BAS386 Datasheet by Vishay General Semiconductor - Diodes Division

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BAS386
www.vishay.com Vishay Semiconductors
Rev. 2.1, 02-Jun-17 1Document Number: 85505
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Small Signal Schottky Diode
DESIGN SUPPORT TOOLS click logo to get started
MECHANICAL DATA
Case: MicroMELF
Weight: approx. 12 mg
Cathode band color: black
Packaging codes/options:
TR3/10K per 13" reel (8 mm tape), 10K/box
TR/2.5K per 7" reel (8 mm tape), 12.5K/box
FEATURES
Integrated protection ring against static
discharge
Very low forward voltage
AEC-Q101 qualified
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Applications where a very low forward voltage is required
Available
Models
PARTS TABLE
PART TYPE DIFFERENTIATION ORDERING CODE CIRCUIT CONFIGURATION REMARKS
BAS386 VR = 50 V BAS386-TR3 or BAS386-TR Single Tape and reel
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Reverse voltage VR50 V
Peak forward surge current tp = 10 ms IFSM 5A
Repetitive peak forward current tp 1 s IFRM 500 mA
Forward continuous current IF200 mA
Average forward current IFAV 200 mA
THERMAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT
Junction to ambient air On PC board
50 mm x 50 mm x 1.6 mm RthJA 320 K/W
Junction temperature Tj125 °C
Storage temperature range Tstg -65 to +150 °C
ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT
Forward voltage
IF = 0.1mA VF300 mV
IF = 1 mA VF380 mV
IF = 10 mA VF450 mV
IF = 30 mA VF600 mV
IF = 100 mA VF900 mV
Reserve current VR = 40 V IRA
Diode capacitance VR = 1 V, f = 1 MHz CD8pF
VISHAY. 52 I 55 DwodesAmencas@\/wshay.com DwodesAswa@wshay.com DwodesEuvogemushauom www.v\shay.com/doc?91000
BAS386
www.vishay.com Vishay Semiconductors
Rev. 2.1, 02-Jun-17 2Document Number: 85505
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Fig. 1 - Max. Reverse Power Dissipation vs.
Junction Temperature
Fig. 2 - Reverse Current vs. Junction Temperature
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 4 - Diode Capacitance vs. Reverse Voltage
Fig. 5 - Board for RthJA Definition (in mm)
15827
0
50
100
150
200
250
300
350
400
450
500
25 50 75 100 125 150
Tj- Junction Temperature (°C)
P - Reverse Power Dissipation (mW)
R
- Limit
at 100 % V
PR
R
- Limit
at 80 % V
PR
R
RthJA = 540 K/W
VR= 50 V
1
10
100
1000
10000
25 50 75 100 125 150
15828
I - Reverse Current (µA)
R
T
j
- Junction Temperature (°C)
V
R
=V
RRM
15829
0 0.5 1.0 1.5
0.1
1
10
100
1000
I - Forward Current (A)
F
V
F
- Forward Voltage (V)
T
j
= 25 °C
T
j
= 125 °C
15830
0
1
2
3
4
5
6
7
8
9
10
0.1 1 10 100
f = 1 MHz
V
R
- Reverse Voltage (V)
C - Diode Capacitance (pF)
D
25
2.5
10
0.71 1.3 1.27
9.9
24
0.152
0.355
95 10329
VISHAY. ] x \ \ J J r fl 1 F; 1 t \ DwodesAmencas@\/wshay.com DwodesAswa@\/wshay.com DwodesEuvogemusnauom www.v\shay.com/doc?91000
BAS386
www.vishay.com Vishay Semiconductors
Rev. 2.1, 02-Jun-17 3Document Number: 85505
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PACKAGE DIMENSIONS in millimeters (inches): MicroMELF
Cathode indification
surface plan1 (0.039)
glass
glass
surface plan
2 (0.079)
1.8 (0.071)
0.25 (0.010)
0.15 (0.006)
1.2 (0.047)
1.1 (0.043)
> R2.5 (0.098)
< 1.35 (0.053)
0.6 (0.024)
Foot print recommendation:
Reflow soldering Wave soldering
2.4 (0.094) 2.8 (0.110)
0.8 (0.031)0.8 (0.031) 0.9 (0.035) 0.9 (0.035)
1.2 (0.047)
0.8 (0.031)
1.4 (0.055)
1 (0.039)
Document no.:6.560-5007.01-4
Rev. 13 - Date: 07.June.2006
96 12072
Created - Date: 26.July.1996
*
* The gap between plug and glass can
be either on cathode or anode side
— VISHAY. V
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Revision: 01-Jan-2021 1Document Number: 91000
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