MM70-yyyB1 Spec Datasheet by JAE Electronics

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LEAD FREE CwflaurII1997U—flt’57 _| ODS-0847040360 1/5 JAPAN AVlATION ELECTRONICS IND., LTD. Connector Specification No. CONNECTOR DIVISION JACS-1D543-1 H$hfi§i¥l¥lfii§fi . Connector Series Name fl.5 :I $75$§€ll SPECIFICATION TABLE MM70- “B1 TYPE THIs SPECIFICATION TABLE CANNOT BE fig fl fifijfifi Applicable Drawing No. fit? A REPRODUCED WITHOUTWRI'I'I'EN 5.1109265 etc. CONSENT OF JAE. 1-K Zwfiflfifliltflxfigfi¥lfififi%fiw C itfiimtiullflWSEE§U§33 Rev. Date DCN No Drawn by checked by Approved by Elia fifi El E gt EM *3 1 9.Jul.2008 — M.K|MURA — Y.YAHIRO 2 23.Feb.2011 071669 H.Koizumi ‘7’" 7947 f ‘ flézzéé Standard data as V ' Rated current 0.5A per contact Eifi 0.5A/1 33%|fo Rated voltage 50V Dc Eli Operating temperature range EEFHEEIEQE 40°C to +85°C Recommended stn ge temperature range fifififififiifi E -20”C to +60°C Note Wi% -This specification covers the requirements for the connector mated with PCB moduletType A or B) which standardized by MXMSD. -Hold down and stopper have Tin plated parts. Although this plate might be tarnished depending on the temperature profile in soldering, the product performance satisfies this specification. ditifigli MXM3.0 l:;offfi$§lbéhf:—E91—Ibéfifi(TypeA 2i: B) tomcat:aascmarzouriaatc. A fik—ILFi'T/txhwt- ltfibcfi'flt’)?» §§E03E§#I:;atlt mamrevsaemfiw. flitafifi’elli Kflfiéfifl‘dfi. [tern Procedure afifiifi | Requirement fifi MECHANICAL ransom: Examination of product Meets requirements of product drawing. fififl'fifia‘t Ifiktfififiuzt Material & Finish Meets requirements of product drawing. metrical}: lilfietfiflmct Insertion lorce Measure force necessary to insert PCB module. 55 N (Max) A (See Fig.1) HA7] ffil~lb§fi0fil§fi5u (Fig.1 #lfi) Extraction force Measure force necessary to extract PCB module. 50 N (Max) (See Fig.1) lift i91~llx§l§0>¥§£§fiio (Fig.1 3%) Vibration EIA—364-28 Test condition Vli condition D No electrical discontinuity more than 111 s. No damage as mechanical deficiency, m'fifi Frequency range : 20 to 500 Hz (Applying an appropriate holder is allowed in Full duration : 15 minutes each of 3 axis Vibration test.) With a 40X4Dmm block of 1009mms fastened and centered at the GPU center of a MXM Type B PCB 111$ mingiflflfllflififihz kn module. (See Fig.4) maueflaenamanxmtem L\:.!:a fiififil : 20~500 Hz (fiEIJTEQEfiIItSL‘TlaL Hfilflziflfiffikll’ Zlflfififlfi = all! fi 15min fi-Etfiflfiifl iififilis MXM Type B igl’)b§fizfififao ’6 =2; warm. GPU retreat 40x40mm 7 A El w 7 (1009) El! "J filiTfllflfi‘EfifiE—fii. (Fig.4 3%) ‘ DCF—C—EZBG—Z‘XOSDD JAE Connector Div. Proprietary. Copyright: @2008, Japan Aviation Electronics Industry, Ltd.
JACS-1 0543-1 2/5 Item Procedure WEE Requirement $3 Shock ElA—364-27 Test condition A No electrical discontinuity more than 1 u s. No damage as mechanical deficiency. iiiilfig'li Shock acceleration : 490 mls2 (Applying an appropriate holder is allowed in Duration of impact : 11ms Shock test.) Three shocks in three axes. With a 40X40mm block of 1009mm fastened and 1115 miceaaqmrttcuu. centered at the GPU center of a MXM Type B PCB fiafil:%§é&li?$5tfififi99flliféfliufi module. (See Fig.4) Ditto (flifififlfilflsmtlx Eltfitflzfigtfiklb ”DEE = 490 ml sic fifififlfi : 11ms i—Z—fifi?6) macaw = 3 ill! § 3 iii A amen. MXM Type a a91—JLfitfi2fififi5. i91~1b§ifilt. GF'U Eitti‘rEl: 40x40mm 7 i: w’] (1009) Eli! U filflfllflfi'flifitsfiE—fifio (Fig.4 fit?!) Durability ElA-364-9 Contact resistance: 80 in!) (Max.) fifififi? 30 cycles (See Fig.3) Efltfitfiflo m9 HT ELECTRICAL ifiifiiifle Contact resistance Measure the contact resistance with Voltage drop 55 m0 (Max.) (Low level) method. (See Fig.2) Open voltage: 20mV. Emaifi new») Circuit current: 1mA A EEKTfial‘rifiuET6. (Fig.2 an) fifiiiStE Eiiafififi: 1mA Insulation resistance ElA—364-21 250 M9 (Min.) imitfifi Apply 500V DC between adjacent contacts and measure its Insulation resistance within one minute. fig: >97 I-l‘a‘ll: DCSOUV EEWJDL, 1fiiéll7‘il: iR'lETéc Vlfithstanding voltage WEE: ElA—364-20 Apply the specified voltage between adjacent contacts. SEE: >5! 7 FraEJIZEEEEEEME'é‘fie 0.25kV AC r.m.s. (SDHZ) No breakdown occurred for 1 (Current leakage 0.5mA Max.) minute. Aco.25kv r.m.s. (son) 1 fiffigfiwlkt‘: & ('J —0 fifiifi : 0.5mA lal'F) ENVIRONMENTAL filfifififié Temperature life Subject specimens to temperature life at 85% tor 96 hours. (See Fig.2) Contact resistance: 80 m9 (Max.) iliiiia’lfi Mifififlo in Q ET A E‘s): 85°00§flfit§t2 $7 '3 ’c‘ 96 fifilifli‘d‘én (Fig.2 3%) Rapid change of Subject specimens to 5 cycles between -55“c and Contact resistance: an m 9 (Max.) temperature +85%: for 30 minutes each. (See Fig.2) Insulation resistance: 50 M9 (Min.) Voltage proof: 0.25kV AC r.m.s. , 1 min mfi§ 65%(30 5)) ~25“c(5 fian—wss‘crso 51‘) » 25°G(5 QH‘F) i— 5 *Hflrfiie fiflifitfiflo mi! DJ'F (Fig.2 $Efi) flfifififio ME) DJ: WEE:ACO.25kV r.m.s. 1 ”Egfifil“ C k Damp heat, Subject specimens to 90% to 95%RH at 40°C for 96 Contact resistance: 80 mfl (Max.) steady state iiiifiltt hours. (See Fig.2) EEK 4012‘ SEE 90~95%RH 03$}!l::l $7 5 {r 96 fififl’flfi‘fée (Fig.2 $Rfi) Insulation resistance: 50 M9 (Min) Voltage proof: 0.25kV AC r.m.s. , 1 min Wififizao m 52 EFF fifiifimfio ME! leiJ: MEEACQEKV r.m.s. 1 fififififib‘: & DcFrcrEzosrzcmm) JAE Connector Div. Proprietary. Copyright @2008, Japan Aviation Electronics Industry, Ltd.
JACS‘10543-1 3/5 Item Procedure ante Requirement mi Corrosion. salt mist Subject specimens to 5% salt concentration at 35°C Contact resistance: 80 m9 (Max) for 48 hours. (See Fig.2) Wilfifi‘lfli A fiflifififlm leal'F fifidfigfifi I Emifig 5%, 35‘0. 48h (Fig.2 $P§> Resistance to soldering Reflow soldering method: At heat~resistant No damage. heat temperature profile. Soldering iron method: Soldering iron temperature flifilziifiwfiLEk arm-ram 35015°c for 320.53 : marmwvkuue. mhflrrfigamisbgiox Soldemhility After dipping in the flux for 5 to 10 seconds. immerse Wet Solder Coverage: 90%(Min.) connector specimens to a solder oi Sn-Ag-Cu . HiBJFl‘l‘l'fi (Sn96_5%) mated at 240:3 “c tor 5i0.5 seconds. 5% Ltflfiw 90%!21ib‘5léfi‘fiibh'c L‘ 5 C e @875 “y 7 XI: 5~1Us 55% L Sn~Ag-Cu 45E (Sn96.5%) 2401 Tel: 510.55 rare-r 3.: Insert Extraction (PCB module) (PCB module) I I PCB \ Test holder PCB Module flfiififi (TYPE A) Connector Fig.1 Measurement method of Insertion and extraction torce fifihifiiifiifi DCFVCVEZOSVZC(03.D1) JAE Connemr Div. Proprietary. Copyright @2003, Japan Aviation Electronics Industry, Ltd.
JACS»10543—1 4/5 7 O Connector 6 6 ‘ Screw (x2) PCB Module (Tvoe A) ‘ l g/ m C. _ l l l A l l 111‘ PCB / Support parts ‘ \ Nu! (x2) ( X 2) Fig.2 Test sample condition fififi'yjll’wfifi 1 cycle (128 Min.) = (D—>®—>®—>@"' @ PCB Module (Type A) Connector 4* 3 If, .. . ,, 7.7... PCB Fig.3 Durability method fimfififiifi Block (40X40mm, 1009mms) PCB Module (Tvoe B) l D S » 5 r5 . Comedy ‘ Screw (x2) m / m i_‘,, . V , 9| 3 . i, ,, , .4. '\ pCB Suppon parts (x2) Nul (x2) Fig.4 Tesi sample condilion for \fibration and Shock lesl) fimflufi§flfifi>7lbwfifl§ ocecezoezcwam) JAE Connector Div, Proprietary. Capyn'ght @2008, Japan Aviation Elemonics Industry, Ltd.
JACSv1 054$1 5/5 [Heat-resistant and Recommended temperature profile of reflow soldering] (U 7 n—mfififij’n774lb/lfifi U 7n—zae7’n 774M Prehealing temperature 150 to 180% 90i305 Main healing temperature 220°C or more 60s Max. Peak temperature Heat resistance 260°C Max 105 Max. Recommendation 240: 5"(: 105 Max. Number of renews 2 cycles or less *fimfi 150~180°C 90:305 mm 220°clau: 603 HT H_7 35,: were 260°cu1= 10s BA‘F fig 240: 5°C 1 OS FAT ”71:! - IE3} 2 [El EFF Heat resistanoe(surlace of a resin body): 260°C Max. 250 iiifil‘li $15 1' —§fi 'ZSOCEA‘F 200 Temperature (°C) Recommendation(soldered part): 240 : 5°C #gaearearm - 24o+5°c 100 IR reflaw. IR & Hot air reflow IR, |R+§d§lfifii Heating time > Note: As this refluw conditions varies in Ihe rellow facimy and PCB, please mnductthe evaluation of your rellow mnditions before manufacluring. Z-E : 7i: U 7 EI—filIHIBE L‘Eli. '17 D—Efifilfifiifi§l:éz U fit‘fit: U iiwrh EfiIZWEfiifiL‘fi L§‘§‘c DCF£~E206~2C(03.01) JAE Connector Div. Proprietary, Copyright @2005, Japan Aviation Electmniw Industry, Ltd.

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