NFA21SLyyyyNA4yy Spec Datasheet by Murata Electronics

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$990 No JENF243D 0040 01 NF 21 SL 207 1A NFA21SL287V1A45L NFA21SL287V1A45E NFA21SL287V1A45L E NFA21SL3|7V1A45L NFA21SL3|7V1A45E NFA21SL3|7V1A45L E NFA21SL337V1A45L NFA21SL337V1A45E NFA21SL337V1A45L E mm. 20 min 20
Spec. No. JENF243D-0004Q-01 P 1/10
MURATA MFG.CO., LTD.
Reference Only
Chip EMIFIL LC Combined Array Type
NFA21SL□□□□1A4□□ Reference Specification
1. Scope
This reference specification applies to Chip EMIFIL LC Combined Array Type NFA21S Series.
2. Part Numbering
NF A 21 SL 207 X 1A 4 8 L
Product ID Structure Dimension Features Cut-off Frequency Characteristics Rated Voltage Electrode Dimension Packaging Code
(L×W) (T) (L : Taping / B : Bulk)
3. Rating 106dB
227dB
Customer
Part Number
MURATA
Part Number
Cut-off
Frequen
cy
[MHz]
Insertion Loss (I.L.)(dB min.) Insulation
Resistance
[MΩ min.]
Rated
Voltage
[V(DC)]
Rated
Current
[mA(DC)]
Withstanding
Voltage
[V(DC)]
50
MHz
80
MHz
200
MHz
300
MHz
500
MHz
800
MHz
1000
MHz
NFA21SL506X1A48L 50 1 30 20 1000 10 20 30
NFA21SL506X1A48B
NFA21SL806X1A48L 80 2 - - 25 - 25 1000 10 20 30
NFA21SL806X1A48B
NFA21SL207X1A45L
200
2- 13 25 25 1000 10 100 30
NFA21SL207X1A45B
NFA21SL207X1A48L
NFA21SL207X1A48B
NFA21SL307X1A45L
300 -
27 20 25 1000 10 100 30
NFA21SL307X1A45B
NFA21SL307X1A48L
NFA21SL307X1A48B
<Capacitance> NFA21SL506X1A4□□:80pF (typ.) <Inductance> NFA21SL506X1A4□□:140nH(typ.)
NFA21SL806X1A4□□75pF (typ.) NFA21SL806X1A4□□79 nH (typ.)
NFA21SL207X1A4□□42pF (typ.) NFA21SL207X1A4□□29 nH (typ.)
NFA21SL307X1A4□□22pF (typ.) NFA21SL307X1A4□□29 nH (typ.)
Customer
Part Number
MURATA
Part Number
Cut-off
Frequency
[MHz]
Insertion Loss (I.L.)(dB ) Insulation
Resistance
[MΩ min.]
Rated
Voltage
[V(DC)]
Rated
Current
[mA(DC)]
Withstanding
Voltage
[V(DC)]
280
MHz
310
MHz
330
MHz
800
MHz
900
MHz
NFA21SL287V1A45L
280 6
max. - - 25
min.
25
min. 1000 10 100 30
NFA21SL287V1A45B
NFA21SL287V1A48L
NFA21SL287V1A48B
NFA21SL317V1A45L
310 -
6
max. - 20
min.
20
min. 1000 10 100 30
NFA21SL317V1A45B
NFA21SL317V1A48L
NFA21SL317V1A48B
NFA21SL337V1A45L
330 - -
6
max.
15
min.
15
min. 1000 10 100 30
NFA21SL337V1A45B
NFA21SL337V1A48L 20
min.
20
min.
NFA21SL337V1A48B
<Capacitance> NFA21SL287V1A4□□ : 15pF (typ.) <Inductance> NFA21SL□□□V1A48 : 47nH (typ.)
NFA21SL317V1A4□□ : 8pF (typ.) NFA21SL□□□V1A45 : 37nH (typ.)
NFA21SL337V1A4□□ : 4pF (typ.)
Operating Temperature: -55°C to +125°C (Includes self-heating.)
Storage Temperature: -55°C to +125°C
4. Standard Testing Condition
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. / 15 °C to 35 °C Temperature: 20 °C ± 2 °C
Humidity: Ordinary Humidity / 25 %(RH) to 85 %(RH) Humidity: 60 %(RH) to 70 %(RH)
Atmospheric pressure: 86 kPa to 106 kPa
SQec No, JENF243D700040701 WW 9 H \Q m ) CD MAL
Spec. No. JENF243D-0004Q-01 P 2/10
MURATA MFG.CO., LTD.
Reference Only
5. Style and Dimensions
T(mm)
NFA21SL□□□□1A45 0.5 ±0.1
NFA21SL□□□□1A48 0.85±0.1
Equivalent Circuits Unit Mass(Typical value)
NFA21SL□□□□1A45□:0.007g
NFA21SL□□□□1A48□:0.012g
Insertion Loss Characteristics: 50ΩSystem (Typ.)
2.0±0.1
GND
0.2±0.15
1.25±0.1
GND
0.2±0.15
0.25±0.1
0.5±0.05
0.15 min.
③④
⑦⑧
③④⑤⑥:
IN
OUT
⑦⑧⑨⑩:
OUT
IN
Electrode
(in mm)
Polarity
Marking
Bottom View
Top View
0.25±0.1
T
GND GND
⑨⑩
NFA21SL□□□X1A48
0
10
20
30
40
50
60
10 100 1000 10000
Frequency(MHz)
Insertion Loss (dB)
NFA21SL806X1A48
NFA21SL207X1A48
NFA21SL307X1A48
NFA21SL□□□V1A48
0
10
20
30
40
50
60
10 100 1000 10000
Frequency(MHz)
Insertion Loss (dB)
NFA21SL287V1A48
NFA21SL317V1A48
NFA21SL337V1A48
NFA21SL□□□X1A45
0
10
20
30
40
50
60
10 100 1000 10000
Frequency(MHz)
Insertion Loss (dB)
NFA21SL207X1A45
NFA21SL307X1A45
NFA21SL□□□V1A45
0
10
20
30
40
50
60
10 100 1000 10000
Frequency(MHz)
Insertion Loss (dB)
NFA21SL287V1A45
NFA21SL317V1A45
NFA21SL337V1A45
Reference Onl SQec No, JENF243D700040701 (fl) Tab‘e 1
Spec. No. JENF243D-0004Q-01 P 3/10
MURATA MFG.CO., LTD.
Reference Only
6. Marking
Polarity Marking on capacitor side
7. Electrical Performance
No. Item Specification Test Method
7.1 Insertion Loss
(I.L.)
Meet item 3.
Insertion Loss = 20 log (E
0
/ E
1
)
E
0
: Level without FILTER (short)
E
1
: Level with FILTER
7.2
Insulation
Resistance(I.R.)
· Voltage : Rated Voltage
· Time : 1 minutes
7.3 Withstanding
Voltage
Products shall not be damaged. · Test Voltage : 30V(DC)
· Time : 1 to 5 s
· Charge Current : 50 mA max.
8. Mechanical Performance
No. Item Specification Test Method
8.1 Appearance and
Dimensions
Meet item 5. Visual Inspection and measured with Micrometer
caliper and Microscope.
8.2 Solderability Electrodes shall be at least 90%
covered with new solder coating.
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150°C, 60 s
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 245 ± 3°C
· Immersion Time : 3±1 s
· Immersion and emersion rates : 25mm / s
8.3 Resistance to
soldering heat
Meet Table 1.
Table 1
· Flux : Ethanol solution of rosin, 25(wt)%
· Pre-heat : 150°C, 60 s
· Solder : Sn-3.0Ag-0.5Cu
· Solder Temperature : 270 ± 5°C
· Immersion Time : 10 ± 1 s
· Immersion and emersion rates : 25mm / s
8.4 Resistance to
soldering heat
(Reflow)
Meet Table 1.
· Pre-heat : 150~180°C, 90±30 s
· Heating : 230 °C min., 60 s max.
· Peak Temperature : 260 °C, 10 s max.
· Solder : Sn-3.0Ag-0.5Cu
· The number of Times : 2 times
Appearance No damaged
Insertion Loss
Meet item 3
Insulation Resistance
50
Ω
10dB
E
50
Ω
SG
50
Ω
50
Ω
10dB
Method of measurement based on MIL- STD- 220
Attenuator
Specimen
Attenuator
NFA21SL506X1A48
0
10
20
30
40
50
60
10 100 1000 10000
Frequency(MHz)
I.L.(dB)
$990 No, JENF243D700040701
Spec. No. JENF243D-0004Q-01 P 4/10
MURATA MFG.CO., LTD.
Reference Only
No. Item Specification Test Method
8.5 Drop Products shall be no failure after
tested.
It shall be dropped on concrete or steel board.
· Method : Free fall
· Height : 1m
· Attitude from which the product is dropped
: 3 directions
· The Number of Time : 3 times for each direction
(Total 9 times)
8.6 Bonding
Strength
The electrodes shall be no failure after
tested.
It shall be soldered on the glass-epoxy substrate.
· Applying Force (F) : 9.8 N
· Applying Time : 30 s
(in mm)
8.7 Vibration Meet Table 1. It shall be soldered on the glass-epoxy substrate.
· Oscillation Frequency : 10 to 2000 to 10Hz for
20 minutes.
· Total amplitude 1.5 mm or Acceleration amplitude
196m/s2 whichever is smaller.
· Time : A period of 2 hours in each of 3 mutually
perpendicular directions. (Total 6 hours)
8.8 Bending
Strength
Products shall be no failure after
tested.
It shall be soldered on the glass-epoxy substrate
(t = 1.0mm).
· Deflection : 2.0 mm
· Keeping Time : 30 s
(in mm)
9. Environment Performance
It shall be soldered on the glass-epoxy substrate.
No. Item Specification Test Method
9.1 Temperature
Cycling
Meet Table 1. · 1 Cycle
1 step : -55 ±
03 °C / 30 ± 30 min
2 step : Room Temperature / within 3 min
3 step : +125 ±
30 °C / 30 ± 30 min
4 step : Room Temperature / within 3 min
· Total of 100 cycles
9.2 Humidity · Temperature : 40 ± 2 °C
· Humidity : 90 to 95%(RH)
· Time : 500± 240 hours
9.3 Heat Life · Temperature : 125 ± 2 °C
· Test Voltage : Rated Voltage × 200%
· Charge Current : 50 mA max.
· Time : 1000 ± 480 hours
45
R230
F
Deflection
45 Product
Pressure jig
0.25 1.6
0.25
0.5
Reference Onl 0040701
Spec. No. JENF243D-0004Q-01 P 5/10
MURATA MFG.CO., LTD.
Reference Only
10. Specification of Packaging
10.1.
Appearance and Dimensions (8mm-wide plastic tape)
<NFA21SL□□□□1A45>
<NFA21SL□□□□1A48>
10.2.Specification of Taping
(1) Packing quantity (standard quantity)
4000 pcs. / reel
(2) Packing Method
Products shall be packaged in the cavity of the plastic tape and sealed with cover tape.
(3) Sprocket Hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
The cover tape have no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater, and are not
continuous. The specified quantity per reel is kept.
10.3. Pull Strength of Plastic Tape and Cover Tape
Plastic tape 5N min.
Cover tape 10N min.
10.4. Peeling off force of cover tape
0.2N to 0.7N (minimum value is typical)
Speed of Peeling off : 300 mm / min
165 to 180 degree FCover tape
Plastic tape
4.0±0.1 2.0±0.05
0.25±0.05
φ
1.
8.0±0.2
3.5±0.05 1.75±0.1
0.1
0
Sprocket Hole
Direction of feed
Embossed Cavity
1.45±0.1
2.25±0.1
1.05±0.054.0±0.1
φ
1.0±
0.2
0
(in mm)
4.0±0.1 2.0±0.05
0.25±0.05
φ
1.5±
8.0±0.2
3.5±0.05 1.75±0.1
0.1
0
1.55±0.1
2.30±0.1
0.7±0.054.0±0.1
Direction of feed
Sprocket Hole Embossed Cavity
(in mm)
Dimension of the Cavity is
measured at the bottom side.
Dimension of the Cavity is
measured at the bottom side.
Sgec No, JENF243DVOOOAQVO1 m ><><><>
Spec. No. JENF243D-0004Q-01 P 6/10
MURATA MFG.CO., LTD.
Reference Only
10.5.Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape (top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
10.6.Marking for reel
Customer part number , MURATA part number , Inspection number(1) , RoHS marking(2) , Quantity , etc
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O,N,D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
10.7.Marking for Outside package (corrugated paper box)
Customer name , Purchasing Order Number , Customer Part Number , MURATA part number ,
RoHS marking (2) , Quantity , etc
10.8. Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
11. Standard Land Dimensions
The chip EMI filter suppresses noise by conducting the high-frequency noise element to ground.
Therefore, to get enough noise reduction, feed through holes which is connected to ground-plane should be arranged
according to the figure to reinforce the ground-pattern.
< Standard land dimensions for reflow >
Side on which chips are mounted
(in mm)
Resist
Copper foil pattern
Small diameter thru hole
φ
0.2
1.75
0.5
0.25
0.25 0.25
0.5
2.5
0.25
0.25
1.5
W
D
Label
H
Empty tape
190 min.
Leader
Trailer
Top tape
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180±
φ
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
$990 No, JENF243D700040701 A ’5 ’5 I, // ‘4) II —/_-§I _/-(I /'\/7\, ,fl Perlmanon El ¢ 40000:)0000 T El Slit /\/\,
Spec. No. JENF243D-0004Q-01 P 7/10
MURATA MFG.CO., LTD.
Reference Only
12. ! Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability for
the prevention of defects which might directly cause damage to the third party’s life, body or property.
(1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant control equipment
(5) Medical equipment (6) Transportation equipment(automobiles, trains, ships, etc.) (7) Traffic signal equipment
(8) Disaster prevention / crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
13. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Mounting direction of a product
In the case of mounting, Polarity Marking should surely serve as the upper surface.
When mounted upside down, since the Polarity Marking is formed with the conductor, it has a possibility that the short-
circuit between terminals may occur.
13.2.Flux and Solder
Flux Use rosin-based flux, Do not use highly acidic flux (with chlorine content exceeding 0.2(wt)%).
Do not use water soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.3.Note for Assembling
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products surface is limited
to 100°C max. Also cooling into solvent after soldering should be in such a way that the temperature difference is
limited to 100°C max.
13.4.Attention Regarding P.C.B. Bending
The following shall be considered when designing P.C.B.'s and laying out products.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
[Products direction]
Products shall be located in the sideways
direction (Length:a
<
b) to the mechanical stress.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.If a Cutting Disc is used, stress will be
diagonal to the PCB, therefore A > D is invalid.
Poor example
Good example
b
a
Reference Onl S ec No, JENF243D700040701
Spec. No. JENF243D-0004Q-01 P 8/10
MURATA MFG.CO., LTD.
Reference Only
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
13.5. Pre-heating Temperature
Soldering shall be handled so that the difference between pre-heating temperature and solder temperature shall be
limited to 100°C max. to avoid the heat stress for the products.
13.6. Reflow Soldering
1) Soldering paste printing for reflow
· Standard thickness of solder paste: 100µm to 150µm.
· Use the solder paste printing pattern of the below pattern.
· For the resist and copper foil pattern, use standard land dimensions.
Standard printing pattern of solder paste.
(in mm)
2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C, 90s±30s
Heating above 220°C, 30s60s above 230°C, 60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
1.75
0.75
0.25
0.25 0.25
0.5 1.5 0.5
Limit Profile
Standard Profile
90s±30s
230
260℃
245±3
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
$990 No, JENF243D700040701
Spec. No. JENF243D-0004Q-01 P 9/10
MURATA MFG.CO., LTD.
Reference Only
13.7. Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron.
Pre-heating : 150°C, 1 min Soldering iron output : 30W max.
Tip temperature : 350°C max. Tip diameter : φ3mm max.
Soldering time : 3(+1,-0) s Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on the
ceramic material due to the thermal shock.
13.8. Solder Volume
Solder shall be used not to be exceeded as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
13.9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, with avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W / l max. Frequency: 28kHz to 40kHz Time: 5 minutes max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in order to
remove the cleaner.
(5) Other cleaning
Please contact us.
13.10. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the performance, such as
insulation resistance may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
13.11. Resin coating
The capacitance and inductance value may change and/or it may affect on the product's performance due to high cure-
stress of resin to be used for coating / molding products. So please pay your careful attention when you select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
13.12. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
t
Upper Limit
Recommendable
Upper Limit
Recommendable
1/3T
t
T(T:Chip thickness)
Sgec No JENF243D700040701
Spec. No. JENF243D-0004Q-01 P 10/10
MURATA MFG.CO., LTD.
Reference Only
13.13. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
· Products should be stored in the warehouse on the following conditions.
Temperature: -10 to +40°C
Humidity: 15 to 85% relative humidity
No rapid change on temperature and humidity
· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization of
electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
14. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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