Ultra-Fit Series Prod Spec Datasheet by Molex

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molex’“ C) REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No:U LATE: CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BV: CHECKED BV: ‘ APPROVED BY:
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
A5
EC No:
UCP2016-0922
1 of 16
DATE:
08/28/2015
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FILENAME: PS75431r0.DOC
ULTRA-FIT
WIRE-TO-BOARD
CONNECTOR SYSTEM
Receptacle Housing
Dual Row: 172258/172262
Single Row: 172256/172260
TPA
Receptacle Terminal
172264/172268
172253
> molex‘a REVISION: ECR/ECN INFORMATION: TITLE: SHEET No. EC No:U E CONNECTOR SYSTEM DOCUMENT NUMBER: CREATED / REVISED BV: CHECKED BV: APPROVED BY:
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
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PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
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UCP2016-0922
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Header Vertical Dual Row with Kinked Pins
Dual Row: 172298
Single Row: 172286
Header Vertical Dual Row with Solder Clip
Dual Row: 172299
Single Row: 172287
Header Right Angle
Dual Row: 172316
Single Row: 172310
> molex‘ \_/ Table of Contents REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No.U E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
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PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
A5
EC No:
UCP2016-0922
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Table of Contents
1.0 SCOPE 3
2.0 PRODUCT DESCRIPTION 3
2.1 Product Name and Series Numbers 3
2.2 Dimensions, Materials, Plating and Markings 3
2.3 Safety Agency Approvals 3
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS 4
3.1 Molex Documents 4
3.2 Industry Documents 4
4.0 ELECTRICAL PERFORMANCE RATINGS 4
4.1 Voltage 4
4.2 Applicable Wires 5
4.3 Maximum Current Rating 5
4.4 Temperature 6
4.5 Durability 6
4.6 Current Interruption 7
5.0 QUALIFICATION 7
6.0 PERFORMANCE 7
6.1 Electrical Performance 7
6.2 Mechanical Performance 8
6.3 Environmental Performance 10
7.0 TEST SEQUENCE GROUPS 12
8.0 SOLDER INFORMATION 14
8.1 Solder Process Temperature 14
8.2 Reflow Solder Profile 14
> REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
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PRODUCT SPECIFICATION FOR
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CONNECTOR SYSTEM
SHEET No.
A5
EC No:
UCP2016-0922
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1.0 SCOPE
This Product Specification covers Ultra-Fit® 3.50 mm pitch wire to board connector systems with gold and tin
plating. Receptacles are terminated with 22 to 16 AWG wire using crimp technology.
2.0 PRODUCT DESCRIPTION
2.1 PRODUCT NAME AND SERIES NUMBER (S)
Table 1 WIRE-TO-BOARD
Description
Series Number
Receptacle Crimp Terminal
172253
Receptacle Housing, Single Row
172256/172260
Receptacle Housing, Single Row
172258/172262
TPA
172264/172268
Vertical Header Single Row, Kinked Pins
172286
Vertical Header Single Row, Solder Clips
172287
Vertical Header Dual Row, Kinked Pins
172298
Vertical Header Dual Row, Solder Clips
172299
Right Angle Header Single Row
172310
Right Angle Header Dual Row
172316
2.2 DIMENSIONS, MATERIALS, PLATING AND MARKINGS
Dimensions & Plating: See individual sales drawings.
Material: RoHS compliant materials.
2.3 SAFETY AGENCY APPROVALS
2.3.1 UL File Number: E29179
UL (fully loaded)
NON-current interruption
Current interruption per UL1977
14 Amps @ 400V (16 AWG wire)
14 Amps @ 48V AC (16 AWG wire)
> CCUS REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC N0.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED EV. APPROVED BY.
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2.3.2 IEC License Number per IEC / EN 61984: TBD
IEC (fully loaded)
NON-current interruption
14 Amps @ 400V (16 AWG wire)
2.3.3 File Number*: 70022376 (LR19980)
CSA approval meets following standards/test procedures:
* “C” and “US” mark adjacent to CSA signifies that the product has been evaluated to the applicable CSA and
ANSI/UL standards, for use in Canada and US respectively.
CSA (single circuit)
NON-current interruption
14 Amps @ 400V (16 AWG wire)
3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS
3.1 MOLEX DOCUMENTS
See series specific sales drawings and the other sections of this specifications for the necessary
referenced documents and specifications.
Ultra-Fit Test Summary TS-172323-0001
Molex Solderability Specification SMES-152
Molex Heat Resistance Specification AS-40000-5013
3.2 INDUSTRY DOCUMENTS
EIA-364-1000.01
UL-60950-1
UL-1977
CSA STD. C22.2 NO. 182.3-M1987
IEC / EN 61984
USCAR-2 REV.6
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PRODUCT SPECIFICATION
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ECR/ECN INFORMATION:
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4.0 ELECTRICAL PERFORMANCE RATINGS
4.1 VOLTAGE *
400 Volts AC (RMS) or 400 Volts DC max.
* This connector voltage meets the connector level provided by the safety agency. For application voltage
requirements per UL-60950 or other standards, the creepage & clearance also needs to be determined
based upon pads/traces on the PCB.
4.2 APPLICABLE WIRES
Maximum Insulation
Diameter and
Applicable Wire Gauges
Stranded copper 16 AWG: 2.39mm MAXIMUM
Stranded copper 18 AWG: 2.03mm MAXIMUM
Stranded copper 20 AWG: 1.78mm MAXIMUM
Stranded copper 22 AWG: 1.57mm MAXIMUM
4.3 MAXIMUM CURRENT RATING
Current rating is application dependent and may be affected by the wire rating such as listed in UL-60950-
1. Each application should be evaluated by the end user for compliance to specific safety agency
requirements. The ratings listed in the chart below are per Molex test method based on a 30° C maximum
temperature rise over ambient temperature and are provided as a guideline. Appropriate de-rating is
required based on circuit size, ambient temperature, copper trace size on the PCB, gross heating from
adjacent modules/components and other factors that influence connector performance. Wire size,
insulation thickness, stranding, tin coated or bare copper, wire length & crimp quality are other factors that
influence current rating.
Wire to Board Current Rating (Amp Max.)
(Tested with TIN plated terminals)
Connector fully loaded with all circuits powered
AWG Wire
Size
Circuit Size (Single Row)
Circuit Size (Dual Row)
2
3
4
5
6
7
8
4
6
8
10
12
14
16
16
14
12.8*
12.1*
11.5*
11.1*
10.7*
11
12
11.1*
11*
10.5*
10.3*
10*
10
18
12.6*
11.6*
10.9*
10.4*
9.9*
9.5*
9.2*
10.9*
9.9*
9.2*
8.6*
8.2*
7.8*
7.5*
20
11.5*
10.5*
9.8*
9.2*
8.8*
8.4*
8.1*
9.8*
8.8*
8.1*
7.5*
7*
6.7*
6.3*
22
9
8.8*
8.6*
8.1*
7.6*
7.3*
7
8
7.6*
6.9*
6.4*
5.9*
5.5*
5
Temperature Rise vs. Current per EIA-364-70
Tested with UL1061 Tinned Wire and PCB with 2oz. Copper Traces of 1.8mm width and 3.5mm length.
*Extrapolated from test data.
> molex‘ C TIN plated GOLD elated REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC N0.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
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Wire to Board Current Rating (Amp Max.)
(Tested with GOLD plated terminals)
Connector fully loaded with all circuits powered
AWG Wire Size
Circuit Size (Single Row)
Circuit Size (Dual Row)
2
3
4
5
6
7
8
4
6
8
10
12
14
16
16
12
11.2*
11
10.7*
10.5*
10.3*
10
11
9.6*
9
8.5*
8*
7.7*
7
18
11*
10.1*
9.5*
9*
8.6*
8.2*
7.9*
9.5*
8.6*
7.9*
7.4*
7*
6.6*
6.3*
20
10*
9.1*
8.4*
7.9*
7.5*
7.2*
6.9*
8.4*
7.5*
6.9*
6.4*
6*
5.6*
5.3*
22
8
7.7*
7.4*
6.9*
6.5*
6.1*
6
6
5.8*
5.5*
5.3*
5.2*
5.1*
5
Temperature Rise vs. Current per EIA-364-70
Tested with UL1061 Tinned Wire and PCB with 2oz. Copper Traces of 1.8mm width and 3.5mm length.
*Extrapolated from test data.
4.4 TEMPERATURE
TIN plated
Max. operating temperature range (including T-rise from applied current) is -40°C to 105°C.
Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 65°C for 10
years life per table-8.
GOLD plated
Max. operating temperature range (including T-rise from applied current) is -40°C to 120°C, thermal aging
at 120°C for 1000 hours.
Field temperatures and field life: Tested per EIA 364-1000.01 to meet field temperature of 85°C for 10
years or 95°C for 7 years life per table-8.
4.5 DURABILITY
Tin plated: 25 mating cycles
Gold plated: 200 mating cycles
As tested in accordance with EIA-364-1000.01 test method (see Sec. 7.0 of this specification). Durability
per EIA-364-09.
48 Volt AC @ 14 Amp
Tested at 48 volt AC with a current of 14 Amp hot-plug test conducted with all circuits powered with 16
AWG wire per UL1977 with tin plated contacts.
5.0 QUALIFICATION
Laboratory conditions and sample selection are in accordance with EIA-364-1000.01
> molex‘ C REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No.U E CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED av. APPROVED BY.
PRODUCT SPECIFICATION
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ECR/ECN INFORMATION:
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PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
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UCP2016-0922
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6.0 PERFORMANCE
6.1 ELECTRICAL PERFORMANCE
DESCRIPTION
TEST CONDITION
REQUIREMENT
Initial Contact Resistance
(Low Level)
Mate connectors, apply a maximum
voltage of 20 mV and a current of 100
mA (measurement locations shown)
Per EIA-364-23
Wire resistance and traces shall be
removed from the measured value.
Maximum (Initial):
Tin: 2 m
15µ” & 30µ” Gold: 3 m
Contact Resistance
@Rated Current
(Voltage Drop)
Mate connectors; apply the rated
current.
Per EIA-364-70
Maximum:
Tin: 5 m
15µ” & 30µ” Gold: 7 m
Insulation
Resistance
Apply 500 VDC between adjacent
terminals or ground.
Per EIA-364-21
1,000 M
minimum
Dielectric
Withstanding
Voltage
Apply 1800 VAC for 1 minute
between adjacent terminals.
Per EIA-364-20
No breakdown
Current leakage <5mA
Temperature
Rise
Mate connectors, measure
T- Rise @ Rated Current
Per EIA-364-70
Temperature rise: 30° C
maximum
(see chart) PASS
> REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
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6.2 MECHANICAL PERFORMANCE
ITEM
TEST CONDITION
REQUIREMENT
Connector
Mating Force
Without Latches
Mate connectors at a rate of 25.4
+/- 6 mm per minute. Per EIA-364-
37
Tin plated: 4.5 N MAX. initial mate
force per circuit
15µ” & 30µGold plated: 2.8 N MAX.
per circuit
Connector
Un-mating Force
Without Latches
Un-mate connectors with latch
disabled at a rate of 25.4 +/- 6 mm
per minute.
Per EIA-364-37
Tin plated: 4.0 N MAX. initial
un-mate force per circuit
15µ” & 30µGold plated: 2.3 N MAX.
per circuit
Connector
Mating Force
Without Terminals
Mate connectors at a rate of 25.4
+/- 6 mm per minute. Per EIA-364-
37
8 N MAX.
Thumb Latch Yield
Strength
Mate loaded connectors fully. Pull
connectors apart at a rate of 25.4
+/- 6 mm per minute.
89 N MIN.
Durability
Mate connectors 25 cycles for tin
plated and 200 cycles for gold
plated connectors at a maximum
rate of 10 cycles per minute.
Per EIA-364-09
Maximum change from initial:
Tin: 7 m
15µ” & 30µ” Gold: 3 m
> REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
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Header Pin Retention
Force in Housing
Axial pull force on the vertical
header housing away from the PCB
at a rate of 25.4 +/- 6 mm per
minute.
Push from mating side: 50N MIN.
Push from PCB side: 30N MIN.
6.2 MECHANICAL PERFORMANCE (CONT.)
ITEM
TEST CONDITION
REQUIREMENT
PCB Peg Insertion
Force into the PCB
(Right Angle Header)
Insert a header at a rate of 25.4±6
mm/minute.
(Applies to parts with PCB retention
pegs only)
Header with 2 pegs:
35 N MAX insertion force
Headers with 1 peg:
23 N MAX insertion force
PCB Peg Retention
Force to the PCB
(Right Angle Header)
Insert a header at a rate of 25.4±6
mm/minute.
(Applies to parts with PCB retention
pegs only)
Header with 2 pegs:
0.2 N MIN retention force
Headers with 1 peg:
0.1 N MIN retention force
Header Insertion Force
into the PCB
(Vertical Header)
Insert a header at a rate of 25.4±6
mm/minute.
With Kinked Pins: 35 N MAX.
With Solder Clip: 25 N MAX.
Header Retention Force
to the PCB
(Vertical Header)
Remove a header at a rate of
25.4±6 mm/minute.
With Kinked Pins: 1 N MIN.
With Solder Fork: 1 N MIN.
Crimp Terminal
Retention Force
(in housing)
Axial pullout force on the terminal
in the housing at a rate of 25 ± 6
mm per minute.
Per EIA-364-29
27 N
MINIMUM retention force
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Wire Pull Out Force
From Terminal (Axial)
Apply an axial pullout force on the
wire at a rate of 25 ± 6 mm per
minute.
16AWG 68.4N MIN
18AWG 68.4N MIN
20AWG 57.9N MIN
22AWG 35.6N MIN
Reference Molex Application Tooling
Specification for Molex crimp tooling
being used.
Vibration
(Random)
Mate connectors and vibrate per
EIA-364-28
test condition VII-D
Tin: 15 minutes each axis.
Gold: 1.5 hours each axis.
Maximum Change from Initial:
Tin: 7 m
15µ” & 30µ” Gold: 3 m
Discontinuity < 1 microsecond
Vibration per USCAR-2
Class V1, S1, T1
Mate connectors, mounted and
vibrate as per USCAR-2 Rev6:
5.4.6 Class V1, S1, T2.
Random Duration: 8hrs/axis
Maximum Change from Initial:
Tin: 7 m
15µ” & 30µ” Gold: 3 m
Reseating
Unmate/Mate connectors by hand
three cycles
Maximum Change from Initial:
Tin: 7 m
15µ” & 30µ” Gold: 3 m
6.3 ENVIRONMENTAL PERFORMANCE*
ITEM
TEST CONDITION
REQUIREMENT
Thermal
Shock
Mate connectors, expose to 10
cycles from -55°C to 85°C
Per EIA-364-32 method A,
condition 1
Maximum Change from Initial:
Tin: 7 m
15µ” & 30µ” Gold: 3 m
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Thermal Aging
Mate Connectors, expose to 240
hours at 105°C
Per EIA-364-17
Method A
Maximum Change from Initial:
Tin: 7 m
15µ” & 30µ” Gold: 3 m
Cyclic Temperature
And Humidity
Mate connectors: expose to 24
cycles from 25 °C / 80% RH to 65
°C / 50% RH
ramp time: 0.5hr dwell time: 1hr
Per EIA-364-31
Maximum Change from Initial:
Tin: 7 m
15µ” & 30µ” Gold: 3 m
Solderability
Dip Test
Per Molex test method:
SMES-152
Solder area shall have MIN. of 95%
solder coverage
(PASS)
Reflow Solder
Resistance
Convection reflow solder process
260°C Max per AS-40000-5013
Visual: No damage
Wave Solder
Resistance
Dip header terminal tails in solder:
Duration: 5±0.5 seconds
Solder temperature: 260±5° C
Per AS-40000-5013
Visual: No damage
Thermal Cycling
Tin Plated Only
Per EIA-364-1000.01 Test Group
5: Cycle mated connector
between 15°C±3°C and
85°C±3°C as measured on the
part. Ramps should be a
minimum of 2°C per minute, and
dwell times should insure
contacts reach the temperature
extremes (minimum of 5 minutes).
Humidity is not controlled.
Perform 500 cycles.
Maximum Change from Initial:
Tin: 7 m
*Environmental tests have been performed per EIA-364-100.01 except where noted.
> MN | | ceI | I use CB ce CB MN | | ceI | I use I:I | | | | REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
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ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
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A5
EC No:
UCP2016-0922
13 of 16
DATE:
08/28/2015
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7.0 TEST SEQUENCE GROUPS
Reliability Test Sequences Per 364-1000.01
Group I
Temperature Life
144 contacts tin
144 contacts gold
Group II
Thermal Shock
144 contacts tin
144 contacts gold
Group III
Vibration
144 contacts tin
144 contacts gold
Group V
Thermal Cycling
144 contacts tin
(tin plated only)
Group VII
Durability
144 contacts tin
144 contacts gold
|
|
|
|
|
Initial Contact
Resistance
EIA-364-23
Initial Contact
Resistance
EIA-364-23
Initial Contact
Resistance
EIA-364-23
Initial Contact
Resistance
EIA-364-23
DWV
EIA-364-20
|
|
|
|
|
Durability
Tin plated: 5 cycles
Gold plated: 20
cycles
EIA-364-09
Durability
Tin plated: 5 cycles
Gold plated: 20
cycles
EIA-364-09
Durability
Tin plated: 5 cycles
Gold plated: 20
cycles
EIA-364-09
Durability
20 cycles
EIA-364-09
Initial Contact
Resistance
EIA-364-23
|
|
|
|
|
Contact Resistance
Contact Resistance
Contact Resistance
Contact Resistance
Durability
Tin plated: 25
cycles
Gold plated: 200
cycles
EIA-364-09
|
|
|
|
Thermal Aging
TIN 105C, 240 hrs
GOLD 120C, 1000
hrs
10 Yrs @ 65C
EIA-364-17
Thermal Shock
10 cycles
-55C and +85C
EIA-364-32
Thermal Aging
105C, 120 hours
GOLD 120C, 1000
hrs
10 Yrs @ 65C
EIA-364-17
Thermal Aging
105C, 120 hours
GOLD 120C, 1000
hrs
10 Yrs @ 65C
EIA-364-17
|
|
|
|
|
Contact Resistance
Contact Resistance
Contact Resistance
Contact Resistance
Contact
Resistance
|
|
|
|
|
Reseating
3 cycles
Cyclic Temperature
and Humidity
EIA-364-31
Random Vibration
EIA-364-28
Condition VIID
Thermal Cycling
EIA-364-1000.01
DWV
EIA-364-20
|
|
|
|
Contact Resistance
Contact Resistance
Contact Resistance
Contact Resistance
|
|
Reseating
3 cycles
Reseating
3 cycles
Latch Retention
|
|
Contact Resistance
Contact Resistance
> I V V I I REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC No.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
A5
EC No:
UCP2016-0922
14 of 16
DATE:
08/28/2015
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-172323-0001
PPEREZ
RHODGE
RHODGE
FILENAME: PS75431r0.DOC
Individual Tests
Connector
Mating / Unmating Force
Connector
Mating / Unmating with latch
without terminals
Header Pin Retention Force in
the Housing
Header Insertion/Retention into
the PCB (Vertical Header with
solder clip)
Header Insertion/Retention into
the PCB (Vertical Header with
kinked pins 16 circuit, PTH)
R/A Header Insertion/Retention
into the PCB (crush pegs)
Receptacle Terminal retention
force into the housing 20
Terminals / 4 Connectors
Crimped terminal retention
force into the housing with TPA
Solderability Dip Test
Solder Clip retention force into
the housing
Receptacle latch retention
force
Receptacle latch retention
force after durability x200
cycles
USCAR Vibration
Initial Contact Resistance
USCAR 5.9.6 Class V1, Si, T1
Connector and/or Terminal
Cycling
USCAR-2 Rev6: 5.1.7
Vibration
USCAR-2 Rev6: 5.4.6
Voltage Drop
USCAR-2 Rev6: 5.3.2
Mechanical Shock USCAR-2
Rev6: 5.4.6
Dry Circuit Resistance
> molex‘ C TIme to Peak fem perature —> rememmm Time 2! Fax maven-um Peak Tamperamr: Ramp Rat: Peak Temneramre Cam Dawn Ramp Rm m. at Puma! hm p-mure Liqwdus Yemvaramre Preheat rmpmmve Ramp Rale Preheat Temperature Yime wmnm 5 °c oIPeaK Room Yempelature Tune Time Abave i‘_ qunidus _.i Temperature REVISION. ECR/ECN INFORMATION. TITLE. SHEET No. EC N0.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVISED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
A5
EC No:
UCP2016-0922
15 of 16
DATE:
08/28/2015
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-172323-0001
PPEREZ
RHODGE
RHODGE
FILENAME: PS75431r0.DOC
8.0 SOLDER INFORMATION
8.1 SOLDER PROCESS TEMPERATURES
Wave Solder: 265°C Max
Reflow Solder: 260°C Max
8.2 REFLOW SOLDERING PROFILE
(This profile is per AS-40000-5013 and is provided as a guideline only. Please see notes for additional
information)
Description
Requirement
Average Ramp Rate
3°C/sec Max
Preheat Temperature
150°C Min to 200°C Max
Preheat Time
60 to 180 sec
Ramp to Peak
3°C/sec Max
Time over Liquidus (217°C)
60 to 150 sec
Peak Temperature
260 +0/-5°C
Time within 5°C of Peak
20 to 40 sec
Ramp - Cool Down
6°C/sec Max
Time 25°C to Peak
8 min Max
> REVTSION. ECR/ECN INFORMATION. TITLE. SHEET No. EC N0.U % CONNECTOR SYSTEM DOCUMENT NUMBER. CREATED / REVTSED BY. CHECKED EV. APPROVED BY.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION FOR
ULTRA-FIT WIRE TO BOARD
CONNECTOR SYSTEM
SHEET No.
A5
EC No:
UCP2016-0922
16 of 16
DATE:
08/28/2015
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
PS-172323-0001
PPEREZ
RHODGE
RHODGE
FILENAME: PS75431r0.DOC
Notes:
1. Temperature indicated refers to the PCB surface temperature at solder tail area.
2. Connector can withstand 1 reflow cycle.
3. Actual reflow profile also depends on equipment, solder paste, PCB thickness, and other components on the
board. Please consult your solder paste & reflow equipment manufacturer for their recommendations to adopt a
suitable process.

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