1042490810 Spec Datasheet by Molex

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DESIGN CONTROL
K
STATUS
WRITTEN
BY:
JHCHANG
CHECKED
BY:
KSKIM
APPROVED
BY:
YSKIM02
DATE: YR/MO/DAY
2015/05/15
DOCUMENT NUMBER
PS-104249-001
FILE NAME
PS-104249-001.docx
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
1SCOPE
This specification covers the 0.8 mm PITCH BOARD TO BOARD CONNECTOR series.
2PRODUCT NAME AND PART NUMBER
Product Name
Part Number
Receptacle Housing Assembly
104249-0891
Embossed Tape Package for 104249-0891
104249-0810
Plug Housing Assembly
104250-0800
Embossed Tape Package for 104250-0800
104250-0820
molex
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PRODUCT SPECIFICATION
3RATINGS
Item
Standard
Rated Voltage (MAX.)
50 V
[ AC (rms) / DC ]
Rated Current (MAX.)
For 4 PINS
0.3A / 1PIN
For 4 PINS
4.5A / 1PIN*3
Ambient Temperature
Range*1
-40°C ~ + 85°C*2
Storage condition after
opening the Humidity
prevention package
Temperature
-10℃~+50
Humidity
85%R.H. MAX. (No condensation)
Term
For 6 months after shipping
(unopened package)
*1. Non-operating connectors after reflow must follow the operating temperature range condition.
*2. Including the terminal temperature rise generated by conducting electricity.
*3. When 2 circuits are constructed via PWB/FPC circuit, 9A of current per 2-circuit is applicable.
But the circuit via fitting nail shall not be acceptable for excessive temperature increase.
molex 4,1_ Electrical Performance 4,2 Mechanical Performance
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PRODUCT SPECIFICATION
4PERFORMANCE
4-1Electrical Performance
Item
Test Condition
Requirement
4-1-1
Contact
Resistance
Mate connectors and measured by dry
circuit, 20mV MAX., 10mA. MAX.
(JIS C5402 5.4)
10 milliohm MAX. /PIN
4-1-2
Insulation
Resistance
Mate connectors and apply 250V DC
between adjacent terminal and ground.
(JIS C5402 5.2/MIL-STD-202 Method 302)
100 Mega ohm MIN.
4-1-3
Dielectric
Strength
Mate connectors and apply 250V AC (rms)
for 1 minute between adjacent terminal and
ground.
(JIS C5402 5.1/MIL-STD-202 Method 301)
No Breakdown on function
4-1-4
Temperature
Rise
Mate connectors and conduct the
maximum rated current.
(UL 498)
30 °C MAX.
4-2Mechanical Performance
Item
Test Condition
Requirement
4-2-1
Insertion and
Withdrawal
Force
Insert and withdraw connectors at the
speed rate of 5cycle per minute.
Insertion
46.5 N MAX.
{4.74 kgf}
Withdrawal
10.0 N MIN.
{1.02 kgf}
4-2-2
Terminal /
Housing
Retention
Force
Apply axial pull out force at the speed rate
of 25±3 mm/minute on the terminal
assembled in the housing.
0.15N {0.015 kgf} MIN.
molex 473. Environmental Performance and Others
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PRODUCT SPECIFICATION
4-3Environmental Performance and Others
Item
Test Condition
Requirement
4-3-1
Repeated
Insertion /
Withdrawal
When mated up to 10 cycles repeatedly by
the rate of 5 cycles per minute.
Contact
Resistance
20milliohm MAX.
4-3-2
Vibration
Amplitude : 1.5mm P-P
Frequency : 10~55~10 Hz in 1 minute.
Duration : 2 hours in each X.Y.Z.axes.
(MIL-STD-202 Method 201)
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
Discontinuity
1.0 microsecond MAX.
4-3-3
Mechanical
Shock
490m/s { 50G } ,
3 strokes in each X.Y.Z.axes.
(JIS C60068-2-27/MIL-STD-202
Method 213)
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
Discontinuity
1.0 microsecond MAX.
4-3-4
Heat
Resistance
85±2°C, 96 hours
(JIS C60068-2-2/MIL-STD-202
Method 108)
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
4-3-5
Cold
Resistance
40±3°C, 96 hours
(JIS C60068-2-1)
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-6
Humidity
Temperature : 60±2°C
Relative Humidity : 90~95%
Duration : 96 hours
(JIS C60068-2-3/MIL-STD-202
Method 103)
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
Dielectric
Strength
Must meet 4-1-3
Insulation
Resistance
50 Mega ohm MIN.
4-3-7
Temperature
Cycling
5 cycles of :
a) 55°C, 30 minutes
b) + 85°C, 30 minutes
(JIS C0025)
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
4-3-8
Salt Spray
48±4 hours exposure to a salt spray
from the 5±1% solution at 35±2°C.
(JIS C60068-2-11/MIL-STD-202
Method 101)
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
4-3-9
SO2 Gas
Density of SO2 gas : 50±5ppm
Temperature : 40±2°C
Duration : 24 hours
Appearance
No Damage on function
Contact
Resistance
20milliohm MAX.
4-3-10
Solderability
Soldering Time : 3±0.5 sec.
Solder Temperature : 245±5 °C
Solder
Wetting
95% of immersed area
must show no voids,
pin holes.
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PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-11
Resistance to
Soldering Heat
( Soldering iron
method )
0.2mm from terminal tip and fitting nail tip.
Soldering time : 5 seconds MAX.
Solder temperature : 350±10
Appearance
No Damage on function
( ) : Reference Standard
{ } : Reference Unit
【5.PRODUCT SHAPE, DIMENSIONS AND MATERIALS
Refer to the drawing.
ELV AND RoHS COMPLIANT.
molex TEMPERATURE CONDITION GRAPH
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
6INFRARED REFLOW CONDITION
30~60 Seconds MAX.
(230 MIN.)
90~120 Seconds
(Pre-heat 150200)
TEMPERATURE CONDITION GRAPH
(TEMPERATURE ON BOARD PATTERN SIDE)
NOTE; Please check the reflow soldering condition by your own devices beforehand.
Because the condition changes by the soldering devices, PWB, and so on.
Also please check mount condition in case of Nitrogen atmosphere.
7INSTRUCTION UPON USAGE
[Mating]
Please mate the connector with parallel manner. (Fig. 1)
Please locate the inside wall of the rec. housing and the plug after mating.
In the case of skew mating, please do not mate the connector at more than 10°lead in angle. (Fig. 2)
Please do not mate the rec. and plug at an angle as this way, because the housing is broken. (Fig. 3)
[Un-mating]
Please extract the connector with parallel manner (Fig. 1), or swing them right to left slightly. (Fig. 4)
Please do not mate connector at an angle as this manner, because the housing might be broken.
Please be very careful when extracting the connection at an angle.
This many cause damage to the connector. (Fig. 5)
(Please take care of twist extraction.)
250 +5/-10 MAX (Peak Temperature.)
molex
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Inside wall of REC.
Interference area
Inside wall of REC.
Inside wall of REC.
Inside wall of PLUG
<Pitch direction>
<Span direction>
PLUG
REC.
Fig. 1 Mating & Un-mating in parallel manner (Ideal)
Less
than 10
degrees
Outside of PLUG
Fig. 2 Mating with the alignment using outside of plug
Fig. 3 Mating with the alignment using inside of plug (Not preferred)
Fig. 4 Un-mating by shaking back or force
Fig. 5 Un-mating with one strong rotation (can damage connector)
Outside of PLUG
Less
than 10
degrees
molex
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
11OTHERS
1. Prohibit from applying an excessive load to the housing around terminals before mounting the connector
onto PWB.
2. Please do not touch the terminals and fitting nails before or after mounting the connector onto PWB.
3. There may be slight differences in the housing coloring, but there will be no influence on the product’s
performance.
4. Specification is met although black spots, scratch on the housing, or a minim air bubble and so on may
exist on mold resin.
As LCP is used as the mold material, the weld lines may be visible in some cases. However, they do not
affect product performance.
5. Please ensure that the connector is fully mated. After setting the connector and cable assembly in the
device, please ensure that the connector does not become unengaged due to vibration and shock
conditions. There may be case of coming off if mating is insufficient and connectors get an inclines of 5
degrees.
6. There is instruction of design the following.
Please prepared without pattern area.
When an excessive mounting gap occurs, there may be contact area solder wicking.
7. The mounting specification for coplanarity does not include the influence of warpage of PWB.
The warpage of PWB should be a maximum of 0.02mm if measuring from one connector edge to the
other.
8. This connector performance was tested based on using rigid epoxy-glass PWB.
If you need to mount the connector on FPC, please make sure to conduct the reflow test in advance.
9. Recommend to place any stiffener board or film on the backside of FFC/FPC when you mount the
connector to prevent deformation.
Due to the low profile design, please be cautious to set the reflow condition to prevent solder wicking.
10. Fillet condition might be different depending on the mounting condition, please care of fillet condition of
connectors.
11. There may be a case which changes housing color by depending on reflow conditions. However, it does
not effect on connector performance.
12. There may be a case that the plated surface looks wavy by depending on reflow conditions. However, it
does not effect on connector performance.
13. There is no influence in the product performance though discoloration might be seen in the soldering tail
after the reflow. There is no solder on the top surface of tail in spec, and there is no influence in
performance.
molex
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
14. Because this product has a cut off area on the tip of the terminal, the solderability performance in this
area is not as good as compared to the side/back of the terminal. However, by building a good soldering
fillet at the side/back of the terminal, there will be no issue on either the product function or the retention
force of PWB.
15. If you leave any soldering area on this product open, there may be the possibility of a missing terminal
short circuiting between pins, terminal buckling or the potential for the connector to come off of PWB.
Therefore, please solder all of the terminals and fitting nails on PWB.
16. If there is accidental contact with the connector while it is going through the reflow machine, there may be
deformation or damage caused to the connector. Please check to prevent this.
17. When conducting manual repairs using a soldering iron, please follow the soldering conditions shown in
the product specification. If the conditions in the product spec are not followed, it may cause the terminals
to fall off, a change in the contact gap, a deformation of the housing, melting of the housing, and damage
the connector.
18. When conducting manual repairs with a soldering iron, please do not use excessive solder or flux than
needed. This may cause solder wicking or flux wicking issues, also it may eventually cause a contact
defect and functional issues.
19. Please do not stack up PWB directly after mounted the connector on it.
20. If an alternative solder past is used (other than Sn-Ag-Cu 96.5%-3%-0.5%), please ensure in advance
that the solder ability and PWB peeling force will not have any issues.
21. Please do not use the connector in a condition where the wire, PWB, or the contact area is experiencing a
sympathetic vibration of wires and PWB, and constant movement of devices. This may cause a defect in
the contact due to the contact area being worn down. Therefore, please fix wires and PWB on the chassis,
and reduces sympathetic vibration.
22. Please do not conduct any “washing process” on the connector because it may damage the product’s
function.
23. Please investigate the mounting condition (reflow soldering condition) on your own devices beforehand.
The mounting conditions may change due to the soldering temperature, soldering paste, air reflow
machine, Nitrogen reflow machine, and the type of PWB. The different mounting conditions may have an
influence on the product’s performance.
24. Please do not use the connector alone to provide mechanical support for PWB. Please ensure that there
is a fixed structure on the phone chassis or other component support for PWB.
25. There should not be more than one board to board connection between two separate PWB.
When mounting several board to board connectors between parallel PWB, please ensure to separate
each mated board to board connectors by using separate PWB.
26. Please keep enough clearance between connector and chassis of your application in order not to apply
any pressure on the connector.
molex
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PRODUCT SPECIFICATION
27. This product is not designed for the mating and un-mating of the connectors to be performed under the
condition of an active electrical circuit. It may cause a spark and product defect if the connectors are
mated and un-mated in this way.
28. After mated the connector, please do not allow PWB to apply pressure on the connector in either the pitch
direction or the span direction. It may cause damage to the connector and may crack the soldering.
29. Due to the low profile design, there might be the flux going up to receptacle terminal beam part , anchor
part and the other side of plug contacting part. However, it does not effect on connector performance.
30. To prevent excessive temperature increase, please make appropriate circuit design for PWB/FPC on
which the connectors mount.
31. Notes of caution about wiring of power circuit
- To prevent excessive temperature increase, please make appropriate circuit design for PWB/FPC on
which the connectors mount.
- The heat capacity of micro connector is very lower than PWB, so the temperature rise by power
distribution depends on the wiring condition of PWB mainly. Also the reasonable dimension of wiring
section on PWB is 1.0mm width x 35μm thickness in case of applying 1A.
- It is possible to apply Max. 9A on this connector by shunting current to 2 power pins on PWB wiring.
But the circuit via fitting nail shall not be acceptable for excessive temperature increase. In addition, the
fitting nail in this product can’t be acceptable for the electrical circuit.
molex
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PRODUCT SPECIFICATION
REV.
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED BY :
0
PROPOSED
'15/04/16
-
JHCHANG
KSKIM
1
PRODUCT NUMBER
MODIFICATION
'15/04/28
-
JHCHANG
KSKIM
A
RELEASED
'15/05/15
-
JHCHANG
KSKIM

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