ICM-20608 Datasheet by TDK InvenSense

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InvenSense
ICM-20608-G
MPU-6500
This document contains information on a pre-production
product. InvenSense Inc. reserves the right to change
specifications and information herein without notice.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 9887339
www.invensense.com
Document Number: DS-000081
Revision: 1.0
Release Date: 06/15/2015
ICM-20608-G Datasheet
Revision 1.0
InvenSense
ICM-20608-G
Page 2 of 35
Document Number: DS-000081
Revision: 1.0
TABLE OF CONTENTS
TABLE OF CONTENTS....................................................................................................................................................... 2
Table Of FIGURES ............................................................................................................................................................ 4
Table Of TABLES .............................................................................................................................................................. 4
1. General Description ............................................................................................................................................. 5
1.2 Purpose and Scope .................................................................................................................................... 5
1.3 Product Overview...................................................................................................................................... 5
1.4 Applications ............................................................................................................................................... 5
2. Features ............................................................................................................................................................... 6
2.1 Gyroscope Features .................................................................................................................................. 6
2.2 Accelerometer Features ............................................................................................................................ 6
2.3 Additional features.................................................................................................................................... 6
3. Electrical Characteristics ...................................................................................................................................... 7
3.1 Gyroscope Specifications .......................................................................................................................... 7
3.2 Accelerometer Specifications .................................................................................................................... 8
3.3 Electrical Specifications ............................................................................................................................. 9
3.3.1 D.C. Electrical Characteristics .................................................................................................................... 9
3.3.2 Standard (Duty-Cycle) Mode Noise and Power Performance: ................................................................ 10
3.3.3 A.C. Electrical Characteristics .................................................................................................................. 11
3.3.4 Other Electrical Specifications ................................................................................................................ 13
3.4 I2C Timing characterization..................................................................................................................... 14
3.5 spi Timing characterization ..................................................................................................................... 15
3.6 Absolute Maximum Ratings .................................................................................................................... 16
4. Applications Information ................................................................................................................................... 17
4.1 Pin Out Diagram and Signal Description ................................................................................................. 17
4.2 Typical Operating Circuit ......................................................................................................................... 18
4.3. bill of materials for external components ............................................................................................... 19
4.4. Block Diagram ......................................................................................................................................... 19
4.5. Overview ................................................................................................................................................. 20
4.6. Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning ............................................... 20
4.7. Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning ......................................... 20
4.8. I2C and SPI Serial Communications Interfaces ........................................................................................ 20
4.8.1 ICM-20608-G Solution Using I2C Interface ............................................................................................. 20
4.8.2 ICM-20608-G Solution Using SPI Interface .............................................................................................. 21
4.9 Self-Test................................................................................................................................................... 22
4.10 Clocking ............................................................................................................................................... 22
4.11 Sensor Data Registers ......................................................................................................................... 22
4.12 FIFO ..................................................................................................................................................... 22
4.13 Interrupts ............................................................................................................................................ 22
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Document Number: DS-000081
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4.14 Digital-Output Temperature Sensor ................................................................................................... 22
4.15 Bias and LDOs ..................................................................................................................................... 23
4.16 Charge Pump ...................................................................................................................................... 23
4.17 Power Modes ...................................................................................................................................... 23
5 Programmable Interrupts .................................................................................................................................. 24
5.1 Wake-on-Motion Interrupt ..................................................................................................................... 24
6 Digital Interface ................................................................................................................................................. 25
6.1 I2C and SPI Serial Interfaces .................................................................................................................... 25
6.2 I2C Interface ............................................................................................................................................ 25
6.3 I2C Communications Protocol ................................................................................................................. 25
6.4 I2C Terms ................................................................................................................................................. 27
6.5 SPI Interface ............................................................................................................................................ 28
7 Assembly ............................................................................................................................................................ 29
Orientation of Axes ............................................................................................................................................ 29
Package Dimensions .......................................................................................................................................... 30
8 Part Number Package Marking .......................................................................................................................... 32
9.Reference ................................................................................................................................................................... 33
Revision History ................................................................................................................................................. 34
Compliance Declaration Disclaimer ................................................................................................................... 35
InvenSense
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
TABLE OF FIGURES
Figure 1. I2C Bus Timing Diagram ............................................................................................................................................................ 14
Figure 2. SPI Bus Timing Diagram ............................................................................................................................................................. 15
Figure 3. Pin out Diagram for ICM-20608-G 3.0x3.0x0.75mm LGA ......................................................................................................... 17
Figure 4. ICM-20608-G I2C Operation Application Schematic ................................................................................................................. 18
Figure 5. ICM-20608-G SPI Operation Application Schematic ................................................................................................................. 18
Figure 6. ICM-20608-G Block Diagram ..................................................................................................................................................... 19
Figure 7. ICM-20608-G Solution Using I2C Interface ................................................................................................................................ 21
Figure 8. ICM-20608-G Solution Using SPI Interface ................................................................................................................................ 21
Figure 9. START and STOP Conditions ...................................................................................................................................................... 25
Figure 10. Acknowledge on the I2C Bus ................................................................................................................................................... 26
Figure 11. Complete I2C Data Transfer ..................................................................................................................................................... 26
Figure 12. Typical SPI Master/Slave Configuration .................................................................................................................................. 28
Figure 13. Orientation of Axes of Sensitivity and Polarity of Rotation .................................................................................................... 29
TABLE OF TABLES
Table 1. Gyroscope Specifications ............................................................................................................................................................. 7
Table 2. Accelerometer Specifications ....................................................................................................................................................... 8
Table 3. D.C. Electrical Characteristics ....................................................................................................................................................... 9
Table 4. Gyroscope Noise and Current Consumption .............................................................................................................................. 10
Table 5. Accelerometer Noise and Current Consumption ....................................................................................................................... 10
Table 6. A.C. Electrical Characteristics ..................................................................................................................................................... 12
Table 7. Other Electrical Specifications .................................................................................................................................................... 13
Table 8. I2C Timing Characteristics ........................................................................................................................................................... 14
Table 9. SPI Timing Characteristics (8MHz Operation) ............................................................................................................................ 15
Table 10. Absolute Maximum Ratings ..................................................................................................................................................... 16
Table 12. Bill of Materials ....................................................................................................................................................................... 19
Table 13. Power Modes for ICM-20608-G ............................................................................................................................................... 23
Table 14. Table of Interrupt Sources ........................................................................................................................................................ 24
Table 15. Serial Interface ......................................................................................................................................................................... 25
Table 16. I2C Terms .................................................................................................................................................................................. 27
InvenSense
ICM-20608-G
Page 5 of 35
Document Number: DS-000081
Revision: 1.0
1. GENERAL DESCRIPTION
1.2 PURPOSE AND SCOPE
This document is a product specification, providing a description, specifications, and design related information on the ICM-20608-
G™ MotionTracking device. The device is housed in a small 3x3x0.75mm 16-pin LGA package.
1.3 PRODUCT OVERVIEW
The ICM-20608-G is a 6-axis MotionTracking device that combines a 3-axis gyroscope, and a 3-axis accelerometer in a small
3x3x0.75mm (16-pin LGA) package. It also features a 512-byte FIFO that can lower the traffic on the serial bus interface, and reduce
power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. ICM-20608-G,
with its 6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system level
integration of discrete devices, guaranteeing optimal motion performance for consumers.
The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec. The accelerometer has a user-
programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors
reduces production-line calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and
programmable interrupts. The device features I2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.45V, and a separate
digital IO supply, VDDIO from 1.71V to 3.45V. Communication with all registers of the device is performed using either I2C at 400kHz
or SPI at 8MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion
CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of
3x3x0.75mm (16-pin LGA), to provide a very small yet high performance low cost package. The device provides high robustness by
supporting 10,000g shock reliability.
1.4 APPLICATIONS
Mobile phones and tablets
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
InvenSense
ICM-20608-G
Page 6 of 35
Document Number: DS-000081
Revision: 1.0
2. FEATURES
2.1 GYROSCOPE FEATURES
The triple-axis MEMS gyroscope in the ICM-20608-G includes a wide range of features:
Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable full-scale range of ±250, ±500,
±1000, and ±2000°/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Factory calibrated sensitivity scale factor
Self-test
2.2 ACCELEROMETER FEATURES
The triple-axis MEMS accelerometer in ICM-20608-G includes a wide range of features:
Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and ±16g and
integrated 16-bit ADCs
User-programmable interrupts
Wake-on-motion interrupt for low power operation of applications processor
Self-test
2.3 ADDITIONAL FEATURES
The ICM-20608-G includes the following additional features:
Smallest and thinnest LGA package for portable devices: 3x3x0.75mm (16-pin LGA)
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
512 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers
8MHz SPI serial interface for communicating with all registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
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ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
3. ELECTRICAL CHARACTERISTICS
3.1 GYROSCOPE SPECIFICATIONS
Typical Operating Circuit of section 0, VDD = 1.8 V, VDDIO = 1.8 V, TA = 25°C, unless otherwise noted.
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
GYROSCOPE SENSITIVITY
FS_SEL=0
±250
/s
3
FS_SEL=1
±500
/s
3
FS_SEL=2
±1000
/s
3
FS_SEL=3
±2000
/s
3
16
bits
3
FS_SEL=0
131
LSB/(/s)
3
FS_SEL=1
65.5
LSB/(/s)
3
FS_SEL=2
32.8
LSB/(/s)
3
FS_SEL=3
16.4
LSB/(/s)
3
25°C
±2
%
2
-40°C to +85°C
±3
%
1
Best fit straight line; 25°C
±0.1
%
1
±2
%
1
ZERO-RATE OUTPUT (ZRO)
25°C
±5
/s
2
-40°C to +85°C
±0.1
/s/°C
1
GYROSCOPE NOISE PERFORMANCE (FS_SEL=0)
0.008
/s/√Hz
1
25
27
29
KHz
2
Programmable Range
5
250
Hz
3
From Sleep mode
35
ms
1
Standard (duty-cycled) mode
3.91
500
Hz
1
Low-Noise (active) mode
4
8000
Hz
1
Table 1. Gyroscope Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Tested in production.
3. Guaranteed by design.
InvenSense
ICM-20608-G
Page 8 of 35
Document Number: DS-000081
Revision: 1.0
3.2 ACCELEROMETER SPECIFICATIONS
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
ACCELEROMETER SENSITIVITY
Full-Scale Range
AFS_SEL=0
±2
g
3
AFS_SEL=1
±4
g
3
AFS_SEL=2
±8
g
3
AFS_SEL=3
±16
g
3
ADC Word Length
Output in two’s complement format
16
bits
3
Sensitivity Scale Factor
AFS_SEL=0
16,384
LSB/g
3
AFS_SEL=1
8,192
LSB/g
3
AFS_SEL=2
4,096
LSB/g
3
AFS_SEL=3
2,048
LSB/g
3
Initial Tolerance
Component-level
±2
%
2
Sensitivity Change vs. Temperature
-40°C to +85°C AFS_SEL=0
Component-level
±0.016
%/C
1
Nonlinearity
Best Fit Straight Line
±0.5
%
1
Cross-Axis Sensitivity
±2
%
1
ZERO-G OUTPUT
Initial Tolerance
Component-level, all axes
±60
mg
1
Zero-G Level Change vs. Temperature
-40°C to +85°C,
Board-level
X and Y axes
±0.5
mg/°C
1
Z axis
±1
mg/°C
1
NOISE PERFORMANCE
Noise Spectral Density
250
µg/√Hz
1
Low Pass Filter Response
Programmable Range
5
218
Hz
3
Intelligence Function Increment
4
mg/LSB
3
Accelerometer Startup Time
From Sleep mode
20
ms
1
From Cold Start, 1ms VDD ramp
30
ms
1
Output Data Rate
Standard (duty-cycled) mode
0.24
500
Hz
1
Low-Noise (active) mode
4
4000
Hz
Table 2. Accelerometer Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Tested in production.
3. Guaranteed by design.
InvenSense
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
3.3 ELECTRICAL SPECIFICATIONS
3.3.1 D.C. Electrical Characteristics
Typical Operating Circuit of section 0, VDD = 1.8 V, VDDIO = 1.8 V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
SUPPLY VOLTAGES
VDD
1.71
1.8
3.45
V
1
VDDIO
1.71
1.8
3.45
V
1
SUPPLY CURRENTS
Low-Noise Mode
6-axis Gyroscope + Accelerometer
3
mA
1
3-axis Gyroscope
2.6
mA
1
3-axis Accelerometer, 4kHz ODR
390
µA
1
Accelerometer Standard Mode
100Hz ODR, 1x averaging
57
µA
1
Gyroscope Standard Mode
100Hz ODR, 1x averaging
1.6
mA
1
Gyroscope Standard Mode
10Hz ODR, 1x averaging
1.3
mA
1
6-Axis Standard Mode (Gyroscope
Standard Mode; Accelerometer Low-
Noise Mode)
100Hz ODR, 1x averaging
1.9
mA
1
Full-Chip Sleep Mode
6
µA
1
TEMPERATURE RANGE
Specified Temperature Range
Performance parameters are not applicable
beyond Specified Temperature Range
-40
+85
°C
1
Table 3. D.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
InvenSense
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
3.3.2 Standard (Duty-Cycle) Mode Noise and Power Performance:
The following tables contain Gyroscope and Accelerometer noise and current consumption values for standard (duty-cycle) mode,
for various ODRs and averaging filter settings. Please refer to the ICM-20608-G Register Map for further information about the
registers referenced in the tables below.
FCHOICE_B
0
0
0
0
0
0
0
0
G_AVGCFG
0
1
2
3
4
5
6
7
Averages
1x
2x
4x
8x
16x
32x
64x
128x
Ton (ms)
1.73
2.23
3.23
5.23
9.23
17.23
33.23
65.23
Noise BW (Hz)
650.8
407.1
224.2
117.4
60.2
30.6
15.6
8.0
Noise (dps) TYP based on
0.008º/s/Hz
0.20
0.16
0.12
0.09
0.06
0.04
0.03
0.02
SMPLRT_DIV
ODR
(Hz)
Current Consumption (mA) TYP
255
3.9
1.3
1.3
1.3
1.3
1.4
1.4
1.5
1.8
99
10.0
1.3
1.3
1.4
1.4
1.5
1.6
1.9
2.5
64
15.4
1.4
1.4
1.4
1.5
1.6
1.8
2.2
N/A
32
30.3
1.4
1.4
1.5
1.6
1.8
2.2
N/A
19
50.0
1.5
1.5
1.6
1.8
2.1
2.8
9
100.0
1.6
1.7
1.9
2.2
3.0
N/A
7
125.0
1.7
1.8
2.0
2.5
N/A
4
200.0
1.9
2.1
2.5
N/A
3
250.0
2.1
2.3
2.7
2
333.3
2.3
2.6
N/A
1
500.0
2.9
N/A
Table 4. Gyroscope Noise and Current Consumption
ACCEL_FCHOICE_B
1
0
0
0
0
A_DLPF_CFG
x
7
7
7
7
DEC2_CFG
x
0
1
2
3
Averages
1x
4x
8x
16x
32x
Ton (ms)
1.084
1.84
2.84
4.84
8.84
Noise BW (Hz)
1100.0
441.6
235.4
121.3
61.5
Noise (mg) TYP based on
250µg/Hz
8.3
5.3
3.8
2.8
2.0
SMPLRT_DIV
ODR
(Hz)
Current Consumption (µA) TYP
255
3.9
8.4
9.4
10.8
13.6
19.2
127
7.8
9.8
11.9
14.7
20.3
31.4
63
15.6
12.8
17.0
22.5
33.7
55.9
31
31.3
18.7
27.1
38.2
60.4
104.9
15
62.5
30.4
47.2
69.4
113.9
202.8
7
125.0
57.4
87.5
132.0
220.9
N/A
3
250.0
100.9
168.1
257.0
N/A
1
500.0
194.9
329.3
N/A
Table 5. Accelerometer Noise and Current Consumption
InvenSense
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
3.3.3 A.C. Electrical Characteristics
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
SUPPLIES
Supply Ramp Time (TRAMP)
Monotonic ramp. Ramp rate is
10% to 90% of the final value
0.01
100
ms
1
TEMPERATURE SENSOR
Operating Range
Ambient
-40
85
°C
1
Room Temperature Offset
25°C
0
°C
1
Sensitivity
Untrimmed
326.8
LSB/°C
1
POWER-ON RESET
Supply Ramp Time (TRAMP)
Valid power-on RESET
0.01
100
ms
1
Start-up time for register read/write
From power-up
11
100
ms
1
From sleep
5
ms
1
I2C ADDRESS
AD0 = 0
AD0 = 1
1101000
1101001
DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS)
VIH, High Level Input Voltage
0.7*VDDIO
V
1
VIL, Low Level Input Voltage
0.3*VDD
IO
V
CI, Input Capacitance
< 10
pF
DIGITAL OUTPUT (SDO, INT)
VOH, High Level Output Voltage
RLOAD=1MΩ;
0.9*VDDIO
V
1
VOL1, Low-Level Output Voltage
RLOAD=1MΩ;
0.1*VDD
IO
V
VOL.INT, INT Low-Level Output Voltage
OPEN=1, 0.3mA sink
Current
0.1
V
Output Leakage Current
OPEN=1
100
nA
tINT, INT Pulse Width
LATCH_INT_EN=0
50
µs
I2C I/O (SCL, SDA)
VIL, Low-Level Input Voltage
-0.5V
0.3*VDD
IO
V
1
VIH, High-Level Input Voltage
0.7*VDDIO
VDDIO +
0.5V
V
Vhys, Hysteresis
0.1*VDD
IO
V
VOL, Low-Level Output Voltage
3mA sink current
0
0.4
V
IOL, Low-Level Output Current
VOL=0.4V
VOL=0.6V
3
6
mA
mA
Output Leakage Current
100
nA
tof, Output Fall Time from VIHmax to VILmax
Cb bus capacitance in pf
20+0.1Cb
300
ns
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ICM-20608-G
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Document Number: DS-000081
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INTERNAL CLOCK SOURCE
Sample Rate
FCHOICE_B=1,2,3
SMPLRT_DIV=0
32
kHz
2
FCHOICE_B=0;
DLPFCFG=0 or 7
SMPLRT_DIV=0
8
kHz
2
FCHOICE_B=0;
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
1
kHz
2
Clock Frequency
Initial Tolerance
CLK_SEL=0, 6 or gyro
inactive; 25°C
-5
+5
%
1
CLK_SEL=1,2,3,4,5 and
gyro active; 25°C
-1
+1
%
1
Frequency
Variation over
Temperature
CLK_SEL=0,6 or gyro
inactive
-10
+10
%
1
CLK_SEL=1,2,3,4,5 and
gyro active
-1
+1
%
1
Table 6. A.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Guaranteed by design.
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ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
3.3.4 Other Electrical Specifications
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
SERIAL INTERFACE
SPI Operating Frequency, All Registers
Read/Write
Low-Speed Characterization
100 ±10%
kHz
1
High-Speed Characterization
1
8
MHz
1, 2
SPI Modes
Modes 0
and 3
I2C Operating Frequency
All registers, Fast-mode
400
kHz
1
All registers, Standard-mode
100
kHz
1
Table 7. Other Electrical Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. SPI clock duty cycle between 45% and 55% should be used for 8-MHz operation.
InvenSense
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
3.4 I2C TIMING CHARACTERIZATION
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
I2C TIMING
I2C FAST-MODE
fSCL, SCL Clock
Frequency
400
kHz
1
tHD.STA, (Repeated)
START Condition Hold
Time
0.6
µs
1
tLOW, SCL Low Period
1.3
µs
1
tHIGH, SCL High Period
0.6
µs
1
tSU.STA, Repeated START
Condition Setup Time
0.6
µs
1
tHD.DAT, SDA Data Hold
Time
0
µs
1
tSU.DAT, SDA Data Setup
Time
100
ns
1
tr, SDA and SCL Rise
Time
Cb bus cap. from 10 to 400pF
20+0.1Cb
300
ns
1
tf, SDA and SCL Fall
Time
Cb bus cap. from 10 to 400pF
20+0.1Cb
300
ns
1
tSU.STO, STOP Condition
Setup Time
0.6
µs
1
tBUF, Bus Free Time
Between STOP and
START Condition
1.3
µs
1
Cb, Capacitive Load for
each Bus Line
< 400
pF
1
tVD.DAT, Data Valid Time
0.9
µs
1
tVD.ACK, Data Valid
Acknowledge Time
0.9
µs
1
Table 8. I2C Timing Characteristics
Notes:
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
SDA
SCL
SDA
SCL
70%
30%
tf
S
70%
30%
trtSU.DAT
tr
tHD.DAT
70%
30%
tHD.STA 1/fSCL
1st clock cycle
70%
30%
tLOW tHIGH
tVD.DAT
9th clock cycle
continued below at A
A
Sr PS
70%
30%
tSU.STA tHD.STA tVD.ACK tSU.STO
tBUF
70%
30%
9th clock cycle
tf
Figure 1. I2C Bus Timing Diagram
InvenSense #1 III +I j_ Mar/«1%? 2* if /%, |‘—’<—l>I |« X
ICM-20608-G
Page 15 of 35
Document Number: DS-000081
Revision: 1.0
3.5 SPI TIMING CHARACTERIZATION
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
SPI TIMING
fSCLK, SCLK Clock
Frequency
8
MHz
1
tLOW, SCLK Low Period
56
ns
1
tHIGH, SCLK High Period
56
ns
1
tSU.CS, CS Setup Time
2
ns
1
tHD.CS, CS Hold Time
63
ns
1
tSU.SDI, SDI Setup Time
3
ns
1
tHD.SDI, SDI Hold Time
7
ns
1
tVD.SDO, SDO Valid Time
Cload = 20pF
40
ns
1
tDIS.SDO, SDO Output
Disable Time
20
ns
1
tFall, SCLK Fall Time
6.5
ns
2
tRise, SCLK Rise Time
6.5
ns
2
tDIS.SDO, SDO Output
Disable Time
20
ns
1
Table 9. SPI Timing Characteristics (8MHz Operation)
Notes:
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
2. Based on calculation from other parameter values
tHIGH
70%
30%
1/fCLK tHD;CS
CS
SCLK
SDI
SDO MSB OUT
MSB IN LSB IN
LSB OUT
tDIS;SDO
70%
30%
tSU;CS
tSU;SDI tHD;SDI
70%
30%
tHD;SDO
70%
30%
tVD;SDO
tLOW
tFall tRise
Figure 2. SPI Bus Timing Diagram
InvenSense
ICM-20608-G
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Document Number: DS-000081
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3.6 ABSOLUTE MAXIMUM RATINGS
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
PARAMETER
RATING
Supply Voltage, VDD
-0.5V to +4V
Supply Voltage, VDDIO
-0.5V to +4V
REGOUT
-0.5V to 2V
Input Voltage Level (AD0, FSYNC, SCL, SDA)
-0.5V to VDD + 0.5V
Acceleration (Any Axis, unpowered)
10,000g for 0.2ms
Operating Temperature Range
-40°C to +85°C
Storage Temperature Range
-40°C to +125°C
Electrostatic Discharge (ESD) Protection
2kV (HBM);
250V (MM)
Latch-up
JEDEC Class II (2),125°C
±100mA
Table 10. Absolute Maximum Ratings
InvenSense UUU EEEEE WWW 33333
ICM-20608-G
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Document Number: DS-000081
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4. APPLICATIONS INFORMATION
4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION
PIN NUMBER
PIN NAME
PIN DESCRIPTION
1
VDDIO
Digital I/O supply voltage
2
SCL/SCLK
I2C serial clock (SCL); SPI serial clock (SCLK)
3
SDA/SDI
I2C serial data (SDA); SPI serial data input (SDI)
4
AD0/SDO
I2C slave address LSB (AD0); SPI serial data output (SDO)
5
CS
Chip select (0 = SPI mode; 1 = I2C mode)
6
INT
Interrupt digital output (totem pole or open-drain)
7
RESV
Reserved. Do not connect.
8
FSYNC
Synchronization digital input (optional). Connect to GND if unused.
9
RESV
Reserved. Connect to GND.
10
RESV
Reserved. Connect to GND.
11
RESV
Reserved. Connect to GND.
12
RESV
Reserved. Connect to GND.
13
GND
Connect to GND
14
REGOUT
Regulator filter capacitor connection
15
RESV
Reserved. Connect to GND.
16
VDD
Power Supply
Table 11. Signal Descriptions
6 7 8
INT
RESV
FSYNC
9
1
4
CS
AD0/SDO
16 15 14
REGOUT
RESV
VDD
ICM-20608-G
LGA Package (Top View)
16-pin, 3mm x 3mm x 0.75mm
Typical Footprint and thickness
2
3
VDDIO
12
11
10
RESV
Orientation of Axes of Sensitivity and Polarity of Rotation
ICM-20608-G
+Z
+X+Y
13
5
SCL/SCLK
SDA/SDI RESV
RESV
RESV
GND
Figure 3. Pin out Diagram for ICM-20608-G 3.0x3.0x0.75mm LGA
InvenSense I): VDD‘O SBA/SDI ADosDo M VDD‘O SBA/SDI ADosDo
ICM-20608-G
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Document Number: DS-000081
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4.2 TYPICAL OPERATING CIRCUIT
678
9
1
4
16 15 14
ICM-20608-G
2
3
12
11
10
13
5
VDDIO
AD0/SDO
SCL/SCLK
CS
SDA/SDI
C3, 10 nF SCL
VDDIO
SDA
AD0
1.8 3.3 VDC
VDD
1.8 3.3VDC
C2, 0.1 mFREGOUT
GND
RESV
RESV
C1, 0.47 mF
RESV
RESV
INT
FSYNC
RESV
RESV
C4, 2.2 mF
Figure 4. ICM-20608-G I2C Operation Application Schematic
678
9
1
4
16 15 14
ICM-20608-G
2
3
12
11
10
13
5
VDDIO
AD0/SDO
SCL/SCLK
CS
SDA/SDI
C3, 10 nF SCLK
nCS
SDI
SDO
1.8 3.3 VDC
VDD
1.8 3.3VDC
C2, 0.1 mFREGOUT
GND
RESV
RESV
C1, 0.47 mF
RESV
RESV
INT
FSYNC
RESV
RESV
C4, 2.2 mF
Figure 5. ICM-20608-G SPI Operation Application Schematic
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ICM-20608-G
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4.3. BILL OF MATERIALS FOR EXTERNAL COMPONENTS
COMPONENT
LABEL
SPECIFICATION
QUANTITY
REGOUT Capacitor
C1
Ceramic, X7R, 0.47µF ±10%, 2V
1
VDD Bypass Capacitors
C2
Ceramic, X7R, 0.1µF ±10%, 4V
1
C4
Ceramic, X7R, 2.2µF ±10%, 4V
1
VDDIO Bypass Capacitor
C3
Ceramic, X7R, 10nF ±10%, 4V
1
Table 11. Bill of Materials
4.4. BLOCK DIAGRAM
ICM-20608-G
Charge
Pump
CS
AD0 / SDO
SCL / SCLK
SDA / SDI
Temp Sensor ADC
ADC
Z Gyro
ADCY Gyro
FSYNC
Slave I2C and
SPI Serial
Interface
Interrupt
Status
Register
VDD
Bias & LDOs
GND REGOUT
Z Accel
Y Accel
X Accel ADC
ADC
ADC
ADCX Gyro
Signal Conditioning
FIFO
User & Config
Registers
Sensor
Registers
Self
test
Self
test
Self
test
Self
test
Self
test
Self
test
INT
Figure 6. ICM-20608-G Block Diagram
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4.5. OVERVIEW
The ICM-20608-G is comprised of the following key blocks and functions:
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Primary I2C and SPI serial communications interfaces
Self-Test
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDOs
Charge Pump
Standard Power Modes
4.6. THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING
The ICM-20608-G consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about the X-, Y-, and Z-
Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a vibration that is detected by a capacitive
pickoff. The resulting signal is amplified, demodulated, and filtered to produce a voltage that is proportional to the angular rate.
This voltage is digitized using individual on-chip 16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range
of the gyro sensors may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample rate is
programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low-pass filters enable a wide
range of cut-off frequencies.
4.7. THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING
The ICM-20608-G’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis induces
displacement on the corresponding proof mass, and capacitive sensors detect the displacement differentially. The ICM-20608-G’s
architecture reduces the accelerometers’ susceptibility to fabrication variations as well as to thermal drift. When the device is placed
on a flat surface, it will measure 0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the
factory and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing digital outputs.
The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.
4.8. I2C AND SPI SERIAL COMMUNICATIONS INTERFACES
The ICM-20608-G communicates to a system processor using either a SPI or an I2C serial interface. The ICM-20608-G always acts as a
slave when communicating to the system processor. The LSB of the I2C slave address is set by pin 4 (AD0).
4.8.1 ICM-20608-G Solution Using I2C Interface
In the figure below, the system processor is an I2C master to the ICM-20608-G.
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ICM-20608-G AD0
SCL
SDA
Interrupt
Status
Register
INT
VDD
Bias & LDOs
GND REGOUT
FIFO
User & Config
Registers
Sensor
Register
Factory
Calibration
Slave I2C
or SPI
Serial
Interface
System
Processor
SCL
SDA
VDDIO or GND
I2C Processor Bus: for reading all
sensor data from ICM-20608
Figure 7. ICM-20608-G Solution Using I2C Interface
4.8.2 ICM-20608-G Solution Using SPI Interface
In the figure below, the system processor is an SPI master to the ICM-20608-G. Pins 2, 3, 4, and 5 are used to support the SCLK, SDI,
SDO, and CS signals for SPI communications.
ICM-20608-G SDO
SCLK
SDI
Interrupt
Status
Register INT
FIFO
Config
Register
Sensor
Register
Factory
Calibration
CS
Slave I2C
or SPI
Serial
Interface
System
Processor
SDI
SCLK
SDO
nCS
Processor SPI Bus: for reading all
data from ICM-20608 and for
configuring ICM-20608
VDD
Bias & LDOs
GND REGOUT
Figure 8. ICM-20608-G Solution Using SPI Interface
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4.9 SELF-TEST
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each measurement axis can
be activated by means of the gyroscope and accelerometer self-test registers (registers 27 and 28).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output signal. The output signal is
used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled Sensor output with self-test disabled
The self-test response for each gyroscope axis is defined in the gyroscope specification table, while that for each accelerometer axis
is defined in the accelerometer specification table.
When the value of the self-test response is within the specified min/max limits of the product specification, the part has passed self-
test. When the self-test response exceeds the min/max values, the part is deemed to have failed self-test. It is recommended to use
InvenSense MotionApps software for executing self-test.
4.10 CLOCKING
The ICM-20608-G has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the internal synchronous
circuitry. This synchronous circuitry includes the signal conditioning and ADCs, and various control circuits and registers. An on-chip
PLL provides flexibility in the allowable inputs for generating this clock.
Allowable internal sources for generating the internal clock are:
a) An internal relaxation oscillator
b) Auto-select between internal relaxation oscillator and gyroscope MEMS oscillator to use the best available source
The only setting supporting specified performance in all modes is option b). It is recommended that option b) be used.
4.11 SENSOR DATA REGISTERS
The sensor data registers contain the latest gyroscope, accelerometer, and temperature measurement data. They are read-only
registers, and are accessed via the serial interface. Data from these registers may be read anytime.
4.12 FIFO
The ICM-20608-G contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO configuration register
determines which data is written into the FIFO. Possible choices include gyro data, accelerometer data, temperature readings, and
FSYNC input. A FIFO counter keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
The ICM-20608-G allows FIFO read in standard (duty cycle) accelerometer mode.
4.13 INTERRUPTS
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include the INT pin
configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that can trigger an interrupt are (1)
Clock generator locked to new reference oscillator (used when switching clock sources); (2) new data is available to be read (from
the FIFO and Data registers); (3) accelerometer event interrupts; (4) FIFO overflow. The interrupt status can be read from the
Interrupt Status register.
4.14 DIGITAL-OUTPUT TEMPERATURE SENSOR
An on-chip temperature sensor and ADC are used to measure the ICM-20608-G die temperature. The readings from the ADC can be
read from the FIFO or the Sensor Data registers.
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4.15 BIAS AND LDOS
The bias and LDO section generates the internal supply and the reference voltages and currents required by the ICM-20608-G. Its
two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The LDO output is bypassed by a capacitor at
REGOUT. For further details on the capacitor, please refer to the Bill of Materials for External Components.
4.16 CHARGE PUMP
An on-chip charge pump generates the high voltage required for the MEMS oscillator.
4.17 POWER MODES
The following table lists the user-accessible power modes for ICM-20608-G.
MODE
NAME
GYRO
ACCEL
1
Sleep Mode
Off
Off
2
Standby Mode
Drive On
Off
3
Accelerometer Standard Mode
Off
Duty-Cycled
4
Accelerometer Low-Noise Mode
Off
On
5
Gyroscope Standard Mode
Duty-Cycled
Off
6
Gyroscope Low-Noise Mode
On
Off
7
6-Axis Low-Noise Mode
On
On
8
6-Axis Standard Mode
Duty-Cycled
On
Table 12. Power Modes for ICM-20608-G
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5 PROGRAMMABLE INTERRUPTS
The ICM-20608-G has a programmable interrupt system which can generate an interrupt signal on the INT pin. Status flags indicate
the source of an interrupt. Interrupt sources may be enabled and disabled individually.
INTERRUPT NAME
MODULE
Motion Detection
Motion
FIFO Overflow
FIFO
Data Ready
Sensor Registers
Table 13. Table of Interrupt Sources
5.1 WAKE-ON-MOTION INTERRUPT
The ICM-20608-G provides motion detection capability. A qualifying motion sample is one where the high passed sample from any
axis has an absolute value exceeding a user-programmable threshold. The following steps explain how to configure the Wake-on-
Motion Interrupt.
Step 1: Ensure that Accelerometer is running
In PWR_MGMT_1 register (0x6B) set CYCLE = 0, SLEEP = 0, and GYRO_STANDBY = 0
In PWR_MGMT_2 register (0x6C) set STBY_XA = STBY_YA = STBY_ZA = 0, and STBY_XG = STBY_YG = STBY_ZG = 1
Step 2: Accelerometer Configuration
In ACCEL_CONFIG2 register (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPF_CFG[2:0] = 1 (b001)
Step 3: Enable Motion Interrupt
In INT_ENABLE register (0x38) set WOM_INT_EN = 111 to enable motion interrupt
Step 4: Set Motion Threshold
Set the motion threshold in ACCEL_WOM_THR register (0x1F)
Step 5: Enable Accelerometer Hardware Intelligence
In ACCEL_INTEL_CTRL register (0x69) set ACCEL_INTEL_EN = ACCEL_INTEL_MODE = 1; Ensure that bit 0 is set to 0.
Step 6: Set Frequency of Wake-Up
In Standard Mode Configuration register (0x1E) set LPOSC_CLKSEL[3:0] for a sample rate as indicated in the register map
Step 7: Enable Cycle Mode (Accelerometer Standard Mode)
In PWR_MGMT_1 register (0x6B) set CYCLE = 1
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6 DIGITAL INTERFACE
6.1 I2C AND SPI SERIAL INTERFACES
The internal registers and memory of the ICM-20608-G can be accessed using either I2C at 400 kHz or SPI at 8MHz. SPI operates in
four-wire mode.
PIN NUMBER
PIN NAME
PIN DESCRIPTION
1
VDDIO
Digital I/O supply voltage.
4
AD0 / SDO
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
2
SCL / SCLK
I2C serial clock (SCL); SPI serial clock (SCLK)
3
SDA / SDI
I2C serial data (SDA); SPI serial data input (SDI)
Table 14. Serial Interface
Note:
To prevent switching into I2C mode when using SPI, the I2C interface should be disabled by setting the I2C_IF_DIS configuration bit.
Setting this bit should be performed immediately after waiting for the time specified by the “Start-Up Time for Register Read/Write”
in Section 3.3.3.
6.2 I2C INTERFACE
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the lines are open-drain and bi-
directional. In a generalized I2C interface implementation, attached devices can be a master or a slave. The master device puts the
slave address on the bus, and the slave device with the matching address acknowledges the master.
The ICM-20608-G always operates as a slave device when communicating to the system processor, which thus acts as the master.
SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is 400 kHz.
The slave address of the ICM-20608-G is b110100X which is 7 bits long. The LSB bit of the 7 bit address is determined by the logic
level on pin AD0. This allows two ICM-20608-Gs to be connected to the same I2C bus. When used in this configuration, the address
of one of the devices should be b1101000 (pin AD0 is logic low) and the address of the other should be b1101001 (pin AD0 is logic
high).
6.3 I2C COMMUNICATIONS PROTOCOL
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is defined as a HIGH-to-LOW
transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until the master puts a STOP
condition (P) on the bus, which is defined as a LOW to HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
SDA
SCL
S
START condition STOP condition
P
Figure 9. START and STOP Conditions
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Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data transfer. Each byte
transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge signal is generated by the master,
while the receiver generates the actual acknowledge signal by pulling down SDA and holding it low during the HIGH portion of the
acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can hold SCL
LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave is ready, and releases the clock line
(refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
DATA OUTPUT BY
RECEIVER (SDA)
SCL FROM
MASTER
START
condition
clock pulse for
acknowledgement
acknowledge
not acknowledge
1 2 8 9
Figure 10. Acknowledge on the I2C Bus
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address followed by an 8th bit, the
read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the slave device. Then, the
master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device. Each byte transferred must be
followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of
the SCL line. Data transmission is always terminated by the master with a STOP condition (P), thus freeing the communications line.
However, the master can generate a repeated START condition (Sr), and address another slave without first generating a STOP
condition (P). A LOW to HIGH transition on the SDA line while SCL is HIGH defines the stop condition. All SDA changes should take
place when SCL is low, with the exception of start and stop conditions.
SDA
START
condition
SCL
ADDRESS R/W ACK DATA ACK DATA ACK STOP
condition
S P
1 7 8 9 1 7 8 9 1 7 8 9
Figure 11. Complete I2C Data Transfer
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To write the internal ICM-20608-G registers, the master transmits the start condition (S), followed by the I2C address and the write
bit (0). At the 9th clock cycle (when the clock is high), the ICM-20608-G acknowledges the transfer. Then the master puts the register
address (RA) on the bus. After the ICM-20608-G acknowledges the reception of the register address, the master puts the register
data onto the bus. This is followed by the ACK signal, and data transfer may be concluded by the stop condition (P). To write multiple
bytes after the last ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the ICM-
20608-G automatically increments the register address and loads the data to the appropriate register. The following figures show
single and two-byte write sequences.
Single-Byte Write Sequence
Burst Write Sequence
To read the internal ICM-20608-G registers, the master sends a start condition, followed by the I2C address and a write bit, and then
the register address that is going to be read. Upon receiving the ACK signal from the ICM-20608-G, the master transmits a start
signal followed by the slave address and read bit. As a result, the ICM-20608-G sends an ACK signal and the data. The
communication ends with a not acknowledge (NACK) signal and a stop bit from master. The NACK condition is defined such that the
SDA line remains high at the 9th clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Burst Read Sequence
6.4 I2C TERMS
SIGNAL
DESCRIPTION
S
Start Condition: SDA goes from high to low while SCL is high
AD
Slave I2C address
W
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: SDA line is low while the SCL line is high at the 9th clock
cycle
NACK
Not-Acknowledge: SDA line stays high at the 9th clock cycle
RA
ICM-20608-G internal register address
DATA
Transmit or received data
P
Stop condition: SDA going from low to high while SCL is high
Table 15. I2C Terms
Master
S
AD+W
RA
DATA
P
Slave
ACK
ACK
ACK
Master
S
AD+W
RA
DATA
DATA
P
Slave
ACK
ACK
ACK
ACK
Master
S
AD+W
RA
S
AD+R
NACK
P
Slave
ACK
ACK
ACK
DATA
Master
S
AD+W
RA
S
AD+R
ACK
NACK
P
Slave
ACK
ACK
ACK
DATA
DATA
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6.5 SPI INTERFACE
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The ICM-20608-G always operates as a
Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial Data Input (SDI) are shared
among the Slave devices. Each SPI slave device requires its own Chip Select (CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line is active at a time, ensuring
that only one slave is selected at any given time. The CS lines of the non-selected slave devices are held high, causing their SDO lines
to remain in a high-impedance (high-z) state so that they do not interfere with any active devices.
SPI Operational Features
1. Data is delivered MSB first and LSB last
2. Data is latched on the rising edge of SCLK
3. Data should be transitioned on the falling edge of SCLK
4. The maximum frequency of SCLK is 8MHz
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The first byte contains the
SPI Address, and the following byte(s) contain(s) the SPI data. The first bit of the first byte contains the Read/Write bit
and indicates the Read (1) or Write (0) operation. The following 7 bits contain the Register Address. In cases of
multiple-byte Read/Writes, data is two or more bytes:
SPI Address format
MSB
LSB
R/W
A6
A5
A4
A3
A2
A1
A0
SPI Data format
MSB
LSB
D7
D6
D5
D4
D3
D2
D1
D0
6. Supports Single or Burst Read/Writes.
SPI Master SPI Slave 1
SPI Slave 2
CS1
CS2
SPC
SDI
SDO
CS
SPC
SDI
SDO
CS
Figure 12. Typical SPI Master/Slave Configuration
InvenSense
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7 ASSEMBLY
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros packaged in
LGA package.
ORIENTATION OF AXES
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1 identifier () in the
figure.
ICM-20608-G
+Z
+X
+Y
+Z
+Y
+X
Figure 13. Orientation of Axes of Sensitivity and Polarity of Rotation
InvenSense _ , - » A MN’ Lawn , , wnrx MA fl \A/z \< f="" »="" r="" *1="" km="" \="" \="" x="" \="">
ICM-20608-G
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Document Number: DS-000081
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PACKAGE DIMENSIONS
16 Lead LGA (3x3x0.75) mm NiAu pad finish
InvenSense
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Document Number: DS-000081
Revision: 1.0
DIMENSIONS IN MILLIMETERS
SYMBOLS
MIN
NOM
MAX
Total Thickness
A
0.7
0.75
0.8
Substrate Thickness
A1
0.105 REF
Mold Thickness
A2
0.63 REF
Body Size
D
2.9
3
3.1
E
2.9
3
3.1
Lead Width
W
0.2
0.25
0.3
Lead Length
L
0.3
0.35
0.4
Lead Pitch
e
0.5 BSC
Lead Count
n
16
Edge Ball Center to Center
D1
2 BSC
E1
1 BSC
Body Center to Contact Ball
SD
--- BSC
SE
--- BSC
Ball Width
b
---
---
---
Ball Diameter
---
Ball Opening
---
Ball Pitch
e1
---
Ball Count
n1
---
Pre-Solder
---
---
---
Package Edge Tolerance
aaa
0.1
Mold Flatness
bbb
0.2
Coplanarity
ddd
0.08
Ball Offset (Package)
eee
---
Ball Offset (Ball)
fff
---
Lead Edge to Package Edge
M
0.01
0.06
0.11
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Document Number: DS-000081
Revision: 1.0
8 PART NUMBER PACKAGE MARKING
The part number package marking for ICM-20608-G devices is summarized below:
PART NUMBER
PART NUMBER PACKAGE MARKING
ICM-20608-G
IC268G
InvenSense
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
9.REFERENCE
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:
Manufacturing Recommendations
o Assembly Guidelines and Recommendations
o PCB Design Guidelines and Recommendations
o MEMS Handling Instructions
o ESD Considerations
o Reflow Specification
o Storage Specifications
o Package Marking Specification
o Tape & Reel Specification
o Reel & Pizza Box Label
o Packaging
o Representative Shipping Carton Label
Compliance
o Environmental Compliance
o DRC Compliance
o Compliance Declaration Disclaimer
InvenSense H
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
REVISION HISTORY
REVISION
DATE
REVISION
NUMBER
DESCRIPTION
06/15/2015
1.0
Initial Release
InvenSense InvenSense
ICM-20608-G
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Document Number: DS-000081
Revision: 1.0
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2015 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2015 InvenSense, Inc. All rights reserved.

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