MPZ2012 Series, Automotive Datasheet by TDK Corporation

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@TDK MPzzm zsaquTDZS MPszzsIm ATDzs MP220125221ATD25 MP220125331AT025 MPzzm 25601 ATD25 MPszzsmzATDzs
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EMC Components
Chip beads
For power line
MPZ series (for automotive)
MPZ2012 type
FEATURES
Noise reduction solution for power line.
Compared to the MMZ series, has low direct current resistance for compatibility with large currents, optimal for low power consumption.
Performs well even in signal lines where low direct current resistance is required.
Operating temperature range: –55 to +125°C
Compliant with AEC-Q200
APPLICATION
Various ECUs, powertrains, body controls, and car multimedia (telematics).
PART NUMBER CONSTRUCTION
CHARACTERISTICS SPECIFICATION TABLE
Please refer to the graph of rated current vs. temperature characteristics (derating) about the rating current at 85°C or more in temperature of the product.
Measurement equipment
Equivalent measurement equipment may be used.
Rated current vs. temperature characteristics (derating)
MPZ 2012 S 101 A T D25
Series name L×W×T dimensions Material name Impedance Characteristic
type Packaging style Internal code
2.0×1.25x0.85 mm () at 100MHz
Impedance DC resistance Rated currentPart No.
[100MHz]
()Tolerance ()max. (A)max.
30 ±100.010 6MPZ2012S300ATD25
100 ±25% 0.020 4 MPZ2012S101ATD25
220 ±25% 0.040 3MPZ2012S221ATD25
330 ±25% 0.050 2.5 MPZ2012S331ATD25
600 ±25% 0.100 2MPZ2012S601ATD25
1000 ±25% 0.150 1.5 MPZ2012S102ATD25
Measurement item Product No. Manufacturer
Impedance E4991A+16192A Keysight Technologies
DC resistance Type-7556 Yokogawa
AEC-Q200
S300A
S331A
S101A
S221A
S601A
S102A
0
1
2
3
4
5
6
7
–55 –35 –15 5 25 45 65 85 105 125
Temperature (°C)
Rated current
(A)
REACH
SVHC-Free
Lead
Free
RoHS
Pb
Halogen
Free
Br
Cl
@TDK
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EMC Components
MPZ2012 type
Z VS. FREQUENCY CHARACTERISTICS (BY SERIES)
MPZ2012S series
Z, X, R VS. FREQUENCY CHARACTERISTICS
MPZ2012S300ATD25 MPZ2012S101ATD25 MPZ2012S221ATD25
MPZ2012S331ATD25 MPZ2012S601ATD25 MPZ2012S102ATD25
100
300
500
700
1200
400
200
600
800
900
1000
1100
0100001000100101
Frequency (MHz)
Impedance (Ω)
MPZ2012S102A
MPZ2012S221A
MPZ2012S101A
MPZ2012S300A
MPZ2012S331A
MPZ2012S601A
50
40
30
20
10
01 10 100 1000 10000
Z
X
R
Frequency (MHz)
Impedance (Ω)
1 10 100 1000 10000
0
20
40
60
80
100
120
140
Frequency (MHz)
Impedance (Ω)
Z
R
X
300
100
50
150
200
250
01 10 100 1000 10000
Z
R
X
Frequency (MHz)
Impedance (Ω)
0
100
200
300
400
500
600
700
1 10 100 1000 10000
Frequency (MHz)
Impedance (Ω)
Z
R
X
1200
400
200
600
800
1000
01 10 100 1000 10000
Z
R
X
Frequency (MHz)
Impedance (Ω)
@TDK D----D D D E Mm D----D D E
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EMC Components
MPZ2012 type
SHAPE & DIMENSIONS
RECOMMENDED LAND PATTERN
RECOMMENDED REFLOW PROFILE
PACKAGING STYLE
REEL DIMENSIONS
TAPE DIMENSIONS
PACKAGE QUANTITY
TEMPERATURE RANGE, INDIVIDUAL WEIGHT
The storage temperature range is for after the assembly.
Dimensions in mm
1.25±0.2
2.0±0.2
0.5±0.3
0.85±0.2
Dimensions in mm
10.80.8
1.2
Natural
cooling
10s
60 to 120s
Preheating
30 to 60s
Soldering
230°C 230°C
250 to 260°C
180°C
150°C
Time
Peak
Temperature
Ty p e A B K
MPZ2012 1.5±0.2 2.3±0.2 1.1max.
Package quantity 4,000 pcs/reel
Operating
temperature range
Storage
temperature range
Individual
weight
–55 to +125°C –55 to +125°C 8 mg
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
Dimensions in mm
1.0
ø60min.
14.4max.
8.4
+2.0
–0.0
K
8.0±0.3
1.75±0.1
4.0±0.1
4.0±0.1
2.0±0.05
B
A
3.5±0.05
Dimensions in mm
Sprocket
hole 1.5 +0.1
–0
Cavity
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
@TDK
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REMINDERS FOR USING THESE PRODUCTS
Before using these products, be sure to request the delivery specifications.
SAFETY REMINDERS
Please pay sufficient attention to the warnings for safe designing when using this products.
The storage period is within 12 months. Be sure to follow the storage conditions (temperature: 5 to 40°C, humidity: 10 to 75% RH or
less).
If the storage period elapses, the soldering of the terminal electrodes may deteriorate.
Do not use or store in locations where there are conditions such as gas corrosion (salt, acid, alkali, etc.).
Before soldering, be sure to preheat components.
The preheating temperature should be set so that the temperature difference between the solder temperature and chip temperature
does not exceed 150°C.
Soldering corrections after mounting should be within the range of the conditions determined in the specifications.
If overheated, a short circuit, performance deterioration, or lifespan shortening may occur.
When embedding a printed circuit board where a chip is mounted to a set, be sure that residual stress is not given to the chip due to
the overall distortion of the printed circuit board and partial distortion such as at screw tightening portions.
Self heating (temperature increase) occurs when the power is turned ON, so the tolerance should be sufficient for the set thermal
design.
Carefully lay out the coil for the circuit board design of the non-magnetic shield type.
A malfunction may occur due to magnetic interference.
Use a wrist band to discharge static electricity in your body through the grounding wire.
Do not expose the products to magnets or magnetic fields.
Do not use for a purpose outside of the contents regulated in the delivery specifications.
The products listed on this catalog are intended for use in general electronic equipment (AV equipment, telecommunications equip-
ment, home appliances, amusement equipment, computer equipment, personal equipment, office equipment, measurement equip-
ment, industrial robots) under a normal operation and use condition.
The products are not designed or warranted to meet the requirements of the applications listed below, whose performance and/or qual-
ity require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage to society,
person or property.
If you intend to use the products in the applications listed below or if you have special requirements exceeding the range or conditions
set forth in the each catalog, please contact us.
(1) Aerospace/aviation equipment
(2) Transportation equipment (electric trains, ships, etc.)
(3) Medical equipment
(4) Power-generation control equipment
(5) Atomic energy-related equipment  
(6) Seabed equipment
(7) Transportation control equipment
(8) Public information-processing equipment
(9) Military equipment
(10) Electric heating apparatus, burning equipment
(11) Disaster prevention/crime prevention equipment
(12) Safety equipment
(13) Other applications that are not considered general-purpose
applications
When designing your equipment even for general-purpose applications, you are kindly requested to take into consideration securing pro-
tection circuit/device or providing backup circuits in your equipment.
REMINDERS

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