LQG18Hyyyy00D Ref Sheet Datasheet by Murata Electronics

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Spec No.: JELF243B 0002W701 efe re n ce 0 n ly n To‘erance e \nduclance
Spec No.: JELF243B_0002W-01 P1/10
MURATA MFG CO., LTD
CHIP COILS (CHIP INDUCTORS) LQG18HN□□□□00 REFERENCE SPECIFICATION
1. Scope
This reference specification applies to chip coils (chip inductors) LQG18HN_00 series for general electronic equipment.
2. Part Numbering
(Ex.)
LQ G 18 H N 1N2 S 0 0 D
Product
ID
Structure Dimension
(L × W)
Application
and
characteristic
Category Inductance Tolerance Performance Electrode
specification
Packaging
D: taping
*B: bulk
*B: Bulk packing is also available.
3. Part Number and Rating
Operating temperature range -40°C to +85°C
Storage temperature range -55°C to +125°C
Customer
Part number
Murata
Part number
Inductance
Q
(Min.)
DC
resistance
(Ω max.)
Self-resonant
frequency
(MHz min.)
Rated current
(mA)
Nominal
value
(nH)
Tolerance
LQG18HN1N2S00D 1.2 ±0.3 nH 12 0.10 6000 1100
LQG18HN1N5S00D 1.5 ±0.3 nH 12 0.10 6000 1100
LQG18HN1N8S00D 1.8 ±0.3 nH 12 0.10 6000 1100
LQG18HN2N2S00D 2.2 ±0.3 nH 12 0.10 6000 1100
LQG18HN2N7S00D 2.7 ±0.3 nH 12 0.12 6000 1000
LQG18HN3N3S00D 3.3 ±0.3 nH 12 0.12 6000 1000
LQG18HN3N9S00D 3.9 ±0.3 nH 12 0.15 6000 900
LQG18HN4N7S00D 4.7 ±0.3 nH 12 0.15 6000 900
LQG18HN5N6S00D 5.6 ±0.3 nH 12 0.20 5000 800
LQG18HN6N8J00D 6.8 ±5% 12 0.20 5000 800
LQG18HN8N2J00D 8.2 ±5% 12 0.20 4000 800
LQG18HN10NJ00D 10 ±5% 12 0.30 3500 650
LQG18HN12NJ00D 12 ±5% 12 0.35 3000 600
LQG18HN15NJ00D 15 ±5% 12 0.35 2800 600
LQG18HN18NJ00D 18 ±5% 12 0.37 2600 600
LQG18HN22NJ00D 22 ±5% 12 0.50 2300 500
LQG18HN27NJ00D 27 ±5% 12 0.54 2000 500
LQG18HN33NJ00D 33 ±5% 12 0.54 1700 500
LQG18HN39NJ00D 39 ±5% 12 0.60 1500 450
LQG18HN47NJ00D 47 ±5% 12 0.70 1200 400
LQG18HN56NJ00D 56 ±5% 12 0.75 1100 400
LQG18HN68NJ00D 68 ±5% 12 0.80 1000 400
LQG18HN82NJ00D 82 ±5% 12 0.85 900 350
LQG18HNR10J00D 100 ±5% 12 0.90 800 350
4. Testing Conditions
Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa
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Spec No.: JELF243B_0002W-01 P2/10
MURATA MFG CO., LTD
5. Appearance and Dimensions
Unit mass (typical value): 0.003 g
6. Marking
7. Electrical Performance
No. Item Specification Test method
7.1 Inductance Meet chapter 3 ratings. Measuring equipment: Keysight E4991A or the
equivalent
Measuring frequency: 100 MHz
Measuring conditions:
Measurement signal level: Approx. 0 dBm
Measurement terminal distance: 1.0 mm
Electrical length: 10 mm
Weight: Approx. 1 N to 5 N
Position the chip coil under test as shown in the
measuring example below and connect it to the
electrode by applying weight.
Measurement example:
Measuring method: see "Electrical performance:
Measuring method for inductance/Q" in the Appendix.
7.2 Q Meet chapter 3 ratings.
7.3 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter
7.4 Self-resonant
frequency
Meet chapter 3 ratings. Measuring equipment: Keysight 8753C or the
equivalent
7.5 Rated current Product temperature rise: 25°C max. Apply the rated current specified in chapter 3.
Reference Only Spec No; JELF243B 0002W701 45 45 \’ ‘Product (in mm)
Spec No.: JELF243B_0002W-01 P3/10
MURATA MFG CO., LTD
8. Mechanical Performance
No. Item Specification Test method
8.1 Shear test No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test substrate: glass-epoxy substrate
Applying force: 10 N
Holding time: 5 s±1 s
Force application direction:
8.2 Bending test No significant mechanical damage or no
sign of electrode peeling off shall be
observed.
Test substrate: glass-epoxy substrate (100 mm × 40
mm × 1.0 mm)
Pressurizing speed: 1 mm/s
Pressure jig: R340
Deflection: 2 mm
Holding time: 30 s
8.3 Vibration Appearance shall have no significant
mechanical damage.
Inductance change rate: within ±10%
Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for
approx. 1 min
Total amplitude: 1.5 mm
Test time: 3 directions perpendicular to each other, 2
h for each direction (6 h in total)
8.4 Solderability 90% or more of the outer electrode shall
be covered with new solder seamlessly.
Flux: immersed in ethanol solution with a rosin
content of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5 Resistance to
soldering heat
Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
Flux: immersed in ethanol solution with a rosin
content of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/1 min to 2 min
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h
9. Environmental Performance
The product is soldered on a glass-epoxy substrate for test.
No. Item Specification Test method
9.1 Humidity Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
Temperature: 40°C±2°C
Humidity: 90% (RH) to 95% (RH)
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.2 Heat life Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
Temperature: 85°C±2°C
Applied current: Rated current specified in chapter 3
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.3 Humidity load Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
Temperature: 40°C±2°C
Humidity: 90% (RH) to 95% (RH)
Applied current: Rated current specified in chapter 3
Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
Spec No; JELF243B 0002W701 efe rence only ‘0‘ 20*0fli 4010! 01.370 175w! ‘ Z a a M m A 40101 ( Dueumn a! Feed IYop wew mm Cavity ouemon o! leed
Spec No.: JELF243B_0002W-01 P4/10
MURATA MFG CO., LTD
No. Item Specification Test method
9.4 Temperature cycle Appearance: No significant mechanical
damage shall be observed.
Inductance change rate: within ±10%
Single cycle conditions:
Step 1: -40°C (+0°C, -3°C)/30 min±3 min
Step 2: ordinary temperature/2 min to 3 min
Step 3: +85°C (+3°C, -0°C)/30 min±3 min
Step 4: ordinary temperature/2 min to 3 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h
10. Specification of Packaging
10.1 Appearance and dimensions of tape (8 mm width/paper tape)
A 1.05±0.1
B 1.85±0.1
t 1.1 max.
(in mm)
10.2 Taping specifications
Packing quantity
(Standard quantity)
4000 pcs/reel
Packing method The products are placed in cavities of a carrier tape and sealed by a cover tape (top tape and bottom
tape when the cavities of the carrier tape are punched type).
Feed hole position The feed holes on the carrier tape are on the right side when the cover tape (top tape when the
cavities of the carrier tape are punched type) is pulled toward the user.
Joint The carrier tape and cover tape (top tape when the cavities of the carrier tape are punched type) are
seamless.
Number of missing
products
Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
are not continuous. The specified quantity per reel is kept.
10.3 Break down force of tape
Cover tape (or top tape) 5 N min.
Bottom tape (only when the cavities of the carrier tape are punched
type) 5 N min.
ELF243B 0002W701 (over lapE (or mp tape] / o F » 165-180 /// . ; canlellape _ mailer 150 mm. leader 10“” , label ‘90 . . ”a . H mln. _ zmmm. , E , produdslorage pan emptylape (ovenape s onoplape mama] , 92mm; directionoffeed +1 5‘ 54 0 MAmax: mango (ln mm)
Spec No.: JELF243B_0002W-01 P5/10
MURATA MFG CO., LTD
10.4 Peeling off force of tape
Speed of peeling off 300 mm/min
Peeling off force 0.1 N to 0.6 N (The lower limit is for typical value.)
10.5 Dimensions of leader section, trailer section and reel
A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)
10.6 Marking for reel
Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.:
□□ ○○○○ 
(1) (2) (3)
(1) Factory code
(2) Date
First digit: year/last digit of year
Second digit: month/Jan. to Sep.1 to 9, Oct. to Dec.O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking:
ROHS- Y ()
(1) (2)
(1) RoHS regulation conformity
(2) Murata classification number
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.
10.8 Specification of outer box
Dimensions of outer box
(mm) Standard reel quantity
in outer box (reel)
W D H
186 186 93 5
* Above outer box size is typical. It depends on a
quantity of an order.
W
D
Label
H
Spec No; JELF243B OOOZW701 Reference onli A ' :1 \anupa‘lew . . |:| Su‘devvwn
Spec No.: JELF243B_0002W-01 P6/10
MURATA MFG CO., LTD
11. Caution
11.1 Restricted applications
Please contact us before using our products for the applications listed below which require especially high reliability for the
prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (2) Aerospace equipment (3) Undersea
equipment
(4) Power plant
control equipment
(5) Medical equipment (6) Transportation equipment (vehicles,
trains, ships, etc.)
(7) Traffic signal
equipment
(8) Disaster/crime
prevention
equipment
(9) Data-processing
equipment
(10) Applications of similar complexity and/or reliability
requirements to the applications listed in the above
11.2 Precautions on rating
Avoid using in exceeded the rated temperature range, rated voltage, or rated current.
Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.
11.3 Inrush current
If an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product,
overheating could occur, resulting in wire breakage, burning, or other serious fault.
12. Precautions for Use
This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.
Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal
expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.
The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and
the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.
12.1. Land dimensions
The following diagram shows the recommended land dimensions for reflow soldering:
a 0.7
b 2.0
c 0.7
(in mm)
12.2 Flux and solder used
Flux • Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder • Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.
Spec No; JELF243B 0002W701 efe rence only Uppev eru Ruwllwmnddb‘k‘ mum (I (Npmzkngssl
Spec No.: JELF243B_0002W-01 P7/10
MURATA MFG CO., LTD
12.3 Soldering conditions (reflow)
• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
150°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.
Standard profile Limit profile
Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s
Heating Above 220°C/30 s to 60 s Above 230°C/60 s max.
Peak temperature 245°C±3°C 260°C/10 s
Number of reflow cycles 2 times 2 times
12.4 Reworking with soldering iron
The following requirements must be met to rework a soldered product using a soldering iron.
Item Requirement
Pre-heating 150°C/approx. 1 min
Tip temperature of soldering iron 350°C max.
Power consumption of soldering iron 80 W max.
Tip diameter of soldering iron ø3 mm max.
Soldering time 3 s (+1 s, -0 s)
Number of reworking operations 2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal
shock.
12.5 Solder volume
Solder shall be used not to be exceeded the upper limits as shown below.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.
Limit Profile
Standard Profile
90s±30s
230
260
245±3
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Spec N0.: JELFZASB 0002W701 Reference Onlfl Contenls of measures Stress level WWT ¢E 0000: 0000( STE] S III /‘\#/\/\_ @Efl-Dfl] Recommended Screw Hole
Spec No.: JELF243B_0002W-01 P8/10
MURATA MFG CO., LTD
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction (length: a < b) to the mechanical stress.
(2) Components location on PCB separation
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures
Stress level
(1) Turn the mounting direction of the component parallel to the
board separation surface.
A > D
*1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the
board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting components near screw holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.
12.7 Handling of substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
Poor example
Good example
b
a
Reference Only Spec No; JELF243B 0002W701
Spec No.: JELF243B_0002W-01 P9/10
MURATA MFG CO., LTD
12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item Requirement
Power 20 W/L max.
Time 5 min max.
Frequency 28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.
12.9 Storage and transportation
Storage period Use the product within 6 months after delivery.
If you do not use the product for more than 6 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and
humidity. The recommended temperature range is -10°C to +40°C. The recommended relative
humidity range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid may cause the
poor solderability.
• Do not place the products directly on the floor; they should be placed on a palette so that they
are not affected by humidity or dust.
Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
• Do not keep products in bulk packaging. Bulk storage could result in collisions between the
products or between the products and other parts, resulting in chipping or wire breakage.
Avoid storing the product by itself bare (i.e. exposed directly to air).
Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.
12.10 Resin coating (including moisture-proof coating)
When the product is coated/molded with resin, its electrical characteristics may change.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc.
Some resins contain impurities or hydrolyzable chlorine, which could result in corrosion of the conducting materials, leading
to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.
12.11 Mounting conditions
Check the mounting condition before using.
Using mounting conditions (nozzles, equipment conditions, etc.) that are not suitable for products may lead to pick up errors,
misalignment, or damage to the product.
12.12 Operating environment
Do not use this product under the following environmental conditions as it may cause deterioration of product quality.
(1) In the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.
(the sea breeze, Cl2, H2S, NH3, SO2, NO2, etc)
(2) In the atmosphere where liquid such as organic solvent, may splash on the products.
(3) In the atmosphere where the temperature/humidity changes rapidly and it is easy to dew.
12.13 Mounting density
If this product is placed near heat-generating products, be sure to implement sufficient heat-dissipating measures.
If this product is subjected to a significant amount of heat from other products, this could adversely affect product quality,
resulting in a circuit malfunction or failure of the mounted section. Also, be sure that the product is used in a manner so that
the heat that the product is subjected to from other products does not exceed the upper limit of the rated operating
temperature for the product.
Spec No.: JELF243B 0002W701 A _|1 ~> _._ 2m: V1 + Test Head B D (2 Test fixture ) Reference Onli | a ~> V: A (Y:)=(2 530:) Product D/A
Spec No.: JELF243B_0002W-01 P10/10
MURATA MFG CO., LTD
13. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.
Appendix
Electrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is
included in the rating table.)
Perform measurement using the method described below. (Perform correction for the error deriving from the measuring
terminal.)
(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-pole
terminal as shown in the figure below.
(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by using
the respective current and voltage for input/output.
Zm= V1
I1
Zx= V2
I2
(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.
Zx=αZm-β
1-ZmΓ
Here,
α = D/
A
= 1
β = B/D = Zsm - (1 - Yom Zsm) Zss
Γ = C/A = Yom
Zsm: measured impedance of short chip
Zss: residual impedance of short chip (0.771 nH)
Yom: measured admittance when measuring
terminal is open
(4) Calculate inductance Lx and Qx using the equations shown below.
Lx= Im(Zx)
2πf Lx: inductance of chip coil
Qx: Q of chip coil
f: measuring frequency
Qx= Im(Zx)
Re(Zx)

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