LTW-2R3D7 Datasheet by Lite-On Inc.

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LITEIO] l I” D oProELEcTHoNIcs
LITE-ON DCC
RELEASE
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
Through Hole Lamp
Product Data Sheet
LTW-2R3D7
Spec No.: DS20-2005-253
Effective Date: 12/24/2016
Revision: C
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
l3 lJTEilll‘ DatazSheei @m LTW-2R3D7 Descrigtion
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Through Hole Lamp
LTW-2R3D7
Through Hole Lamp
LTW-2R3D7
Rev
Description
By
Date
P001
Preliminary SPEC (RDR-20050399)
Lewis
09/08/2005
Above data for PD and Customer tracking only
-
NPPR Received and Upload on OPNC
Javy
05/26/2006
A
Update DS
Leo
09/20/2012
B
Change Vf spec
Leo
09/12/2013
C
Update packing spec
Sasipan
11/21/2016
mm” Data Sheet nmELEcTRcNIcS m (.34) SEE rm: x ( EssjmlN, _ u , a _ m “P. Fur DEMNES CATHuDE ( 32‘, mp“) MIN. A .
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Through Hole Lamp
LTW-2R3D7
1. Description
Through hole white LEDs are offered in a variety of packages such as 3mm, 4mm, 5mm, rectangular and cylinder which are
suitable for all applications requiring status indication. Several intensity and viewing angle choices are available in each
package for design flexibility.
1. 1. Features
Lead (Pb) free product - RoHS compliant
Low power consumption & High efficiency.
Versatile mounting on p.c. board or panel.
I.C. compatible/low current requirement.
Popular T-1 diameter InGaN White & Water Clear lens
1.2. Applications
Computer
Communication
Consumer
Home appliance
Industrial
2. Outline Dimensions
Notes :
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm (.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.
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3. Absolute Maximum Ratings at TA=25
Parameter
Maximum Rating
Unit
Power Dissipation
76
mW
Peak Forward Current
(Duty Cycle1/10, Pulse Width10ms)
60
mA
DC Forward Current
20
mA
Derating Linear From 30
0.3
mA/
Operating Temperature Range
-40°C to + 105°C
Storage Temperature Range
-40°C to + 105°C
Lead Soldering Temperature
[2.0mm (.079") From Body]
260°C for 5 Seconds Max.
4. Electrical / Optical Characteristics at TA=25
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
Luminous Intensity
IV
2500
4200
7200
mcd
IF = 20mA
Note 1,3,4
Viewing Angle
2θ1/2
-
35
-
deg
Note 2 (Fig.6)
Chromaticity Coordinates
x
-
0.27
-
nm
IF = 20mA, Note 5
Hue Spec. Table &
Chromaticity Diagram
y
-
0.27
-
nm
Forward Voltage
VF
2.8
3.2
3.8
V
IF = 20mA
Reverse Current
IR
-
-
50
μA
VR = 5V
NOTE:
1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE eye-response curve.
2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
3. Iv classification code is marked on each packing bag.
4. The Iv guarantee must be included with ±15% testing tolerance.
5. The chromaticity coordinates (x, y) is derived from the 1931 CIE chromaticity diagram..
6. Reverse voltage (VR) condition is applied for IR test only. The device is not designed for reverse operation.
Relaiive Luminous inlensily Relaiive Iniensiiy Forward Curreni ir(mA) Normaiized of ZOmA LITE!) 1|“ umELEcmcmcs Data Sheet 0.5 0 400 A50 500 550 600 650 700 Wavelengih A (nm) Fig.‘ Rclciiivc inicnsiiy VS. Woveiergih 50 A0 50 20 i0 2A 2.5 5.2 3.6 4.0 4.4 Forward Voiiagc vF(v) Fig.3 Forward CJI’FEHi vs. Forward Voliqge 2.0 LB LE LA i.2 LC 0.5 0.5 0.4 0.2 940 -20 0 20 40 60 80 ‘00 120 Ambicni Tcmpcruiurc M's) Fig.5 Reiuiive quirous Iniensiiy VS. Ambieni Temperature Relaiive Luminous inlensily Forward Curran? ir(rriA) ed a! ZOmA Norr’i 0 20 40 60 80 100 ill) Ambient Temperature TA('C Fig.2 Forward Curran! Dcroiing Curve 0 ‘0 20 30 40 50 Forward Currem (mA) Fig.4 Reiuiive Luminous iniensiiy vs. Forward CJrreni 0' i0‘ 20' 30‘ Fig.6 Spaiiol Disiribuiiorr 40' 50' 60' 70' 80' 90'
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5. Typical Electrical / Optical Characteristics Curves
(25 Ambient Temperature Unless Otherwise Noted)
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LTW-2R3D7
6. Packing Spec.
500, 200 or 100 pcs per packing bag
10 packing bags per inner carton
Total 5,000 pcs per inner carton
8 Inner cartons per outer carton
Total 40,000 pcs per outer carton
In every shipping lot, only the last pack will be non-full packing
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7. Bin Table Specification
Luminous Intensity Iv (mcd) IF@20mA
Bin Code
Min.
Max.
T
2500
3200
U
3200
4200
V
4200
5500
W
5500
7200
Note: Tolerance of each bin limit is ±15%
Forward Voltage VF (V) IF@20mA
Bin Code
Min.
Max.
2E
2.80
3.00
3E
3.00
3.20
4E
3.20
3.40
5E
3.40
3.60
6E
3.60
3.80
Note: Forward Voltage Measurement allowance is ±0.1V
Hue Ranks
Chromaticity Coordinates, CC(x, y), IF@20mA
60
x
0.306
0.306
0.285
0.285
y
0.369
0.269
0.244
0.344
70
x
0.285
0.285
0.250
0.250
y
0.344
0.244
0.200
0.300
80
x
0.250
0.250
0.210
0.210
y
0.300
0.200
0.150
0.250
Note: Color Coordinates Measurement allowance is ±0.01
Data Sheet LEE.) i I' D . 0.30 (V) 0.25 0.20 0.15 0.10 0.30 0.20 0.35 0.25 0.15 (X)
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C.I.E. 1931 Chromaticity Diagram
L3 55mm Data Sheet
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LTW-2R3D7
8. CAUTIONS
8.1. Application
This LED lamp is good for application of indoor and outdoor sign, also ordinary electronic equipment.
8.2. Storage
The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity. It is recommended that
LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is
recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen
ambient.
8.3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
8.4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the
lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly
on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
8.5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the
solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high
temperature.
Recommended soldering conditions:
Soldering iron
Wave soldering
Temperature
Soldering time
Position
350°C Max.
3 seconds Max.
(one time only)
No closer than 2mm
from the base of the epoxy bulb
Pre-heat
Pre-heat time
Solder wave
Soldering time
Dipping Position
100°C Max.
60 seconds Max.
260°C Max.
5 seconds Max.
No lower than 2mm from the
base of the epoxy bulb
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic
failure of the LED. IR reflow is not suitable process for through hole type LED lamp product.
8.6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an
application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as
shown in Circuit A below.
Circuit model (A) Circuit model (B)
LED
LED
(A) Recommended circuit
(B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs.
[3 ”13'1" Data Sheet @ 0mm
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8.7. ESD (Electrostatic Discharge)
Static Electricity or power surge will damage the LED.
Suggestions to prevent ESD damage:
Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
All devices, equipment, and machinery must be properly grounded
Work tables, storage racks, etc. should be properly grounded
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs plastic
lens as a result of friction between LEDs during storage and handing
Suggested checking list:
Training and Certification
8.7.1.1. Everyone working in a static-safe area is ESD-certified?
8.7.1.2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
8.7.2.1. Static-safe workstation or work-areas have ESD signs?
8.7.2.2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
8.7.2.3. All ionizer activated, positioned towards the units?
8.7.2.4. Each work surface mats grounding is good?
Personnel Grounding
8.7.3.1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes
with conductive flooring?
8.7.3.1. If conductive footwear used, conductive flooring also present where operator stand or walk?
8.7.3.2. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
8.7.3.3. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DLs?
8.7.3.4. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
8.7.4.1. Every ESDS items identified by EIA-471 labels on item or packaging?
8.7.4.2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe workstation?
8.7.4.3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
8.7.4.4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
8.7.5.1. Audit result reported to entity ESD control coordinator?
8.7.5.2. Corrective action from previous audits completed?
8.7.5.3. Are audit records complete and on file?
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9. Reliability Test
Classification
Test Item
Test Condition
Sample Size
Reference Standard
Endurance
Test
Operation Life
Ta = Under Room Temperature
IF = Per Data Sheet Maximum Rating
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1026 (1995)
MIL-STD-883G:1005 (2006)
High Temperature
High Humidity
storage (THB)
Ta = 60°C
RH = 90%
Test Time= 240hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-202G:103B (2002)
JEITA ED-4701:100 103 (2001)
High Temperature
Storage
Ta= 105 ± 5°C
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1031 (1995)
MIL-STD-883G:1008 (2006)
JEITA ED-4701:200 201 (2001)
Low Temperature
Storage
Ta= -55 ± 5°C
Test Time= 1000hrs
22 PCS
(CL=90%;
LTPD=10%)
JEITA ED-4701:200 202 (2001)
Environmental
Test
Temperature
Cycling
100°C 25°C -40°C 25°C
30mins 5mins 30mins 5mins
Test time: 30 Cycles
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1051 (1995)
MIL-STD-883G:1010 (2006)
JEITA ED-4701:100 105 (2001)
JESD22-A104C (2005)
Thermal
Shock
100 ± 5°C -30°C ± 5°C
15mins 15mins
Test time: 30 Cycles
22 PCS
(CL=90%;
LTPD=10%)
MIL-STD-750D:1056 (1995)
MIL-STD-883G:1011 (2006)
MIL-STD-202G:107G (2002)
JESD22-A106B (2004)
Solder
Resistance
T.sol = 260 ± 5°C
Dwell Time= 11 seconds
3mm from the base of the epoxy bulb
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:2031(1995)
JEITA ED-4701: 300 302 (2001)
Solderability
T. sol = 245 ± 5°C
Dwell Time= 5 ± 0.5 seconds
(Lead Free Solder, Coverage 95% of
the dipped surface)
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-750D:2026 (1995)
MIL-STD-883G:2003 (2006)
MIL-STD-202G:208H (2002)
IPC/EIA J-STD-002 (2004)
Soldering Iron
T. sol = 350 ± 5°C
Dwell Time= 3.5 ± 0.5 seconds
11 PCS
(CL=90%;
LTPD=18.9%)
MIL-STD-202G:208H (2002)
JEITA ED-4701:300 302 (2001)
10. Others
White LED is materialized by combining blue LED and phosphors. Color of White LED is changed a little by an operating current.
The appearance and specifications of the product may be modified for improvement, without prior notice.

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