uClamp2501T Datasheet by Semtech Corporation

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a SEMTECH
PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - MicroClamp®®
®®
®
uClamp2501T
Low Voltage μClamp®®
®®
®
2.5V TVS Diode
Description Features
Dimensions Schematic & PIN Configuration
Revision 10/21/2009
Applications
Mechanical Characteristics
Cellular Handsets & Accessories
Portable Instrumentation
Keypads, Side Keys, LCD Displays
Notebooks & Desktop Computers
mp3 Players
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small package (1.0 x 0.6 x 0.4mm)
Low leakage current: <10nA typical (VR=2.5V)
Low Operating voltage: 2.5V
Low capacitance
Protects one data line
Solid-state silicon-avalanche technology
SLP1006P2T package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 1.0 x 0.6 x 0.4 mm
Lead Finish: NiPdAu
Molding compound flammability rating: UL 94V-0
Marking : Marking code, cathode band
Packaging : Tape and Reel
SLP1006P2T (Bottom View)
Nominal Dimensions (mm)
0.65
0.40
0.60
1.0
The μClamp® series of Transient Voltage Suppressors
(TVS) are designed to replace multilayer varistors
(MLVs) in portable applications such as cell phones,
notebook computers, and PDAs. They offer superior
electrical characteristics such as lower clamping
voltage and no device degradation when compared to
MLVs. They are designed to protect sensitive semicon-
ductor components from damage or upset due to
electrostatic discharge (ESD), lightning, electrical fast
transients (EFT), and cable discharge events (CDE).
The μClamp®2501T is constructed using Semtech’s
proprietary EPD TVS process technology. The EPD
process provides low operating voltages with significant
reductions in leakage currents and capacitance over
silicon-avalanche diode processes. They feature a true
sub 5 volt operating voltage for superior protection
when compared to traditional pn junction devices.
The μClamp2501T is in a 2-pin SLP1006P2T package.
It measures 1.0 x 0.6 x 0.4mm. The leads are spaced
at a pitch of 0.65mm and are finished with lead-free
NiPdAu. Each device will protect one line operating at
2.5 volts. It gives the designer the flexibility to protect
single lines in applications where arrays are not practi-
cal. They may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (±15kV air,
±8kV contact discharge). The combination of small
size and high ESD surge capability makes them ideal
for use in portable applications such as cellular
phones, digital cameras, and MP3 players.
1
2
r SEMTECH — — —
2© 2009 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp2501T
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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74 a SEMTECH 1 Reverse Vonage - v. (v) 15 2 ESD Clamping (Pin 2 to 1) (8kV Contact per IEC 61000-4—2) TekRun: 5.00551? SaTmDIe m ESD Clam (-8kV Contact TekRun: 5.00551? SaTmDIe m ping (Pin 1 to 2) per IEC 61000-4—2 W 1 W [I WWW—raw WWW Note: Data ‘5 taken wxm a 10x attenuator Note: Data ‘5 taken with a 10x attenuator © 2009 Semlech Carp. www
3
© 2009 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp2501T
Non-Repetitive Peak Pulse Power vs. Pulse Time Clamping Voltage vs. Peak Pulse Current
Normalized Junction Capacitance vs. Reverse Voltage Typical Insertion Loss (S21)
ESD Clamping (Pin 1 to 2)
(-8kV Contact per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
ESD Clamping (Pin 2 to 1)
(8kV Contact per IEC 61000-4-2)
Note: Data is taken with a 10x attenuator
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
00.511.522.53
Reverse Voltage - VR (V)
Cj(VR) / Cj(VR=0V)
f = 1 MHz
0
1
2
3
4
5
6
7
8
9
10
0123456
Peak Pulse Current - IPP (A)
Clamping Voltage - VC (V)
Waveform
Parameters:
tr = 8μs
td = 20μs
0.01
0.1
1
0.1 1 10 100 1000
Pulse Duration - tp (s)
Peak Pulse Power - PPP (kW)
1
2 3
4
START
. 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -9.2069 dB
900 MHz
2: -12.958 dB
1.8 GHz
3: -11.689 dB
2.5 GHz
4: -3.0358 dB
227MHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB 1
GHz
100
MHz 3
GHz
10
MHz
1
MHz
4© 2009 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp2501T
Applications Information
Device Connection Options
The μClamp2501T is designed to protect one data line
operating up to 2.5 volts. It will present a high
impedance to the protected line up to 2.5 volts. It will
“turn on” when the line voltage exceeds 2.7 volts. The
device is unidirectional and may be used on lines
where the signal polarity is above ground. These
devices are not recommended for use on DC power
supply lines due to their snap-back voltage
characteristic.
EPD TVS Characteristics
These devices are constructed using Semtech’s
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional ava-
lanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 2.5V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. The EPD mecha-
nism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will “punch-through” to a conduct-
ing state. This structure results in a device with supe-
rior DC electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
1
2
Device Schematic & Pin Configuration
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5
© 2009 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp2501T
Spice Model
Applications Information - Spice Model
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DIMENSI S INCHES MILLIMETERS MIN M MAX MIN NOM MAX . 15 . . 7 . , —T -j_ BO'I'I'OM VIEW 1777 + \ \ L77 + + e
6© 2009 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp2501T
Outline Drawing - SLP1006P2T
Land Pattern - SLP1006P2T
bxN
e
A1 .000 .001 .002 0.00 0.03 0.05
R
2x L
PIN 1 ID
R .002 .004 .006 0.05 0.10 0.15
A
INCHES
.026 BSC
aaa
N
E
L
e
.008
.020
DIM
A
MIN
.018
.015
0.30
0.70
0.20
0.50
.003
2
.010
.024
.012
.028
0.08
2
0.25
0.60
0.65 BSC
MILLIMETERS
MAX
0.55
0.43
DIMENSIONS
MIN
0.45
NOM
.016
.020
MAX
.022
.017
NOM
0.37
0.50
0.40
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
BOTTOM VIEW
TOP VIEW
AB
C
b
aaa C
SEATING
PLANE
bbb C A B
D.035 .039 .043 0.90 1.10
1.00
.004bbb 0.10
D
E
A1
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
Y
G
C
MILLIMETERSINCHES
(0.85)
.055
.012
.022
(.033)
1.40
0.55
0.30
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
Z
Y
(C) GZ
X .024 0.60
X
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
7
© 2009 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp2501T
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Marking Code Ordering Information
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Notes:
1) MicroClamp, uClamp and μClamp are marks of Semtech
Corporation
Tape and Reel Specification
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mm8 mm2.4
)561.(
mm1.0+5.1
mm0.0-
500.+95.0(
)000.-
mm4.0
52.0±
)130.(
01.±057.1
mm
)400.±960.
(
50.0±5.3
mm
)200.±831.(
01.0±0.4
mm
-00.±751.(
)4
1.0±0.4
mm
-00.±751.(
)4
50.0±0.2
mm
)200.±970.(
20.0±452.0
)610.(mm
mm0.8
mm3.0+
mm1.0-
)210.±213.(
0A0B0K
mm01.0-/+96.0mm01.0-/+91.1mm01.0-/+66.0
Device Orientation in Tape
Pin 1 Location
User Direction of feed
25
Notes:
1) Marking will also include line matrix date code

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