LQH2MCNyyyy02L Spec Datasheet by Murata Electronics

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SQecNo.JELF243A70053TVO1 Re fe I' e n C e O n I y
SpecNo.JELF243A-0053T-01 P1/8
MURATA MFG.CO., LTD
Reference Only
CHIP COILCHIP INDUCTORSLQH2MCN□□□□02L REFERENCE SPECIFICATION
1.Scope
This reference specification applies to LQH2MCN_02 Series, Chip coil (Chip Inductors).
2.Part Numbering
(ex) LQ H 2M C N 100 K 0 2 L
Product ID Structure Dimension Applications Category Inductance Tolerance Features Electrode Packaging
(L×W) and L: Taping
Characteristics
3.Rating
Operating Temperature Range. -40 to +85°C
Storage Temperature Range. -40 to +85°C
Customer
Part Number
MURATA
Part Number
Inductance DC
Resistance
(Ω)
Self
Resonant
Frequency
(MHz min)
Rated
Current
(mA)
(µH) Tolerance
LQH2MCN1R0M02L 1.0
M:±20%
0.30 ±30% 100 485
LQH2MCN1R5M02L 1.5 0.40 ±30% 95 445
LQH2MCN2R2M02L 2.2 0.48 ±30% 70 425
LQH2MCN3R3M02L 3.3 0.60 ±30% 65 375
LQH2MCN4R7M02L 4.7 0.8 ±30% 60 300
LQH2MCN5R6M02L 5.6 0.9 ±30% 60 280
LQH2MCN6R8M02L 6.8 1.0 ±30% 55 255
LQH2MCN8R2M02L 8.2 1.1 ±30% 50 235
LQH2MCN100K02L 10
K:±10%
1.2 ±30% 48 225
LQH2MCN120K02L 12 1.4 ±30% 44 210
LQH2MCN150K02L 15 1.6 ±30% 40 200
LQH2MCN180K02L 18 1.8 ±30% 35 190
LQH2MCN220K02L 22 2.1 ±30% 30 185
LQH2MCN270K02L 27 2.5 ±30% 30 180
LQH2MCN330K02L 33 2.8 ±30% 28 160
LQH2MCN390K02L 39 4.4 ±30% 24 125
LQH2MCN470K02L 47 5.1 ±30% 18 120
LQH2MCN560K02L 56 5.7 ±30% 17 110
LQH2MCN680K02L 68 6.6 ±30% 14 100
LQH2MCN820K02L 82 7.5 ±30% 14 90
When applied Rated current to the Products, Inductance will be within ±10% of initial Inductance value.
When applied Rated current to the Products ,temperature rise caused by self-generated heat shall be limited
to 40 max.
4. Testing Conditions
Unless otherwise specified In case of doubt
Temperature : Ordinary Temperature (15 to 35°C) Temperature : 20 ± 2°C
Humidity : Ordinary Humidity (25 to 85 %(RH)) Humidity : 60 to 70 %(RH)
Atmospheric Pressure : 86 to 106 kPa
SQecNo.JELF243A70053TrO1 Re fe I' e n C e O n I y F ”mg
SpecNo.JELF243A-0053T-01 P2/8
MURATA MFG.CO., LTD
Reference Only
0.6±0.2 0.8±0.2 0.6±0.2
2.0±0.2 1.6±0.2
090±005
0.1 min.
1.0±0.2
5.Appearance and Dimensions
Unit Mass (Typical value)
0.010g
No marking.
( in mm )
6.Electrical Performance
No. Item Specification Test Method
6.1 Inductance Inductance shall meet item 3. Measuring Equipment: KEYSIGHT 4192A or equivalent
Measuring Frequency: 1MHz
6.2 DC Resistance DC Resistance shall meet item 3. Measuring Equipment: Digital multi meter
6.3 Self Resonant
Frequency(S.R.F)
S.R.F shall meet item 3. Measuring Equipment: KEYSIGHT E4991A or equivalent
7.Mechanical Performance
No. Item Specification Test Method
7.1 Shear Test Chip coil shall not be damaged. Substrate: Glass-epoxy substrate
Force: 5N
Hold Duration: 5±1s
7.2 Bending Test Substrate: Glass-epoxy substrate
(100×40×0.8mm)
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 5seconds.
(in mm)
7.3 Vibration Oscillation Frequency: 10~55~10Hz for 1 minute
Total Amplitude: 1.5mm
Testing Time: A period of 2 hours in each of 3 mutually
perpendicular directions.
(Total 6 hours)
Chip coil
Substrate
45
R230
F
Deflection
45 Product
Pressure jig
SQecNo.JELF243A70053TVO1 Re fe I' e n C e O n I y
SpecNo.JELF243A-0053T-01 P3/8
MURATA MFG.CO., LTD
Reference Only
No. Item Specification Test Method
7.4 Solderability The wetting area of the electrode
shall be at least 90% covered with
new solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 80 to 120°C / 10 to 30seconds.
Solder Temperature: 245±3°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Inductance Change: within ±5%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder: Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 1 to 2 minutes
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room condition for
24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance:No damage
Inductance Change: within ± 5%
DC Resistance Change:
within ± 5%
Temperature: 85±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000h (+48h , -0h)
Then measured after exposure in the room condition for
24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 minutes
2 step:Ordinary temp. / 10 to 15 minutes
3 step:+85±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 minutes
Total of 10 cycles
Then measured after exposure in the room condition for
24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
Dimension of the Cavity is measured at the bottom side.
2.0.1
φ
1.5
1.9±0.1
4.0±0.1
2.0±0.05
4.0±0.1
+0.1
-0 1.75±0.1
3.5±0.05
8.0±0.2
1.05±0.1
0.25
Direction of feed (in mm)
Lead- in/out wire
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
SQecNo.JELF243A70053TrO1 Re fe I' e n C e O n I y Pa Mm Y (A)
SpecNo.JELF243A-0053T-01 P4/8
MURATA MFG.CO., LTD
Reference Only
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs / reel
(2) Packing Method
Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Plastic tape and Cover tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and are
not continuous. The specified quantity per reel is kept.
9.3 Pull Strength
Embossed carrier tape 10N min.
Cover tape 10N min.
9.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force 0.2 to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number(1), RoHS marking(2), Quantity etc ・・・
1) <Expression of Inspection No.> □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit
: Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS Marking (2) ,Quantity, etc ・・・
165 to 180 degree FCover tape
Plastic tape
190 min
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
210 min
φ
60±
1
0
13±1.4
φ
180±
0
3
1
0
(in mm)
Trailer : 160 min.
Direction of feed
Empty tape
Leader
Cover tape
Label
SQecNo.JELF243A70053TrO1 Re fe I' e n C e O n I y
SpecNo.JELF243A-0053T-01 P5/8
MURATA MFG.CO., LTD
Reference Only
9.8. Specification of Outer Case
Outer Case Dimensions (mm) Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order
10. Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party's life, body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment
(10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
11. Notice
This product is designed for solder mounting. (Reflow soldering only)
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing (Reflow Soldering)
Recommended land pattern for reflow soldering is as follows:
It has been designed for Electric characteristics and solderability.
Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or
solderability may be affected, or result to "position shift" in soldering process.
11.2 Flux, Solder
Flux
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).
Don’t use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100μm to 150μm
Other flux (except above) Please contact us for details, then use.
Chip Coil
Solder Resist
Land
2.6
0.8
1.0
(in mm)
W
D
Label
H
SQecNoJELFZACsArOOSSTVm Re fe I' e n C e O n I y
SpecNo.JELF243A-0053T-01 P6/8
MURATA MFG.CO., LTD
Reference Only
11.3 soldering conditions (Reflow)
Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is
limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron.
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C,1 min
Reworking should be limited to only once.
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3 s max.
Times 1 time
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the products
due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3T t T
(T: Lower flange thickness)
Upper Limit
Recommendable
Tt
150
90s±30s Time(s)
245℃±3℃
Temp.
(℃)
220℃
30s~60s
180
260℃
230℃
60s max
Limit Profile
Standard Profile
SQecNo.JELF243Aa0053TaO1 /\/_|:|\_fl/\ ”all.” mm. |:| \LEW (3) Mounting Components Near Screw Holes When a component is mounted near a screw hole, it may be affected by the board deflectlorl that occurs during the tightening or the screw Mount the component in a position as far away from the screw holes as possible. GEE-r Screw Hole Rec 11.7 Cleaning Conditions Products shall be cleaned on lhe lollowlng condilicns. BM, Producls can be used wilhout cleanlngJo (1) Cleaning temperalure shall be limited to 60°C max.(40°C max lor IPA) (2) Ultrasonic cleaning shall comply with lhe following condilions wilh avoiding lhe resonance phe al the mounted products and P.C.B. Power: 20 W / I max. Frequency : ZBKHZ Io AOKHZ Tlme : 5 mlnules max (3) Cleaner 1 Alternalive cleaner - sopropyl alcohol (lPA) 2 Aqueous agenl - PINE ALPHA sT-mos (4) There shall be no residual flux and residual Cleaner after cleaning. ln the case or using aqueous agenl, producls shall be dried complelely after rinse with d order to remove lhe cleaner. (5) Other cleaning Please ccnlact us. 11.6 Resin coating The inductance value may change due lo high cureastress of resin lo be used for coaling/molding p circuil issue may occur by mechanical stress caused by lhe resin. amount/cured shape or re condilion etc. Some resin conlains some impurilies or chloride possible to generale chlorine by some operaling condilion may cause corrosion of wire of coil. leading to open circuil. So, please allenlion when you selecl resin in case of coalinglmolding lhe products with the resin.Prior to use please make sure no reliabilily issue is observed by evalualing products mounted on your board. 11.9 Temperature rating at lhe circuit board and components located around Temperature may rise up to max. 40 “0 when applying the raled currenl to lhe Producls Be carerul or the temperalure rating of lhe circuit board and componenls located around. MURATA MFG.CO., LTD
SpecNo.JELF243A-0053T-01 P7/8
MURATA MFG.CO., LTD
Reference Only
11.6 Product's location
The following shall be considered when designing and laying out P.C.B.’s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to
the board separation surface. A > D 1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from
the board separation surface. A > C
1 A > D is valid when stress is added vertically to
the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to
the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole,
it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component
in a position as far away from the screw holes as possible.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions. But, Products can be used without cleaning,too.
(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.
(3) Cleaner
1. Alternative cleaner
sopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in
order to remove the cleaner.
(5) Other cleaning
Please contact us.
11.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products. An open
circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under
some operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your careful
attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin,
please make sure no reliability issue is observed by evaluating products mounted on your board.
11.9 Temperature rating of the circuit board and components located around
Temperature may rise up to max. 40 when applying the rated current to the Products.
Be careful of the temperature rating of the circuit board and components located around.
Poor example
Good example
b
a
Seam
Slit
AD
BC
b
a
Length:a
<
b
Screw Hole Recommended
SQecNoJELFZASArOOSCiTrm Re fe I‘ e n C e O n I y
SpecNo.JELF243A-0053T-01 P8/8
MURATA MFG.CO., LTD
Reference Only
11.10 Caution for use
Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched
to the winding portion to prevent the breaking of wire.
Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.12 Storage and Handling Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10 ~ 40°C
Humidity : 15 to 85% relative humidity No rapid change on temperature and humidity
The electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,
chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.
Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breaking
of winding wire caused by the collision between the products.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
12. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted
to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering

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