BDN Series, Peel-Stick Heat Dissipators Datasheet by CTS Thermal Management Products

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With pre-applied adhesive, just peel
off the release liner and press onto the
component
Reduces assembly costs; no more
messy adhesives or greases required
Excellent mechanical bond
Thermally optimized pin fin
Omnidirectional
Adhesive shear strength at 100°C is
36psi (a one inch square heat sink would
require a 36lb. force to remove heat sink)
Applicable for BGA, PGA, PLCC,
and QFP packages
NOTES:
*Thermal resistance
of adhesive tape is
included.
**Thermal resistance
values based on
power density of
3 watts/in2
***Part numbers
listed for standard
black anodized
heat sinks with
CTS adhesive
tapes.
All dimensions are in inches.
PART NUMBER***
SIZE PIN FIN CONFIGURATION THERMAL RESISTANCE CASE
TO AMBIENT* °C/WATTS
(W)
(L)
(H)
T
P
G
FIN
MATRIX
NATURAL
CONVECTION**
FORCED
CONVECTION
@ 400 LFPM
BDN09-3CB/A01 0.91 0.91 .355
.09
.069
.072
7x7
26.9
9.6
BDN09-6CB/A01 .605
.10
.132
.128
4x4
24.5
7.7
BDN10-3CB/A01
1.01
1.01
.355
.09
.083
.072
7x7
26.4
8.0
BDN10-5CB/A01 .555
.10
.111
.114
5x5
20.8
6.3
BDN11-3CB/A01
1.11
1.11
.355
.09
.076
.072
8x8
20.9
7.2
BDN11-6CB/A01 .605
.10
.119
.128
5x5
18.5
5.7
BDN12-3CB/A01
1.21
1.21
.355
.09
.060
.081
9x9
19.6
6.8
BDN12-5CB/A01 .555
.10
.105
.114
6x6
16.5
5.2
BDN13-3CB/A01
1.31
1.31
.355
.09
.074
.081
9x9
16.1
6.0
BDN13-5CB/A01 .555
.10
.125
.114
6x6
14.9
4.7
BDN14-3CB/A01
1.41
1.41
.355
.09
.067
.081
10x10
16.2
5.6
BDN14-6CB/A01 .605
.10
.128
.128
6x6
13.1
4.2
BDN15-3CB/A01
1.51
1.51
.355
.09
.062
.081
11x11
15.1
4.5
BDN15-5CB/A01 .555
.10
.118
.114
7x7
11.9
3.8
BDN16-3CB/A01
1.61
1.61
.355
.09
.072
.081
11x11
13.5
4.5
BDN16-6CB/A01 .605
.10
.119
.128
7x7
10.6
3.5
BDN17-3CB/A01 1.71
1.71
.355
.09
.065
.072
13x13
11.5
3.8
BDN18-3CB/A01
1.81
1.81
.355
.09
.072
.072
13x13
10.8
3.5
BDN18-6CB/A01 .605
.10
.128
.114
8x8
8.1
2.8
BDN19-3CB/A01 1.91
1.91
.355
.09
.069
.072
14x14
9.9
2.9
BDN21-3CB/A01 2.11
2.11
.355
.09
.064
.072
16x16
8.5
2.6

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