TYPICAL FLUX PROPERTIES Tesl 362 366 Amd value 170mgKOH/g lSSmQKOH/g Halide conlent (0.5% 1.0% SlR Test Classification
ROSIN BASED CORED SOLDER WIRE FLUXES
Properties of Multicore 362 and 366 solid fluxes for cored
solder wire:
Good wetting on most common surfaces
Two activity levels: Multicore 362 for general work and
Multicore 366 for more difficult surfaces
Non-corrosive
Fast soldering
Rosin based
Halide activated
PRODUCT RANGE
Multicore 362 and 366 cored wires are manufactured with a
range of flux contents. Although users will normally be using
products with a nominal flux content of 3%.
Multicore 362 and 366 cored wires are available in a variety of
alloys conforming to J-STD-006 and EN 29453 or alloys
conforming to similar national or international standards. For
details refer to document “Properties of Alloys used in Cored
Solder Wires”. A wide range of wire diameters is available.
Alternative flux contents and alloys may be manufactured to
special order.
TECHNICAL SPECIFICATION
A full description of test methods and detailed test results are
available on request.
Alloys: The alloys used for Multicore flux cored solder wires
conform to the purity requirements of the common national and
international standards. A wide range of wire diameters is
available manufactured to close dimensional tolerances. For
details refer to document “Properties of Alloys used in Cored
Solder Wires ”.
Flux: Multicore 362 and 366 solid flux leave dry and non-sticky
residues. In use its odour is typically that of rosin fluxes.
TYPICAL FLUX PROPERTIES
Test 362 366
Acid value 170mgKOH/g 158mgKOH/g
Halide content <0.5% 1.0%
SIR Test
(without cleaning)
J-STD-004 Pass Pass
Classification
J-STD-004
EN29451-1
ROL1
1.1.2
ROM1
1.1.2
SPECIAL PROPERTIES
Surface Insulation Resistance: Multicore 362 and 366 flux
pass the J-STD-004 SIR test and other elements of J-STD-
004 test protocols associated with the flux classification ROL1
for 362 and ROM1 for 366.
Electromigration Test: Multicore 362 and 366 pass the
Bellcore GR-78-CORE Electromigration tes
RECOMMENDED OPERATING CONDITIONS
Soldering iron: Good results should be obtained using a
range of tip temperatures. However, the optimum tip
temperature and heat capacity required for a hand soldering
process is a function of both soldering iron design and the
nature of the task and care should be exercised to avoid
unnecessarily high tip temperatures for excessive times. A
high tip temperature will increase any tendency to flux spitting
and it may produce some residue darkening.
The soldering iron tip should be properly tinned and this may
be achieved using Multicore cored wire. Severely
contaminated soldering iron tips should first be cleaned and
pre-tinned using Multicore Tip Tinner/Cleaner TTC1, then
wiped on a clean, damp sponge before re-tinning with
Multicore cored wire.
Soldering process: Multicore cored wires contain a careful
balance of resins and activators to provide clear residues,
maximum activity and high residue reliability, without cleaning
in most situations. To achieve the best results from Multicore
solder wires, recommended working practices for hand
soldering should be observed as follows:
Apply the soldering iron tip to the work surface, ensuring
that it simultaneously contacts the base material and the
cmponent termination to heat both surfaces adequately.
This process should only take a fraction of a second.
Apply Multicore flux cored solder wire to a part of the joint
surface away from the soldering iron and allow to flow
sufficiently to form a sound joint fillet – this should be
virtually instantaneous. Do not apply excessive solder or
heat to the joint as this may result in dull, gritty fillets and
excessive or darkened flux residues.
Remove solder wire from the work piece and then remove
the iron tip.
The total process will be very rapid, depending upon thermal
mass, tip temperature and configuration and the solderability
of the surfaces to be joined.
Technical Data Sheet
Multicore Solder Cored Wire Flux
362 & 366
June 2004
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN ARE INTENDED AS REFERENCE
ONLY: PLEASE CONTACT HENKEL TECHNOLOGIES FOR ASSISTANCE AND
RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
HENKEL LOCTITE ADHESIVES LTD. , KELSEY HOUSE, WOODLANE END. HEMEL
HEMPSTEAD, HERTFORDSHIRE HP2 4RQ, UK, TEL. +44 1442 233 233, FAX +44 1442 269 554
Technologies
Multicore flux cored solder wires provide fast soldering on
copper and brass surfaces as well as solder coated materials.
Activity of the halide activated versions on nickel is also good
depending on the state of oxidation of the nickel finish. The good
thermal stability of Multicore fluxes means they are also well
suited to soldering applications requiring high melting
temperature alloys.
Cleaning: Multicore 362 and 366 cored solder wires have been
formulated to leave pale flux residues and to resist spilling and
fuming.
Cleaning will not be required in most situations but if necessary
this is best achieved using Multicore MCF800 Cleaner (see
separate technical data sheet). Other proprietary solvent or
semi-aqueous processes may be suitable. Saponification may
be viable but customers must ensure that the desired level of
cleanliness can be achieved by their chosen system.
HEALTH AND SAFETY
Warning: The following information is for guidance only and
users must refer to the Material Safety Data Sheets relevant to
specific Multicore 362 and 366 products before use.
Health Hazards and Precautions: Inhalation of the flux fumes
given off during soldering should be avoided. The fumes are
irritating to the throat and respiratory system. Prolonged or
repeated exposure to rosin or modified rosin based flux fumes
may lead to the development of respiratory sensitisation and
occupational asthma.
Multicore solder wires must always be used with suitable fume
extraction equipment to remove fumes from the breathing zone
of operators and the general work environment.
Solder alloys containing lead give off negligible fume at normal
soldering temperatures up to 500°C.
Normal handling of lead alloy wires will not cause lead to be
absorbed through the skin. The most likely route of entry is
through ingestion but this will not be significant if a good
standard of personal hygiene is maintained. Eating, drinking
and smoking should not be permitted in the working area.
Hands should be washed with soap and warm water after
handling solder wire.
Waste disposal: Wherever possible, waste solder wire should be
recycled for recovery of metal. Otherwise it should be disposed of
according to local or national regulations.
Note
The data contained herein are furnished for information only and are
believed to be reliable. We cannot assume responsibility for the
results obtained by others over whose methods we have no control.
It is the user's responsibility to determine suitability for the user's
purpose of any production methods mentioned herein and to adopt
such precautions as may be advisable for the protection of property
and of persons against any hazards that may be involved in the
handling and use thereof. In light of the foregoing, Henkel
Corporation specifically disclaims all warranties expressed or
implied, including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages
of any kind, including lost profits. The discussion herein of
various processes or compositions is not to be interpreted as
representation that they are free from domination of patents owned
by others or as a license under any Henkel Corporation patents that
may cover such processes or compositions. We recommend that
each prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered by
one or more United States or foreign patents or patent applications.
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN ARE INTENDED AS REFERENCE
ONLY: PLEASE CONTACT HENKEL TECHNOLOGIES FOR ASSISTANCE AND
RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
HENKEL LOCTITE ADHESIVES LTD. , KELSEY HOUSE, WOODLANE END. HEMEL
HEMPSTEAD, HERTFORDSHIRE HP2 4RQ, UK, TEL. +44 1442 233 233, FAX +44 1442 269 554
All trademarks, except where noted, are the property of Henkel Corp. U.S.A
NOMINAL SPECIFICATION D TA SHEET FOR Sn62/LMP (62S) ALLOY Alloy specification EN29453 35219 J-STD-006 S-Sn62Ph36Ag2 Grade 628 Sn62Pb36Ag2B Liquidus 179°C 179°C 179°C Allov Composition Tin 61.5-62.5 61.5-62.5 61.5-62.5 Lead Remainder Remainder Remainder Arsenic (max) 0.03 0.03 0.03 Bismuth (max) 0.1 0.1 0.1 lron (max) 0.02 0.02 0.02 Copper (max) 0.05 0.08 0.05 Aluminium (max) 0.001 0.001 0.001 Cadmium (max) 0.002 0.005 0.002 Zinc (max) 0.001 0.003 0.001 Antimonv (max) 0.05 0.2 0.05 Gold (max) 0.05 0.005 0.05 Nickel (max) 0.01 0.005 0.01 Silver 1.8-2.2 1.8-2.2 1.8-2.2
NOMINAL SPECIFICATION DATA SHEET FOR
Sn62/LMP (62S) ALLOY
Alloy specification EN29453 BS219 J-STD-006
S-Sn62Pb36Ag2 Grade 62S Sn62Pb36Ag2B
Solidus 179°C 179°C 179°C
Liquidus 179°C 179°C 179°C
Alloy Composition
Tin 61.5-62.5 61.5-62.5 61.5-62.5
Lead Remainder Remainder Remainder
Arsenic (max) 0.03 0.03 0.03
Bismuth (max) 0.1 0.1 0.1
Iron (max) 0.02 0.02 0.02
Copper (max) 0.05 0.08 0.05
Aluminium (max) 0.001 0.001 0.001
Cadmium (max) 0.002 0.005 0.002
Zinc (max) 0.001 0.003 0.001
Antimony (max) 0.05 0.2 0.05
Gold (max) 0.05 0.005 0.05
Nickel (max) 0.01 0.005 0.01
Silver 1.8-2.2 1.8-2.2 1.8-2.2
BS219 is an obsolete specification. Our alloys are now manufactured to
EN29453.