VSMY2943SL Datasheet by Vishay Semiconductor Opto Division

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VISHAY. i ® ROH S cowum mmsm FREE GREEN 5-m- Sul'lLigmm www.vishay.com/doc?99912 emmanechsuggorl®wshay£0m www.v\shay.com/doc?91000
VSMY2943SL
www.vishay.com Vishay Semiconductors
Rev. 1.1, 08-Dec-17 1Document Number: 84253
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
High Speed Infrared Emitting Diode, 940 nm,
Surface Emitter Technology
DESCRIPTION
As part of the SurfLightTM portfolio, the VSMY2943SL is an
infrared, 940 nm, side looking emitting diode based on
GaAlAs surface emitter chip technology with extreme high
radiant intensities, high optical power and high speed,
molded in clear, untinted plastic packages (with lens) for
surface mounting (SMD).
APPLICATIONS
Miniature light barrier
• Photointerrupters
Optical switch
Emitter source for proximity sensors
IR illumination
Remote control
FEATURES
Package type: surface-mount
Package form: side view
Dimensions (L x W x H in mm): 2.3 x 2.55 x 2.3
Peak wavelength: λp = 940 nm
High reliability
High radiant power
Very high radiant intensity
Angle of half intensity: ϕ = ± 28°
Suitable for high pulse current operation
Package matches with detector VEMD2xx3SLX01 and
VEMT2xx3SLX01 series
Floor life: 4 weeks, MSL 2a, according to J-STD-020
Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
Test conditions see table “Basic Characteristics“
Note
MOQ: minimum order quantity
PRODUCT SUMMARY
COMPONENT Ie (mW/sr) ϕ (deg) λp (nm) tr (ns)
VSMY2943SL 50 ± 28 940 10
ORDERING INFORMATION
ORDERING CODE PACKAGING REMARKS PACKAGE FORM
VSMY2943SL Tape and reel MOQ: 3000 pcs, 3000 pcs/reel Side view
VISHAY. em\ttertechsupgon@wshay,com www.v\shay,com/doc?91000
VSMY2943SL
www.vishay.com Vishay Semiconductors
Rev. 1.1, 08-Dec-17 2Document Number: 84253
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR5V
Forward current IF100 mA
Peak forward current tp/T = 0.5, tp = 100 μs IFM 180 mA
Surge forward current tp = 100 μs IFSM 1A
Power dissipation PV200 mW
Junction temperature Tj100 °C
Operating temperature range Tamb -40 to +85 °C
Storage temperature range Tstg -40 to +100 °C
Soldering temperature According to Fig. 7, J-STD-020 Tsd 260 °C
Thermal resistance junction-to-ambient J-STD-051, soldered on PCB RthJA 250 K/W
0
20
40
60
80
100
120
140
160
180
200
0 20406080100
PV-Power Dissipation (mW)
Tamb - Ambient Temperature (°C)
RthJA = 250 K/W
0
20
40
60
80
100
0 20406080100
IF- Forward Current (mA)
Tamb - Ambient Temperature (°C)
RthJA = 250 K/W
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage IF = 100 mA, tp = 20 ms VF-1.41.8V
IF = 1 A, tp = 100 μs VF-2.5- V
Temperature coefficient of VFIF = 100 mA TKVF --0.7-mV/K
Reverse current IRNot designed for reverse operation μA
Junction capacitance VR = 0 V, f = 1 MHz, E = 0 mW/cm2CJ-55-pF
Radiant intensity IF = 100 mA, tp = 20 ms Ie27 50 75 mW/sr
IF = 1 A, tp = 100 μs Ie- 350 - mW/sr
Radiant power IF = 100 mA, tp = 20 ms φe-55-mW
Temperature coefficient of radiant
power IF = 100 mA TKφe--0.2-%/K
Angle of half intensity ϕ 28-deg
Peak wavelength IF = 100 mA λp920 940 960 nm
Spectral bandwidth IF = 30 mA Δλ -50-nm
Temperature coefficient of λpIF = 30 mA TKλp-0.25-nm/K
Rise time IF = 100 mA, 20 % to 80 % tr-10-ns
Fall time IF = 100 mA, 20 % to 80 % tf-10-ns
VISHAY. gso cc, za %ax Ar- emmanechsuggorl®wshay£om www.v\shay.com/doc?91000
VSMY2943SL
www.vishay.com Vishay Semiconductors
Rev. 1.1, 08-Dec-17 3Document Number: 84253
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 4 - Radiant Intensity vs. Forward Current
Fig. 5 - Relative Radiant Power vs. Wavelength
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
SOLDER PROFILE
Fig. 7 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 4 weeks
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, according to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
1
10
100
1000
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
IF- Forward Current (mA)
VF- Forward Voltage (V)
tp= 100 μs
0.01
0.1
1
10
1101001000
Ie,rel - Relative Radiant Intensity
(Ie/ Ie(100 mA))
IF- Forward Current (mA)
tp= 100 μs
0%
20%
40%
60%
80%
100%
800 850 900 950 1000 1050
Ie, rel - Relative Radiant Intensity
λ- Wavelength (nm)
IF= 100 mA
22688
Ie rel - Relative Radiant Intensity
ϕ - Angular Displacement
0.4 0.2 00.6
10° 20°
0.9
0.8
30°
40°
50°
60°
70°
80°
0.7
1.0
240 °C
Max. 260 °C
217 °C
255 °C
19841-1
10
100
1000
10000
0
100
200
300
0 50 100 150 200 300
Axis Title
1st line
2nd line
2nd line
Temperature (°C)
Time (s)
50
150
250
250
245 °C
Max. 100 s
Max. 30 s
Max. 120 s
Max. ramp down 6 °C/s
Max. ramp up 3 °C/s
— VISHAY. www.msha .com/doc791oou
VSMY2943SL
www.vishay.com Vishay Semiconductors
Rev. 1.1, 08-Dec-17 4Document Number: 84253
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters: VSMY2943SL
Drawing-No.: 6.544-5410.03-4
Issue: 3; 02.10.15
Solder pad proposal
acc. IPC 7351
4.2
1.2
0.9 0.9
center of pick
and place area
Ø 1.8
0.4
2.2
3.8
0.5
2.3
2.3
1.6
0.3
0.85
Anode
Cathode
2.55
2.22
0.9
0.05 ± 0.1
Exceeding cut residues or cut ins allowed
within the tolerance of the leads
Technical drawings
according to DIN
specifications
Not indicated tolerances ± 0.2
— VISHAY. V $$$$$$颢 a @@@® A www.msha .com/doc791oou
VSMY2943SL
www.vishay.com Vishay Semiconductors
Rev. 1.1, 08-Dec-17 5Document Number: 84253
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TAPING AND REEL DIMENSIONS in millimeters: VSMY2943SL
12 + 0.3
- 0.1
II
I
1.75 ± 0.1
5.5 ± 0.05
2 ± 0.05
4 ± 0.1
Ø 1.55 ± 0.05
8 ± 0.1 2.85 ± 0.1
X (2 : 1)
Drawing-No.: 9.800-5123.01-4
Issue: 4; 02.10.15
Leader and trailer tape
Reel
Terminal position in tape
Parts mounted
Empty (400 mm min.)
Empty (160 mm min.)
Direction of pulling out
Unreel direction
Ø 62 ± 0.5
Ø 330 ± 1
2.5 ± 0.5
Label posted here
Tape position
coming out from reel
6000 pcs / reel
X
Ø 13 ± 0.5
12.4 ± 1.5
Technical drawings
according to DIN
specifications
Lead I
Cathode
Collector
Anode
Lead II
Anode
Emitter
Cathode
Device
VSMB2943SLX01
VSMF2893SLX01
VSMB2948SL
VEMD2023SLX01
VEMD2523SLX01
VEMT2023SLX01
VEMT2523SLX01
VSMY2853SL
VSMY2943SL
VSMY294310SL
— VISHAY. V
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Revision: 01-Jan-2019 1Document Number: 91000
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