave mode (does not
generate the serial clock).
The SPI interface uses up to four pins. These are:
•CS
- Chip Select
SCK - Serial Clock
SDI - Serial Data In
SDO - Serial Data Out
Typical SPI Interfaces are shown in Figure 6-1. In the
SPI interface, The Master’s Output pin is connected to
the Slave’s Input pin and the Master’s Input pin is
connected to the Slave’s Output pin.
The MCP4XXX SPI’s module supports two (of the four)
standard SPI modes. These are Mode 0,0 and 1,1.
The SPI mode is determined by the state of the SCK
pin (VIH or VIL) on the when the CS pin transitions from
inactive (VIH) to active (VIL or VIHH).
All SPI interface signals are high-voltage tolerant.
FIGURE 6-1: Typical SPI Interface Block Diagram.
SDI/SDO SDI
SDO
SDO
SDI R1(2)
MCP41X1
SCK SCK
SDI
SDO
MCP4XXX
SDO
SDI
SCK
SCK
( Master Out - Slave In (MOSI) )
( Master In - Slave Out (MISO) )
Host
Controller
Host
Controller
Typical SPI Interface Connections
Typical MCP41X1 SPI Interface Connections (Host Controller Hardware SPI)
SDI/SDO SDI
SDO
I/O
MCP41X1
I/O SCK
Host
Controller
Alternate MCP41X1 SPI Interface Connections (Host Controller Firmware SPI)
(SDO/SDI)
(SCK)
CS
I/O (1)
CS
I/O (1)
CS
I/O (1)
Note 1: If High voltage commands are desired, some type of external circuitry needs to be
implemented.
2: R1 must be sized to ensure VIL and VIH of the devices are met.
MCP413X/415X/423X/425X
DS22060B-page 42 © 2008 Microchip Technology Inc.
6.1 SDI, SDO, SCK, and CS Operation
The operation of the four SPI interface pins are
discussed in this section. These pins are:
SDI (Serial Data In)
SDO (Serial Data Out)
SCK (Serial Clock)
•CS
(Chip Select)
The serial interface works on either 8-bit or 16-bit
boundaries depending on the selected command. The
Chip Select (CS) pin frames the SPI commands.
6.1.1 SERIAL DATA IN (SDI)
The Serial Data In (SDI) signal is the data signal into
the device. The value on this pin is latched on the rising
edge of the SCK signal.
6.1.2 SERIAL DATA OUT (SDO)
The Serial Data Out (SDO) signal is the data signal out
of the device. The value on this pin is driven on the
falling edge of the SCK signal.
Once the CS pin is forced to the active level (VIL or
VIHH), the SDO pin will be driven. The state of the SDO
pin is determined by the serial bit’s position in the
command, the command selected, and if there is a
command error state (CMDERR).
6.1.3 SDI/SDO
For device packages that do not have enough pins for
both an SDI and SDO pin, the SDI and SDO
functionality is multiplexed onto a single I/O pin called
SDI/SDO.
The SDO will only be driven for the command error bit
(CMDERR) and during the data bits of a read command
(after the memory address and command has been
received).
6.1.3.1 SDI/SDO Operation
Figure 6-2 shows a block diagram of the SDI/SDO pin.
The SDI signal has an internal “smart” pull-up. The
value of this pull-up determines the frequency that data
can be read from the device. An external pull-up can be
added to the SDI/SDO pin to improve the rise time and
therefore improve the frequency that data can be read.
Data written on the SDI/SDO pin can be at the
maximum SPI frequency.
On the falling edge of the SCK pin during the C0 bit
(see Figure 7-1), the SDI/SDO pin will start outputting
the SDO value. The SDO signal overrides the control of
the smart pull-up, such that whenever the SDI/SDO pin
is outputting data, the smart pull-up is enabled.
The SDI/SDO pin will change from an input (SDI) to an
output (SDO) after the state machine has received the
Address and Command bits of the Command Byte. If
the command is a Read command, then the SDI/SDO
pin will remain an output for the remainder of the
command. For any other command, the SDI/SDO pin
returns to an input.
FIGURE 6-2: Serial I/O Mux Block
Diagram.
Note: MCP41X1 Devices Only .
Note: To support the High voltage requirement of
the SDI function, the SDO function is an
open drain output.
Note: Care must be take to ensure that a Drive
conflict does not exist between the Host
Controllers SDO pin (or software SDI/SDO
pin) and the MCP41x1 SDI/SDO pin (see
Figure 6-1).
SDI/SDO SDI
SDO
Control
“smart” pull-up
Open
Drain
Logic
Vo‘ali‘e SDI. SDO 10 MHZ 10 MHZ SDI/SDO“) kHz (2'
© 2008 Microchip Technology Inc. DS22060B-page 43
MCP413X/415X/423X/425X
6.1.4 SERIAL CLOCK (SCK)
(SPI FREQUENCY OF OPERATION)
The SPI interface is specified to operate up to 10 MHz.
The actual clock rate depends on the configuration of
the system and the serial command used. Table 6-1
shows the SCK frequency for different configurations.
TABLE 6-1: SCK FREQUENCY
6.1.5 THE CS SIGNAL
The Chip Select (CS) signal is used to select the device
and frame a command sequence. To start a command,
or sequence of commands, the CS signal must
transition from the inactive state (VIH) to an active state
(VIL or VIHH).
After the CS signal has gone active, the SDO pin is
driven and the clock bit counter is reset.
If an error condition occurs for an SPI command, then
the Command byte’s Command Error (CMDERR) bit
(on the SDO pin) will be driven low (VIL). To exit the
error condition, the user must take the CS pin to the VIH
level.
When the CS pin returns to the inactive state (VIH) the
SPI module resets (including the address pointer).
While the CS pin is in the inactive state (VIH), the serial
interface is ignored. This allows the Host Controller to
interface to other SPI devices using the same SDI,
SDO, and SCK signals.
The CS pin has an internal pull-up resistor. The resistor
is disabled when the voltage on the CS pin is at the VIL
level. This means that when the CS pin is not driven,
the internal pull-up resistor will pull this signal to the VIH
level. When the CS pin is driven low (VIL), the
resistance becomes very large to reduce the device
current consumption.
The high voltage capability of the CS pin allows
MCP413X/415X/423X/425X devices to be used in
systems previously designed for the MCP414X/416X/
424X/426X devices.
Memory Type Access
Command
Read
Write,
Increment,
Decrement
Volatile
Memory
SDI, SDO 10 MHz 10 MHz
SDI/SDO
(1) 250 kHz (2) 10 MHz
Note 1: MCP41X1 devices only.
2: This is the maximum clock frequency
without an external pull-up resistor.
Note: There is a required delay after the CS pin
goes active to the 1st edge of the SCK pin.
\ A l
MCP413X/415X/423X/425X
DS22060B-page 44 © 2008 Microchip Technology Inc.
6.2 The SPI Modes
The SPI module supports two (of the four) standard SPI
modes. These are Mode 0,0 and 1,1. The mode is
determined by the state of the SDI pin on the rising
edge of the 1st clock bit (of the 8-bit byte).
6.2.1 MODE 0,0
In Mode 0,0: SCK idle state = low (VIL), data is clocked
in on the SDI pin on the rising edge of SCK and clocked
out on the SDO pin on the falling edge of SCK.
6.2.2 MODE 1,1
In Mode 1,1: SCK idle state = high (VIH), data is
clocked in on the SDI pin on the rising edge of SCK and
clocked out on the SDO pin on the falling edge of SCK.
6.3 SPI Waveforms
Figure 6-3 through Figure 6-8 show the different SPI
command waveforms. Figure 6-3 and Figure 6-4 are
read and write commands. Figure 6-5 and Figure 6-6
are read commands when the SDI and SDO pins are
multiplexed on the same pin (SDI/SDO). Figure 6-7
and Figure 6-8 are increment and decrement
commands.
FIGURE 6-3: 16-Bit Commands (Write, Read) - SPI Waveform (Mode 1,1).
FIGURE 6-4: 16-Bit Commands (Write, Read) - SPI Waveform (Mode 0,0).
CS
SCK
Write to
SSPBUF
SDI
Input
Sample
SDO bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
bit15 bit14 bit13 bit12 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
AD3 AD2 AD1 AD0
C1 C0
XD8 D7 D6 D5 D4 D3 D2 D1 D0
VIH
VIL
CMDERR bit
VIHH (1)
Note 1: VIHH is supported for compability with the MCP414X/6X and MCP424X/6X devices high voltage
operation.
CS
SCK
Write to
SSPBUF
SDI
Input
Sample
SDO bit15 bit14 bit13 bit12 bit11 bit10 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
bit15 bit14 bit13 bit12 bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
AD3 AD2 AD1 AD0
C1 C0
XD8 D7 D6 D5 D4 D3 D2 D1 D0
VIH
VIL
CMDERR bit
VIHH(1)
Note 1: VIHH is supported for compability with the MCP414X/6X and MCP424X/6X devices high voltage
operation.
TITITI TTITITITITIT
© 2008 Microchip Technology Inc. DS22060B-page 45
MCP413X/415X/423X/425X
FIGURE 6-5: 16-Bit Read Command for Devices with SDI/SDO multiplexed -
SPI Waveform (Mode 1,1).
FIGURE 6-6: 16-Bit Read Command for Devices with SDI/SDO multiplexed -
SPI Waveform (Mode 0,0).
CS
SCK
Write to
SSPBUF
SDI
Input
Sample
SDO bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
bit15 bit14 bit13 bit12
AD3 AD2 AD1 AD0 C1 C0
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
VIH
VIL
CMDERR bit
(1) (1) (1) (1) (1) (1) (1) (1) (1) (1)
11
VIHH (1)
Note 1: The SDI pin will read the state of the SDI pin which will be the SDO signal, unless overdriven.
2: VIHH is supported for compability with the MCP414X/6X and MCP424X/6X devices high voltage
operation.
CS
SCK
Write to
SSPBUF
SDI
Input
Sample
SDO bit9 bit8 bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
bit15 bit14 bit13 bit12
AD3 AD2 AD1 AD0 C1 C0
D8 D7 D6 D5 D4 D3 D2 D1 D0
X
VIH
VIL
CMDERR bit
(1) (1) (1) (1) (1) (1) (1) (1) (1) (1)
11
VIHH (1)
Note 1: The SDI pin will read the state of the SDI pin which will be the SDO signal, unless overdriven.
2: VIHH is supported for compability with the MCP414X/6X and MCP424X/6X devices high voltage
operation.
MCP413X/415X/423X/425X
DS22060B-page 46 © 2008 Microchip Technology Inc.
FIGURE 6-7: 8-Bit Commands (Increment, Decrement, Modify - SPI Waveform with PIC MCU
(Mode 1,1).
FIGURE 6-8: 8-Bit Commands (Increment, Decrement, Modify - SPI Waveform with PIC MCU
(Mode 0,0).
bit7 bit0
bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
CS
SCK
Write to
SSPBUF
SDI
Input
Sample
SDO
VIH
VIL
AD3 AD2 AD1 AD0 C0
C1 X X
“1” = “Valid” Command/Address
“0” = “Invalid” Command/Address
CMDERR bit
VIHH (1)
Note 1: VIHH is supported for compability with the MCP414X/6X and MCP424X/6X devices high voltage
operation.
SCK
Input
Sample
SDI
bit7 bit0
SDO bit7 bit6 bit5 bit4 bit3 bit2 bit1 bit0
Write to
SSPBUF
CS
VIH
VIL
AD3 AD2 AD1 AD0 C0
C1 X X
“1” = “Valid” Command/Address
“0” = “Invalid” Command/Address
CMDERR bit
VIHH (1)
Note 1: VIHH is supported for compability with the MCP414X/6X and MCP424X/6X devices high voltage
operation.
Read Dam
© 2008 Microchip Technology Inc. DS22060B-page 47
MCP413X/415X/423X/425X
7.0 DEVICE COMMANDS
The MCP4XXX’s SPI command format supports 16
memory address locations and four commands. Each
command has two modes. These are:
Normal Serial Commands
High-Voltage Serial Commands
Normal serial commands are those where the CS pin is
driven to VIL. High Voltage Serial Commands, CS pin is
driven to VIHH, for compatibility with systems that also
support the MCP414X/416X/424X/426X devices. High
Voltage Serial Commands operate identically to their
corresponding Normal Serial Command. In each
mode, there are four possible commands. These
commands are shown in Table 7-1.
The 8-bit commands (Increment Wiper and Decre-
ment Wiper commands) contain a Command Byte,
see Figure 7-1, while 16-bit commands (Read Data
and Write Data commands) contain a Command Byte
and a Data Byte. The Command Byte contains two data
bits, see Figure 7-1.
Table 7-2 shows the supported commands for each
memory location and the corresponding values on the
SDI and SDO pins.
Table 7-3 shows an overview of all the SPI commands
and their interaction with other device features.
7.1 Command Byte
The Command Byte has three fields, the Address, the
Command, and 2 Data bits, see Figure 7-1. Currently
only one of the data bits is defined (D8). This is for the
Write command.
The device memory is accessed when the master
sends a proper Command Byte to select the desired
operation. The memory location getting accessed is
contained in the Command Byte’s AD3:AD0 bits. The
action desired is contained in the Command Byte’s
C1:C0 bits, see Ta b l e 7 - 1 . C1:C0 determines if the
desired memory location will be read, written,
Incremented (wiper setting +1) or Decremented (wiper
setting -1). The Increment and Decrement commands
are only valid on the volatile wiper registers.
As the Command Byte is being loaded into the device
(on the SDI pin), the device’s SDO pin is driving. The
SDO pin will output high bits for the first six bits of that
command. On the 7th bit, the SDO pin will output the
CMDERR bit state (see Section 7.3 “Error Condi-
tion”). The 8th bit state depends on the the command
selected.
TABLE 7-1: COMMAND BIT OVERVIEW
FIGURE 7-1: General SPI Command Formats.
C1:C0 Bit
States Command # of Bits
11 Read Data 16-Bits
00 Write Data 16-Bits
01 Increment 8-Bits
10 Decrement 8-Bits
A
D
3
A
D
2
A
D
1
A
D
0
C
1
C
0
D
9
D
8
Memory
Command Byte
Data
Address Bits
Command
Bits
A
D
3
A
D
2
A
D
1
A
D
0
C
1
C
0
D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Memory
16-bit Command
Data
Address Bits
Command
Bits
0 0 = Write Data
0 1 = INCR
1 0 = DECR
1 1 = Read Data
C C
1 0
Command
Bits
8-bit Command
Command Byte Data Byte
MCP413X/415X/423X/425X
DS22060B-page 48 © 2008 Microchip Technology Inc.
TABLE 7-2: MEMORY MAP AND THE SUPPORTED COMMANDS
Address
Command Data
(10-bits) (1)
SPI String (Binary)
Value Function MOSI (SDI pin) MISO (SDO pin) (2)
00h Volatile Wiper 0 Write Data nn nnnn nnnn 0000 00nn nnnn nnnn 1111 1111 1111 1111
Read Data nn nnnn nnnn 0000 11nn nnnn nnnn 1111 111n nnnn nnnn
Increment Wiper 0000 0100 1111 1111
Decrement Wiper 0000 1000 1111 1111
01h Volatile Wiper 1 Write Data nn nnnn nnnn 0001 00nn nnnn nnnn 1111 1111 1111 1111
Read Data nn nnnn nnnn 0001 11nn nnnn nnnn 1111 111n nnnn nnnn
Increment Wiper 0001 0100 1111 1111
Decrement Wiper 0001 1000 1111 1111
02h Reserved
03h Reserved
04h Volatile
TCON Register
Write Data nn nnnn nnnn 0100 00nn nnnn nnnn 1111 1111 1111 1111
Read Data nn nnnn nnnn 0100 11nn nnnn nnnn 1111 111n nnnn nnnn
05h Status Register Read Data nn nnnn nnnn 0101 11nn nnnn nnnn 1111 111n nnnn nnnn
06h-0Fh Reserved
Note 1: The Data Memory is only 9-bits wide, so the MSb is ignored by the device.
2: All these Address/Command combinations are valid, so the CMDERR bit is set. Any other Address/Command
combination is a command error state and the CMDERR bit will be clear.
© 2008 Microchip Technology Inc. DS22060B-page 49
MCP413X/415X/423X/425X
7.2 Data Byte
Only the Read Command and the Write Command use
the Data Byte, see Figure 7-1. These commands
concatenate the 8-bits of the Data Byte with the one
data bit (D8) contained in the Command Byte to form
9-bits of data (D8:D0). The Command Byte format
supports up to 9-bits of data so that the 8-bit resistor
network can be set to Full-Scale (100h or greater). This
allows wiper connections to Terminal A and to
Terminal B.
The D9 bit is currently unused, and corresponds to the
position on the SDO data of the CMDERR bit.
7.3 Error Condition
The CMDERR bit indicates if the four address bits
received (AD3:AD0) and the two command bits
received (C1:C0) are a valid combination (see
Table 4-1). The CMDERR bit is high if the combination
is valid and low if the combination is invalid.
SPI commands that do not have a multiple of 8 clocks
are ignored.
Once an error condition has occurred, any following
commands are ignored. All following SDO bits will be
low until the CMDERR condition is cleared by forcing
the CS pin to the inactive state (VIH).
7.3.1 ABORTING A TRANSMISSION
All SPI transmissions must have the correct number of
SCK pulses to be executed. The command is not
executed until the complete number of clocks have
been received. If the CS pin is forced to the inactive
state (VIH) the serial interface is reset. Partial com-
mands are not executed.
SPI is more susceptible to noise than other bus
protocols. The most likely case is that this noise
corrupts the value of the data being clocked into the
MCP4XXX or the SCK pin is injected with extra clock
pulses. This may cause data to be corrupted in the
device, or a command error to occur, since the address
and command bits were not a valid combination. The
extra SCK pulse will also cause the SPI data (SDI) and
clock (SCK) to be out of sync. Forcing the CS pin to the
inactive state (VIH) resets the serial interface. The SPI
interface will ignore activity on the SDI and SCK pins
until the CS pin transition to the active state is detected
(VIH to VIL or VIH to VIHH).
Note 1: When data is not being received by the
MCP4XXX, It is recommended that the
CS pin be forced to the inactive level (VIL)
2: It is also recommended that long
continuous command strings should be
broken down into single commands or
shorter continuous command strings.
This reduces the probability of noise on
the SCK pin corrupting the desired SPI
commands.
MCP413X/415X/423X/425X
DS22060B-page 50 © 2008 Microchip Technology Inc.
7.4 Continuous Commands
The device supports the ability to execute commands
continuously. While the CS pin is in the active state
(VIL or VIHH). Any sequence of valid commands may be
received.
The following example is a valid sequence of events:
1. CS pin driven active (VIL or VIHH).
2. Read Command.
3. Increment Command (Wiper 0).
4. Increment Command (Wiper 0).
5. Decrement Command (Wiper 1).
6. Write Command.
7. Write Command.
8. CS pin driven inactive (VIH).
TABLE 7-3: COMMANDS
Note 1: It is recommended that while the CS pin is
active, only one type of command should
be issued. When changing commands, it
is recommended to take the CS pin
inactive then force it back to the active
state.
2: It is also recommended that long
command strings should be broken down
into shorter command strings. This
reduces the probability of noise on the
SCK pin corrupting the desired SPI
command string.
Command Name # of Bits
High Voltage
(VIHH) on CS
pin?
Write Data 16-Bits —
Read Data 16-Bits —
Increment Wiper 8-Bits
Decrement Wiper 8-Bits
High Voltage Write Data 16-Bits Yes
High Voltage Read Data 16-Bits Yes
High Voltage Increment Wiper 8-Bits Yes
High Voltage Decrement Wiper 8-Bits Yes
occufi
© 2008 Microchip Technology Inc. DS22060B-page 51
MCP413X/415X/423X/425X
7.5 Write Data
Normal and High Voltage
The Write command is a 16-bit command. The format
of the command is shown in Figure 7-2.
A Write command to a Volatile memory location
changes that location after a properly formatted Write
Command (16-clock) have been received.
7.5.1 SINGLE WRITE
The write operation requires that the CS pin be in the
active state (VILor VIHH). Typically, the CS pin will be in
the inactive state (VIH) and is driven to the active state
(VIL). The 16-bit Write Command (Command Byte and
Data Byte) is then clocked in on the SCK and SDI pins.
Once all 16 bits have been received, the specified
volatile address is updated. A write will not occur if the
write command isn’t exactly 16 clocks pulses. This
protects against system issues from corrupting the
memory locations.
Figure 6-3 and Figure 6-4 show possible waveforms
for a single write.
FIGURE 7-2: Write Command - SDI and SDO States.
Note: The High Voltage Write Data command is
supported for compatability with system
that also support MCP414X/416X/424X/
426X devices.
A
D
3
A
D
2
A
D
1
A
D
0
00D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
1111111111111111Valid Address/Command combination
1111110000000000 Invalid Address/Command combination (1)
COMMAND BYTE DATA BYTE
SDI
SDO
Note 1: If an Error Condition occurs (CMDERR = L), all following SDO bits will be low until the CMDERR
condition is cleared (the CS pin is forced to the inactive state).
MAN DATA A A A A 0 D D D 1 1 1 1 1 1‘ 1 1 A A A A 0 D D D —> 1 1 1 1 1 1‘ 1 1 A A A A 0 D D D —> 1 1 1 1 1 1‘ 1 1 |—> .0. Command Errorfi:
MCP413X/415X/423X/425X
DS22060B-page 52 © 2008 Microchip Technology Inc.
7.5.2 CONTINUOUS WRITES
Continuous writes are possible only when writing to the
volatile memory registers (address 00h, 01h, and 04h).
Figure 7-3 shows the sequence for three continuous
writes. The writes do not need to be to the same volatile
memory address.
FIGURE 7-3: Continuous Write Sequence.
A
D
3
A
D
2
A
D
1
A
D
0
00D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
1111111*111111111
A
D
3
A
D
2
A
D
1
A
D
0
00D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
1111111*111111111
A
D
3
A
D
2
A
D
1
A
D
0
00D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
1111111*111111111
COMMAND BYTE DATA BYTE
SDI
SDO
Note 1: If a Command Error (CMDERR) occurs at this bit location (*), then all following SDO bits will be
driven low until the CS pin is driven inactive (VIH).
DATA
© 2008 Microchip Technology Inc. DS22060B-page 53
MCP413X/415X/423X/425X
7.6 Read Data
Normal and High Voltage
The Read command is a 16-bit command. The format
of the command is shown in Figure 7-4.
The first 6-bits of the Read command determine the
address and the command. The 7th clock will output
the CMDERR bit on the SDO pin. The remaining
9-clocks the device will transmit the 9 data bits (D8:D0)
of the specified address (AD3:AD0).
Figure 7-4 shows the SDI and SDO information for a
Read command.
7.6.1 SINGLE READ
The read operation requires that the CS pin be in the
active state (VILor VIHH). Typically, the CS pin will be in
the inactive state (VIH) and is driven to the active state
(VILor VIHH). The 16-bit Read Command (Command
Byte and Data Byte) is then clocked in on the SCK and
SDI pins. The SDO pin starts driving data on the 7th bit
(CMDERR bit) and the addressed data comes out on
the 8th through 16th clocks. Figure 6-3 through
Figure 6-6 show possible waveforms for a single read.
Figure 6-5 and Figure 6-6 show the single read
waveforms when the SDI and SDO signals are
multiplexed on the same pin. For additional information
on the multiplexing of these signals, refer to
Section 6.1.3 “SDI/SDO”.
FIGURE 7-4: Read Command - SDI and SDO States.
Note: The High Voltage Read Data command is
supported for compatability with system
that also support MCP414X/416X/424X/
426X devices.
A
D
3
A
D
2
A
D
1
A
D
0
11XXXXXXXXXX
1111111D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Valid Address/Command combination
1111110000000000Attempted Memory Read of Reserved
Memory location.
COMMAND BYTE DATA BYTE
SDI
SDO
READ DATA
COMMAN DATA AAA A 1 1“ 1“ 1“
MCP413X/415X/423X/425X
DS22060B-page 54 © 2008 Microchip Technology Inc.
7.6.2 CONTINUOUS READS
Continuous reads allows the devices memory to be
read quickly. Continuous reads are possible to all
memory locations.
Figure 7-5 shows the sequence for three continuous
reads. The reads do not need to be to the same
memory address.
FIGURE 7-5: Continuous Read Sequence.
A
D
3
A
D
2
A
D
1
A
D
0
11XXXXXXXXXX
1111111*D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
D
3
A
D
2
A
D
1
A
D
0
11XXXXXXXXXX
1111111*D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
A
D
3
A
D
2
A
D
1
A
D
0
11XXXXXXXXXX
1111111*D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
COMMAND BYTE DATA BYTE
SDI
SDO
Note 1: If a Command Error (CMDERR) occurs at this bit location (*), then all following SDO bits will be
driven low until the CS pin is driven inactive (VIH).
© 2008 Microchip Technology Inc. DS22060B-page 55
MCP413X/415X/423X/425X
7.7 Increment Wiper
Normal and High Voltage
The Increment Command is an 8-bit command. The
Increment Command can only be issued to wiper
memory locations. The format of the command is
shown in Figure 7-6.
An Increment Command to the wiper memory location
changes that location after a properly formatted
command (8-clocks) have been received.
Increment commands provide a quick and easy
method to modify the value of the wiper location by +1
with minimal overhead.
FIGURE 7-6: Increment Command -
SDI and SDO States.
7.7.1 SINGLE INCREMENT
Typically, the CS pin starts at the inactive state (VIH),
but may be already be in the active state due to the
completion of another command.
Figure 6-7 through Figure 6-8 show possible
waveforms for a single increment. The increment
operation requires that the CS pin be in the active state
(VILor VIHH). Typically, the CS pin will be in the inactive
state (VIH) and is driven to the active state (VILor VIHH).
The 8-bit Increment Command (Command Byte) is
then clocked in on the SDI pin by the SCK pins. The
SDO pin drives the CMDERR bit on the 7th clock.
The wiper value will increment up to 100h on 8-bit
devices and 80h on 7-bit devices. After the wiper value
has reached Full-Scale (8-bit =100h, 7-bit =80h), the
wiper value will not be incremented further. If the Wiper
register has a value between 101h and 1FFh, the
Increment command is disabled. See Table 7-4 for
additional information on the Increment Command
versus the current volatile wiper value.
The Increment operations only require the Increment
command byte while the CS pin is active (VILor VIHH)
for a single increment.
After the wiper is incremented to the desired position,
the CS pin should be forced to VIH to ensure that
unexpected transitions on the SCK pin do not cause
the wiper setting to change. Driving the CS pin to VIH
should occur as soon as possible (within device
specifications) after the last desired increment occurs.
TABLE 7-4: INCREMENT OPERATION VS.
VOLATILE WIPER VALUE
Note: The High Voltage Increment Wiper
command is supported for compatability
with system that also support MCP414X/
416X/424X/426X devices.
A
D
3
A
D
2
A
D
1
A
D
0
01XX
1111111*1Note 1, 2
1111110 0 Note 1, 3
(INCR COMMAND (n+1) )
SDI
SDO
COMMAND BYTE
Note 1: Only functions when writing the volatile
wiper registers (AD3:AD0) 0h and 1h.
2: Valid Address/Command combination.
3: Invalid Address/Command combination
all following SDO bits will be low until the
CMDERR condition is cleared.
(the CS pin is forced to the inactive
state).
4: If a Command Error (CMDERR) occurs
at this bit location (*), then all following
SDO bits will be driven low until the CS
pin is driven inactive (VIH).
Current Wiper
Setting Wiper (W)
Properties
Increment
Command
Operates?
7-bit
Pot
8-bit
Pot
3FFh
081h
3FFh
101h
Reserved
(Full-Scale (W = A))
No
080h 100h Full-Scale (W = A) No
07Fh
041h
0FFh
081
W = N
040h 080h W = N (Mid-Scale) Yes
03Fh
001h
07Fh
001
W = N
000h 000h Zero Scale (W = B) Yes
MA COMM)A MA / V \f \ XXAAAAOWXXAAAA01
MCP413X/415X/423X/425X
DS22060B-page 56 © 2008 Microchip Technology Inc.
7.7.2 CONTINUOUS INCREMENTS
Continuous Increments are possible only when writing
to the wiper registers.
Figure 7-7 shows a Continuous Increment sequence
for three continuous writes. The writes do not need to
be to the same volatile memory address.
When executing an continuous Increment commands,
the selected wiper will be altered from n to n+1 for each
Increment command received. The wiper value will
increment up to 100h on 8-bit devices and 80h on 7-bit
devices. After the wiper value has reached Full-Scale
(8-bit =100h, 7-bit =80h), the wiper value will not be
incremented further. If the Wiper register has a value
between 101h and 1FFh, the Increment command is
disabled.
Increment commands can be sent repeatedly without
raising CS until a desired condition is met. The value in
the Volatile Wiper register can be read using a Read
Command.
When executing a continuous command string, The
Increment command can be followed by any other valid
command.
The wiper terminal will move after the command has
been received (8th clock).
After the wiper is incremented to the desired position,
the CS pin should be forced to VIH to ensure that
unexpected transitions (on the SCK pin do not cause
the wiper setting to change). Driving the CS pin to VIH
should occur as soon as possible (within device
specifications) after the last desired increment occurs.
FIGURE 7-7: Continuous Increment Command - SDI and SDO States.
A
D
3
A
D
2
A
D
1
A
D
0
01XXA
D
3
A
D
2
A
D
1
A
D
0
01XXA
D
3
A
D
2
A
D
1
A
D
0
01XX
1111111*11111111*11111111*1Note 1, 2
111111000000000000000000Note 3, 4
111111111111110000000000Note 3, 4
11111111111111111111110 0 Note 3, 4
(INCR COMMAND (n+1) ) (INCR COMMAND (n+2) ) (INCR COMMAND (n+3) )
SDI
SDO
COMMAND BYTE COMMAND BYTE COMMAND BYTE
Note 1: Only functions when writing the volatile wiper registers (AD3:AD0) 0h and 1h.
2: Valid Address/Command combination.
3: Invalid Address/Command combination.
4: If an Error Condition occurs (CMDERR = L), all following SDO bits will be low until the CMDERR
condition is cleared (the CS pin is forced to the inactive state).
3FFh 3FFh Reserved
© 2008 Microchip Technology Inc. DS22060B-page 57
MCP413X/415X/423X/425X
7.8 Decrement Wiper
Normal and High Voltage
The Decrement Command is an 8-bit command. The
Decrement Command can only be issued to wiper
memory locations. The format of the command is
shown in Figure 7-6.
An Decrement Command to the wiper memory location
changes that location after a properly formatted
command (8-clocks) have been received.
Decrement commands provide a quick and easy
method to modify the value of the wiper location by -1
with minimal overhead.
FIGURE 7-8: Decrement Command -
SDI and SDO States.
7.8.1 SINGLE DECREMENT
Typically the CS pin starts at the inactive state (VIH), but
may be already be in the active state due to the
completion of another command.
Figure 6-7 through Figure 6-8 show possible
waveforms for a single Decrement. The decrement
operation requires that the CS pin be in the active state
(VILor VIHH). Typically the CS pin will be in the inactive
state (VIH) and is driven to the active state (VILor VIHH).
Then the 8-bit Decrement Command (Command Byte)
is clocked in on the SDI pin by the SCK pins. The SDO
pin drives the CMDERR bit on the 7th clock.
The wiper value will decrement from the wipers
Full-Scale value (100h on 8-bit devices and 80h on
7-bit devices). Above the wipers Full-Scale value
(8-bit =101h to 1FFh, 7-bit = 81h to FFh), the
decrement command is disabled. If the Wiper register
has a Zero Scale value (000h), then the wiper value will
not decrement. See Ta b l e 7 - 4 for additional information
on the Decrement Command vs. the current volatile
wiper value.
The Decrement commands only require the Decrement
command byte, while the CS pin is active (VILor VIHH)
for a single decrement.
After the wiper is decremented to the desired position,
the CS pin should be forced to VIH to ensure that
unexpected transitions on the SCK pin do not cause
the wiper setting to change. Driving the CS pin to VIH
should occur as soon as possible (within device
specifications) after the last desired decrement occurs.
TABLE 7-5: DECREMENT OPERATION VS.
VOLATILE WIPER VALUE
Note: The High Voltage Decrement Wiper
command is supported for compatability
with system that also support MCP414X/
416X/424X/426X devices.
A
D
3
A
D
2
A
D
1
A
D
0
10XX
1111111*1Note 1, 2
1111110 0 Note 1, 3
(DECR COMMAND (n+1))
SDI
SDO
COMMAND BYTE
Note 1: Only functions when writing the volatile
wiper registers (AD3:AD0) 0h and 1h.
2: Valid Address/Command combination.
3: Invalid Address/Command combination
all following SDO bits will be low until the
CMDERR condition is cleared.
(the CS pin is forced to the inactive
state).
4: If a Command Error (CMDERR) occurs
at this bit location (*), then all following
SDO bits will be driven low until the CS
pin is driven inactive (VIH).
Current Wiper
Setting Wiper (W)
Properties
Decrement
Command
Operates?
7-bit
Pot
8-bit
Pot
3FFh
081h
3FFh
101h
Reserved
(Full-Scale (W = A))
No
080h 100h Full-Scale (W = A) Yes
07Fh
041h
0FFh
081
W = N
040h 080h W = N (Mid-Scale) Yes
03Fh
001h
07Fh
001
W = N
000h 000h Zero Scale (W = B) No
MA COMMfi MA f V \/ \ 0XXAAAA10XXAAAA1
MCP413X/415X/423X/425X
DS22060B-page 58 © 2008 Microchip Technology Inc.
7.8.2 CONTINUOUS DECREMENTS
Continuous Decrements are possible only when writing
to the wiper registers.
Figure 7-9 shows a continuous Decrement sequence
for three continuous writes. The writes do not need to
be to the same volatile memory address.
When executing an continuous Decrement commands,
the selected wiper will be altered from n to n-1 for each
Decrement command received. The wiper value will
decrement from the wipers Full-Scale value (100h on
8-bit devices and 80h on 7-bit devices). Above the
wipers Full-Scale value (8-bit =101h to 1FFh,
7-bit = 81h to FFh), the decrement command is
disabled. If the Wiper register has a Zero Scale value
(000h), then the wiper value will not decrement. See
Table 7-4 for additional information on the Decrement
Command vs. the current volatile wiper value.
Decrement commands can be sent repeatedly without
raising CS until a desired condition is met. The value in
the Volatile Wiper register can be read using a Read
Command.
When executing a continuous command string, The
Decrement command can be followed by any other
valid command.
The wiper terminal will move after the command has
been received (8th clock).
After the wiper is decremented to the desired position,
the CS pin should be forced to VIH to ensure that
“unexpected” transitions (on the SCK pin do not cause
the wiper setting to change). Driving the CS pin to VIH
should occur as soon as possible (within device
specifications) after the last desired decrement occurs.
FIGURE 7-9: Continuous Decrement Command - SDI and SDO States.
A
D
3
A
D
2
A
D
1
A
D
0
10XXA
D
3
A
D
2
A
D
1
A
D
0
10XXA
D
3
A
D
2
A
D
1
A
D
0
10XX
1111111*11111111*11111111*1Note 1, 2
111111000000000000000000Note 3, 4
111111111111110000000000Note 3, 4
11111111111111111111110 0 Note 3, 4
(DECR COMMAND (n-1) ) (DECR COMMAND (n-1) ) (DECR COMMAND (n-1) )
SDI
SDO
COMMAND BYTE COMMAND BYTE COMMAND BYTE
Note 1: Only functions when writing the volatile wiper registers (AD3:AD0) 0h and 1h.
2: Valid Address/Command combination.
3: Invalid Address/Command combination.
4: If an Error Condition occurs (CMDERR = L), all following SDO bits will be low until the CMDERR
condition is cleared (the CS pin is forced to the inactive state).
Note 1: V minimum : 0.8 “ V D‘
© 2008 Microchip Technology Inc. DS22060B-page 59
MCP413X/415X/423X/425X
8.0 APPLICATIONS EXAMPLES
Digital potentiometers have a multitude of practical
uses in modern electronic circuits. The most popular
uses include precision calibration of set point thresh-
olds, sensor trimming, LCD bias trimming, audio atten-
uation, adjustable power supplies, motor control
overcurrent trip setting, adjustable gain amplifiers and
offset trimming. The MCP413X/415X/423X/425X
devices can be used to replace the common mechani-
cal trim pot in applications where the operating and
terminal voltages are within CMOS process limitations
(VDD = 2.7V to 5.5V).
8.1 Split Rail Applications
All inputs that would be used to interface to a Host
Controller support High Voltage on their input pin. This
allows the MCP4XXX device to be used in split power
rail applications.
An example of this is a battery application where the
PIC® MCU is directly powered by the battery supply
(4.8V) and the MCP4XXX device is powered by the
3.3V regulated voltage.
For SPI applications, these inputs are:
•CS
•SCK
SDI (or SDI/SDO)
SHDN
Figure 8-1 through Figure 8-2 show three example split
rail systems. In this system, the MCP4XXX interface
input signals need to be able to support the PIC MCU
output high voltage (VOH).
In Example #1 (Figure 8-1), the MCP4XXX interface
input signals need to be able to support the PIC MCU
output high voltage (VOH). If the split rail voltage delta
becomes too large, then the customer may be required
to do some level shifting due to MCP4XXX VOH levels
related to Host Controller VIH levels.
In Example #2 (Figure 8-2), the MCP4XXX interface
input signals need to be able to support the lower
voltage of the PIC MCU output high voltage level (VOH).
Table 8-1 shows an example PIC microcontroller I/O
voltage specifications and the MCP4XXX
specifications. So this PIC MCU operating at 3.3V will
drive a VOH at 2.64V, and for the MCP4XXX operating
at 5.5V, the VIH is 2.47V. Therefore, the interface
signals meet specifications.
FIGURE 8-1: Example Split Rail
System 1.
FIGURE 8-2: Example Split Rail
System 2.
TABLE 8-1: VOH - VIH COMPARISONS
PIC (1) MCP4XXX
(2)
Comment
VDD VIH VOH VDD VIH VOH
5.5 4.4 4.4 2.7 1.215 (3)
5.0 4.0 4.0 3.0 1.35 (3)
4.5 3.6 3.6 3.3 1.485 (3)
3.3 2.64 2.64 4.5 2.025 (3)
3.0 2.4 2.4 5.0 2.25 (3)
2.7 2.16 2.16 5.5 2.475 (3)
Note 1: VOH minimum = 0.8 * VDD;
VOL maximum = 0.6V
VIH minimum = 0.8 * VDD;
VIL maximum = 0.2 * VDD;
2: VOH minimum (SDA only) =;
VOL maximum = 0.2 * VDD
VIH minimum = 0.45 * VDD;
VIL maximum = 0.2 * VDD
3: The only MCP4XXX output pin is SDO,
which is Open-Drain (or Open-Drain with
Internal Pull-up) with High Voltage Support
Voltage
Regulator
5V 3V
PIC MCU MCP4XXX
SDI
CS
SCK
SHDN
SDI
CS
SCK
SHDN
SDO
SDO
Voltage
Regulator
3V
5V
PIC MCU MCP4XXX
SDI
CS
SCK
SHDN
SDI
CS
SCK
SHDN
SDO
SDO
GPO
MCP413X/415X/423X/425X
DS22060B-page 60 © 2008 Microchip Technology Inc.
8.2 Techniques to force the CS pin to
VIHH
The circuit in Figure 8-3 shows a method using the
TC1240A doubling charge pump. When the SHDN pin
is high, the TC1240A is off, and the level on the CS pin
is controlled by the PIC® microcontrollers (MCUs) IO2
pin.
When the SHDN pin is low, the TC1240A is on and the
VOUT voltage is 2 * VDD. The resistor R1 allows the CS
pin to go higher than the voltage such that the PIC
MCU’s IO2 pin “clamps” at approximately VDD.
FIGURE 8-3: Using the TC1240A to
generate the VIHH voltage.
The circuit in Figure 8-4 shows the method used on the
MCP402X Non-volatile Digital Potentiometer Evalua-
tion Board (Part Number: MCP402XEV). This method
requires that the system voltage be approximately 5V.
This ensures that when the PIC10F206 enters a
brown-out condition, there is an insufficient voltage
level on the CS pin to change the stored value of the
wiper. The MCP402X Non-volatile Digital
Potentiometer Evaluation Board User’s Guide
(DS51546) contains a complete schematic.
GP0 is a general purpose I/O pin, while GP2 can either
be a general purpose I/O pin or it can output the internal
clock.
For the serial commands, configure the GP2 pin as an
input (high-impedance). The output state of the GP0
pin will determine the voltage on the CS pin (VIL or VIH).
For high-voltage serial commands, force the GP0
output pin to output a high level (VOH) and configure the
GP2 pin to output the internal clock. This will form a
charge pump and increase the voltage on the CS pin
(when the system voltage is approximately 5V).
FIGURE 8-4: MCP4XXX Non-Volatile
Digital Potentiometer Evaluation Board
(MCP402XEV) implementation to generate the
VIHH voltage.
8.3 Using Shutdown Modes
Figure 8-5 shows a possible application circuit where
the independent terminals could be used.
Disconnecting the wiper allows the transistor input to
be taken to the Bias voltage level (disconnecting A and
or B may be desired to reduce system current).
Disconnecting Terminal A modifies the transistor input
by the RBW rheostat value to the Common B.
Disconnecting Terminal B modifies the transistor input
by the RAW rheostat value to the Common A. The
Common A and Common B connections could be
connected to VDD and VSS.
FIGURE 8-5: Example Application Circuit
using Terminal Disconnects.
CS
PIC MCU
MCP402X
R1
IO1
IO2
C2
TC1240A
VIN
SHDN
C+
C-
VOUT
C1
CS
PIC10F206
MCP4XXX
R1
GP0
GP2
C2
C1
Balance Bias
W
B
Input
Input
To ba s e
of Transistor
(or Amplifier)
A
Common B
Common A
© 2008 Microchip Technology Inc. DS22060B-page 61
MCP413X/415X/423X/425X
8.4 Design Considerations
In the design of a system with the MCP4XXX devices,
the following considerations should be taken into
account:
Power Supply Considerations
Layout Considerations
8.4.1 POWER SUPPLY
CONSIDERATIONS
The typical application will require a bypass capacitor
in order to filter high-frequency noise, which can be
induced onto the power supply's traces. The bypass
capacitor helps to minimize the effect of these noise
sources on signal integrity. Figure 8-6 illustrates an
appropriate bypass strategy.
In this example, the recommended bypass capacitor
value is 0.1 µF. This capacitor should be placed as
close (within 4 mm) to the device power pin (VDD) as
possible.
The power source supplying these devices should be
as clean as possible. If the application circuit has
separate digital and analog power supplies, VDD and
VSS should reside on the analog plane.
FIGURE 8-6: Typical Microcontroller
Connections.
8.4.2 LAYOUT CONSIDERATIONS
Inductively-coupled AC transients and digital switching
noise can degrade the input and output signal integrity,
potentially masking the MCP4XXX’s performance.
Careful board layout minimizes these effects and
increases the Signal-to-Noise Ratio (SNR). Multi-layer
boards utilizing a low-inductance ground plane,
isolated inputs, isolated outputs and proper decoupling
are critical to achieving the performance that the silicon
is capable of providing. Particularly harsh
environments may require shielding of critical signals.
If low noise is desired, breadboards and wire-wrapped
boards are not recommended.
8.4.3 RESISTOR TEMPCO
Characterization curves of the resistor temperature
coefficient (Tempco) are shown in Figure 2-11,
Figure 2-24, Figure 2-36, and Figure 2-48.
These curves show that the resistor network is
designed to correct for the change in resistance as
temperature increases. This technique reduces the
end to end change is RAB resistance.
8.4.4 HIGH VOLTAGE TOLERANT PINS
High Voltage support (VIHH) on the Serial Interface pins
supports two features. These are:
In-Circuit Accommodation of split rail applications
and power supply sync issues
Compatability with systems that also support
MCP414X/416X /424X/426X devices
VDD
VDD
VSS VSS
MCP413X/415X/
423X/425X
0.1 µF
PIC® Microcontroller
0.1 µF
U/D
CS
W
B
A
MCP413X/415X/423X/425X
DS22060B-page 62 © 2008 Microchip Technology Inc.
NOTES:
11D
© 2008 Microchip Technology Inc. DS22060B-page 63
MCP413X/415X/423X/425X
9.0 DEVELOPMENT SUPPORT
9.1 Development Tools
Several development tools are available to assist in
your design and evaluation of the MCP4XXX devices.
The currently available tools are shown in Ta b l e 9-1.
These boards may be purchased directly from the
Microchip web site at www.microchip.com.
9.2 Technical Documentation
Several additional technical documents are available to
assist you in your design and development. These
technical documents include Application Notes,
Technical Briefs, and Design Guides. Tab l e 9 - 2 shows
some of these documents.
TABLE 9-1: DEVELOPMENT TOOLS
TABLE 9-2: TECHNICAL DOCUMENTATION
Board Name Part # Supported Devices
MCP42XX Digital Potentiometer PICtail Plus Demo
Board
MCP42XXDM-PTPLS MCP42XX
MCP4XXX Digital Potentiometer Daughter Board (1) MCP4XXXDM-DB MCP42XXX, MCP42XX,
MCP4021, and MCP4011
8-pin SOIC/MSOP/TSSOP/DIP Evaluation Board SOIC8EV Any 8-pin device in DIP, SOIC,
MSOP, or TSSOP package
14-pin SOIC/MSOP/DIP Evaluation Board SOIC14EV Any 14-pin device in DIP, SOIC, or
MSOP package
Note 1: Requires the use of a PICDEM Demo board (see Users Guide for details)
Application
Note Number
Title Literature #
AN1080 Understanding Digital Potentiometers Resistor Variations DS01080
AN737 Using Digital Potentiometers to Design Low Pass Adjustable Filters DS00737
AN692 Using a Digital Potentiometer to Optimize a Precision Single Supply Photo Detect DS00692
AN691 Optimizing the Digital Potentiometer in Precision Circuits DS00691
AN219 Comparing Digital Potentiometers to Mechanical Potentiometers DS00219
Digital Potentiometer Design Guide DS22017
Signal Chain Design Guide DS21825
MCP413X/415X/423X/425X
DS22060B-page 64 © 2008 Microchip Technology Inc.
NOTES:
XXXXXX 0% 413152 lid 0% O G 0‘8 0’8 NNN alor( ‘)
© 2008 Microchip Technology Inc. DS22060B-page 65
MCP413X/415X/423X/425X
10.0 PACKAGING INFORMATION
10.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
8-Lead DFN (3x3) Example:
Part Number Code Part Number Code
MCP4131-502E/MF DAAE MCP4132-502E/MF DAAY
MCP4131-103E/MF DAAF MCP4132-103E/MF DAAZ
MCP4131-104E/MF DAAH MCP4132-104E/MF DABB
MCP4131-503E/MF DAAG MCP4132-503E/MF DABA
MCP4151-502E/MF DAAP MCP4152-502E/MF DAAA
MCP4151-103E/MF DAAQ MCP4152-103E/MF DABD
MCP4151-104E/MF DAAS MCP4152-104E/MF DAAD
MCP4151-503E/MF DAAR MCP4152-503E/MF DAAC
DAAE
0817
256
XXXX
YYWW
NNN
8-Lead MSOP
XXXXXX
YWWNNN
Example
413152
817256
Part Number Code Part Number Code
MCP4131-502E/MS 413152 MCP4132-502E/MS 413252
MCP4131-103E/MS 413113 MCP4132-103E/MS 413213
MCP4131-104E/MS 413114 MCP4132-104E/MS 413214
MCP4131-503E/MS 413153 MCP4132-503E/MS 413253
MCP4151-502E/MS 415152 MCP4152-502E/MS 415252
MCP4151-103E/MS 415113 MCP4152-103E/MS 415213
MCP4151-104E/MS 415114 MCP4152-104E/MS 415214
MCP4151-503E/MS 415153 MCP4152-503E/MS 415253
XXXXXNNN
8-Lead PDIP
XXXXXXXX
YYWW
E/P 256
Example
4131-502
0817
3
e
8-Lead SOIC
XXXXXXXX
XXXXYYWW
NNN
Example
4131502E
SN^^^0817
256
3
e
XXXXXX 0‘9 ofi‘ HHHHHHH ’9 O UUUUUUU HHHHHHH '3‘ O UUUUUUU
MCP413X/415X/423X/425X
DS22060B-page 66 © 2008 Microchip Technology Inc.
Package Marking Information (Continued)
10-Lead DFN (3x3) Example:
Part Number Code Part Number Code
MCP4232-502E/MF BAEH MCP4252-502E/MF BAES
MCP4232-103E/MF BAEJ MCP4252-103E/MF BAET
MCP4232-104E/MF BAEL MCP4252-104E/MF BAEV
MCP4232-503E/MF BAEK MCP4252-503E/MF BAEU
BAEH
0817
256
XXXX
YYWW
NNN
10-Lead MSOP
XXXXXX
YWWNNN
Example
423252
817256
Part Number Code Part Number Code
MCP4232-502E/MS 423252 MCP4252-502E/MS 425252
MCP4232-103E/MS 423213 MCP4252-103E/MS 425213
MCP4232-104E/MS 423214 MCP4252-104E/MS 425214
MCP4232-503E/MS 423253 MCP4252-503E/MS 425253
14-Lead TSSOP
XXXXXXXX
YYWW
NNN
Example
4251502E
0817
256
XXXXX
16-Lead QFN
XXXXXX
YWWNNN
Example
14-Lead SOIC (.150”)
XXXXXXXXXXX
XXXXXXXXXXX
YYWWNNN
Example
MCP4251
502E/SL^^
0817256
3
e
XXXXXX
4251
502
0817256
E/ML^^
3
e
14-Lead PDIP
XXXXXXXXXXXXXX
XXXXXXXXXXXXXX
YYWWNNN
Example
MCP4251
502E/P^^
0817256
3
e
© 2008 Microchip Technology Inc. DS22060B-page 67
MCP413X/415X/423X/425X
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BOTTOM VIEW
TOP VIEW
D
N
E
NOTE 1
12
EXPOSED PAD
b
e
N
L
E2
K
NOTE 1
D2
21
NOTE 2
A
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MCP413X/415X/423X/425X
DS22060B-page 68 © 2008 Microchip Technology Inc.
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MCP413X/415X/423X/425X
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+ &  ","%!"&"$ %!  "$ %!   %#"@ "
& "%,-.
/01/ & %#%! ))%!%% 
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 60;,
& 5&% 6 67 8
6!&($ 6 9
%  /0
%%  = = 
""**  . + .
/ %%  . = =
!"%!"<"% ,  + +.
""*<"% ,  . 9
75%  +9 +:. 
%% 5 . + .
5"* 9  .
45"<"% (  : 
5)5"<"% (  9 
7)? / = = +
N
E1
NOTE 1
D
12
3
A
A1
A2
L
b1
b
e
E
eB
c
  ) 09/
MCP413X/415X/423X/425X
DS22060B-page 70 © 2008 Microchip Technology Inc.
() *')#)*$
%
 !"#$%!&'(!%&! %(%")%%%"
&  ","%!"&"$ %!  "$ %!   %#".&& "
+ & "%,-.
/01 / & %#%! ))%!%% 
,21 $& '! !)%!%%'$$&%!  
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 55,,
& 5&% 6 67 8
6!&($ 6 9
%  :./0
7;%  = = 
""**  . 9. .
%"$$   = .
7<"% , /0
""*<"% , +/0
75%  +/0
2%5% 5  : 9
2%% 5 .,2
2% IA = 9A
5"* 9 = +
5"<"% (  = 
D
N
E
E1
NOTE 1
12
e
b
A
A1
A2
c
L1 L
φ
  ) 0/
© 2008 Microchip Technology Inc. DS22060B-page 71
MCP413X/415X/423X/425X
) *')((+ !"#)*&,$
%
  !"#$%!&'(!%&! %(%")%%%"
 ?$%0% %
+ &  ","%!"&"$ %!  "$ %!   %#".&& "
 & "%,-.
/01 / & %#%! ))%!%% 
,21 $& '! !)%!%%'$$&%!  
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 55,,
& 5&% 6 67 8
6!&($ 6 9
%  /0
7;%  = = .
""**  . = =
%"$$
?
  = .
7<"% , :/0
""*<"% , +/0
75%  /0
0&$B%C  . = .
2%5% 5  = 
2%% 5 ,2
2% A = 9A
5"*  = .
5"<"% ( + = .
"$% .A = .A
"$%/%%& .A = .A
D
N
e
E
E1
NOTE 1
12 3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
  ) 0./
Notes: 41 / S‘LK SCREEN LJULJ A X1 RECOMMENDED LAND PATTERN Umts MILUMETERS Dxmension Lmts MIN \ NOM \ MAX 013an Pitch E 1 27 BSC Contact Fad Spacmg C 5 4D Con'ad Fad wmm (X8) X1 0 60 Contact Pad Lengm (x5) Y1 1 55 1 Dimensmning and (o‘erancing per ASME v14 5M 850 Basic Dimensm. Theoreucauy exact value shown wnnom to‘erances. Mucmcmp Technology Drawmg No GOA-2057A
MCP413X/415X/423X/425X
DS22060B-page 72 © 2008 Microchip Technology Inc.
) *')((+ !"#)*&,$
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
wa—Z P/
© 2008 Microchip Technology Inc. DS22060B-page 73
MCP413X/415X/423X/425X
- !"#$
%
 !"#$%!&'(!%&! %(%")%%%"
*&&# "%( %" 
+ *  ) !%"
& "%,-.
/01 / & %#%! ))%!%% 
,21 $& '! !)%!%%'$$&%!  
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 55,,
& 5&% 6 67 8
6!&($ 6 
%  ./0
7;%  9  
%"$$    .
0%%* + ,2
75%  +/0
,# ""5%   +. 9
7<"% , +/0
,# ""<"% ,  .9 .
0%%<"% ( 9 . +
0%%5% 5 +  .
0%%%,# "" >  = =
D
N
NOTE 1 12
E
b
e
N
L
E2
NOTE 1
1
2
D2
K
EXPOSED
PAD
BOTTOM VIEW
TOP VIEW
A3 A1
A
NOTE 2
  ) 0:+/
*ELELDDDDJ _,|EL_ X1 —> ‘<— silk="" screen="" recommended="" land="" pattern="" umts="" milumeters="" dtmension="" ltths="" min="" |="" nom="" |="" max="" contact="" pttch="" e="" 0.50="" bsc="" opltonal="" center="" pad="" wtdm="" w2="" 2.48="" opltonal="" center="" pad="" length="" t2="" 1.55="" contact="" pad="" spacmg="" c1="" 3.10="" contact="" pad="" wtdm="" (x8)="" x1="" 0.30="" contact="" pad="" length="" (x8)="" w="" 0.65="" distance="" between="" fads="" g="" o="" 20="" notes="" 1="" dtmenstonlng="" and="" toterancmg="" per="" asme="" v14="" sm="" 880="" basic="" dimenston="" thearettca‘ly="" axaci="" value="" shawn="" wtthuut="" tutarances="" microchtp="" technology="" drawtng="" no.="" c0472063a="">
MCP413X/415X/423X/425X
DS22060B-page 74 © 2008 Microchip Technology Inc.
- !"#$
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
© 2008 Microchip Technology Inc. DS22060B-page 75
MCP413X/415X/423X/425X
-() *'.#)*$
%
  !"#$%!&'(!%&! %(%")%%%"
 &  ","%!"&"$ %!  "$ %!   %#".&& "
+ & "%,-.
/01 / & %#%! ))%!%% 
,21 $& '! !)%!%%'$$&%!  
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 55,,
& 5&% 6 67 8
6!&($ 6 
%  ./0
7;%  = = 
""**  . 9. .
%"$$   = .
7<"% , /0
""*<"% , +/0
75%  +/0
2%5% 5  : 9
2%% 5 .,2
2% A = 9A
5"* 9 = +
5"<"% ( . = ++
D
E
E1
N
NOTE 1
12
b
e
A
A1
A2 c
L
L1
φ
  ) 0/
H‘WH‘WH‘WF‘WH‘WH‘WH‘W ’94 HHHHLUJHHHHHHLUJ jW¥ fl
MCP413X/415X/423X/425X
DS22060B-page 76 © 2008 Microchip Technology Inc.
-/&'' !"#&$
%
 !"#$%!&'(!%&! %(%")%%%"
?$%0% %
+ &  ","%!"&"$ %!  "$ %!   %#"@ "
& "%,-.
/01/ & %#%! ))%!%% 
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 60;,
& 5&% 6 67 8
6!&($ 6 
%  /0
%%  = = 
""**  . + .
/ %%  . = =
!"%!"<"% ,  + +.
""*<"% ,  . 9
75%  +. . .
%% 5 . + .
5"* 9  .
45"<"% ( . : 
5)5"<"% (  9 
7)? / = = +
N
E1
D
NOTE 1
123
E
c
eB
A2
L
A
A1
b1
be
  ) 0./
Hflflmflflfl NNNNN
© 2008 Microchip Technology Inc. DS22060B-page 77
MCP413X/415X/423X/425X
-/) *')((+ !"#)*&,$
%
 !"#$%!&'(!%&! %(%")%%%"
?$%0% %
+ &  ","%!"&"$ %!  "$ %!   %#".&& "
& "%,-.
/01 / & %#%! ))%!%% 
,21 $& '! !)%!%%'$$&%!  
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 55,,
& 5&% 6 67 8
6!&($ 6 
%  /0
7;%  = = .
""**  . = =
%"$$?   = .
7<"% , :/0
""*<"% , +/0
75%  9:./0
0&$B%C  . = .
2%5% 5  = 
2%% 5 ,2
2% IA = 9A
5"*  = .
5"<"% ( + = .
"$% D.A = .A
"$%/%%& E.A = .A
NOTE 1
N
D
E
E1
123
b
e
A
A1
A2
L
L1
c
h
hα
β
φ
  ) 0:./
14-Lead Plastic Small Outline (SL) - Narrow, 3.90 mm Body [SOIC] _—| ‘<— gx="" ‘mdddde="" t="" s‘lk="" screen="" .3]="" hume:="" a="" lt?="" l—="" l="" recommended="" land="" pattern="" untts="" milltmeters="" dtmenslun="" ttmtts="" mw="" \="" nom="" \="" max="" contact="" pttcn="" e="" 1="" 27="" bsc="" contact="" pad="" spaclng="" c="" 5="" 40="" contact="" pad="" wudtn="" x="" c="" 60="" contact="" pad="" length="" v="" 1="" 50="" distance="" between="" pads="" gx="" 0.67="" distance="" between="" pads="" g="" 3.90="" notes.="" t="" dimenstomng="" and="" toleranctng="" per="" asme="" v14="" sm="" 350="" basic="" dtmenston.="" theorettcauy="" exact="" value="" shown="" without="" toterances.="" microcmp="" technology="" drawtng="" no.="" canoes/x="">
MCP413X/415X/423X/425X
DS22060B-page 78 © 2008 Microchip Technology Inc.
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
HHHHHHH MM \ \ \ \ \ \ L r, 4 7 EJ
© 2008 Microchip Technology Inc. DS22060B-page 79
MCP413X/415X/423X/425X
-/01')1(') *')0// !"#0))*$
%
  !"#$%!&'(!%&! %(%")%%%"
 &  ","%!"&"$ %!  "$ %!   %#".&& "
+ & "%,-.
/01 / & %#%! ))%!%% 
,21 $& '! !)%!%%'$$&%!  
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 55,,
& 5&% 6 67 8
6!&($ 6 
%  :./0
7;%  = = 
""**  9  .
%"$$  . = .
7<"% , :/0
""*<"% , +  .
""*5%   . .
2%5% 5 . : .
2%% 5 ,2
2% IA = 9A
5"*  = 
5"<"% (  = +
NOTE 1
D
N
E
E1
12
e
b
c
A
A1
A2
L1 L
φ
  ) 09/
+ ‘J w
MCP413X/415X/423X/425X
DS22060B-page 80 © 2008 Microchip Technology Inc.
-23// !"#3$
%
  !"#$%!&'(!%&! %(%")%%%"
 *  ) !%"
+ & "%,-.
/01 / & %#%! ))%!%% 
,21 $& '! !)%!%%'$$&%!  
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
4% 55,,
& 5&% 6 67 8
6!&($ 6 :
%  :./0
7;%  9  
%"$$    .
0%%* + ,2
7<"% , /0
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0%%<"% ( . + +.
0%%5% 5 +  .
0%%%,# "" >  = =
D
E
N
2
1
EXPOSED
PAD
D2
E2
2
1
e
b
K
N
NOTE 1
A3
A1
A
L
TOP VIEW BOTTOM VIEW
  ) 0/
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] 01 W2 --.- DUDE SILK SCREEN RECOMMENDED LAND PATTERN Units MiLLiMETERs Dimension Limits MiN \ NOM \ MAX Contact Pitcn E 0.05 BSC Optionai Center Fad Width wz 2.50 Optionai Center Pad Lengin T2 2.50 Contact Pad Spacing CI 4.00 Contact Pad Spacing CZ 4.00 Contact Pad Wiuin (X28) Xi 0.35 Contact Pad Lengtn (x25) w 0.80 Disiance Between Pads G 0.30 Noies: i. Dimensiomng and toierancing per ASME VM.5M BSC Basic Dimension. Tneoreueaiiy exact value shown wunout toietances. Mlcmchip Technology Drawing No GOA-2127A
© 2008 Microchip Technology Inc. DS22060B-page 81
MCP413X/415X/423X/425X
% 2%& %!%*") '  %*$%%"%
%%133)))&&3*
MCP413X/415X/423X/425X
DS22060B-page 82 © 2008 Microchip Technology Inc.
NOTES:
© 2008 Microchip Technology Inc. DS22060B-page 83
MCP413X/415X/423X/425X
APPENDIX A: REVISION HISTORY
Revision B (December 2008)
The following is the list of modifications:
1. Updated IPU specifications to specify test
conditions and new limit.
2. Updated DFN package in “Package Types (top
view)”, including Exposed Thermal Pad sample
(EP).
3. Added new descriptions in Section 3.0 “Pin
Descriptions”.
4. Added new Development Tool support items.
5. Updated Package Outline section.
Revision A (September 2007)
Original Release of this Document.
APPENDIX B: MIGRATING FROM
THE MCP41XXX AND
MCP42XXX DEVICES
This is intended to give an overview of some of the
differences to be aware of when migrating from the
MCP41XXX and MCP42XXX devices.
B.1 MCP41XXX to MCP41XX
Differences
Here are some of the differences to be aware of:
1. SI pin is now SDI/SDO pin, and the contents of
the device memory can be read.
2. Need to address the Terminal Connect Feature
(TCON register) of MCP41XX.
3. MCP41XX supports software Shutdown mode.
4. New 5 kΩ version.
5. MCP41XX have 7-bit resolution options.
6. Alternate pinout versions (for Rheostat
configuration).
7. Verify device’s electrical specifications.
8. Interface signals are now high voltage tolerant.
9. Interface signals now have internal pull-up
resistors.
B.2 MCP42XXX to MCP42XX
Differences
Here are some of the differences to be aware of:
1. Daisy chaining of devices is no longer
supported.
2. SDO pin allows contents of device memory to be
read.
3. Need to address the Terminal Connect Feature
(TCON register) of MCP42XX.
4. MCP42XX supports software Shutdown mode.
5. New 5 kΩ version.
6. MCP42XX have 7-bit resolution options.
7. Alternate package/pinout versions (for Rheostat
configuration).
8. Verify device’s electrical specifications.
9. Interface signals are now high voltage tolerant
10. Interface signals now have internal pull-up
resistors.
MCP413X/415X/423X/425X
DS22060B-page 84 © 2008 Microchip Technology Inc.
NOTES:
PART No. v Xxx 41x (xx Examples:
© 2008 Microchip Technology Inc. DS22060B-page 85
MCP413X/415X/423X/425X
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XXXXX
Resistance PackageTemperature
Range
Device
Device MCP4131: Single Volatile 7-bit Potentiometer
MCP4131T: Single Volatile 7-bit Potentiometer
(Tape and Reel)
MCP4132: Single Volatile 7-bit Rheostat
MCP4132T: Single Volatile 7-bit Rheostat
(Tape and Reel)
MCP4151: Single Volatile 8-bit Potentiometer
MCP4151T: Single Volatile 8-bit Potentiometer
(Tape and Reel)
MCP4152: Single Volatile 8-bit Rheostat
MCP4152T: Single Volatile 8-bit Rheostat
(Tape and Reel)
MCP4231: Dual Volatile 7-bit Potentiometer
MCP4231T: Dual Volatile 7-bit Potentiometer
(Tape and Reel)
MCP4232: Dual Volatile 7-bit Rheostat
MCP4232T: Dual Volatile 7-bit Rheostat
(Tape and Reel)
MCP4251: Dual Volatile 8-bit Potentiometer
MCP4251T: Dual Volatile 8-bit Potentiometer
(Tape and Reel)
MCP4252: Dual Volatile 8-bit Rheostat
MCP4252T: Dual Volatile 8-bit Rheostat
(Tape and Reel)
Resistance Version: 502 = 5 k
103 = 10 k
503 = 50 k
104 = 100 k
Temperature Range I = -40°C to +85°C (Industrial)
E= -40°C to +125°C (Extended)
Package MF = Plastic Dual Flat No-lead (3x3 DFN), 8/10-lead
ML = Plastic Quad Flat No-lead (QFN), 16-lead
MS = Plastic Micro Small Outline (MSOP), 8-lead
P = Plastic Dual In-line (PDIP) (300 mil), 8/14-lead
SN = Plastic Small Outline (SOIC), (150 mil), 8-lead
SL = Plastic Small Outline (SOIC), (150 mil), 14-lead
ST = Plastic Thin Shrink Small Outline (TSSOP), 14-lead
UN = Plastic Micro Small Outline (MSOP), 10-lead
Examples:
a) MCP4131-502E/XX: 5 k, 8LD Device
b) MCP4131T-502E/XX: T/R, 5 k, 8LD Device
c) MCP4131-103E/XX: 10 k, 8-LD Device
d) MCP4131T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4131-503E/XX: 50 k, 8LD Device
f) MCP4131T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4131-104E/XX: 100 k, 8LD Device
h) MCP4131T-104E/XX: T/R, 100 k, 8LD Device
a) MCP4132-502E/XX: 5 k, 8LD Device
b) MCP4132T-502E/XX: T/R, 5 k, 8LD Device
c) MCP4132-103E/XX: 10 k, 8-LD Device
d) MCP4132T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4132-503E/XX: 50 k, 8LD Device
f) MCP4132T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4132-104E/XX: 100 k, 8LD Device
h) MCP4132T-104E/XX: T/R, 100 k, 8LD Device
a) MCP4151-502E/XX: 5 k, 8LD Device
b) MCP4151T-502E/XX: T/R, 5 k, 8LD Device
c) MCP4151-103E/XX: 10 k, 8-LD Device
d) MCP4151T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4151-503E/XX: 50 k, 8LD Device
f) MCP4151T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4151-104E/XX: 100 k, 8LD Device
h) MCP4151T-104E/XX: T/R, 100 k, 8LD Device
a) MCP4152-502E/XX: 5 k, 8LD Device
b) MCP4152T-502E/XX: T/R, 5 k, 8LD Device
c) MCP4152-103E/XX: 10 k, 8-LD Device
d) MCP4152T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4152-503E/XX: 50 k, 8LD Device
f) MCP4152T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4152-104E/XX: 100 k, 8LD Device
h) MCP4152T-104E/XX: T/R, 100 k, 8LD Device
a) MCP4231-502E/XX: 5 k, 8LD Device
b) MCP4231T-502E/XX: T/R, 5 kΩ, 8LD Device
c) MCP4231-103E/XX: 10 k, 8-LD Device
d) MCP4231T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4231-503E/XX: 50 k, 8LD Device
f) MCP4231T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4231-104E/XX: 100 k, 8LD Device
h) MCP4231T-104E/XX: T/R, 100 k, 8LD Device
a) MCP4232-502E/XX: 5 k, 8LD Device
b) MCP4232T-502E/XX: T/R, 5 k, 8LD Device
c) MCP4232-103E/XX: 10 k, 8-LD Device
d) MCP4232T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4232-503E/XX: 50 k, 8LD Device
f) MCP4232T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4232-104E/XX: 100 k, 8LD Device
h) MCP4232T-104E/XX: T/R, 100 k, 8LD Device
a) MCP4251-502E/XX: 5 k, 8LD Device
b) MCP4251T-502E/XX: T/R, 5 k, 8LD Device
c) MCP4251-103E/XX: 10 k, 8-LD Device
d) MCP4251T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4251-503E/XX: 50 k, 8LD Device
f) MCP4251T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4251-104E/XX: 100 k, 8LD Device
h) MCP4251T-104E/XX: T/R, 100 k, 8LD Device
a) MCP4252-502E/XX: 5 k, 8LD Device
b) MCP4252T-502E/XX: T/R, 5 k, 8LD Device
c) MCP4252-103E/XX: 10 k, 8-LD Device
d) MCP4252T-103E/XX: T/R, 10 k, 8LD Device
e) MCP4252-503E/XX: 50 k, 8LD Device
f) MCP4252T-503E/XX: T/R, 50 k, 8LD Device
g) MCP4252-104E/XX: 100 k, 8LD Device
h) MCP4252T-104E/XX: T/R, 100 k, 8LD Device
XX = MF for 8/10-lead 3x3 DFN
= ML for 16-lead QFN
= MS for 8-lead MSOP
= P for 8/14-lead PDIP
= SN for 8-lead SOIC
= SL for 14-lead SOIC
= ST for 14-lead TSSOP
= UN for 10-lead MSOP
Version
MCP413X/415X/423X/425X
DS22060B-page 86 © 2008 Microchip Technology Inc.
NOTES:
QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV = ISO/TS 1694922002 =
© 2008 Microchip Technology Inc. DS22060B-page 87
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, rfPIC, SmartShunt and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
FilterLab, Linear Active Thermistor, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, In-Circuit Serial
Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, PICkit, PICDEM,
PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo,
PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total
Endurance, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2008, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
Q ‘MICROCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
DS22060B-page 88 © 2008 Microchip Technology Inc.
AMERICAS
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WORLDWIDE SALES AND SERVICE
01/02/08

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