ATxmega32E5,16E5,8E5 Datasheet by Microchip Technology

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2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 1
Features
High-performance, low-power AVR® XMEGA® 8/16-bit Microcontroller
Nonvolatile program and data memories
8K –32KB of in-system self-programmable flash
2K – 4KB boot section
512Bytes – 1KB EEPROM
1K – 4KB internal SRAM
Peripheral features
Four-channel enhanced DMA controller with 8/16-bit address match
Eight-channel event system
Asynchronous and synchronous signal routing
Quadrature encoder with rotary filter
Three 16-bit timer/counters
One timer/counter with four output compare or input capture channels
Two timer/counter with two output compare or input capture channels
High resolution extension enabling down to 4ns PWM resolution
Waveform extension for control of motor, LED, lighting, H-bridge, high drives, and more
Fault extension for safe and deterministic handling and/or shut-down of external driver
CRC-16 (CRC-CCITT) and CRC-32 (IEEE 802.3) generator
XMEGA Custom Logic (XCL) module with timer, counter and logic functions
Two 8-bit timer/counters with capture/compare and 16-bit cascade mode
Connected to one USART to support custom data frame length
Connected to I/O pins and event system to do programmable logic functions
MUX, AND, NAND, OR, NOR, XOR, XNOR, NOT, D-Flip-Flop, D Latch, RS Latch
XMEGA® E5 Data Sheet
ATxmega32E5/16E5/8E5
Introduction
The AVR® XMEGA® E5 is a family of low power, high performance, and peripheral rich 8/16-bit microcon-
trollers based on the AVR enhanced RISC architecture. The XMEGA E5 is a 32-pins device ranging from
8KB to 32KB Flash, with 1KB to 4KB SRAM, 512Bytes to 1KB EEPROM and up to 4KB boot section. The
ATxmegaE5 devices operate at a maximum frequency of 32MHz. By executing instructions in a single
clock cycle, the devices achieve CPU throughput approaching one million instructions per second (MIPS)
per megahertz, allowing the system designer to optimize power consumption versus processing speed.
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ATxmega32E5/16E5/8E5
Two USARTs with full-duplex and single wire half-duplex configuration
Master SPI mode
Support custom protocols with configurable data frame length up to 256-bit
System wake-up from deep sleep modes when used with internal 8MHz oscillator
One two-wire interface with dual address match (I2C and SMBus compatible)
Bridge configuration for simultaneous master and slave operation
Up to 1MHz bus speed support
One serial peripheral interface (SPI)
16-bit real time counter with separate oscillator and digital correction
One sixteen-channel, 12-bit, 300ksps Analog to Digital Converter with:
Offset and gain correction
Averaging
Over-sampling and decimation
One two-channel, 12-bit, 1Msps Digital to Analog Converter
Two Analog Comparators with window compare function and current sources
External interrupts on all general purpose I/O pins
Programmable watchdog timer with separate on-chip ultra low power oscillator
QTouch® library support
Capacitive touch buttons, sliders and wheels
Special microcontroller features
Power-on reset and programmable brown-out detection
Internal and external clock options with PLL
Programmable multilevel interrupt controller
Five sleep modes
Programming and debug interface
PDI (Program and Debug Interface)
I/O and Packages
26 programmable I/O pins
7x7mm 32-lead TQFP
5x5mm 32-lead VQFN
4x4mm 32-lead UQFN
Operating Voltage
1.6 – 3.6V
Operating frequency
0 – 12MHz from 1.6V
0 – 32MHz from 2.7V
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Table Of Content
1 Ordering Information ............................................................................... 8
2 Typical Applications ................................................................................ 9
3 Pinout and Block Diagram .................................................................... 10
4 Overview ................................................................................................. 11
5 Resources ............................................................................................... 12
5.1 Recommended Reading.................................................................................. 12
6 Capacitive Touch Sensing .................................................................... 12
7 CPU .......................................................................................................... 13
7.1 Features .......................................................................................................... 13
7.2 Overview.......................................................................................................... 13
7.3 Architectural Overview..................................................................................... 13
7.4 ALU - Arithmetic Logic Unit ............................................................................. 15
7.5 Program Flow .................................................................................................. 15
7.6 Status Register ................................................................................................ 15
7.7 Stack and Stack Pointer .................................................................................. 16
7.8 Register File .................................................................................................... 16
8 Memories ................................................................................................ 17
8.1 Features .......................................................................................................... 17
8.2 Overview.......................................................................................................... 17
8.3 Flash Program Memory ................................................................................... 17
8.4 Fuses and Lock Bits ........................................................................................ 19
8.5 Data Memory ................................................................................................... 20
8.6 EEPROM ......................................................................................................... 20
8.7 I/O Memory...................................................................................................... 20
8.8 Data Memory and Bus Arbitration ................................................................... 20
8.9 Memory Timing................................................................................................ 20
8.10 Device ID and Revision ................................................................................... 21
8.11 I/O Memory Protection..................................................................................... 21
8.12 Flash and EEPROM Page Size....................................................................... 21
9 EDMA – Enhanced DMA Controller ...................................................... 22
9.1 Features .......................................................................................................... 22
9.2 Overview.......................................................................................................... 22
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10 Event System .......................................................................................... 24
10.1 Features .......................................................................................................... 24
10.2 Overview.......................................................................................................... 24
11 System Clock and Clock options ......................................................... 26
11.1 Features .......................................................................................................... 26
11.2 Overview.......................................................................................................... 26
11.3 Clock Sources ................................................................................................. 27
12 Power Management and Sleep Modes ................................................. 29
12.1 Features .......................................................................................................... 29
12.2 Overview.......................................................................................................... 29
12.3 Sleep Modes.................................................................................................... 29
13 System Control and Reset .................................................................... 31
13.1 Features .......................................................................................................... 31
13.2 Overview.......................................................................................................... 31
13.3 Reset Sequence .............................................................................................. 31
13.4 Reset Sources ................................................................................................. 31
14 WDT – Watchdog Timer ......................................................................... 33
14.1 Features .......................................................................................................... 33
14.2 Overview.......................................................................................................... 33
15 Interrupts and Programmable Multilevel Interrupt Controller ........... 34
15.1 Features .......................................................................................................... 34
15.2 Overview.......................................................................................................... 34
15.3 Interrupt Vectors .............................................................................................. 34
16 I/O Ports .................................................................................................. 36
16.1 Features .......................................................................................................... 36
16.2 Overview.......................................................................................................... 36
16.3 Output Driver ................................................................................................... 37
16.4 Input Sensing................................................................................................... 39
16.5 Alternate Port Functions .................................................................................. 39
17 Timer Counter Type 4 and 5 .................................................................. 40
17.1 Features .......................................................................................................... 40
17.2 Overview.......................................................................................................... 40
18 WeX – Waveform Extension .................................................................. 42
18.1 Features .......................................................................................................... 42
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18.2 Overview.......................................................................................................... 42
19 Hi-Res – High Resolution Extension .................................................... 44
19.1 Features .......................................................................................................... 44
19.2 Overview.......................................................................................................... 44
20 Fault Extension ...................................................................................... 45
20.1 Features .......................................................................................................... 45
20.2 Overview.......................................................................................................... 45
21 RTC – 16-bit Real-Time Counter ........................................................... 46
21.1 Features .......................................................................................................... 46
21.2 Overview.......................................................................................................... 46
22 TWI – Two-Wire Interface ...................................................................... 48
22.1 Features .......................................................................................................... 48
22.2 Overview.......................................................................................................... 48
23 SPI – Serial Peripheral Interface ........................................................... 50
23.1 Features .......................................................................................................... 50
23.2 Overview.......................................................................................................... 50
24 USART ..................................................................................................... 51
24.1 Features .......................................................................................................... 51
24.2 Overview.......................................................................................................... 51
25 IRCOM – IR Communication Module .................................................... 53
25.1 Features .......................................................................................................... 53
25.2 Overview.......................................................................................................... 53
26 XCL – XMEGA Custom Logic Module .................................................. 54
26.1 Features .......................................................................................................... 54
26.2 Overview.......................................................................................................... 54
27 CRC – Cyclic Redundancy Check Generator ...................................... 56
27.1 Features .......................................................................................................... 56
27.2 Overview.......................................................................................................... 56
28 ADC – 12-bit Analog to Digital Converter ............................................ 57
28.1 Features .......................................................................................................... 57
28.2 Overview.......................................................................................................... 57
29 DAC – Digital to Analog Converter ....................................................... 59
29.1 Features .......................................................................................................... 59
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29.2 Overview.......................................................................................................... 59
30 AC – Analog Comparator ...................................................................... 61
30.1 Features .......................................................................................................... 61
30.2 Overview.......................................................................................................... 61
31 Programming and Debugging ............................................................... 63
31.1 Features .......................................................................................................... 63
31.2 Overview.......................................................................................................... 63
32 Pinout and Pin Functions ...................................................................... 64
32.1 Alternate Pin Function Description .................................................................. 64
32.2 Alternate Pin Functions ................................................................................... 66
33 Peripheral Module Address Map .......................................................... 68
34 Instruction Set Summary ....................................................................... 70
35 Packaging Information .......................................................................... 75
35.1 32A .................................................................................................................. 75
35.2 32Z .................................................................................................................. 76
35.3 32MA ............................................................................................................... 77
36 Electrical Characteristics ...................................................................... 78
36.1 Absolute Maximum Ratings............................................................................. 78
36.2 General Operating Ratings.............................................................................. 78
36.3 Current Consumption ...................................................................................... 80
36.4 Wake-up Time from Sleep Modes ................................................................... 82
36.5 I/O Pin Characteristics..................................................................................... 83
36.6 ADC Characteristics ........................................................................................ 83
36.7 DAC Characteristics ........................................................................................ 86
36.8 Analog Comparator Characteristics................................................................. 87
36.9 Bandgap and Internal 1.0V Reference Characteristics ................................... 88
36.10 External Reset Characteristics ....................................................................... 89
36.11 Power-on Reset Characteristics ..................................................................... 89
36.12 Flash and EEPROM Characteristics .............................................................. 89
36.13 Clock and Oscillator Characteristics............................................................... 91
36.14 SPI Characteristics .......................................................................................... 96
36.15 Two-Wire Interface Characteristics ................................................................. 98
37 Typical Characteristics ........................................................................ 100
37.1 Current Consumption .................................................................................... 100
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37.2 I/O Pin Characteristics................................................................................... 111
37.3 ADC Characteristics ...................................................................................... 118
37.4 DAC Characteristics ...................................................................................... 123
37.5 AC Characteristics......................................................................................... 124
37.6 Internal 1.0V Reference Characteristics........................................................ 129
37.7 BOD Characteristics ...................................................................................... 129
37.8 External Reset Characteristics ...................................................................... 130
37.9 Power-on Reset Characteristics .................................................................... 133
37.10 Oscillator Characteristics............................................................................... 135
37.11 Two-wire Interface Characteristics ............................................................... 141
37.12 PDI Characteristics....................................................................................... 142
38 Errata – ATxmega32E5 / ATxmega16E5 / ATxmega8E5 ................... 143
38.1 Rev. B............................................................................................................ 143
38.2 Rev. A............................................................................................................ 145
39 Revision History ................................................................................... 148
39.1 Rev A – 08/2018............................................................................................ 148
39.2 8153K – 08/2016 ........................................................................................... 148
39.3 8153J – 11/2014............................................................................................ 148
39.4 8153I – 08/2014............................................................................................. 148
39.5 8153H – 07/2014 ........................................................................................... 148
39.6 8153G – 10/2013........................................................................................... 149
39.7 8153F – 08/2013 ........................................................................................... 149
39.8 8153E – 06/2013 ........................................................................................... 149
39.9 8153D – 06/2013 ........................................................................................... 149
39.10 8153C – 05/2013 ........................................................................................... 149
39.11 8153B – 04/2013 ........................................................................................... 149
39.12 8153A – 04/2013 ........................................................................................... 149
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1. Ordering Information
Ordering Code Package(1)(2)(3)
Flash
[Bytes]
EEPROM
[Bytes]
SRAM
[Bytes]
Speed
[MHz]
Power supply
[V]
Temp.
[°C]
ATxmega8E5-AU 32A
(7x7mm TQFP)
8K + 2K 512 1K 32 1.6 – 3.6 -40 – 85
ATxmega8E5-AUR(4)
ATxmega8E5-MU 32Z
(5x5mm VQFN)
ATxmega8E5-MUR(4)
ATxmega8E5-M4U 32MA
(4x4mm UQFN)
ATxmega8E5-M4UR(4)
ATxmega16E5-AU 32A
(7x7mm TQFP)
16K + 4K 512 2K 32 1.6 – 3.6 -40 – 85
ATxmega16E5-AUR(4)
ATxmega16E5-MU 32Z
(5x5mm VQFN)
ATxmega16E5-MUR(4)
ATxmega16E5-M4U 32MA
(4x4mm UQFN)
ATxmega16E5-M4UR(4)
ATxmega32E5-AU 32A
(7x7mm TQFP)
32K + 4K 1K 4K 32 1.6 – 3.6 -40 – 85
ATxmega32E5AUR(4)
ATxmega32E5-MU 32Z
(5x5mm VQFN)
ATxmega32E5-MUR(4)
ATxmega32E5-M4U 32MA
(4x4mm UQFN)
ATxmega32E5-M4UR(4)
ATxmega8E5-AN 32A
(7x7mm TQFP)
8K + 2K 512 1K 32 1.6 – 3.6 -40 – 105
ATxmega8E5-ANR(4)
ATxmega8E5-MN 32Z
(5x5mm VQFN)
ATxmega8E5-MNR(4)
ATxmega8E5-M4UN 32MA
(4x4mm UQFN)
ATxmega8E5-M4UNR(4)
ATxmega16E5-AN 32A
(7x7mm TQFP)
16K + 4K 512 2K 32 1.6 – 3.6 -40 – 105
ATxmega16E5-ANR(4)
ATxmega16E5-MN 32Z
(5x5mm VQFN)
ATxmega16E5-MNR(4)
ATxmega16E5-M4UN 32MA
(4x4mm UQFN)
ATxmega16E5-M4UNR(4)
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Notes: 1. This device can also be supplied in wafer form. Please contact your local Microchip sales office for detailed ordering information.
2. Pb-free packaging, complies to the European Directive for Restriction of Hazardous Substances (RoHS directive). Also Halide free and fully Green.
3. For packaging information, see “Packaging Information” on page 75.
4. Tape and Reel.
2. Typical Applications
ATxmega32E5-AN 32A
(7x7mm TQFP)
32K + 4K 1K 4K 32 1.6 – 3.6 -40 – 105
ATxmega32E5ANR(4)
ATxmega32E5-MN 32Z
(5x5mm VQFN)
ATxmega32E5-MNR(4)
ATxmega32E5-M4UN 32MA
(4x4mm UQFN)
ATxmega32E5-M4UNR(4)
Package Type
32A 32-lead, 7x7mm body size, 1.0mm body thickness, 0.8mm lead pitch, thin profile plastic quad flat package (TQFP)
32Z 32-lead, 0.5mm pitch, 5x5mm Very Thin quad Flat No Lead Package (VQFN) Sawn
32MA 32-lead, 0.4mm pitch, 4x4x0.60mm Ultra Thin Quad No Lead (UQFN) Package
Board controller Sensor control Motor control
User interface Industrial control Ballast control, Inverters
Communication bridges Battery charger Utility metering
Appliances
Ordering Code Package(1)(2)(3)
Flash
[Bytes]
EEPROM
[Bytes]
SRAM
[Bytes]
Speed
[MHz]
Power supply
[V]
Temp.
[°C]
DI- o Frog/Debug menace EDMA Controller BUS Controller
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3. Pinout and Block Diagram
Notes: 1. For full details on pinout and alternate pin functions refer to “Pinout and Pin Functions” on page 64.
Digital function
Analog function / Oscillators
Programming, debug, test
External clock / Crystal pins
General Purpose I/O
Ground
Power
PA4
PA3
PA2
PA1
PA0
2
3
4
5
6
GND 1
AVCC32
31
PA6
PA5
PA7
30
29
28
27
26
25
PR1
PR020
19
VCC
GND
18
17
PDI 7
8
PD0
PD2
PD1
PD3
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
9
10
11
12
13
14
15
16
21
22
23
24 PD4
PD5
PD6
PD7
Power
Supervision
EVENT ROUTING NETWORK
EDMA
Controller
BUS
Controller
SRAMFLASH
OCD Prog/Debug
Interface
EEPROM
Event System
Controller
Watchdog
Timer
Watchdog
Oscillator
OSC/CLK
Control
Real Time
Counter
Interrupt
Controller
DATA BUS
DATA BUS
Sleep
Controller
Reset
Controller
TEMPREF
VREF
Port R
CRC CPU
Port A
ADC
AC0:1
AREF
Port C
TC4:5
USART0
SPI
IRCOM
Port D
TC5
USART0
TWI
ADC
DAC
XCL
PDI / RESET
AREF
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4. Overview
The AVR XMEGA is a family of low power, high performance, and peripheral rich 8/16-bit microcontrollers based on the
AVR enhanced RISC architecture. By executing instructions in a single clock cycle, the AVR XMEGA devices achieve CPU
throughput approaching one million instructions per second (MIPS) per megahertz, allowing the system designer to opti-
mize power consumption versus processing speed.
The AVR CPU combines a rich instruction set with 32 general purpose working registers. All 32 registers are directly con-
nected to the arithmetic logic unit (ALU), allowing two independent registers to be accessed in a single instruction,
executed in one clock cycle. The resulting architecture is more code efficient while achieving throughputs many times
faster than conventional single-accumulator or CISC based microcontrollers.
The AVR XMEGA E5 devices provide the following features: in-system programmable flash with read-while-write capabili-
ties; internal EEPROM and SRAM; four-channel enhanced DMA (EDMA) controller; eight-channel event system with
asynchronous event support; programmable multilevel interrupt controller; 26 general purpose I/O lines; CRC-16 (CRC-
CCITT) and CRC-32 (IEEE 802.3) generators; one XMEGA Custom Logic module with timer, counter and logic functions
(XCL); 16-bit real-time counter (RTC) with digital correction; three flexible, 16-bit timer/counters with compare and PWM
channels; two USARTs; one two-wire serial interface (TWI) allowing simultaneous master and slave; one serial peripheral
interface (SPI); one sixteen-channel, 12-bit ADC with programmable gain, offset and gain correction, averaging, over-sam-
pling and decimation; one 2-channel 12-bit DAC; two analog comparators (ACs) with window mode and current sources;
programmable watchdog timer with separate internal oscillator; accurate internal oscillators with PLL and prescaler; and
programmable brown-out detection.
The program and debug interface (PDI), a fast, two-pin interface for programming and debugging, is available.
The AVR XMEGA E5 devices have five software selectable power saving modes. The idle mode stops the CPU while
allowing the SRAM, EDMA controller, event system, interrupt controller, and all peripherals to continue functioning. The
power-down mode saves the SRAM and register contents, but stops the oscillators, disabling all other functions until the
next TWI, or pin-change interrupt, or reset. In power-save mode, the asynchronous real-time counter continues to run,
allowing the application to maintain a timer base while the rest of the device is sleeping. In standby mode, the external crys-
tal oscillator keeps running while the rest of the device is sleeping. This allows very fast startup from the external crystal,
combined with low power consumption. In extended standby mode, both the main oscillator and the asynchronous timer
continue to run. In each power save, standby or extended standby mode, the low power mode of the internal 8MHz oscilla-
tor allows very fast startup time combined with very low power consumption.
To further reduce power consumption, the peripheral clock to each individual peripheral can optionally be stopped in active
mode and idle sleep mode and low power mode of the internal 8MHz oscillator can be enabled.
Microchip offers a free QTouch library for embedding capacitive touch buttons, sliders and wheels functionality into AVR
microcontrollers. The devices are manufactured using high-density, nonvolatile memory technology. The program flash
memory can be reprogrammed in-system through the PDI. A boot loader running in the device can use any interface to
download the application program to the flash memory. The boot loader software in the boot flash section can continue to
run. By combining an 8/16-bit RISC CPU with in-system, self-programmable flash, the AVR XMEGA is a powerful micro-
controller family that provides a highly flexible and cost effective solution for many embedded applications.
All AVR XMEGA devices are supported with a full suite of program and system development tools, including C compilers,
macro assemblers, program debugger/simulators, programmers, and evaluation kits.
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5. Resources
A comprehensive set of development tools, application notes and datasheets are available for download on
www.microchip.com
5.1 Recommended Reading
XMEGA E Manual
XMEGA Application Notes
This device data sheet only contains part specific information with a short description of each peripheral and module. The
XMEGA E Manual describes the modules and peripherals in depth. The XMEGA application notes contain example code
and show applied use of the modules and peripherals.
All documentations are available from www.microchip.com
6. Capacitive Touch Sensing
The QTouch® library provides a simple to use solution to realize touch sensitive interfaces on most AVR® microcontrollers.
The patented charge-transfer signal acquisition offers robust sensing and includes fully debounced reporting of touch keys
and includes Adjacent Key Suppression (AKS) technology for unambiguous detection of key events. The QTouch
library includes support for the QTouch and QMatrix acquisition methods.
Touch sensing can be added to any application by linking the appropriate QTouch library for the AVR Microcontroller. This
is done by using a simple set of APIs to define the touch channels and sensors, and then calling the touch sensing API’s to
retrieve the channel information and determine the touch sensor states.
The QTouch library is FREE and downloadable from the Microchip website at the following location www.microchip.com.
For implementation details and other information, refer to the QTouch library user guide also available for download from
the Microchip website.
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7. CPU
7.1 Features
8/16-bit, high-performance AVR RISC CPU
142 instructions
Hardware multiplier
32x8-bit registers directly connected to the ALU
Stack in RAM
Stack pointer accessible in I/O memory space
Direct addressing of up to 16MB of program memory and 16MB of data memory
True 16/24-bit access to 16/24-bit I/O registers
Efficient support for 8-, 16-, and 32-bit arithmetic
Configuration change protection of system-critical features
7.2 Overview
All AVR XMEGA devices use the 8/16-bit AVR CPU. The main function of the CPU is to execute the code and perform all
calculations. The CPU is able to access memories, perform calculations, control peripherals, and execute the program in
the flash memory. Interrupt handling is described in a separate section, refer to “Interrupts and Programmable Multilevel
Interrupt Controller” on page 34.
7.3 Architectural Overview
In order to maximize performance and parallelism, the AVR CPU uses a Harvard architecture with separate memories and
buses for program and data. Instructions in the program memory are executed with single-level pipelining. While one
instruction is being executed, the next instruction is pre-fetched from the program memory. This enables instructions to be
executed on every clock cycle. For details of all AVR instructions, refer to www.microchip.com.
Reamer Fm: ; Hash Program I ) Memw mama-on Decade - Dam Memory
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Figure 7-1. Block Diagram of the AVR CPU Architecture
The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a reg-
ister. Single-register operations can also be executed in the ALU. After an arithmetic operation, the status register is
updated to reflect information about the result of the operation.
The ALU is directly connected to the fast-access register file. The 32 x 8-bit general purpose working registers all have sin-
gle clock cycle access time allowing single-cycle arithmetic logic unit (ALU) operation between registers or between a
register and an immediate. Six of the 32 registers can be used as three 16-bit address pointers for program and data space
addressing, enabling efficient address calculations.
The memory spaces are linear. The data memory space and the program memory space are two different memory spaces.
The data memory space is divided into I/O registers, SRAM, and memory mapped EEPROM.
All I/O status and control registers reside in the lowest 4KB addresses of the data memory. This is referred to as the I/O
memory space. The lowest 64 addresses can be accessed directly, or as the data space locations from 0x00 to 0x3F. The
rest is the extended I/O memory space, ranging from 0x0040 to 0x0FFF. I/O registers here must be accessed as data
space locations using load (LD/LDS/LDD) and store (ST/STS/STD) instructions.
The SRAM holds data. Code execution from SRAM is not supported. It can easily be accessed through the five different
addressing modes supported in the AVR architecture. The first SRAM address is 0x2000.
Data addresses 0x1000 to 0x1FFF are reserved for EEPROM.
The program memory is divided in two sections, the application program section and the boot program section. Both sec-
tions have dedicated lock bits for write and read/write protection. The SPM instruction that is used for self-programming of
the application flash memory must reside in the boot program section. The application section contains an application table
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ATxmega32E5/16E5/8E5
section with separate lock bits for write and read/write protection. The application table section can be used for save storing
of nonvolatile data in the program memory.
7.4 ALU - Arithmetic Logic Unit
The arithmetic logic unit (ALU) supports arithmetic and logic operations between registers or between a constant and a reg-
ister. Single-register operations can also be executed. The ALU operates in direct connection with all 32 general purpose
registers. In a single clock cycle, arithmetic operations between general purpose registers or between a register and an
immediate are executed and the result is stored in the register file. After an arithmetic or logic operation, the status register
is updated to reflect information about the result of the operation.
ALU operations are divided into three main categories – arithmetic, logical, and bit functions. Both 8- and 16-bit arithmetic
is supported, and the instruction set allows for efficient implementation of 32-bit arithmetic. The hardware multiplier sup-
ports signed and unsigned multiplication and fractional format.
7.4.1 Hardware Multiplier
The multiplier is capable of multiplying two 8-bit numbers into a 16-bit result. The hardware multiplier supports different
variations of signed and unsigned integer and fractional numbers:
Multiplication of unsigned integers
Multiplication of signed integers
Multiplication of a signed integer with an unsigned integer
Multiplication of unsigned fractional numbers
Multiplication of signed fractional numbers
Multiplication of a signed fractional number with an unsigned one
A multiplication takes two CPU clock cycles.
7.5 Program Flow
After reset, the CPU starts to execute instructions from the lowest address in the flash program memory ‘0.’ The program
counter (PC) addresses the next instruction to be fetched.
Program flow is provided by conditional and unconditional jump and call instructions capable of addressing the whole
address space directly. Most AVR instructions use a 16-bit word format, while a limited number use a 32-bit format.
During interrupts and subroutine calls, the return address PC is stored on the stack. The stack is allocated in the general
data SRAM, and consequently the stack size is only limited by the total SRAM size and the usage of the SRAM. After reset,
the stack pointer (SP) points to the highest address in the internal SRAM. The SP is read/write accessible in the I/O mem-
ory space, enabling easy implementation of multiple stacks or stack areas. The data SRAM can easily be accessed
through the five different addressing modes supported in the AVR CPU.
7.6 Status Register
The status register (SREG) contains information about the result of the most recently executed arithmetic or logic instruc-
tion. This information can be used for altering program flow in order to perform conditional operations. Note that the status
register is updated after all ALU operations, as specified in the instruction set reference. This will in many cases remove the
need for using the dedicated compare instructions, resulting in faster and more compact code.
The status register is not automatically stored when entering an interrupt routine nor restored when returning from an inter-
rupt. This must be handled by software.
The status register is accessible in the I/O memory space.
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7.7 Stack and Stack Pointer
The stack is used for storing return addresses after interrupts and subroutine calls. It can also be used for storing tempo-
rary data. The stack pointer (SP) register always points to the top of the stack. It is implemented as two 8-bit registers that
are accessible in the I/O memory space. Data are pushed and popped from the stack using the PUSH and POP instruc-
tions. The stack grows from a higher memory location to a lower memory location. This implies that pushing data onto the
stack decreases the SP, and popping data off the stack increases the SP. The SP is automatically loaded after reset, and
the initial value is the highest address of the internal SRAM. If the SP is changed, it must be set to point above address
0x2000, and it must be defined before any subroutine calls are executed or before interrupts are enabled.
During interrupts or subroutine calls, the return address is automatically pushed on the stack. The return address can be
two or three bytes, depending on program memory size of the device. For devices with 128KB or less of program memory,
the return address is two bytes, and hence the stack pointer is decremented/incremented by two. For devices with more
than 128KB of program memory, the return address is three bytes, and hence the SP is decremented/incremented by
three. The return address is popped off the stack when returning from interrupts using the RETI instruction, and from sub-
routine calls using the RET instruction.
The SP is decremented by one when data are pushed on the stack with the PUSH instruction, and incremented by one
when data is popped off the stack using the POP instruction.
To prevent corruption when updating the stack pointer from software, a write to SPL will automatically disable interrupts for
up to four instructions or until the next I/O memory write.
7.8 Register File
The register file consists of 32 x 8-bit general purpose working registers with single clock cycle access time. The register
file supports the following input/output schemes:
One 8-bit output operand and one 8-bit result input
Two 8-bit output operands and one 8-bit result input
Two 8-bit output operands and one 16-bit result input
One 16-bit output operand and one 16-bit result input
Six of the 32 registers can be used as three 16-bit address register pointers for data space addressing, enabling efficient
address calculations. One of these address pointers can also be used as an address pointer for lookup tables in flash pro-
gram memory.
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8. Memories
8.1 Features
Flash program memory
One linear address space
In-system programmable
Self-programming and boot loader support
Application section for application code
Application table section for application code or data storage
Boot section for application code or bootloader code
Separate read/write protection lock bits for all sections
Built in fast CRC check of a selectable flash program memory section
Data memory
One linear address space
Single-cycle access from CPU
SRAM
EEPROM
Byte and page accessible
Memory mapped for direct load and store
I/O memory
Configuration and status registers for all peripherals and modules
Four bit-accessible general purpose registers for global variables or flags
Bus arbitration
Deterministic handling of priority between CPU, EDMA controller, and other bus masters
Separate buses for SRAM, EEPROM, and I/O memory
Simultaneous bus access for CPU and EDMA controller
Production signature row memory for factory programmed data
ID for each microcontroller device type
Serial number for each device
Calibration bytes for factory calibrated peripherals
User signature row
One flash page in size
Can be read and written from software
Content is kept after chip erase
8.2 Overview
The AVR architecture has two main memory spaces, the program memory and the data memory. Executable code can
reside only in the program memory, while data can be stored in the program memory and the data memory. The data mem-
ory includes the internal SRAM, and EEPROM for nonvolatile data storage. All memory spaces are linear and require no
memory bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and read/write operations. This
prevents unrestricted access to the application software.
A separate memory section contains the fuse bytes. These are used for configuring important system functions, and can
only be written by an external programmer.
The available memory size configurations are shown in “Ordering Information” on page 8”. In addition, each device has a
Flash memory signature row for calibration data, device identification, serial number etc.
8.3 Flash Program Memory
The AVR XMEGA devices contain on-chip, in-system reprogrammable flash memory for program storage. The flash mem-
ory can be accessed for read and write from an external programmer through the PDI or from application software running
in the device.
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All AVR CPU instructions are 16 or 32 bits wide, and each flash location is 16 bits wide. The flash memory is organized in
two main sections, the application section and the boot loader section. The sizes of the different sections are fixed, but
device-dependent. These two sections have separate lock bits, and can have different levels of protection. The store pro-
gram memory (SPM) instruction, which is used to write to the flash from the application software, will only operate when
executed from the boot loader section.
The application section contains an application table section with separate lock settings. This enables safe storage of non-
volatile data in the program memory.
Figure 8-1. Flash Program Memory (hexadecimal address)
8.3.1 Application Section
The Application section is the section of the flash that is used for storing the executable application code. The protection
level for the application section can be selected by the boot lock bits for this section. The application section can not store
any boot loader code since the SPM instruction cannot be executed from the application section.
8.3.2 Application Table Section
The application table section is a part of the application section of the flash memory that can be used for storing data. The
size is identical to the boot loader section. The protection level for the application table section can be selected by the boot
lock bits for this section. The possibilities for different protection levels on the application section and the application table
section enable safe parameter storage in the program memory. If this section is not used for data, application code can
reside here.
8.3.3 Boot Loader Section
While the application section is used for storing the application code, the boot loader software must be located in the boot
loader section because the SPM instruction can only initiate programming when executing from this section. When pro-
gramming, the CPU is halted, waiting for the flash operation to complete. The SPM instruction can access the entire flash,
including the boot loader section itself. The protection level for the boot loader section can be selected by the boot loader
lock bits. If this section is not used for boot loader software, application code can be stored here.
8.3.4 Production Signature Row
The production signature row is a separate memory section for factory programmed data. It contains calibration data for
functions such as oscillators and analog modules. Some of the calibration values will be automatically loaded to the corre-
sponding module or peripheral unit during reset. Other values must be loaded from the signature row and written to the
Word Address
ATxmega32E5 ATxmega16E5 ATxmega8E5
000
Application Section
(32K/16K/8K)
...
37FF / 17FF / BFF
3800 / 1800 / C00 Application Table Section
(4K/4K/2K)
3FFF / 1FFF / FFF
4000 / 2000 / 1000 Boot Section
(4K/4K/2K)
47FF / 27FF / 13FF
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corresponding peripheral registers from software. For details on calibration conditions, refer to “Electrical Characteristics”
on page 78.
The production signature row also contains an ID that identifies each microcontroller device type and a serial number for
each manufactured device. The serial number consists of the production lot number, wafer number, and wafer coordinates
for the device. The device ID for the available devices is shown in Table 8-1.
The production signature row cannot be written or erased, but it can be read from application software and external
programmers.
Table 8-1. Device ID Bytes for AVR XMEGA E5 Devices
8.3.5 User Signature Row
The user signature row is a separate memory section that is fully accessible (read and write) from application software and
external programmers. It is one flash page in size, and is meant for static user parameter storage, such as calibration data,
custom serial number, identification numbers, random number seeds, etc. This section is not erased by chip erase com-
mands that erase the flash, and requires a dedicated erase command. This ensures parameter storage during multiple
program/erase operations and on-chip debug sessions.
8.4 Fuses and Lock Bits
The fuses are used to configure important system functions, and can only be written from an external programmer. The
application software can read the fuses. The fuses are used to configure reset sources such as brownout detector and
watchdog, startup configuration, etc.
The lock bits are used to set protection levels for the different flash sections (i.e., if read and/or write access should be
blocked). Lock bits can be written by external programmers and application software, but only to stricter protection levels.
Chip erase is the only way to erase the lock bits. To ensure that flash contents are protected even during chip erase, the
lock bits are erased after the rest of the flash memory has been erased.
An un-programmed fuse or lock bit will have the value one, while a programmed fuse or lock bit will have the value zero.
Both fuses and lock bits are reprogrammable like the flash program memory.
Device Device ID bytes
Byte 2 Byte 1 Byte 0
ATxmega32E5 4C 95 1E
ATxmega16E5 45 94 1E
ATxmega8E5 41 93 1E
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8.5 Data Memory
The data memory contains the I/O memory, internal SRAM and EEPROM. The data memory is organized as one continu-
ous memory section, see Table 8-2 on page 21. To simplify development, I/O Memory, EEPROM and SRAM will always
have the same start addresses for all XMEGA devices.
Figure 8-2. Data Memory Map (hexadecimal value)
8.6 EEPROM
AVR XMEGA E5 devices have EEPROM for nonvolatile data storage. It is memory mapped and accessed in normal data
space. The EEPROM supports both byte and page access. EEPROM allows highly efficient EEPROM reading and
EEPROM buffer loading. When doing this, EEPROM is accessible using load and store instructions. EEPROM will always
start at hexadecimal address 0x1000.
8.7 I/O Memory
The status and configuration registers for peripherals and modules, including the CPU, are addressable through I/O mem-
ory locations. All I/O locations can be accessed by the load (LD/LDS/LDD) and store (ST/STS/STD) instructions, which are
used to transfer data between the 32 registers in the register file and the I/O memory. The IN and OUT instructions can
address I/O memory locations in the range of 0x00 to 0x3F directly. In the address range 0x00 - 0x1F, single-cycle instruc-
tions for manipulation and checking of individual bits are available.
The I/O memory address for all peripherals and modules in XMEGA E5 is shown in the Peripheral Module Address Map”
on page 68.
8.7.1 General Purpose I/O Registers
The lowest four I/O memory addresses are reserved as general purpose I/O registers. These registers can be used for
storing global variables and flags, as they are directly bit-accessible using the SBI, CBI, SBIS, and SBIC instructions.
8.8 Data Memory and Bus Arbitration
Since the data memory is organized as three separate sets of memories, the different bus masters (CPU, EDMA controller
read and EDMA controller write, etc.) can access different memory sections at the same time.
8.9 Memory Timing
Read and write access to the I/O memory takes one CPU clock cycle. A write to SRAM takes one cycle, and a read from
SRAM takes two cycles. For burst read (EDMA), new data are available every cycle. EEPROM page load (write) takes one
cycle, and three cycles are required for read. For burst read, new data are available every second cycle. Refer to the
instruction summary for more details on instructions and instruction timing.
Byte Address ATxmega32E5 Byte Address ATxmega16E5 Byte Address ATxmega8E5
0
I/O Registers (4K)
0
I/O Registers (4K)
0
I/O Registers (4K)
FFF FFF FFF
1000
EEPROM (1K)
1000
EEPROM (512B)
1000
EEPROM (512B)
13FF 11FF 11FF
RESERVED RESERVED RESERVED
2000
Internal SRAM (4K)
2000
Internal SRAM (2K)
2000
Internal SRAM (2K)
2FFF 27FF 27FF
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8.10 Device ID and Revision
Each device has a three-byte device ID. This ID identifies the manufacturer of the device and the device type. A separate
register contains the revision number of the device.
8.11 I/O Memory Protection
Some features in the device are regarded as critical for safety in some applications. Due to this, it is possible to lock the I/O
register related to the clock system, the event system, and the waveform extensions. As long as the lock is enabled, all
related I/O registers are locked and they cannot be written from the application software. The lock registers themselves are
protected by the configuration change protection mechanism.
8.12 Flash and EEPROM Page Size
The flash program memory and EEPROM data memory are organized in pages. The pages are word accessible for the
flash and byte accessible for the EEPROM.
Table 8-2 shows the Flash Program Memory organization and Program Counter (PC) size. Flash write and erase opera-
tions are performed on one page at a time, while reading the Flash is done one byte at a time. For Flash access the Z-
pointer (Z[m:n]) is used for addressing. The most significant bits in the address (FPAGE) give the page number and the
least significant address bits (FWORD) give the word in the page.
Table 8-2. Number of Words and Pages in the Flash
Table 8-3 shows EEPROM memory organization for the AVR XMEGA E5 devices. EEPROM write and erase operations
can be performed one page or one byte at a time, while reading the EEPROM is done one byte at a time. For EEPROM
access the NVM address register (ADDR[m:n]) is used for addressing. The most significant bits in the address (E2PAGE)
give the page number and the least significant address bits (E2BYTE) give the byte in the page.
Table 8-3. Number of Words and Pages in the EEPROM
Devices PC size Flash size Page Size FWORD FPAGE Application Boot
bits bytes words Size No. of
pages Size No. of
pages
ATxmega32E5 15 32K+4K 64 Z[6:0] Z[14:7] 32K 256 4K 32
ATxmega16E5 14 16K+4K 64 Z[6:0] Z[13:7] 16K 128 4K 32
ATxmega8E5 13 8K+2K 64 Z[6:0] Z[12:7] 8K 64 2K 16
Devices EEPROM Page Size E2BYTE E2PAGE No. of Pages
Size bytes
ATxmega32E5 1K 32 ADDR[4:0] ADDR[10:5] 32
ATxmega16E5 512Bytes 32 ADDR[4:0] ADDR[10:5] 16
ATxmega8E5 512Bytes 32 ADDR[4:0] ADDR[10:5] 16
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9. EDMA – Enhanced DMA Controller
9.1 Features
The EDMA Controller allows data transfers with minimal CPU intervention
from data memory to data memory
from data memory to peripheral
from peripheral to data memory
from peripheral to peripheral
Four peripheral EDMA channels with separate:
transfer triggers
interrupt vectors
addressing modes
data matching
Two peripheral channels can be combined to one standard channel with separate:
transfer triggers
interrupt vectors
addressing modes
data search
Programmable channel priority
From 1byte to 128KB of data in a single transaction
Up to 64K block transfer with repeat
1 or 2 bytes burst transfers
Multiple addressing modes
Static
Increment
Optional reload of source and destination address at the end of each
Burst
Block
Transaction
Optional Interrupt on end of transaction
Optional connection to CRC Generator module for CRC on EDMA data
9.2 Overview
The four-channel enhanced direct memory access (EDMA) controller can transfer data between memories and peripherals,
and thus offload these tasks from the CPU. It enables high data transfer rates with minimum CPU intervention, and frees up
CPU time. The four EDMA channels enable up to four independent and parallel transfers.
The EDMA controller can move data between SRAM and peripherals, between SRAM locations and directly between
peripheral registers. With access to all peripherals, the EDMA controller can handle automatic transfer of data to/from com-
munication modules. The EDMA controller can also read from EEPROM memory.
Data transfers are done in continuous bursts of 1 or 2 bytes. They build block transfers of configurable size from 1 byte to
64KB. Repeat option can be used to repeat once each block transfer for single transactions up to 128KB. Source and des-
tination addressing can be static or incremental. Automatic reload of source and/or destination addresses can be done
after each burst or block transfer, or when a transaction is complete. Application software, peripherals, and events can trig-
ger EDMA transfers.
The four EDMA channels have individual configuration and control settings. This includes source, destination, transfer trig-
gers, and transaction sizes. They have individual interrupt settings. Interrupt requests can be generated when a transaction
is complete or when the EDMA controller detects an error on an EDMA channel.
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To enable flexibility in transfers, channels can be interlinked so that the second takes over the transfer when the first is
finished.
The EDMA controller supports extended features such as double buffering, data match for peripherals and data search for
SRAM or EEPROM.
The EDMA controller supports two types of channel. Each channel type can be selected individually.
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10. Event System
10.1 Features
System for direct peripheral-to-peripheral communication and signaling
Peripherals can directly send, receive, and react to peripheral events
CPU and EDMA controller independent operation
100% predictable signal timing
Short and guaranteed response time
Synchronous and asynchronous event routing
Eight event channels for up to eight different and parallel signal routing and configurations
Events can be sent and/or used by most peripherals, clock system, and software
Additional functions include
Quadrature decoder with rotary filtering
Digital filtering of I/O pin state with configurable filter
Simultaneous synchronous and asynchronous events provided to peripheral
Works in all sleep modes
10.2 Overview
The event system enables direct peripheral-to-peripheral communication and signaling. It allows a change in one periph-
eral’s state to automatically trigger actions in other peripherals. It is designed to provide a predictable system for short and
predictable response times between peripherals. It allows for autonomous peripheral control and interaction without the
use of interrupts, CPU, or EDMA controller resources, and is thus a powerful tool for reducing the complexity, size and exe-
cution time of application code. It allows for synchronized timing of actions in several peripheral modules. The event system
enables also asynchronous event routing for instant actions in peripherals.
A change in a peripheral’s state is referred to as an event, and usually corresponds to the peripheral’s interrupt conditions.
Events can be directly passed to other peripherals using a dedicated routing network called the event routing network. How
events are routed and used by the peripherals is configured in software.
Figure 10-1 shows a basic diagram of all connected peripherals. The event system can directly connect together analog
and digital converters, analog comparators, I/O port pins, the real-time counter, timer/counters, IR communication module
(IRCOM), and XMEGA Custom Logic (programmable logic) block (XCL). It can also be used to trigger EDMA transactions
(EDMA controller). Events can also be generated from software and peripheral clock.
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Figure 10-1. Event System Overview and Connected Peripherals
The event routing network consists of eight software-configurable multiplexers that control how events are routed and
used. These are called event channels, and allow up to eight parallel event configurations and routing. The maximum rout-
ing latency of an external event is two peripheral clock cycles due to re-synchronization, but several peripherals can directly
use the asynchronous event without any clock delay. The event system works in all power sleep modes, but only asynchro-
nous events can be routed in sleep modes where the system clock is not available.
Timer /
Counters
ADC
Real Time
Counter
CPU /
Software
EDMA
Controller
IRCOM
Event Routing Network
Event
System
Controller
clk
PER
Prescaler
AC
Port Pins
DAC XMEGA
Custom Logic
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11. System Clock and Clock options
11.1 Features
Fast start-up time
Safe run-time clock switching
Internal Oscillators:
32MHz run-time calibrated and tuneable oscillator
8MHz calibrated oscillator with 2MHz output option and fast start-up
32.768kHz calibrated oscillator
32kHz Ultra Low Power (ULP) oscillator with 1kHz output
External clock options
0.4 - 16MHz Crystal Oscillator
32kHz crystal oscillator with digital correction
External clock input in selectable pin location
PLL with 20 - 128MHz output frequency
Internal and external clock options and 1 to 31x multiplication
Lock detector
Clock Prescalers with 1x to 2048x division
Fast peripheral clocks running at two and four times the CPU clock frequency
Automatic Run-Time Calibration of the 32MHz internal oscillator
External oscillator and PLL lock failure detection with optional non maskable interrupt
11.2 Overview
AVR XMEGA E5 devices have a flexible clock system supporting a large number of clock sources. It incorporates both
accurate internal oscillators and external crystal oscillator and resonator support. A high-frequency phase locked loop
(PLL) and clock prescalers can be used to generate a wide range of clock frequencies. A calibration feature (DFLL) is avail-
able, and can be used for automatic run-time calibration of the 32MHz internal oscillator to remove frequency drift over
voltage and temperature. An oscillator failure monitor can be enabled to issue a nonmaskable interrupt and switch to the
internal oscillator if the external oscillator or PLL fails.
When a reset occurs, all clock sources except the 32kHz ultra low power oscillator are disabled. After reset, the device will
always start up running from the 2MHz output of the 8MHz internal oscillator. During normal operation, the system clock
source and prescalers can be changed from software at any time.
Figure 11-1 on page 27 presents the principal clock system in the XMEGA E5 family of devices. Not all of the clocks need
to be active at a given time. The clocks for the CPU and peripherals can be stopped using sleep modes and power reduc-
tion registers, as described in “Power Management and Sleep Modes” on page 29.
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Figure 11-1. The Clock System, Clock Sources, and Clock Distribution
11.3 Clock Sources
The clock sources are divided in two main groups: internal oscillators and external clock sources. Most of the clock sources
can be directly enabled and disabled from software, while others are automatically enabled or disabled, depending on
peripheral settings. After reset, the device starts up running from the 2MHz output of the 8MHz internal oscillator. The other
clock sources, DFLL and PLL, are turned off by default.
The internal oscillators do not require any external components to run. For details on characteristics and accuracy of the
internal oscillators, refer to the device datasheet.
11.3.1 32kHz Ultra Low Power Internal Oscillator
This oscillator provides an approximate 32kHz clock. The 32kHz ultra low power (ULP) internal oscillator is a very low
power clock source, and it is not designed for high accuracy. The oscillator employs a built-in prescaler that provides a
1kHz output. The oscillator is automatically enabled/disabled when it is used as clock source for any part of the device. This
oscillator can be selected as the clock source for the RTC.
Real Time
Counter Peripherals RAM AVR CPU Non-Volatile
Memory
Watchdog
Timer
Brown-out
Detector
System Clock Prescalers
System Clock Multiplexer
(SCLKSEL)
DIV32
32 kHz
Int. ULP
32.768 kHz
Int. OSC
32.768 kHz
TOSC
8MHz
Int. Osc
32 MHz
Int. Osc
0.4 16 MHz
XTAL
DIV32
DIV32
DIV4
PLL
TOSC1
TOSC2
XTAL1
XTAL2
clk
SYS
clk
RTC
clk
PER2
clk
PER
clk
CPU
clk
PER4
PC[4]
XOSCSEL
RTCSRC
PLLSRC
DIV4
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11.3.2 32.768kHz Calibrated Internal Oscillator
This oscillator provides an approximate 32.768kHz clock. It is calibrated during production to provide a default frequency
close to its nominal frequency. The calibration register can also be written from software for run-time calibration of the oscil-
lator frequency. The oscillator employs a built-in prescaler, which provides both a 32.768kHz output and a 1.024kHz
output.
11.3.3 32.768kHz Crystal Oscillator
A 32.768kHz crystal oscillator can be connected between the TOSC1 and TOSC2 pins and enables a dedicated low fre-
quency oscillator input circuit. A low power mode with reduced voltage swing on TOSC2 is available. This oscillator can be
used as a clock source for the system clock and RTC, and as the DFLL reference clock.
11.3.4 0.4 - 16MHz Crystal Oscillator
This oscillator can operate in four different modes optimized for different frequency ranges, all within 0.4 - 16MHz.
11.3.5 8MHz Calibrated Internal Oscillator
The 8MHz calibrated internal oscillator is the default system clock source after reset. It is calibrated during production to
provide a default frequency close to its nominal frequency. The calibration register can also be written from software for
run-time calibration of the oscillator frequency,e.g.tocompensatefortemperatureinducedfrequencydriftorwhenrun
ningatadifferentsupplyvoltagethantheoscillatoriscalibratedatinproduction. The oscillator employs a built-in
prescaler, with 2MHz output. The default output frequency at start-up and after reset is 2MHz. A low power mode option
can be used to enable fast system wake-up from power-save mode. In all other modes, the low power mode can be
enabled to significantly reduce the power consumption of the internal oscillator.
11.3.6 32MHz Run-time Calibrated Internal Oscillator
The 32MHz run-time calibrated internal oscillator is a high-frequency oscillator. It is calibrated during production to provide
a default frequency close to its nominal frequency. A digital frequency looked loop (DFLL) can be enabled for automatic
run-time calibration of the oscillator to compensate for temperature and voltage drift and optimize the oscillator accuracy.
This oscillator can also be adjusted and calibrated to any frequency between 30 and 55MHz.
11.3.7 External Clock Sources
The XTAL1 and XTAL2 pins can be used to drive an external oscillator, either a quartz crystal or a ceramic resonator.
XTAL1 or pin 4 of port C (PC4) can be used as input for an external clock signal. The TOSC1 and TOSC2 pins are dedi-
cated to driving a 32.768kHz crystal oscillator.
11.3.8 PLL with 1x-31x Multiplication Factor
The built-in phase locked loop (PLL) can be used to generate a high-frequency system clock. The PLL has a user-select-
able multiplication factor of from 1 to 31. In combination with the prescalers, this gives a wide range of output frequencies
from all clock sources.
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12. Power Management and Sleep Modes
12.1 Features
Power management for adjusting power consumption and functions
Five sleep modes
Idle
Power down
Power save
Standby
Extended standby
Power reduction register to disable clock and turn off unused peripherals in active and idle modes
12.2 Overview
Various sleep modes and clock gating are provided in order to tailor power consumption to application requirements. This
enables the AVR XMEGA microcontroller to stop unused modules to save power.
All sleep modes are available and can be entered from active mode. In active mode, the CPU is executing application code.
When the device enters sleep mode, program execution is stopped and interrupts or a reset is used to wake the device
again. The application code decides which sleep mode to enter and when. Interrupts from enabled peripherals and all
enabled reset sources can restore the microcontroller from sleep to active mode.
In addition, power reduction registers provide a method to stop the clock to individual peripherals from software. When this
is done, the current state of the peripheral is frozen, and there is no power consumption from that peripheral. This reduces
the power consumption in active mode and idle sleep modes and enables much more fine-tuned power management than
sleep modes alone.
12.3 Sleep Modes
Sleep modes are used to shut down modules and clock domains in the microcontroller in order to save power. XMEGA
microcontrollers have five different sleep modes tuned to match the typical functional stages during application execution.
A dedicated sleep instruction (SLEEP) is available to enter sleep mode. Interrupts are used to wake the device from sleep,
and the available interrupt wake-up sources are dependent on the configured sleep mode. When an enabled interrupt
occurs, the device will wake up and execute the interrupt service routine before continuing normal program execution from
the first instruction after the SLEEP instruction. If other, higher priority interrupts are pending when the wake-up occurs,
their interrupt service routines will be executed according to their priority before the interrupt service routine for the wake-up
interrupt is executed. After wake-up, the CPU is halted for four cycles before execution starts.
The content of the register file, SRAM and registers are kept during sleep. If a reset occurs during sleep, the device will
reset, start up, and execute from the reset vector.
12.3.1 Idle Mode
In idle mode the CPU and nonvolatile memory are stopped (note that any ongoing programming will be completed), but all
peripherals, including the interrupt controller, event system and EDMA controller are kept running. Any enabled interrupt
will wake the device.
12.3.2 Power-down Mode
In power-down mode, all clocks, including the real-time counter clock source, are stopped. This allows operation only of
asynchronous modules that do not require a running clock. The only interrupts that can wake up the MCU are the two-wire
interface address match interrupt and asynchronous port interrupts.
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12.3.3 Power-save Mode
Power-save mode is identical to power down, with one exception. If the real-time counter (RTC) is enabled, it will keep run-
ning during sleep, and the device can also wake up from either an RTC overflow or compare match interrupt. Low power
mode option of 8MHz internal oscillator enables instant oscillator wake-up time. This reduces the MCU wake-up time or
enables the MCU wake-up from UART bus.
12.3.4 Standby Mode
Standby mode is identical to power down, with the exception that the enabled system clock sources are kept running while
the CPU, peripheral, and RTC clocks are stopped. This reduces the wake-up time. The low power option of 8MHz internal
oscillator can be enabled to further reduce the power consumption.
12.3.5 Extended Standby Mode
Extended standby mode is identical to power-save mode, with the exception that the enabled system clock sources are
kept running while the CPU and peripheral clocks are stopped. This reduces the wake-up time. The low power option of
8MHz internal oscillator can be enabled to further reduce the power consumption.
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13. System Control and Reset
13.1 Features
Reset the microcontroller and set it to initial state when a reset source goes active
Multiple reset sources that cover different situations
Power-on reset
External reset
Watchdog reset
Brownout reset
PDI reset
Software reset
Asynchronous operation
No running system clock in the device is required for reset
Reset status register for reading the reset source from the application code
13.2 Overview
The reset system issues a microcontroller reset and sets the device to its initial state. This is for situations where operation
should not start or continue, such as when the microcontroller operates below its power supply rating. If a reset source
goes active, the device enters and is kept in reset until all reset sources have released their reset. The I/O pins are immedi-
ately tri-stated. The program counter is set to the reset vector location, and all I/O registers are set to their initial values.
The SRAM content is kept. However, if the device accesses the SRAM when a reset occurs, the content of the accessed
location can not be guaranteed.
After reset is released from all reset sources, the default oscillator is started and calibrated before the device starts running
from the reset vector address. By default, this is the lowest program memory address, 0, but it is possible to move the reset
vector to the lowest address in the boot section.
The reset functionality is asynchronous, and so no running system clock is required to reset the device. The software reset
feature makes it possible to issue a controlled system reset from the user software.
The reset status register has individual status flags for each reset source. It is cleared at power-on reset, and shows which
sources have issued a reset since the last power-on.
13.3 Reset Sequence
A reset request from any reset source will immediately reset the device and keep it in reset as long as the request is active.
When all reset requests are released, the device will go through three stages before the device starts running again:
Reset counter delay
Oscillator startup
Oscillator calibration
If another reset requests occurs during this process, the reset sequence will start over again.
13.4 Reset Sources
13.4.1 Power-on Reset
A power-on reset (POR) is generated by an on-chip detection circuit. The POR is activated when the VCC rises and reaches
the POR threshold voltage (VPOT), and this will start the reset sequence.
The POR is also activated to power down the device properly when the VCC falls and drops below the VPOT level. The VPOT
level is higher for falling VCC than for rising VCC. Consult the datasheet for POR characteristics data.
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13.4.2 Brownout Detection
The on-chip brownout detection (BOD) circuit monitors the VCC level during operation by comparing it to a fixed, program-
mable level that is selected by the BODLEVEL fuses. If disabled, BOD is forced on at the lowest level during chip erase and
when the PDI is enabled.
13.4.3 External Reset
The external reset circuit is connected to the external RESET pin. The external reset will trigger when the RESET pin is
driven below the RESET pin threshold voltage, VRST, for longer than the minimum pulse period, tEXT. The reset will be held
as long as the pin is kept low. The RESET pin includes an internal pull-up resistor.
13.4.4 Watchdog Reset
The watchdog timer (WDT) is a system function for monitoring correct program operation. If the WDT is not reset from the
software within a programmable timeout period, a watchdog reset will be given. The watchdog reset is active for one to two
clock cycles of the 2MHz internal oscillator. For more details, see “WDT – Watchdog Timer” on page 33.
13.4.5 Software Reset
The software reset makes it possible to issue a system reset from software by writing to the software reset bit in the reset
control register. The reset will be issued within two CPU clock cycles after writing the bit. It is not possible to execute any
instruction from when a software reset is requested until it is issued.
13.4.6 Program and Debug Interface Reset
The program and debug interface reset contains a separate reset source that is used to reset the device during external
programming and debugging. This reset source is accessible only from external debuggers and programmers.
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14. WDT – Watchdog Timer
14.1 Features
Issues a device reset if the timer is not reset before its timeout period
Asynchronous operation from dedicated oscillator
1kHz output of the 32kHz ultra low power oscillator
11 selectable timeout periods, from 8ms to 8s
Two operation modes:
Normal mode
Window mode
Configuration lock to prevent unwanted changes
14.2 Overview
The watchdog timer (WDT) is a system function for monitoring correct program operation. It makes it possible to recover
from error situations such as runaway or deadlocked code. The WDT is a timer, configured to a predefined timeout period,
and is constantly running when enabled. If the WDT is not reset within the timeout period, it will issue a microcontroller
reset. The WDT is reset by executing the WDR (watchdog timer reset) instruction from the application code.
The window mode makes it possible to define a time slot or window inside the total timeout period during which WDT must
be reset. If the WDT is reset outside this window, either too early or too late, a system reset will be issued. Compared to the
normal mode, this can also catch situations where a code error causes constant WDR execution.
The WDT will run in active mode and all sleep modes, if enabled. It is asynchronous, runs from a CPU-independent clock
source, and will continue to operate to issue a system reset even if the main clocks fail.
The configuration change protection mechanism ensures that the WDT settings cannot be changed by accident. For
increased safety, a fuse for locking the WDT settings is also available.
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15. Interrupts and Programmable Multilevel Interrupt Controller
15.1 Features
Short and predictable interrupt response time
Separate interrupt configuration and vector address for each interrupt
Programmable multilevel interrupt controller
Interrupt prioritizing according to level and vector address
Three selectable interrupt levels for all interrupts: low, medium, and high
Selectable, round-robin priority scheme within low-level interrupts
Non-maskable interrupts for critical functions
Interrupt vectors optionally placed in the application section or the boot loader section
15.2 Overview
Interrupts signal a change of state in peripherals, and this can be used to alter program execution. Peripherals can have
one or more interrupts, and all are individually enabled and configured. When an interrupt is enabled and configured, it will
generate an interrupt request when the interrupt condition is present. The programmable multilevel interrupt controller
(PMIC) controls the handling and prioritizing of interrupt requests. When an interrupt request is acknowledged by the PMIC,
the program counter is set to point to the interrupt vector, and the interrupt handler can be executed.
All peripherals can select between three different priority levels for their interrupts: low, medium, and high. Interrupts are
prioritized according to their level and their interrupt vector address. Medium-level interrupts will interrupt low-level interrupt
handlers. High-level interrupts will interrupt both medium- and low-level interrupt handlers. Within each level, the interrupt
priority is decided from the interrupt vector address, where the lowest interrupt vector address has the highest interrupt pri-
ority. Low-level interrupts have an optional round-robin scheduling scheme to ensure that all interrupts are serviced within
a certain amount of time.
Non-maskable interrupts (NMI) are also supported, and can be used for system critical functions.
15.3 Interrupt Vectors
The interrupt vector is the sum of the peripheral’s base interrupt address and the offset address for specific interrupts in
each peripheral. The base addresses for the AVR XMEGA E5 devices are shown in Table 15-1. Offset addresses for each
interrupt available in the peripheral are described for each peripheral in the XMEGA AU manual. For peripherals or mod-
ules that have only one interrupt, the interrupt vector is shown in Table 15-1. The program address is the word address.
Table 15-1. Peripheral Module Address Map
Program address
(base address) Source Interrupt description
0x0000 RESET
0x0002 OSCF_INT_vect Crystal oscillator failure and PLL lock failure interrupt vector (NMI)
0x0004 PORTR_INT_vect Port R Interrupt vector
0x0006 EDMA_INT_base EDMA Controller Interrupt base
0x000E RTC_INT_base Real time counter interrupt base
0x0012 PORTC_INT_vect Port C interrupt vector
0x0014 TWIC_INT_base Two-wire interface on Port C interrupt base
0x0018 TCC4_INT_base Timer/counter 4 on port C interrupt base
0x0024 TCC5_INT_base Timer/counter 5 on port C interrupt base
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0x002C SPIC_INT_vect SPI on port C interrupt vector
0x002E USARTC0_INT_base USART 0 on port C interrupt base
0x0034 NVM_INT_base Non-Volatile Memory interrupt base
0x0038 XCL_INT_base XCL (programmable logic) module interrupt base
0x003C PORTA_INT_vect Port A interrupt vector
0x003E ACA_INT_base Analog comparator on Port A interrupt base
0x0044 ADCA_INT_base Analog to digital converter on Port A interrupt base
0x0046 PORTD_INT_vect Port D interrupt vector
0x0048 TCD5_INT_base Timer/counter 5 on port D interrupt base
0x0050 USARTD0_INT_base USART 0 on port D interrupt base
Program address
(base address) Source Interrupt description
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16. I/O Ports
16.1 Features
26 general purpose input and output pins with individual configuration
Output driver with configurable driver and pull settings:
Totem-pole
Wired-AND
Wired-OR
Bus-keeper
Inverted I/O
Input with asynchronous sensing with interrupts and events
Sense both edges
Sense rising edges
Sense falling edges
Sense low level
Optional pull-up and pull-down resistor on input and Wired-OR/AND configurations
Optional slew rate control per I/O port
Asynchronous pin change sensing that can wake the device from all sleep modes
One port interrupt with pin masking per I/O port
Efficient and safe access to port pins
Hardware read-modify-write through dedicated toggle/clear/set registers
Configuration of multiple pins in a single operation
Mapping of port registers into bit-accessible I/O memory space
Peripheral clocks output on port pin
Real-time counter clock output to port pin
Event channels can be output on port pin
Remapping of digital peripheral pin functions
Selectable USART and timer/counters input/output pin locations
Selectable Analog Comparator output pin locations
16.2 Overview
One port consists of up to eight pins ranging from pin 0 to 7. Each port pin can be configured as input or output with config-
urable driver and pull settings. They also implement asynchronous input sensing with interrupt and events for selectable
pin change conditions.
Asynchronous pin-change sensing means that a pin change can wake the device from all sleep modes, including the
modes where no clocks are running.
All functions are individual and configurable per pin, but several pins can be configured in a single operation. The pins have
hardware read-modify-write (RMW) functionality for safe and correct change of drive value and/or pull resistor configura-
tion. The direction of one port pin can be changed without unintentionally changing the direction of any other pin.
The port pin configuration also controls input and output selection of other device functions. It is possible to have both the
peripheral clock and the real-time clock output to a port pin, and available for external use. The same applies to events
from the event system that can be used to synchronize and control external functions. Other digital peripherals, such as
USART, timer/counters, and analog comparator output can be remapped to selectable pin locations in order to optimize
pin-out versus application needs.
The notations of the ports are PORTA, PORTC, PORTD, and PORTR.
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16.3 Output Driver
All port pins (Pxn) have programmable output configuration. The port pins also have configurable slew rate limitation to
reduce electromagnetic emission.
16.3.1 Push-pull
Figure 16-1. I/O Configuration - Totem-pole
16.3.2 Pull-down
Figure 16-2. I/O Configuration - Totem-pole with Pull-down (on input)
16.3.3 Pull-up
Figure 16-3. I/O Configuration - Totem-pole with Pull-up (on input)
INxn
OUTxn
DIRxn
Pxn
INxn
OUTxn
DIRxn
Pxn
INxn
OUTxn
DIRxn
Pxn
(E fi/l ,,7 W x W ,.11{ + i % fl 4 g g
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16.3.4 Bus-keeper
The bus-keeper’s weak output produces the same logical level as the last output level. It acts as a pull-up if the last level
was ‘1’, and pull-down if the last level was ‘0’.
Figure 16-4. I/O Configuration - Totem-pole with Bus-keeper
16.3.5 Others
Figure 16-5. Output Configuration - Wired-OR with Optional Pull-down
Figure 16-6. I/O Configuration - Wired-AND with Optional Pull-up
INxn
OUTxn
DIRxn
Pxn
INxn
OUTxn
Pxn
INxn
OUTxn
Pxn
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16.4 Input Sensing
Input sensing is synchronous or asynchronous depending on the enabled clock for the ports, and the configuration is
shown in Figure 16-7.
Figure 16-7. Input Sensing System Overview
When a pin is configured with inverted I/O, the pin value is inverted before the input sensing.
16.5 Alternate Port Functions
Most port pins have alternate pin functions in addition to being a general purpose I/O pin. When an alternate function is
enabled, it might override the normal port pin function or pin value. This happens when other peripherals that require pins
are enabled or configured to use pins. If and how a peripheral will override and use pins is described in the section for that
peripheral. “Pinout and Pin Functions” on page 64 shows which modules on peripherals that enable alternate functions on
a pin, and which alternate functions that are available on a pin.
DQ
R
INVERTED I/O
Interrupt
Control
DQ
R
Pxn Synchronizer
INn EDGE
DETECT
Synchronous sensing
EDGE
DETECT
Asynchronous sensing
IRQ
Synchronous
Events
Asynchronous
Events
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17. Timer Counter Type 4 and 5
17.1 Features
Three 16-bit timer/counter
One timer/counter of type 4
Two timer/counter of type 5
32-bit timer/counter support by cascading two timer/counters
Up to four compare or capture (CC) channels
Four CC channels for timer/counters of type 4
Two CC channels for timer/counters of type 5
Double buffered timer period setting
Double buffered CC channels
Waveform generation modes:
Frequency generation
Single-slope pulse width modulation
Dual-slope pulse width modulation
Input capture:
Input capture with noise cancelling
Frequency capture
Pulse width capture
32-bit input capture
Timer overflow and error interrupts/events
One compare match or input capture interrupt/event per CC channel
Can be used with event system for:
Quadrature decoding
Count and direction control
Input capture
Can be used with EDMA and to trigger EDMA transactions
High-resolution extension
Increases frequency and waveform resolution by 4x (2-bit) or 8x (3-bit)
Waveform extension
Low- and high-side output with programmable dead-time insertion (DTI)
Fault extention
Event controlled fault protection for safe disabling of drivers
17.2 Overview
AVR XMEGA devices have a set of flexible, 16-bit timer/counters (TC). Their capabilities include accurate program execu-
tion timing, frequency and waveform generation, and input capture with time and frequency measurement of digital signals.
Two timer/counters can be cascaded to create a 32-bit timer/counter with optional 32-bit input capture.
A timer/counter consists of a base counter and a set of compare or capture (CC) channels. The base counter can be used
to count clock cycles or events. It has direction control and period setting that can be used for timing. The CC channels can
be used together with the base counter to do compare match control, frequency generation, and pulse width modulation
(PWM) generation, as well as various input capture operations. A timer/counter can be configured for either capture, com-
pare, or capture and compare function.
A timer/counter can be clocked and timed from the peripheral clock with optional prescaling, or from the event system. The
event system can also be used for direction control, input capture trigger, or to synchronize operations.
[2.523 53.: 3.5.5 “2.3.8 .dqu Compare/Capture Channel
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There are two differences between timer/counter type 4 and type 5. Timer/counter 4 has four CC channels, and timer/coun-
ter 5 has two CC channels. Both timer/counter 4 and 5 can be set in 8-bit mode, allowing the application to double the
number of compare and capture channels that then get 8-bit resolution.
Some timer/counters have extensions that enable more specialized waveform generation. The waveform extension (WeX)
is intended for motor control, ballast, LED, H-bridge, power converters, and other types of power control applications. It
enables more customized waveform output distribution, and low- and high-side channel output with optional dead-time
insertion. It can also generate a synchronized bit pattern across the port pins. The high-resolution (hi-res) extension can
increase the waveform resolution by four or eight times by using an internal clock source four times faster than the periph-
eral clock. The fault extension (FAULT) enables fault protection for safe and deterministic handling, disabling and/or shut
down of external drivers.
A block diagram of the 16-bit timer/counter with extensions and closely related peripheral modules (in grey) is shown in Fig-
ure 17-1.
Figure 17-1. 16-bit Timer/counter and Closely Related Peripherals
PORTC has one timer/counter 4 and one timer/counter 5. PORTD has one timer/counter 5. Notation of these are TCC4
(timer/counter C4), TCC5, and TCD5, respectively.
XEEXfiEXE
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18. WeX – Waveform Extension
18.1 Features
Module for more customized and advanced waveform generation
Optimized for various type of motor, ballast, and power stage control
Output matrix for timer/counter waveform output distribution
Configurable distribution of compare channel output across port pins
Redistribution of dead-time insertion resource between TC4 and TC5
Four dead-time insertion (DTI) units, each with
Complementary high and low side with non overlapping outputs
Separate dead-time setting for high and low side
8-bit resolution
Four swap (SWAP) units
Separate port pair or low high side drivers swap
Double buffered swap feature
Pattern generation creating synchronized bit pattern across the port pins
Double buffered pattern generation
18.2 Overview
The waveform extension (WEX) provides extra functions to the timer/counter in waveform generation (WG) modes. It is pri-
marily intended for motor control, ballast, LED, H-bridge, power converters, and other types of power control applications.
The WEX consist of five independent and successive units, as shown in Figure 18-1.
Figure 18-1. Waveform Extension and Closely Related Peripherals
The output matrix (OTMX) can distribute and route out the waveform outputs from timer/counter 4 and 5 across the port
pins in different configurations, each optimized for different application types. The dead time insertion (DTI) unit splits the
four lower OTMX outputs into a two non-overlapping signals, the non-inverted low side (LS) and inverted high side (HS) of
the waveform output with optional dead-time insertion between LS and HS switching.
The swap (SWAP) unit can swap the LS and HS pin position. This can be used for fast decay motor control. The pattern
generation unit generates synchronized output waveform with constant logic level. This can be used for easy stepper motor
and full bridge control.
SWAP1DTI1
SWAP1DTI1
SWAP1DTI1
SWAP1DTI1
Pattern Generator
Output Matrix
WEX
Px7
Px6
Px5
Px4
Px3
Px2
Px1
Px0
Fault
Unit 5
Fault
Unit 4
T/C4
T/C5
OUTOVDIS
HIRES
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The output override disable unit can disable the waveform output on selectable port pins to optimize the pins usage. This is
to free the pins for other functional use, when the application does not need the waveform output spread across all the port
pins as they can be selected by the OTMX configurations.
The waveform extension is available for TCC4 and TCC5. The notation of this is WEXC.
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19. Hi-Res – High Resolution Extension
19.1 Features
Increases waveform generator resolution up to 8x (three bits)
Supports frequency, single-slope PWM, and dual-slope PWM generation
Supports the WeX when this is used for the same timer/counter
19.2 Overview
The high-resolution (hi-res) extension can be used to increase the resolution of the waveform generation output from a
timer/counter by four or eight. It can be used for a timer/counter doing frequency, single-slope PWM, or dual-slope PWM
generation. It can also be used with the WeX if this is used for the same timer/counter.
The hi-res extension uses the peripheral 4x clock (ClkPER4). The system clock prescalers must be configured so the
peripheral 4x clock frequency is four times higher than the peripheral and CPU clock frequency when the hi-res extension
is enabled.
There is one hi-res extension that can be enabled for timer/counters pair on PORTC. The notation of this is HIRESC.
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20. Fault Extension
20.1 Features
Connected to timer/counter output and waveform extension input
Event controlled fault protection for instant and predictable fault triggering
Fast, synchronous and asynchronous fault triggering
Flexible configuration with multiple fault sources
Recoverable fault modes
Restart or halt the timer/counter on fault condition
Timer/counter input capture on fault condition
Waveform output active time reduction on fault condition
Non-recoverable faults
Waveform output is forced to a pre-configured safe state on fault condition
Optional fuse output value configuration defining the output state during system reset
Flexible fault filter selections
Digital filter to prevent false triggers from I/O pin glitches
Fault blanking to prevent false triggers during commutation
Fault input qualification to filter the fault input during the inactive output compare states
20.2 Overview
The fault extension enables event controlled fault protection by acting directly on the generated waveforms from timer/
counter compare outputs. It can be used to trigger two types of faults with the following actions:
Recoverable faults: the timer/counter can be restarted or halted as long as the fault condition is preset. The compare
output pulse active time can be reduced as long as the fault condition is preset. This is typically used for current sensing
regulation, zero crossing re-triggering, demagnetization re-triggering, and so on.
Non-recoverable faults: the compare outputs are forced to a safe and pre-configured values that are safe for the
application. This is typically used for instant and predictable shut down and to disable the high current or voltage drivers.
Events are used to trigger a fault condition. One or several simultaneous events are supported, both synchronously or
asynchronously. By default, the fault extension supports asynchronous event operation, ensuring predictable and instant
fault reaction, including system power modes where the system clock is stopped.
By using the input blanking, the fault input qualification or digital filter option in event system, the fault sources can be fil-
tered to avoid false faults detection.
There are two fault extensions, one for each of the timer/counter 4 and timer/counter 5 on PORTC. The notation of these
are FAULTC4 and FAULTC5, respectively.
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21. RTC – 16-bit Real-Time Counter
21.1 Features
16-bit resolution
Selectable clock source
32.768kHz external crystal
External clock
32.768kHz internal oscillator
32kHz internal ULP oscillator
Programmable 10-bit clock prescaling
One compare register
One period register
Clear counter on period overflow
Optional interrupt/event on overflow and compare match
Correction for external crystal oscillator frequency error down to ±0.5ppm accuracy
21.2 Overview
The 16-bit real-time counter (RTC) is a counter that typically runs continuously, including in low power sleep modes, to
keep track of time. It can wake up the device from sleep modes and/or interrupt the device at regular intervals.
The reference clock is typically the 1.024kHz output from a high-accuracy crystal of 32.768kHz, and this is the configuration
most optimized for low power consumption. The faster 32.768kHz output can be selected if the RTC needs a resolution
higher than 1ms. The RTC can also be clocked from an external clock signal, the 32.768kHz internal oscillator or the 32kHz
internal ULP oscillator.
The RTC includes a 10-bit programmable prescaler that can scale down the reference clock before it reaches the counter.
A wide range of resolutions and time-out periods can be configured. With a 32.768kHz clock source, the maximum resolu-
tion is 30.5μs, and time-out periods can range up to 2000 seconds. With a resolution of 1s, the maximum timeout period is
more than 18 hours (65536 seconds). The RTC can give a compare interrupt and/or event when the counter equals the
compare register value, and an overflow interrupt and/or event when it equals the period register value.
IHIEI
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Figure 21-1. Real-time Counter Overview
The RTC also supports correction when operated using external 32.768 kHz crystal oscillator. An externally calibrated
value will be used for correction. The calibration can be done by measuring the default RTC frequency relative to a more
accurate clock input to the device as system clock. The RTC can be calibrated to an accuracy of ±0.5ppm. The RTC cor-
rection operation will either speed up (by skipping count) or slow down (adding extra cycles) the prescaler to account for
the crystal oscillator error.
32.768 kHz Crystal
Osc
32.768 kHz Int. Osc
TOSC1
TOSC2
External Clock
DIV32
32 kHz int ULP
(DIV32)
RTCSRC
clk
RTC
CNT
PER
COMP
=
=
”match”/
Compare
TOP/
Overflow
CALIB
Correction
Counter
Hold Count
DIV32
10-bit
prescaler
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22. TWI – Two-Wire Interface
22.1 Features
One two-wire interface
Phillips I2C compatible
System Management Bus (SMBus) compatible
Bus master and slave operation supported
Slave operation
Single bus master operation
Bus master in multi-master bus environment
Multi-master arbitration
Bridge mode with independent and simultaneous master and slave operation
Flexible slave address match functions
7-bit and general call address recognition in hardware
10-bit addressing supported
Address mask register for dual address match or address range masking
Optional software address recognition for unlimited number of addresses
Slave can operate in all sleep modes, including power-down
Slave address match can wake device from all sleep modes
100kHz, 400kHz, and 1MHz bus frequency support
Slew-rate limited output drivers
Input filter for bus noise and spike suppression
Support arbitration between start/repeated start and data bit (SMBus)
Slave arbitration allows support for address resolve protocol (ARP) (SMBus)
Supports SMBUS Layer 1 timeouts
Configurable timeout values
Independent timeout counters in master and slave (Bridge mode support)
22.2 Overview
The two-wire interface (TWI) is a bidirectional, two-wire communication interface. It is I2C and System Management Bus
(SMBus) compatible. The only external hardware needed to implement the bus is one pull-up resistor on each bus line.
A device connected to the bus must act as a master or a slave. One bus can have many slaves and one or several masters
that can take control of the bus.
The TWI module supports master and slave functionality. The master and slave functionality are separated from each
other, and can be enabled and operate simultaneously and separately. The master module supports multi-master bus
operation and arbitration. It contains the baud rate generator. Quick command and smart mode can be enabled to auto-trig-
ger operations and reduce software complexity. The master can support 100kHz, 400kHz, and 1MHz bus frequency.
The slave module implements 7-bit address match and general address call recognition in hardware. 10-bit addressing is
also supported. A dedicated address mask register can act as a second address match register or as a register for address
range masking. The slave continues to operate in all sleep modes, including power-down mode. This enables the slave to
wake up the device from all sleep modes on TWI address match. It is possible to disable the address matching to let this be
handled in software instead. By using the bridge option, the slave can be mapped to different pin locations. The master and
slave can support 100kHz, 400kHz, and 1MHz bus frequency.
The TWI module will detect START and STOP conditions, bus collisions, and bus errors. Arbitration lost, errors, collision,
and clock hold on the bus are also detected and indicated in separate status flags available in both master and slave
modes.
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It is possible to disable the TWI drivers in the device, and enable a four-wire digital interface for connecting to an external
TWI bus driver. This can be used for applications where the device operates from a different VCC voltage than used by the
TWI bus.
It is also possible to enable the bridge mode. In this mode, the slave I/O pins are selected from an alternative port, enabling
independent and simultaneous master and slave operation.
PORTC has one TWI. Notation of this peripheral is TWIC. Alternative TWI Slave location in bridge mode is on PORTD.
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23. SPI – Serial Peripheral Interface
23.1 Features
One SPI peripheral
Full-duplex, three-wire synchronous data transfer
Master or slave operation
lsb first or msb first data transfer
Eight programmable bit rates
Interrupt flag at the end of transmission
Write collision flag to indicate data collision
Wake up from idle sleep mode
Double speed master mode
23.2 Overview
The Serial Peripheral Interface (SPI) is a high-speed, full duplex, synchronous data transfer interface using three or four
pins. It allows fast communication between an AVR XMEGA device and peripheral devices or between several
microcontrollers.
A device connected to the bus must act as a master or slave. The master initiates and controls all data transactions. The
interconnection between master and slave devices with SPI is shown in Figure 23-1. The system consists of two shift reg-
isters and a clock generator. The SPI master initiates the communication by pulling the slave select (SS) signal low for the
desired slave. Master and slave prepare the data to be sent in their respective shift registers, and the master generates the
required clock pulses on the SCK line to interchange data. Data are always shifted from master to slave on the master out-
put, slave input (MOSI) line, and from slave to master on the master input, slave output (MISO) line. After each data packet,
the master can synchronize the slave by pulling the SS line high.
Figure 23-1. SPI Master-slave Interconnection
By default, the SPI module is single buffered and transmit direction and double buffered in the receive direction. A byte writ-
ten to the transmit data register will be copied to the shift register when a full character has been received. When receiving
data, a received character must be read from the transmit data register before the third character has been completely
shifted in to avoid losing data. Optionally, buffer modes can be enabled. When used, one buffer is available for transmitter
and a double buffer for reception.
PORTC has one SPI. Notation of this is SPIC.
8-bit Shift Register
msb
Transmit Data Register
(DATA)
Receive Buffer Register
Receive Data Register
(DATA)
MOSI lsb
MISO
SCK
SS
SLAVE
8-bit Shift Register
msb
Transmit Data Register
(DATA)
Receive Buffer Register
Receive Data Register
(DATA)
MOSI
lsb MISO
SCK
SS
MASTER
SPI CLOCK
GENERATOR
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24. USART
24.1 Features
Two identical USART peripherals
Full-duplex or one-wire half-duplex operation
Asynchronous or synchronous operation
Synchronous clock rates up to 1/2 of the device clock frequency
Asynchronous clock rates up to 1/8 of the device clock frequency
Supports serial frames with:
5, 6, 7, 8, or 9 data bits
Optionally even and odd parity bits
1 or 2 stop bits
Fractional baud rate generator
Can generate desired baud rate from any system clock frequency
No need for external oscillator with certain frequencies
Built-in error detection and correction schemes
Odd or even parity generation and parity check
Data overrun and framing error detection
Noise filtering includes false start bit detection and digital low-pass filter
Separate interrupts for
Transmit complete
Transmit data register empty
Receive complete
Multiprocessor communication mode
Addressing scheme to address a specific devices on a multidevice bus
Enable unaddressed devices to automatically ignore all frames
System wake-up from Start bit
Master SPI mode
Double buffered operation
Configurable data order
Operation up to 1/2 of the peripheral clock frequency
IRCOM module for IrDA compliant pulse modulation/demodulation
One USART is connected to XMEGA Custom Logic (XCL) module:
Extend serial frame length up to 256 bit by using the peripheral counter
Modulate/demodulate data within the frame by using the glue logic outputs
24.2 Overview
The universal synchronous and asynchronous serial receiver and transmitter (USART) is a fast and flexible serial commu-
nication module. The USART supports full-duplex with asynchronous and synchronous operation and single wire half-
duplex communication with asynchronous operation. The USART can be configured to operate in SPI master mode and
used for SPI communication.
Communication is frame based, and the frame format can be customized to support a wide range of standards. The
USART is buffered in both directions, enabling continued data transmission without any delay between frames. Separate
interrupts for receive and transmit complete enable fully interrupt driven communication. Frame error and buffer overflow
are detected in hardware and indicated with separate status flags. Even or odd parity generation and parity check can also
be enabled.
In one-wire configuration, the TxD pin is connected to the RxD pin internally, limiting the IO pins usage. If the receiver is
enabled when transmitting, it will receive what the transmitter is sending. This mode can be used for bit error detection.
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The clock generator includes a fractional baud rate generator that is able to generate a wide range of USART baud rates
from any system clock frequencies. This removes the need to use an external crystal oscillator with a specific frequency to
achieve a required baud rate. It also supports external clock input in synchronous slave operation.
An IRCOM module can be enabled for one USART to support IrDA 1.4 physical compliant pulse modulation and demodu-
lation for baud rates up to 115.2Kbps.
One USART can be connected to the XMEGA Custom Logic module (XCL). When used with the XCL, the data length
within an USART/SPI frame can be controlled by the peripheral counter (PEC) within the XCL. This enables configurable
frame length up to 256 bits. In addition, the TxD/RxD data can be encoded/decoded before the signal is fed into the USART
receiver, or after the signal is output from transmitter when the USART is connected to XCL LUT outputs.
When the USART is set in master SPI mode, all USART-specific logic is disabled, leaving the transmit and receive buffers,
shift registers, and baud rate generator enabled. The registers are used in both modes, but their functionality differs for
some control settings. Pin control and interrupt generation are identical in both modes.
PORTC and PORTD each has one USART. Notation of these peripherals are USARTC0 and USARTD0, respectively.
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25. IRCOM – IR Communication Module
25.1 Features
Pulse modulation/demodulation for infrared communication
IrDA compatible for baud rates up to 115.2Kbps
Selectable pulse modulation scheme
3/16 of the baud rate period
Fixed pulse period, 8-bit programmable
Pulse modulation disabled
Built-in filtering
Can be connected to and used by any USART
25.2 Overview
AVR XMEGA devices contain an infrared communication module (IRCOM) that is IrDA compatible for baud rates up to
115.2Kbps. It can be connected to any USART to enable infrared pulse encoding/decoding for that USART.
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26. XCL – XMEGA Custom Logic Module
26.1 Features
Two independent 8-bit timer/counter with:
Period and compare channel for each timer/counter
Input Capture for each timer
Serial peripheral data length control for each timer
Timeout support for each timer
Timer underflow interrupt/event
Compare match or input capture interrupt/event for each timer
One 16-bit timer/counter by cascading two 8-bit timer/counters with:
Period and compare channel
Input capture
Timeout support
Timer underflow interrupt/event
Compare match or input capture interrupt/event
Programmable lookup table supporting multiple configurations:
Two 2-input units
One 3-input unit
RS configuration
Duplicate input with selectable delay on one input or output
Connection to external I/O pins, event system or one selectable USART
Combinatorial Logic Functions using programmable truth table:
AND, NAND, OR, NOR, XOR, XNOR, NOT, MUX
Sequential Logic Functions:
D-Flip-Flop, D Latch, RS Latch
Input sources:
From external pins or the event system
One input source includes selectable delay or synchronizing option
Can be shared with selectable USART pin locations
Outputs:
Available on external pins or event system
Includes selectable delay or synchronizing option
Can override selectable USART pin locations
Operates in active mode and all sleep modes
26.2 Overview
The XMEGA Custom Logic module (XCL) consists of two sub-units, each including 8-bit timer/counter with flexible settings,
peripheral counter working with one software selectable USART module, delay elements, glue logic with programmable
truth table and a global logic interconnect array.
The timer/counter configuration allows for two 8-bits timer/counters. Each timer/counter supports normal, compare and
input capture operation, with common flexible clock selections and event channels for each timer. By cascading the two 8-
bit timer/counters, the XCL can be used as a 16-bit timer/counter.
The peripheral counter (PEC) configuration, the XCL is connected to one software selectable USART. This USART con-
trols the counter operation, and the PEC can optionally control the data length within the USART frame.
The glue logic configuration, the XCL implements two programmable lookup tables (LUTs). Each defines the truth table
corresponding to the logical condition between two inputs. Any combinatorial function logic is possible. The LUT inputs can
be connected to I/O pins or event system channels. If the LUT is connected to the USART0 pin locations, the data lines
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(TXD/RXD) data encoding/decoding will be possible. Connecting together the LUT units, RS Latch, or any combinatorial
logic between two operands or three inputs can be enabled.
The LUT works in all sleep modes. Combined with event system and one I/O pin, the LUT can wake-up the system if, and
only if, condition on up to three input pins is true.
A block diagram of the programmable logic unit with extensions and closely related peripheral modules (in grey) is shown
in Figure 26-1.
Figure 26-1. XMEGA Custom Logic Module and Closely Related Peripherals
Interrupts
Interconnect Array
Interconnect Array
Glue Logic
LUT1
LUT0
Truth
Table
Truth
Table
DQ
DQ
G
Timer/Counter
BTC0
8-bit T/C
Normal
Capture
PWM
One Shot
Periph.Counter
BTC1
One Shot
PWM
Capture
Normal
Periph.Counter
8-bit T/C
Control Registers
Event
System Port
Pins USART
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27. CRC – Cyclic Redundancy Check Generator
27.1 Features
Cyclic redundancy check (CRC) generation and checking for
Communication data
Program or data in flash memory
Data in SRAM and I/O memory space
Integrated with flash memory, EDMA controller, and CPU
Continuous CRC on data going through an EDMA channel
Automatic CRC of the complete or a selectable range of the flash memory
CPU can load data to the CRC generator through the I/O interface
CRC polynomial software selectable to:
CRC-16 (CRC-CCITT)
CRC-32 (IEEE 802.3)
Zero remainder detection
27.2 Overview
A cyclic redundancy check (CRC) is an error detection technique test algorithm used to find accidental errors in data, and it
is commonly used to determine the correctness of a data transmission, and data present in the data and program memo-
ries. A CRC takes a data stream or a block of data as input and generates a 16- or 32-bit output that can be appended to
the data and used as a checksum. When the same data are later received or read, the device or application repeats the
calculation. If the new CRC result does not match the one calculated earlier, the block contains a data error. The applica-
tion will then detect this and may take a corrective action, such as requesting the data to be sent again or simply not using
the incorrect data.
Typically, an n-bit CRC applied to a data block of arbitrary length will detect any single error burst not longer than n bits
(any single alteration that spans no more than n bits of the data), and will detect the fraction 1-2-n of all longer error bursts.
The CRC module in XMEGA devices supports two commonly used CRC polynomials; CRC-16 (CRC-CCITT) and CRC-32
(IEEE 802.3).
• CRC-16:
Polynomial: x16 + x12 + x5 + 1
Hex Value: 0x1021
• CRC-32:
Polynomial: x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1
Hex Value: 0x04C11DB7
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28. ADC – 12-bit Analog to Digital Converter
28.1 Features
12-bit resolution
Up to 300 thousand samples per second
Down to 2.3μs conversion time with 8-bit resolution
Down to 3.35μs conversion time with 12-bit resolution
Differential and single-ended input
Up to 16 single-ended inputs
16x8 differential inputs with optional gain
Built-in differential gain stage
1/2x, 1x, 2x, 4x, 8x, 16x, 32x, and 64x gain options
Single, continuous and scan conversion options
Four internal inputs
Internal temperature sensor
DAC output
AVCC voltage divided by 10
1.1V bandgap voltage
Internal and external reference options
Compare function for accurate monitoring of user defined thresholds
Offset and gain correction
Averaging
Over-sampling and decimation
Optional event triggered conversion for accurate timing
Optional interrupt/event on compare result
Optional EDMA transfer of conversion results
28.2 Overview
The ADC converts analog signals to digital values. The ADC has 12-bit resolution and is capable of converting up to 300
thousand samples per second (ksps). The input selection is flexible, and both single-ended and differential measurements
can be done. For differential measurements, an optional gain stage is available to increase the dynamic range. In addition,
several internal signal inputs are available. The ADC can provide both signed and unsigned results.
The ADC measurements can either be started by application software or an incoming event from another peripheral in the
device. The ADC measurements can be started with predictable timing, and without software intervention. It is possible to
use EDMA to move ADC results directly to memory or peripherals when conversions are done.
Both internal and external reference voltages can be used. An integrated temperature sensor is available for use with the
ADC. The output from the DAC, AVCC/10, and the bandgap voltage can also be measured by the ADC.
The ADC has a compare function for accurate monitoring of user defined thresholds with minimum software intervention
required.
When operation in noisy conditions, the average feature can be enabled to increase the ADC resolution. Up to 1024 sam-
ples can be averaged, enabling up to 16-bit resolution results. In the same way, using the over-sampling and decimation
mode, the ADC resolution is increased up to 16-bits, which results in up to 4-bit extra lsb resolution. The ADC includes var-
ious calibration options. In addition to standard production calibration, the user can enable the offset and gain correction to
improve the absolute ADC accuracy.
[’4‘ J L
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Figure 28-1. ADC Overview
The ADC may be configured for 8- or 12-bit result, reducing the propagation delay from 3.35µs for 12-bit to 2.3µs for 8-bit
result. ADC conversion results are provided left- or right adjusted with eases calculation when the result is represented as
a signed.
PORTA has one ADC. Notation of this peripheral is ADCA.
ADC
Digital Correction Logic
2
2
clk
ADC
V
INP
V
INN
Stage
1
Stage
2
½x
-
64x
S&H Σ
ADC DAC
2x
2 bits
V
IN
V
OUT
Reference
Voltage
Internal 1.00V
Internal AVCC/1.6
AREFA
AREFD
Internal AVCC/2
Internal
Signals
ADC1
A
DC14
ADC0
ADC7
ADC0
A
DC15 Threshold
(Int. Req.)
RES
CMP
<
>
Averaging
Gain & Offset
Error
Correction
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29. DAC – Digital to Analog Converter
29.1 Features
One Digital to Analog Converter (DAC)
12-bit resolution
Two independent, continuous-drive output channels
Up to 1 million samples per second conversion rate per DAC channel
Built-in calibration that removes:
Offset error
Gain error
Multiple conversion trigger sources
On new available data
Events from the event system
Drive capabilities and support for
Resistive loads
Capacitive loads
Combined resistive and capacitive loads
Internal and external reference options
DAC output available as input to analog comparator and ADC
Low-power mode, with reduced drive strength
Optional EDMA transfer of data
29.2 Overview
The digital-to-analog converter (DAC) converts digital values to voltages. The DAC has two channels, each with 12-bit res-
olution, and is capable of converting up to one million samples per second (Msps) on each channel. The built-in calibration
system can remove offset and gain error when loaded with calibration values from software.
Figure 29-1. DAC Overview
A DAC conversion is automatically started when new data to be converted are available. Events from the event system can
also be used to trigger a conversion, and this enables synchronized and timed conversions between the DAC and other
peripherals, such as a timer/counter. The EDMA controller can be used to transfer data to the DAC.
The DAC is capable of driving both resistive and capacitive loads aswell as loads which combine both. A low-power mode
is available, which will reduce the drive strength of the output. Internal and external voltage references can be used. The
DAC output is also internally available for use as input to the analog comparator or ADC.
DAC0
DAC1
CTRLA
CH1DATA
CH0DATA
Trigger
Trigger
Internal Output
enable
Enable
Internal 1.00V
AREFA
Reference
selection
AVCC
Output
Driver
Output
Driver
D
A
T
A
Int.
driver
D
A
T
A
CTRLB
EDMA req
(Data Empty)
EDMA req
(Data Empty)
Select
12
12
Select
Enable
To
AC/ADC
AREFD
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PORTA has one DAC. Notation of this peripheral is DACA.
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30. AC – Analog Comparator
30.1 Features
Two Analog Comparators
Selectable propagation delay
Selectable hysteresis
No
Small
Large
Analog Comparator output available on pin
Flexible Input Selection
All pins on the port
Output from the DAC
Bandgap reference voltage
A 64-level programmable voltage scaler of the internal AVCC voltage
Interrupt and event generation on
Rising edge
Falling edge
Toggle
Window function interrupt and event generation on
Signal above window
Signal inside window
Signal below window
Constant current source with configurable output pin selection
Source of asynchronous event
30.2 Overview
The Analog Comparator (AC) compares the voltage level on two inputs and gives a digital output based on this compari-
son. The Analog Comparator may be configured to give interrupt requests and/or synchronous/asynchronous events upon
several different combinations of input change.
One important property of the Analog Comparator when it comes to the dynamic behavior, is the hysteresis. This parame-
ter may be adjusted in order to find the optimal operation for each application.
The input section includes analog port pins, several internal signals and a 64-level programmable voltage scaler. The ana-
log comparator output state can also be directly available on a pin for use by external devices. Using as pair they can also
be set in Window mode to monitor a signal compared to a voltage window instead of a voltage level.
A constant current source can be enabled and output on a selectable pin. This can be used to replace, for example, exter-
nal resistors used to charge capacitors in capacitive touch sensing applications.
The analog comparators are always grouped in pairs on each port. These are called analog comparator 0 (AC0) and ana-
log comparator 1 (AC1). They have identical behavior, but separate control registers. Used as pair, they can be set in
window mode to compare a signal to a voltage range instead of a voltage level.
PORTA has one AC pair. Notation is ACA.
up 9y
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Figure 30-1. Analog Comparator Overview
The window function is realized by connecting the external inputs of the two analog comparators in a pair as shown in Fig-
ure 30-2.
Figure 30-2. Analog Comparator Window Function
Voltage
Scaler ACnMUXCTRL ACnCTRL
Interrupt
Mode
Enable
Enable
Hysteresis
Hysteresis
DAC
Bandgap
AC1OUT
WINCTRL
Interrupt
Sensititivity
Control
&
Window
Function
Events
Interrupts
AC0OUT
Pin Input
Pin Input
Pin Input
Pin Input
AC0
+
-
AC1
+
-
Input signal
Upper limit of window
Lower limit of window
Interrupt
sensitivity
control
Interrupts
Events
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31. Programming and Debugging
31.1 Features
Programming
External programming through PDI interface
Minimal protocol overhead for fast operation
Built-in error detection and handling for reliable operation
Boot loader support for programming through any communication interface
Debugging
Nonintrusive, real-time, on-chip debug system
No software or hardware resources required from device except pin connection
Program flow control
Go, Stop, Reset, Step Into, Step Over, Step Out, Run-to-Cursor
Unlimited number of user program breakpoints
Unlimited number of user data breakpoints, break on:
Data location read, write, or both read and write
Data location content equal or not equal to a value
Data location content is greater or smaller than a value
Data location content is within or outside a range
No limitation on device clock frequency
Program and Debug Interface (PDI)
Two-pin interface for external programming and debugging
Uses the Reset pin and a dedicated pin
No I/O pins required during programming or debugging
31.2 Overview
The Program and Debug Interface (PDI) is a Microchip proprietary interface for external programming and on-chip debug-
ging of a device. The PDI supports fast programming of nonvolatile memory (NVM) spaces; flash, EEPOM, fuses, lock bits,
and the user signature row.
Debug is supported through an on-chip debug system that offers nonintrusive, real-time debug. It does not require any soft-
ware or hardware resources except for the device pin connection. Using the Microchip tool chain, it offers complete
program flow control and support for an unlimited number of program and complex data breakpoints. Application debug
can be done from a C or other high-level language source code level, as well as from an assembler and disassemble level.
Programming and debugging can be done through the PDI physical layer. This is a two-pin interface that uses the Reset
pin for the clock input (PDI_CLK) and one other dedicated pin for data input and output (PDI_DATA). Any external pro-
grammer or on-chip debugger/emulator can be directly connected to this interface.
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32. Pinout and Pin Functions
The device pinout is shown in “Pinout and Block Diagram” on page 10. In addition to general purpose I/O functionality, each
pin can have several alternate functions. This will depend on which peripheral is enabled and connected to the actual pin.
Only one of the pin functions can be used at time.
32.1 Alternate Pin Function Description
The tables below show the notation for all pin functions available and describe its function.
32.1.1 Operation/Power Supply
32.1.2 Port Interrupt Functions
32.1.3 Analog Functions
32.1.4 Timer/Counter and WEX Functions
32.1.5 Communication Functions
VCC Digital supply voltage
AVCC Analog supply voltage
GND Ground
SYNC Port pin with full synchronous and limited asynchronous interrupt function
ASYNC Port pin with full synchronous and full asynchronous interrupt function
ACn Analog Comparator input pin n
ACnOUT Analog Comparator n Output
ADCn Analog to Digital Converter input pin n
DACn Digital to Analog Converter output pin n
AREF Analog Reference input pin
OCnx Output Compare Channel x for timer/counter n
OCnxLS Output Compare Channel x Low Side for Timer/Counter n
OCnxHS Output Compare Channel x High Side for Timer/Counter n
SCL Serial Clock for TWI
SDA Serial Data for TWI
SCLIN Serial Clock In for TWI when external driver interface is enabled
SCLOUT Serial Clock Out for TWI when external driver interface is enabled
SDAIN Serial Data In for TWI when external driver interface is enabled
SDAOUT Serial Data Out for TWI when external driver interface is enabled
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32.1.6 Oscillators, Clock, and Event
32.1.7 Debug/System Functions
XCKn Transfer Clock for USART n
RXDn Receiver Data for USART n
TXDn Transmitter Data for USART n
SS Slave Select for SPI
MOSI Master Out Slave In for SPI
MISO Master In Slave Out for SPI
SCK Serial Clock for SPI
TOSCn Timer Oscillator pin n
XTALn Input/Output for Oscillator pin n
CLKOUT Peripheral Clock Output
EVOUT Event Channel Output
RTCOUT RTC Clock Source Output
RESET Reset pin
PDI_CLK Program and Debug Interface Clock pin
PDI_DATA Program and Debug Interface Data pin
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32.2 Alternate Pin Functions
The tables below show the primary/default function for each pin on a port in the first column, the pin number in the second
column, and then all alternate pin functions in the remaining columns. The head row shows what peripheral that enable and
use the alternate pin functions.
For better flexibility, some alternate functions also have selectable pin locations for their functions, this is noted under the
first table where this apply.
Table 32-1. PORT A – Alternate Functions
Table 32-2. PORT C – Alternate Functions
Table 32-3. Debug – Program and Debug Functions
Table 32-4. PORT R – Alternate Functions
PORT A Pin#
ADCA POS/
GAINPOS
ADCA NEG/
GAINNEG DACA
ACA
POS
ACA
NEG
ACA
OUT REFA
PA0 6ADC 0 ADC 0 AC0 AC0 AREF
PA1 5ADC 1 ADC 1 AC1 AC1
PA2 4ADC 2 ADC 2 DAC0 AC2
PA3 3ADC 3 ADC 3 DAC1 AC3 AC3
PA4 2ADC 4 ADC 4 AC4
PA5 31 ADC 5 ADC 5 AC5 AC5
PA6 30 ADC 6 ADC 6 AC6 AC1OUT
PA7 29 ADC 7 ADC 7 AC7 AC0OUT
PORT C Pin # TCC4 WEXC TCC5 USARTC0 SPIC TWI
XCL
(LUT) EXTCLK AC OUT
PC0 16 OC4A OC4ALS SDA IN1/OUT0
PC1 15 OC4B OC4AHS XCK0 SCL IN2
PC2 14 OC4C OC4BLS RXD0 IN0
PC3 13 OC4D OC4BHS TXD0 IN3
PC4 12 OC4A OC4CLS OC5A SS IN1/OUT0 EXTCLK
PC5 11 OC4B OC4CHS OC5B XCK0 SCK IN2
PC6 10 OC4C OC4DLS RXD0 MISO IN0 AC1OUT
PC7 9OC4D OC4DHS TXD0 MOSI IN3 AC0OUT
DEBUG Pin # PROG
RESET 8PDI CLOCK
PDI 7PDI DATA
PORT R Pin # XTAL TOSC EXTCLK CLOCKOUT EVENTOUT RTCOUT AC OUT
PR0 20 XTAL2 TOSC2 CLKOUT EVOUT RTCOUT AC1 OUT
PR1 19 XTAL1 TOSC1 EXTCLK AC0 OUT
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Table 32-5. PORT D – Alternate Functions
PORT D Pin #
ADCAPOS
GAINPOS TCD5
USART
D0
TWID
(Bridge)
XCL
(LUT)
XCL
(TC)
CLOCK
OUT
EVENT
OUT RTCOUT ACOUT REFD
PD0 28 ADC8 SDA IN1/
OUT0 AREF
PD1 27 ADC9 XCK0 SCL IN2
PD2 26 ADC10 RXD0 IN0 OC0
PD3 25 ADC11 TXD0 IN3 OC1
PD4 24 ADC12 OC5A IN1/
OUT0 CLKOUT EVOUT
PD5 23 ADC13 OC5B XCK0 IN2
PD6 22 ADC14 RXD0 IN0 RTCOUT AC1OUT
PD7 21 ADC15 TXD0 IN3 CLKOUT EVOUT AC0OUT
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 68
ATxmega32E5/16E5/8E5
33. Peripheral Module Address Map
The address maps show the base address for each peripheral and module in XMEGA E5. For complete register description
and summary for each peripheral module, refer to the XMEGA E Manual.
Table 33-1. Peripheral Module Address Map
Base Address Name Description
0x0000 GPIO General Purpose IO Registers
0x0010 VPORT0 Virtual Port A
0x0014 VPORT1 Virtual Port C
0x0018 VPORT2 Virtual Port D
0x001C VPORT3 Virtual Port R
0x0030 CPU CPU
0x0040 CLK Clock Control
0x0048 SLEEP Sleep Controller
0x0050 OSC Oscillator Control
0x0060 DFLLRC32M DFLL for the 32MHz Internal Oscillator
0x0070 PR Power Reduction
0x0078 RST Reset Controller
0x0080 WDT Watch-Dog Timer
0x0090 MCU MCU Control
0x00A0 PMIC Programmable Multilevel Interrupt Controller
0x00B0 PORTCFG Port Configuration
0x00D0 CRC CRC Module
0x0100 EDMA Enhanced DMA Controller
0x0180 EVSYS Event System
0x01C0 NVM Non Volatile Memory (NVM) Controller
0x0200 ADCA Analog to Digital Converter on port A
0x0300 DACA Digital to Analog Converter on port A
0x0380 ACA Analog Comparator pair on port A
0x0400 RTC Real Time Counter
0x0460 XCL XMEGA Custom Logic Module
0x0480 TWIC Two-Wire Interface on port C
0x0600 PORTA Port A
0x0640 PORTC Port C
0x0660 PORTD Port D
0x07E0 PORTR Port R
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 69
ATxmega32E5/16E5/8E5
0x0800 TCC4 Timer/Counter 4 on port C
0x0840 TCC5 Timer/Counter 5 on port C
0x0880 FAULTC4 Fault Extension on TCC4
0x0890 FAULTC5 Fault Extensionon TCC5
0x08A0 WEXC Waveform Extension on port C
0x08B0 HIRESC High Resolution Extension on port C
0x08C0 USARTC0 USART 0 on port C
0x08E0 SPIC Serial Peripheral Interface on port C
0x08F8 IRCOM Infrared Communication Module
0x0940 TCD5 Timer/Counter 5 on port D
0x09C0 USARTD0 USART 0 on port D
Base Address Name Description
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 70
ATxmega32E5/16E5/8E5
34. Instruction Set Summary
Mnemonics Operands Description Operation Flags #Clocks
Arithmetic and Logic Instructions
ADD Rd, Rr Add without Carry Rd Rd + Rr Z,C,N,V,S,H 1
ADC Rd, Rr Add with Carry Rd Rd + Rr + C Z,C,N,V,S,H 1
ADIW Rd, K Add Immediate to Word Rd Rd + 1:Rd + K Z,C,N,V,S 2
SUB Rd, Rr Subtract without Carry Rd Rd - Rr Z,C,N,V,S,H 1
SUBI Rd, K Subtract Immediate Rd Rd - K Z,C,N,V,S,H 1
SBC Rd, Rr Subtract with Carry Rd Rd - Rr - C Z,C,N,V,S,H 1
SBCI Rd, K Subtract Immediate with Carry Rd Rd - K - C Z,C,N,V,S,H 1
SBIW Rd, K Subtract Immediate from Word Rd + 1:Rd Rd + 1:Rd - K Z,C,N,V,S 2
AND Rd, Rr Logical AND Rd Rd Rr Z,N,V,S 1
ANDI Rd, K Logical AND with Immediate Rd Rd K Z,N,V,S 1
OR Rd, Rr Logical OR Rd Rd v Rr Z,N,V,S 1
ORI Rd, K Logical OR with Immediate Rd Rd v K Z,N,V,S 1
EOR Rd, Rr Exclusive OR Rd Rd Rr Z,N,V,S 1
COM Rd One’s Complement Rd $FF - Rd Z,C,N,V,S 1
NEG Rd Two’s Complement Rd $00 - Rd Z,C,N,V,S,H 1
SBR Rd,K Set Bit(s) in Register Rd Rd v K Z,N,V,S 1
CBR Rd,K Clear Bit(s) in Register Rd Rd ($FFh - K) Z,N,V,S 1
INC Rd Increment Rd Rd + 1 Z,N,V,S 1
DEC Rd Decrement Rd Rd - 1 Z,N,V,S 1
TST Rd Test for Zero or Minus Rd Rd Rd Z,N,V,S 1
CLR Rd Clear Register Rd Rd Rd Z,N,V,S 1
SER Rd Set Register Rd $FF None 1
MUL Rd,Rr Multiply Unsigned R1:R0 Rd x Rr (UU) Z,C 2
MULS Rd,Rr Multiply Signed R1:R0 Rd x Rr (SS) Z,C 2
MULSU Rd,Rr Multiply Signed with Unsigned R1:R0 Rd x Rr (SU) Z,C 2
FMUL Rd,Rr Fractional Multiply Unsigned R1:R0 Rd x Rr<<1 (UU) Z,C 2
FMULS Rd,Rr Fractional Multiply Signed R1:R0 Rd x Rr<<1 (SS) Z,C 2
FMULSU Rd,Rr Fractional Multiply Signed with Unsigned R1:R0 Rd x Rr<<1 (SU) Z,C 2
DES KData Encryption if (H = 0) then R15:R0
else if (H = 1) then R15:R0
Encrypt(R15:R0, K)
Decrypt(R15:R0, K) 1/2
Branch instructions
RJMP kRelative Jump PC PC + k + 1 None 2
IJMP Indirect Jump to (Z) PC(15:0)
PC(21:16)
Z,
0None 2
EIJMP Extended Indirect Jump to (Z) PC(15:0)
PC(21:16)
Z,
EIND None 2
JMP kJump PC kNone 3
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 71
ATxmega32E5/16E5/8E5
RCALL kRelative Call Subroutine PC PC + k + 1 None 2 / 3(1)
ICALL Indirect Call to (Z) PC(15:0)
PC(21:16)
Z,
0None 2 / 3(1)
EICALL Extended Indirect Call to (Z) PC(15:0)
PC(21:16)
Z,
EIND None 3(1)
CALL kcall Subroutine PC kNone 3 / 4(1)
RET Subroutine Return PC STACK None 4 / 5(1)
RETI Interrupt Return PC STACK I4 / 5(1)
CPSE Rd,Rr Compare, Skip if Equal if (Rd = Rr) PC PC + 2 or 3 None 1 / 2 / 3
CP Rd,Rr Compare Rd - Rr Z,C,N,V,S,H 1
CPC Rd,Rr Compare with Carry Rd - Rr - C Z,C,N,V,S,H 1
CPI Rd,K Compare with Immediate Rd - K Z,C,N,V,S,H 1
SBRC Rr, b Skip if Bit in Register Cleared if (Rr(b) = 0) PC PC + 2 or 3 None 1 / 2 / 3
SBRS Rr, b Skip if Bit in Register Set if (Rr(b) = 1) PC PC + 2 or 3 None 1 / 2 / 3
SBIC A, b Skip if Bit in I/O Register Cleared if (I/O(A,b) = 0) PC PC + 2 or 3 None 2 / 3 / 4
SBIS A, b Skip if Bit in I/O Register Set If (I/O(A,b) =1) PC PC + 2 or 3 None 2 / 3 / 4
BRBS s, k Branch if Status Flag Set if (SREG(s) = 1) then PC PC + k + 1 None 1 / 2
BRBC s, k Branch if Status Flag Cleared if (SREG(s) = 0) then PC PC + k + 1 None 1 / 2
BREQ k Branch if Equal if (Z = 1) then PC PC + k + 1 None 1 / 2
BRNE k Branch if Not Equal if (Z = 0) then PC PC + k + 1 None 1 / 2
BRCS k Branch if Carry Set if (C = 1) then PC PC + k + 1 None 1 / 2
BRCC k Branch if Carry Cleared if (C = 0) then PC PC + k + 1 None 1 / 2
BRSH k Branch if Same or Higher if (C = 0) then PC PC + k + 1 None 1 / 2
BRLO k Branch if Lower if (C = 1) then PC PC + k + 1 None 1 / 2
BRMI k Branch if Minus if (N = 1) then PC PC + k + 1 None 1 / 2
BRPL k Branch if Plus if (N = 0) then PC PC + k + 1 None 1 / 2
BRGE k Branch if Greater or Equal, Signed if (N V= 0) then PC PC + k + 1 None 1 / 2
BRLT k Branch if Less Than, Signed if (N V= 1) then PC PC + k + 1 None 1 / 2
BRHS k Branch if Half Carry Flag Set if (H = 1) then PC PC + k + 1 None 1 / 2
BRHC k Branch if Half Carry Flag Cleared if (H = 0) then PC PC + k + 1 None 1 / 2
BRTS k Branch if T Flag Set if (T = 1) then PC PC + k + 1 None 1 / 2
BRTC k Branch if T Flag Cleared if (T = 0) then PC PC + k + 1 None 1 / 2
BRVS k Branch if Overflow Flag is Set if (V = 1) then PC PC + k + 1 None 1 / 2
BRVC k Branch if Overflow Flag is Cleared if (V = 0) then PC PC + k + 1 None 1 / 2
BRIE k Branch if Interrupt Enabled if (I = 1) then PC PC + k + 1 None 1 / 2
BRID k Branch if Interrupt Disabled if (I = 0) then PC PC + k + 1 None 1 / 2
Data transfer instructions
MOV Rd, Rr Copy Register Rd Rr None 1
MOVW Rd, Rr Copy Register Pair Rd+1:Rd Rr+1:Rr None 1
Mnemonics Operands Description Operation Flags #Clocks
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 72
ATxmega32E5/16E5/8E5
LDI Rd, K Load Immediate Rd KNone 1
LDS Rd, k Load Direct from data space Rd (k) None 2(1)(2)
LD Rd, X Load Indirect Rd (X) None 1(1)(2)
LD Rd, X+ Load Indirect and Post-Increment Rd
X
(X)
X + 1 None 1(1)(2)
LD Rd, -X Load Indirect and Pre-Decrement X X - 1,
Rd (X)
X - 1
(X) None 2(1)(2)
LD Rd, Y Load Indirect Rd (Y) (Y) None 1(1)(2)
LD Rd, Y+ Load Indirect and Post-Increment Rd
Y
(Y)
Y + 1 None 1(1)(2)
LD Rd, -Y Load Indirect and Pre-Decrement Y
Rd
Y - 1
(Y) None 2(1)(2)
LDD Rd, Y+q Load Indirect with Displacement Rd (Y + q) None 2(1)(2)
LD Rd, Z Load Indirect Rd (Z) None 1(1)(2)
LD Rd, Z+ Load Indirect and Post-Increment Rd
Z
(Z),
Z+1 None 1(1)(2)
LD Rd, -Z Load Indirect and Pre-Decrement Z
Rd
Z - 1,
(Z) None 2(1)(2)
LDD Rd, Z+q Load Indirect with Displacement Rd (Z + q) None 2(1)(2)
STS k, Rr Store Direct to Data Space (k) Rd None 2(1)
ST X, Rr Store Indirect (X) Rr None 1(1)
ST X+, Rr Store Indirect and Post-Increment (X)
X
Rr,
X + 1 None 1(1)
ST -X, Rr Store Indirect and Pre-Decrement X
(X)
X - 1,
Rr None 2(1)
ST Y, R r Store Indirect (Y) Rr None 1(1)
ST Y+, Rr Store Indirect and Post-Increment (Y)
Y
Rr,
Y + 1 None 1(1)
ST -Y, Rr Store Indirect and Pre-Decrement Y
(Y)
Y - 1,
Rr None 2(1)
STD Y+q, Rr Store Indirect with Displacement (Y + q) Rr None 2(1)
ST Z, Rr Store Indirect (Z) Rr None 1(1)
ST Z+, Rr Store Indirect and Post-Increment (Z)
Z
Rr
Z + 1 None 1(1)
ST -Z, Rr Store Indirect and Pre-Decrement ZZ - 1 None 2(1)
STD Z+q,Rr Store Indirect with Displacement (Z + q) Rr None 2(1)
LPM Load Program Memory R0 (Z) None 3
LPM Rd, Z Load Program Memory Rd (Z) None 3
LPM Rd, Z+ Load Program Memory and Post-Increment Rd
Z
(Z),
Z + 1 None 3
ELPM Extended Load Program Memory R0 (RAMPZ:Z) None 3
ELPM Rd, Z Extended Load Program Memory Rd (RAMPZ:Z) None 3
ELPM Rd, Z+ Extended Load Program Memory and Post-
Increment
Rd
Z
(RAMPZ:Z),
Z + 1 None 3
Mnemonics Operands Description Operation Flags #Clocks
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 73
ATxmega32E5/16E5/8E5
SPM Store Program Memory (RAMPZ:Z) R1:R0 None -
SPM Z+ Store Program Memory and Post-Increment by 2 (RAMPZ:Z)
Z
R1:R0,
Z + 2 None -
IN Rd, A In From I/O Location Rd I/O(A) None 1
OUT A, Rr Out To I/O Location I/O(A) Rr None 1
PUSH Rr Push Register on Stack STACK Rr None 1(1)
POP Rd Pop Register from Stack Rd STACK None 2(1)
XCH Z, Rd Exchange RAM location
Tem p
Rd
(Z)
Rd,
(Z),
Tem p
None 2
LAS Z, Rd Load and Set RAM location
Tem p
Rd
(Z)
Rd,
(Z),
Temp v (Z)
None 2
LAC Z, Rd Load and Clear RAM location
Tem p
Rd
(Z)
Rd,
(Z),
($FFh – Rd) (Z)
None 2
LAT Z, Rd Load and Toggle RAM location
Tem p
Rd
(Z)
Rd,
(Z),
Tem p (Z)
None 2
Bit and bit-test instructions
LSL Rd Logical Shift Left
Rd(n+1)
Rd(0)
C
Rd(n),
0,
Rd(7)
Z,C,N,V,H 1
LSR Rd Logical Shift Right
Rd(n)
Rd(7)
C
Rd(n+1),
0,
Rd(0)
Z,C,N,V 1
ROL Rd Rotate Left Through Carry
Rd(0)
Rd(n+1)
C
C,
Rd(n),
Rd(7)
Z,C,N,V,H 1
ROR Rd Rotate Right Through Carry
Rd(7)
Rd(n)
C
C,
Rd(n+1),
Rd(0)
Z,C,N,V 1
ASR Rd Arithmetic Shift Right Rd(n) Rd(n+1), n=0..6 Z,C,N,V 1
SWAP Rd Swap Nibbles Rd(3..0) Rd(7..4) None 1
BSET sFlag Set SREG(s) 1SREG(s) 1
BCLR sFlag Clear SREG(s) 0SREG(s) 1
SBI A, b Set Bit in I/O Register I/O(A, b) 1None 1
CBI A, b Clear Bit in I/O Register I/O(A, b) 0None 1
BST Rr, b Bit Store from Register to T TRr(b) T 1
BLD Rd, b Bit load from T to Register Rd(b) TNone 1
SEC Set Carry C1 C 1
CLC Clear Carry C0 C 1
SEN Set Negative Flag N1 N 1
CLN Clear Negative Flag N0 N 1
SEZ Set Zero Flag Z1 Z 1
CLZ Clear Zero Flag Z0 Z 1
Mnemonics Operands Description Operation Flags #Clocks
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 74
ATxmega32E5/16E5/8E5
Notes: 1. Cycle times for data memory accesses assume internal memory accesses, and are not valid for accesses via the external RAM interface.
2. One extra cycle must be added when accessing internal SRAM.
SEI Global Interrupt Enable I1 I 1
CLI Global Interrupt Disable I0 I 1
SES Set Signed Test Flag S1 S 1
CLS Clear Signed Test Flag S0 S 1
SEV Set Two’s Complement Overflow V1 V 1
CLV Clear Two’s Complement Overflow V0 V 1
SET Set T in SREG T1 T 1
CLT Clear T in SREG T0 T 1
SEH Set Half Carry Flag in SREG H1 H 1
CLH Clear Half Carry Flag in SREG H0 H 1
MCU control instructions
BREAK Break (See specific descr. for BREAK) None 1
NOP No Operation None 1
SLEEP Sleep (see specific descr. for Sleep) None 1
WDR Watchdog Reset (see specific descr. for WDR) None 1
Mnemonics Operands Description Operation Flags #Clocks
DRAWINGS NOT SCALED YOP VIEW 5an vwa COMMON DIMENSIONS (Uml of Measure : mm) swam Mm NOM MAX NmE , E D1/E1 690 700 710 2 j c 009 020 e um WWW 3 mag/2012 _ MA, 32 Lds , 0 50mm P\tch,7x7x1 UDmm my me AtmeL mug. Draw-"s mm m Me was“: gm ma. package (mm Am MA c
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 75
ATxmega32E5/16E5/8E5
35. Packaging Information
35.1 32A
DRAWINGS NOT SCALED 1 (9 r o 30 / 1 mA. TVP. LASER MARKING 59:an PLANE TOP VIEW SIDE VIEW COMMON DIMENSIONS _ iazg L A (Unwtaf Measurc : mm) ,, *1, U U U U U U swam MIN NOM MAX NOTE p M A 0 so u as o 90 C A] a no a 05 3 C A} 0 2n REF 3 C PM 1» cramrer D C (r 7301 ”/E 5 D” “SC 3 c: mm 92/9 100 3 10 3 20 /: - C b u 15 u 25 n In 1 I C 9m 1» mm a o 50 BSC Ammmmm W? - _ N ‘ ‘ n 32 mp *5 * H aorroM VIEW Notes 1. Tm; drawmg ‘5 mr genem mmrmatmn cmy. Reverto JEDEC Drawmg M0220, Varmmn warn, mr Draper mmensmns, tolerances, datums, etc 2 nrmensrun b appheg m metaned 1erm|na1and15 measured between 015mm and 0 30mm rram the termma‘ hp yr me fermma‘ has the aphca‘ radms an the mher end offhe 1ermma1, me mmensmn shuum nor be measured m mm radms area 01/31/2012 um: GDC DRAWING ND. REV . PN, 32 Leeds, n.5nmm Dutch, 5 x 5 mm Atmet Package Drawing Coma Very Tmn quad Hat No Lead Package (vow, Sawn ZMF DN ;
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 76
ATxmega32E5/16E5/8E5
35.2 32Z
DRAWINGS NOT SCALED @335 c emu: , LASER MARK row PIN 1 msmxrrcmom w nus AREA TOP VIEW SIDE VIEW 4 g 0.25 commow DIMENSIONS ‘7 D2 4— (Um! OF McESurc : mm) LI U LI U LI U SVMEOl MIN NOM MAX NOTE 3 7 A o 50 n 55 a an :I |: AZ m j I: m 4 no :l I: 52 uz/Ez 1.7a 2.5a 2 an r :l W I: L D 3D 0 3!: HAD 3 ‘ I: U 25 h 0 l5 D N O 15 9 :l l I: i - J 1 7 >\ ; a u w ' L F Tmck'uess D 152 REF L H H H‘[ H H h 1 ’ i 32 r 5mg an MAX ms mum or W m mm mm ID 536 a m mm o m m a as BOTTOM VIEW Notes : 11m: drawmg .5 for generm mmrmauun unw 2 Drmcnsmn a applrcs m mmaurzcd mrmma‘ and rs measured between UJSmm and 0 25mm frum me lermma‘ Up u me rermma‘ has me Dphona‘ radms on the other end 0f me rermmal, me urmensrun b shown nor be measured m mar radma area 10/09/2012 rm: GPC DMWING No V PM, 32 Leads. U 40mm mtch, 4x4xU 60mm AtmeL nukes: Draw-«a mm mm rm gm rm No Lead package WM 5m zzc FM REV.
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 77
ATxmega32E5/16E5/8E5
35.3 32MA
Table 36-2. Operating Vokage and Frequency
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 78
ATxmega32E5/16E5/8E5
36. Electrical Characteristics
All typical values are measured at T = 25°C unless other temperature condition is given. All minimum and maximum values
are valid across operating temperature and voltage unless other conditions are given.
36.1 Absolute Maximum Ratings
36.2 General Operating Ratings
The device must operate within the ratings listed in Table 36-1 in order for all other electrical characteristics and typical
characteristics of the device to be valid.
Table 36-1. General Operating Conditions
Table 36-2. Operating Voltage and Frequency
The maximum CPU clock frequency depends on VCC. As shown in Figure 36-1 the frequency vs. VCC curve is linear
between 1.8V < VCC <2.7V.
Symbol Parameter Min. Typ. Max. Units
VCC Power supply voltage -0.3 4 V
IVCC Current into a VCC pin 200
mA
IGND Current out of a Gnd pin 200
VPIN Pin voltage with respect to Gnd and VCC -0.5 VCC+0.5 V
IPIN I/O pin sink/source current -25 25 mA
TAStorage temperature -65 150
°C
TjJunction temperature 150
Symbol Parameter Min. Typ. Max. Units
VCC Power supply voltage 1.6 3.6
V
AVCC Analog supply voltage 1.6 3.6
TATemperature range -40 85
°C
TjJunction temperature -40 105
Symbol Parameter Condition Min. Typ. Max. Units
ClkCPU CPU clock frequency
VCC = 1.6V 012
MHz
VCC = 1.8V 012
VCC = 2.7V 032
VCC = 3.6V 032
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 79
ATxmega32E5/16E5/8E5
Figure 36-1. Maximum Frequency vs. VCC
1.8
12
32
MHz
V
2.7 3.6
1.6
Safe Operating Area
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 80
ATxmega32E5/16E5/8E5
36.3 Current Consumption
Table 36-3. Current Consumption for Active Mode and Sleep Modes
Symbol Parameter Condition Min. Typ. Max. Units
ICC
Active power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 20
µA
VCC = 3.0V 35
1MHz, Ext. Clk
VCC = 1.8V 155
VCC = 3.0V 290
2MHz, Ext. Clk
VCC = 1.8V 300 400
VCC = 3.0V 0.6 1.2
mA
32MHz, Ext. Clk VCC = 3.0V 710
Idle power
consumption (1)
32kHz, Ext. Clk
VCC = 1.8V 7
µA
VCC = 3.0V 12
1MHz, Ext. Clk
VCC = 1.8V 55
VCC = 3.0V 105
2MHz, Ext. Clk
VCC = 1.8V 110 250
VCC = 3.0V 200 350
32MHz, Ext. Clk VCC = 3.0V 3.5 5mA
Power-down power
consumption
All disabled, T = 25°C
VCC = 3.0V
0.1 0.9
µA
All disabled, T = 85°C 1 3
All disabled, T = 105°C 2 5
WDT and sampled BOD enabled,
T = 25°C
VCC = 3.0V
0.5
WDT and sampled BOD enabled,
T = 85°C 1.2 3.5
WDT and sampled BOD enabled,
T = 105°C 2.5 6
Power-save power
consumption
RTC from ULP clock, WDT and
sampled BOD enabled, T = 25C
VCC = 1.8V 0.4
VCC = 3.0V 0.6
RTC from ULP clock, WDT,
sampled BOD enabled and 8MHz
internal oscillator in low power
mode, T = 25C
VCC = 1.8V 0.5
VCC = 3.0V 0.6
RTC on 1kHz low power 32.768kHz
TOSC, T = 25C
VCC = 1.8V 0.8
VCC = 3.0V 0.9
RTC from low power 32.768kHz
TOSC, T = 25C
VCC = 1.8V 0.9
VCC = 3.0V 1.0
Reset power consumption Current through RESET pin
substracted, T = 25°C VCC = 3.0V 110
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 81
ATxmega32E5/16E5/8E5
Notes: 1. All Power Reduction Registers set.
Table 36-4. Current Consumption for Modules and Peripherals
Notes: 1. All parameters measured as the difference in current consumption between module enabled and disabled. All data at VCC = 3.0V, ClkSYS = 1MHz external clock
without prescaling, T = 25°C unless other conditions are given.
Symbol Parameter Condition(1) Min. Typ. Max. Units
ICC
Internal ULP oscillator 100 nA
32.768kHz int. oscillator 27
µA
8MHz int. oscillator
Normal power mode 65
Low power mode 45
32MHz int. oscillator
275
DFLL enabled with 32.768kHz int. osc. as reference 400
PLL 20x multiplication factor,
32MHz int. osc. DIV4 as reference 230
Watchdog timer 0.3
BOD
Continuous mode 245
Sampled mode 0.4
Internal 1.0V reference 200
Internal temperature sensor 100
ADC
16ksps
VREF = Ext. ref.
1.5
mA
CURRLIMIT = LOW 1.4
CURRLIMIT = MEDIUM 1.3
CURRLIMIT = HIGH 1.2
75ksps, VREF = Ext. ref. CURRLIMIT = LOW 1.7
300ksps, VREF = Ext. ref. 3.1
DAC
250ksps
VREF = Ext. ref.
No load
Normal mode 1.9
Low Power mode 1.1
AC 200
µA
EDMA 200
Timer/counter 25
USART Rx and Tx enabled, 9600 BAUD 8
XCL 16-bit timer/counter 6
Flash memory and EEPROM programming 4mA
Wakeup time
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 82
ATxmega32E5/16E5/8E5
36.4 Wake-up Time from Sleep Modes
Table 36-5. Device Wake-up Time from Sleep Modes with Various System Clock Sources
Notes: 1. The wake-up time is the time from the wake-up request is given until the peripheral clock is available on pin, see Figure 36-2. All peripherals and modules start
execution from the first clock cycle, expect the CPU that is halted for four clock cycles before program execution starts.
Figure 36-2. Wake-up Time Definition
Symbol Parameter Condition Min. Typ.(1) Max. Units
twakeup
Wake-up time from
idle, standby, and
extended standby
mode
External 2MHz clock 0.2
µs
32kHz internal oscillator 120
8MHz internal oscillator 0.5
32MHz internal oscillator 0.2
Wake-up time from
power save mode
External 2MHz clock 4.5
32kHz internal oscillator 320
8MHz internal oscillator
Normal mode 4.5
Low power mode 0.5
32MHz internal oscillator 5.0
Wake-up time from
power down mode
External 2MHz clock 4.5
32kHz internal oscillator 320
8MHz internal oscillator 4.5
32MHz internal oscillator 5.0
Wakeup request
Clock output
Wakeup time
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 83
ATxmega32E5/16E5/8E5
36.5 I/O Pin Characteristics
The I/O pins complies with the JEDEC LVTTL and LVCMOS specification and the high- and low-level input and output volt-
age limits reflect or exceed this specification.
Table 36-6. I/O Pin Characteristics
Notes: 1. The sum of all IOH for PA[7:5] on PORTA must not exceed 100mA.
The sum of all IOH for PA[4:0] on PORTA must not exceed 200mA.
The sum of all IOH for PORTD and PORTR must not exceed 100mA.
The sum of all IOH for PORTC and PDI must not exceed 100mA.
2. The sum of all IOL for PA[7:5] on PORTA must not exceed 100mA.
The sum of all IOL for PA[4:0] on PORTA must not exceed 100mA.
The sum of all IOL for PORTD and PORTR must not exceed 100mA.
The sum of all IOL for PORTC PDI must not exceed 100mA.
36.6 ADC Characteristics
Table 36-7. Power Supply, Reference, and Input Range
Symbol Parameter Condition Min. Typ. Max. Units
IOH (1)/
IOL (2) I/O pin source/sink current -15 15 mA
VIH
High level input voltage,
except XTAL1 and RESET pin
VCC = 2.4 - 3.6V 0.7*VCC VCC+0.5
V
VCC = 1.6 - 2.4V 0.8*VCC VCC+0.5
VIL
Low level input voltage,
except XTAL1 and RESET pin
VCC = 2.4 - 3.6V -0.5 0.3*VCC
VCC = 1.6 - 2.4V -0.5 0.2*VCC
VOH High level output voltage
VCC = 3.3V IOH = -4mA 2.6 3.1
VCC = 3.0V IOH = -3mA 2.1 2.7
VCC = 1.8V IOH = -1mA 1.4 1.7
VOL Low level output voltage
VCC = 3.3V IOL = 8mA 0.20 0.76
VCC = 3.0V IOL = 5mA 0.15 0.64
VCC = 1.8V IOL = 3mA 0.10 0.46
IIN Input leakage current T = 25°C <0.01 1.0 µA
RPPull/buss keeper resistor 27 k
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3
V
VREF Reference voltage 1AVCC- 0.6
Rin Input resistance Switched 4.5 k
Cin Input capacitance Switched 5pF
RAREF Reference input resistance (leakage only) >10 M
CAREF Reference input capacitance Static load 7pF
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 84
ATxmega32E5/16E5/8E5
Table 36-8. Clock and Timing
Table 36-9. Accuracy Characteristics
Vin Input range 0 VREF
VVin Conversion range Differential mode, Vinp - Vinn -0.95*VREF 0.95*VREF
Vin Conversion range Single ended unsigned mode, Vinp -0.05*VREF 0.95*VREF
Symbol Parameter Condition Min. Typ. Max. Units
ClkADC ADC Clock frequency
Maximum is 1/4 of Peripheral clock
frequency 100 1800
kHz
Measuring internal signals 125
fClkADC Sample rate 16 300
ksps
fADC Sample rate
Current limitation (CURRLIMIT) off 16 300
CURRLIMIT = LOW 250
CURRLIMIT = MEDIUM 150
CURRLIMIT = HIGH 50
Sampling Time 1/2 ClkADC cycle 0.25 5µs
Conversion time (latency) (RES+2)/2+(GAIN !=0)
RES (Resolution) = 8 or 12 610
ClkADC
cycles
Start-up time ADC clock cycles 12 24
ADC settling time After changing reference or input
mode 7 7
Symbol Parameter Condition(2) Min. Typ. Max. Units
RES Resolution 12-bit resolution
Differential 812 12
BitsSingle ended signed 711 11
Single ended unsigned 812 12
INL(1) Integral non-linearity
Differential
mode
16ksps, VREF = 3V 1
lsb
16ksps, VREF = 1V 2
300ksps, VREF = 3V 1
300ksps, VREF = 1V 2
Single ended
unsigned mode
16ksps, VREF = 3.0V 11.5
16ksps, VREF = 1.0V 2 3
Symbol Parameter Condition Min. Typ. Max. Units
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 85
ATxmega32E5/16E5/8E5
Notes: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 10% to 90% input voltage range.
2. Unless otherwise noted all linearity, offset and gain error numbers are valid under the condition that external VREF is used.
Table 36-10. Gain Stage Characteristics
DNL(1) Differential non-linearity
Differential
mode
16ksps, VREF = 3V 1
lsb
16ksps, VREF = 1V 2
300ksps, VREF = 3V 1
300ksps, VREF = 1V 2
Single ended
unsigned mode
16ksps, VREF = 3.0V 11.5
16ksps, VREF = 1.0V 2 3
Offset Error Differential
mode
8mV
Temperature drift 0.01 mV/K
Operating voltage drift 0.25 mV/V
Gain Error Differential
mode
External reference -5
mV
AVCC/1.6 -5
AVCC/2.0 -6
Bandgap ±10
Temperature drift 0.02 mV/K
Operating voltage drift 2mV/V
Gain Error Single ended
unsigned mode
External reference -8
mV
AVCC/1.6 -8
AVCC/2.0 -8
Bandgap ±10
Temperature drift 0.03 mV/K
Operating voltage drift 2mV/V
Symbol Parameter Condition Min. Typ. Max. Units
Rin Input resistance Switched 4.0 k
Csample Input capacitance Switched 4.4 pF
Signal range Gain stage output 0AVCC- 0.6 V
Propagation delay ADC conversion rate 1/2 1 3 ClkADC
cycles
Clock rate Same as ADC 100 1800 kHz
Symbol Parameter Condition(2) Min. Typ. Max. Units
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 86
ATxmega32E5/16E5/8E5
36.7 DAC Characteristics
Table 36-11. Power Supply, Reference, and Output Range
Table 36-12. Clock and Timing
Gain error
0.5x gain -1
%
1x gain -1
8x gain -1
64x gain -1.5
Offset error,
input referred
0.5x gain 10
mV
1x gain 5
8x gain 5
64x gain 5
Symbol Parameter Condition Min. Typ. Max. Units
AVCC Analog supply voltage VCC- 0.3 VCC+ 0.3
AVREF External reference voltage 1.0 VCC- 0.6 V
Rchannel DC output impedance 50
Linear output voltage range 0.15 VREF-0.15 V
RAREF Reference input resistance >10 M
CAREF Reference input capacitance Static load 7pF
Minimum Resistance load 1 k
Maximum capacitance load
100 pF
1000 serial resistance 1nF
Output sink/source
Operating within accuracy
specification AVCC/1000
mA
Safe operation 10
Symbol Parameter Condition Min. Typ. Max. Units
fDAC
Conversion
rate
Cload=100pF,
maximum step size
Normal mode 01000
ksps
Low power mode 0500
Symbol Parameter Condition Min. Typ. Max. Units
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 87
ATxmega32E5/16E5/8E5
Table 36-13. Accuracy Characteristics
Note: 1. Maximum numbers are based on characterisation and not tested in production, and valid for 5% to 95% output voltage range.
36.8 Analog Comparator Characteristics
Table 36-14. Analog Comparator Characteristics
Symbol Parameter Condition Min. Typ. Max. Units
RES Input Resolution 12 Bits
INL (1) Integral non-linearity
VREF= Ext 1.0V
VCC = 1.6V ±2.0 ±3
lsb
VCC = 3.6V ±1.5 ±2.5
VREF=AVCC
VCC = 1.6V ±2.0 ±4
VCC = 3.6V ±1.5 ±4
VREF=INT1V
VCC = 1.6V ±5.0
VCC = 3.6V ±5.0
DNL (1) Differential non-linearity
VREF=Ext 1.0V
VCC = 1.6V ±1.5 3
VCC = 3.6V ±0.6 1.5
VREF=AVCC
VCC = 1.6V ±1.0 3.5
VCC = 3.6V ±0.6 1.5
VREF=INT1V
VCC = 1.6V ±4.5
VCC = 3.6V ±4.5
Gain error After calibration <4
Gain calibration step size 4
Gain calibration drift VREF= Ext 1.0V <0.2 mV/K
Offset error After calibration <1 lsb
Offset calibration step size 1
Symbol Parameter Condition Min. Typ. Max. Units
Voff Input offset voltage 10 mV
Ilk Input leakage current <10 50 nA
Input voltage range -0.1 AVCC V
AC startup time 50 µs
Vhys1 Hysteresis, none VCC = 1.6V - 3.6V 0
mVVhys2 Hysteresis, small VCC = 1.6V - 3.6V 12
Vhys3 Hysteresis, large VCC = 1.6V - 3.6V 28
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 88
ATxmega32E5/16E5/8E5
36.9 Bandgap and Internal 1.0V Reference Characteristics
Table 36-15. Bandgap and Internal 1.0V Reference Characteristics
36.9.1 Brownout Detection Characteristics
tdelay Propagation delay
VCC = 3.0V, T= 85°C 22 30
ns
VCC = 1.6V - 3.6V 21 40
64-Level Voltage Scaler Integral non-
linearity (INL) 0.3 0.5 lsb
Current source accuracy after calibration 5 %
Current source calibration range Single mode 4 6
µA
Current source calibration range Double mode 812
Symbol Parameter Condition Min. Typ. Max. Units
Startup time
As reference for ADC 1 ClkPER + 2.5μs
µs
As input voltage to ADC and
AC 1.5
BANDGAP Bandgap voltage 1.1
V
INT1V Internal 1.00V reference for ADC and
DAC T= 25°C, after calibration 0.99 1.0 1.01
Variation over voltage and temperature Calibrated at T= 25°C ±3 %
Symbol Parameter Condition Min. Typ. Max. Units
VBOT
BOD level 0 falling VCC 1.50 1.65 1.75
V
BOD level 1 falling VCC 1.8
BOD level 2 falling VCC 2.0
BOD level 3 falling VCC 2.2
BOD level 4 falling VCC 2.4
BOD level 5 falling VCC 2.6
BOD level 6 falling VCC 2.8
BOD level 7 falling VCC 3.0
TBOD Detection time
Continuous mode 0.4 µs
Sampled mode 1.0 ms
VHYST Hysteresis BOD level 0 - 7. Min value measured
at BOD level 0 1.0 %
Symbol Parameter Condition Min. Typ. Max. Units
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 89
ATxmega32E5/16E5/8E5
36.10 External Reset Characteristics
Table 36-16. External Reset Characteristics
36.11 Power-on Reset Characteristics
Table 36-17. Power-on Reset Characteristics
Note: 1. VPOT- values are only valid when BOD is disabled. When BOD is enabled VPOT- = VPOT+.
36.12 Flash and EEPROM Characteristics
Table 36-18. Endurance and Data Retention
Symbol Parameter Condition Min. Typ. Max. Units
tEXT Minimum reset pulse width 90 1000 ns
VRST
Reset threshold voltage (VIH)
VCC = 2.7 - 3.6V 0.6*VCC
V
VCC = 1.6 - 2.7V 0.6*VCC
Reset threshold voltage (VIL)
VCC = 2.7 - 3.6V 0.5*VCC
VCC = 1.6 - 2.7V 0.4*VCC
RRST Reset pin Pull-up Resistor 25 k
Symbol Parameter Condition Min. Typ. Max. Units
VPOT-(1) POR threshold voltage falling VCC
VCC falls faster than 1V/ms 0.4 1.0
V
VCC falls at 1V/ms or slower 0.8 1.3
VPOT+
POR threshold voltage raising
VCC
1.3 1.59
Parameter Condition Min. Typ. Max. Units
Flash
Write/Erase cycles
25C10K
Cycle85°C 10K
105°C 2K
Data retention
25°C 100
Year85°C 25
105°C 10
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 90
ATxmega32E5/16E5/8E5
Table 36-19. Programming Time
Notes: 1. Programming is timed from the 2MHz output of 8MHz internal oscillator.
2. EEPROM is not erased if the EESAVE fuse is programmed.
EEPROM
Write/Erase cycles
25°C 100K
Cycle85°C 100K
105°C 30K
Data retention
25°C 100
Year85°C 25
105°C 10
Parameter Condition Min. Typ.(1) Max. Units
Chip Erase
32KB Flash, EEPROM(2) 50
ms
16KB Flash, EEPROM(2) 45
8KB Flash, EEPROM(2) 42
Flash
Page erase 4
Page write 4
Atomic page erase and write 8
EEPROM
Page erase 4
Page write 4
Atomic page erase and write 8
Parameter Condition Min. Typ. Max. Units
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 91
ATxmega32E5/16E5/8E5
36.13 Clock and Oscillator Characteristics
36.13.1 Calibrated 32.768kHz Internal Oscillator Characteristics
Table 36-20. 32.768kHz Internal Oscillator Characteristics
36.13.2 Calibrated 8MHz Internal Oscillator Characteristics
Table 36-21. 8MHz Internal Oscillator Characteristics
36.13.3 Calibrated and Tunable 32MHz Internal Oscillator Characteristics
Table 36-22. 32MHz Internal Oscillator Characteristics
36.13.4 32 kHz Internal ULP Oscillator Characteristics
Table 36-23. 32 kHz Internal ULP Oscillator Characteristics
Symbol Parameter Condition Min. Typ. Max. Units
Frequency 32.768 kHz
Factory calibration accuracy T = 25°C, VCC = 3.0V -0.5 0.5
%
User calibration accuracy -0.5 0.5
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range 4.4 9.4
MHz
Factory calibrated frequency 8
Factory calibration accuracy T = 25°C, VCC = 3.0V -0.5 0.5
%
User calibration accuracy -0.5 0.5
Symbol Parameter Condition Min. Typ. Max. Units
Frequency range DFLL can tune to this frequency over voltage
and temperature 30 55
MHz
Factory calibrated frequency 32
Factory calibration accuracy T = 25°C, VCC = 3.0V -1.5 1.5
%User calibration accuracy -0.2 0.2
DFLL calibration step size 0.23
Symbol Parameter Condition Min. Typ. Max. Units
Output frequency 32 kHz
Accuracy -30 30 %
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 92
ATxmega32E5/16E5/8E5
36.13.5 Internal Phase Locked Loop (PLL) Characteristics
Table 36-24. Internal PLL Characteristics
Note: 1. The maximum output frequency vs. supply voltage is linear between 1.8V and 2.7V, and can never be higher than four times the maximum CPU frequency.
36.13.6 External Clock Characteristics
Figure 36-3. External Clock Drive Waveform
Table 36-25. External Clock used as System Clock without Prescaling
Note: 1. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
Symbol Parameter Condition Min. Typ. Max. Units
fIN Input frequency Output frequency must be within fOUT 0.4 64
MHz
fOUT Output frequency (1) VCC= 1.6 - 1.8V 20 48
VCC= 2.7 - 3.6V 20 128
Start-up time 25
µs
Re-lock time 25
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (1) VCC = 1.6 - 1.8V 012
MHz
VCC = 2.7 - 3.6V 032
tCK Clock Period
VCC = 1.6 - 1.8V 83.3
ns
VCC = 2.7 - 3.6V 31.5
tCH Clock High Time
VCC = 1.6 - 1.8V 30.0
VCC = 2.7 - 3.6V 12.5
tCL Clock Low Time
VCC = 1.6 - 1.8V 30.0
VCC = 2.7 - 3.6V 12.5
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
VCC = 2.7 - 3.6V 3
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 10
VCC = 2.7 - 3.6V 3
tCK Change in period from one clock cycle to the next 10 %
tCH
tCL
tCK
tCH
VIL1
VIH1
tCR tCF
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 93
ATxmega32E5/16E5/8E5
Table 36-26. External Clock with Prescaler (1) for System Clock
Notes: 1. System Clock Prescalers must be set so that maximum CPU clock frequency for device is not exceeded.
2. The maximum frequency vs. supply voltage is linear between 1.6V and 2.7V, and the same applies for all other parameters with supply voltage conditions.
36.13.7 External 16MHz Crystal Oscillator and XOSC Characteristics
Table 36-27. External 16MHz Crystal Oscillator and XOSC Characteristics
Symbol Parameter Condition Min. Typ. Max. Units
1/tCK Clock Frequency (2) VCC = 1.6 - 1.8V 090
MHz
VCC = 2.7 - 3.6V 0142
tCK Clock Period
VCC = 1.6 - 1.8V 11
ns
VCC = 2.7 - 3.6V 7
tCH Clock High Time
VCC = 1.6 - 1.8V 4.5
VCC = 2.7 - 3.6V 2.4
tCL Clock Low Time
VCC = 1.6 - 1.8V 4.5
VCC = 2.7 - 3.6V 2.4
tCR Rise Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
VCC = 2.7 - 3.6V 1.0
tCF Fall Time (for maximum frequency)
VCC = 1.6 - 1.8V 1.5
VCC = 2.7 - 3.6V 1.0
tCK Change in period from one clock cycle to the next 10 %
Symbol Parameter Condition Min. Typ. Max. Units
Cycle to cycle jitter
XOSCPWR=0
FRQRANGE=0 <10
ns
FRQRANGE=1, 2, or 3 <1
XOSCPWR=1 <1
Long term jitter
XOSCPWR=0
FRQRANGE=0 <6
FRQRANGE=1, 2, or 3 <0.5
XOSCPWR=1 <0.5
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 94
ATxmega32E5/16E5/8E5
Frequency error
XOSCPWR=0
FRQRANGE=0 <0.1
%
FRQRANGE=1 <0.05
FRQRANGE=2 or 3 <0.005
XOSCPWR=1 <0.005
Duty cycle
XOSCPWR=0
FRQRANGE=0 40
FRQRANGE=1 42
FRQRANGE=2 or 3 45
XOSCPWR=1 48
RQNegative impedance (1)
XOSCPWR=0,
FRQRANGE=0
0.4MHz resonator,
CL=100pF
1MHz crystal, CL=20pF
2MHz crystal, CL=20pF
XOSCPWR=0,
FRQRANGE=1,
CL=20pF
2MHz crystal
8MHz crystal
9MHz crystal
XOSCPWR=0,
FRQRANGE=2,
CL=20pF
8MHz crystal
9MHz crystal
12MHz crystal
XOSCPWR=0,
FRQRANGE=3,
CL=20pF
9MHz crystal
12MHz crystal
16MHz crystal
XOSCPWR=1,
FRQRANGE=0,
CL=20pF
9MHz crystal
12MHz crystal
16MHz crystal
XOSCPWR=1,
FRQRANGE=1,
CL=20pF
9MHz crystal
12MHz crystal
16MHz crystal
XOSCPWR=1,
FRQRANGE=2,
CL=20pF
12MHz crystal
16MHz crystal
XOSCPWR=1,
FRQRANGE=3,
CL=20pF
12MHz crystal
16MHz crystal
ESR SF=Safety factor min(RQ)
/SF k
Symbol Parameter Condition Min. Typ. Max. Units
pacilance ed safew :3: (or deflnma pm Cap
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 95
ATxmega32E5/16E5/8E5
Note: 1. Numbers for negative impedance are not tested in production but guaranteed from design and characterization.
36.13.8 External 32.768kHz Crystal Oscillator and TOSC Characteristics
Table 36-28. External 32.768kHz Crystal Oscillator and TOSC Characteristics
Note: 1. See Figure 36-4 for definition.
Figure 36-4. TOSC Input Capacitance
The parasitic capacitance between the TOSC pins is CL1 + CL2 in series as seen from the crystal when oscillating without
external capacitors.
CXTAL1
Parasitic capacitance
XTAL1 pin 5.4
pFCXTAL2
Parasitic capacitance
XTAL2 pin 7.1
CLOAD
Parasitic capacitance
load 3.07
Symbol Parameter Condition Min. Typ. Max. Units
ESR/R1 Recommended crystal equivalent
series resistance (ESR)
Crystal load capacitance 6.5pF 60
k
Crystal load capacitance 9.0pF 35
CTOSC1 Parasitic capacitance TOSC1 pin 5.3
pF
CTOSC2 Parasitic capacitance TOSC2 pin 7.4
Recommended safety factor capacitance load matched to crystal
specification 3.0
Symbol Parameter Condition Min. Typ. Max. Units
C
L1
C
L2
2CS
O
T
1
CS
O
T
Device internal
External
32.768kHz crystal
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 96
ATxmega32E5/16E5/8E5
36.14 SPI Characteristics
Figure 36-5. SPI Timing Requirements in Master Mode
Figure 36-6. SPI Timing Requirements in Slave Mode
MSB LSB
BSLBSM
t
MOS
t
MIS
t
MIH
t
SCKW
t
SCK
t
MOH
t
MOH
t
SCKF
t
SCKR
t
SCKW
MOSI
(Data Output)
MISO
(Data Input)
SCK
(CPOL = 1)
SCK
(CPOL = 0)
SS
MSB LSB
BSLBSM
t
SIS
t
SIH
t
SSCKW
t
SSCKW
t
SSCK
t
SSH
t
SOSSH
t
SCKR
t
SCKF
t
SOS
t
SSS
t
SOSSS
MISO
(Data Output)
MOSI
(Data Input)
SCK
(CPOL = 1)
SCK
(CPOL = 0)
SS
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 97
ATxmega32E5/16E5/8E5
Table 36-29. SPI Timing Characteristics and Requirements
Symbol Parameter Condition Min. Typ. Max. Units
tSCK SCK period Master
ns
tSCKW SCK high/low width Master 0.5×SCK
tSCKR SCK rise time Master 2.7
tSCKF SCK fall time Master 2.7
tMIS MISO setup to SCK Master 10
tMIH MISO hold after SCK Master 10
tMOS MOSI setup SCK Master 0.5×SCK
tMOH MOSI hold after SCK Master 1.0
tSSCK Slave SCK Period Slave 4×t ClkPE
R
tSSCKW SCK high/low width Slave 2×t ClkPE
R
tSSCKR SCK rise time Slave 1600
tSSCKF SCK fall time Slave 1600
tSIS MOSI setup to SCK Slave 3.0
tSIH MOSI hold after SCK Slave t ClkPER
tSSS SS setup to SCK Slave 21
tSSH SS hold after SCK Slave 20
tSOS MISO setup SCK Slave 8.0
tSOH MISO hold after SCK Slave 13
tSOSS MISO setup after SS low Slave 11
tSOSH MISO hold after SS high Slave 8.0
j lI
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 98
ATxmega32E5/16E5/8E5
36.15 Two-Wire Interface Characteristics
Table 36-6 on page 83 describes the requirements for devices connected to the two-wire interface (TWI) Bus. The AVR
XMEGA TWI meets or exceeds these requirements under the noted conditions. Timing symbols refer to Figure 36-7.
Figure 36-7. Two-wire Interface Bus Timing
Table 36-30. Two-wire Interface Characteristics
Symbol Parameter Condition Min. Typ. Max. Units
VIH Input high voltage 0.7VCC VCC+0.5
V
VIL Input low voltage -0.5 0.3VCC
Vhys
Hysteresis of Schmitt trigger
inputs 0.05VCC(1)
VOL Output low voltage 3mA, sink current 00.4
IOL Low level output current
fSCL 400kHz
VOL = 0.4V
3
mA
fSCL 1MHz 20
trRise time for both SDA and SCL
fSCL 400kHz 20+0.1Cb(1)(2) 300
ns
fSCL 1MHz 120
tof
Output fall time from VIHmin to
VILmax
10pF<
Cb<400pF(2)
fSCL
400kHz 20+0.1Cb(1)(2) 250
fSCL 1MHz 120
tSP Spikes suppressed by Input filter 050
IIInput current for each I/O Pin 0.1 VCC <VI <0.9 VCC -10 10 µA
CICapacitance for each I/O Pin 10 pF
fSCL SCL clock frequency fPER(3) > max(10fSCL,250kHz) 0 1 MHz
RPValue of pull-up resistor
fSCL 100kHz
(VCC-0.4V)/
IOL
100ns/Cb
fSCL 400kHz 300ns/Cb
fSCL 1MHz 550ns/Cb
tHD;STA
Hold time (repeated) START
condition
fSCL 100kHz 4
µsfSCL 400kHz 0.6
fSCL 1MHz 0.26
t
HD;STA
t
of
SDA
SCL
t
LOW
t
HIGH
t
SU;STA
t
BUF
t
r
t
HD;DAT
t
SU;DAT
t
SU;STO
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 99
ATxmega32E5/16E5/8E5
Notes: 1. Required only for fSCL > 100kHz.
2. Cb = Capacitance of one bus line in pF.
3. fPER = Peripheral clock frequency.
tLOW Low period of SCL Clock
fSCL 100kHz 4.7
µs
fSCL 400kHz 1.3
fSCL 1MHz 0.5
tHIGH High period of SCL Clock
fSCL 100kHz 4
fSCL 400kHz 0.6
fSCL 1MHz 0.26
tSU;STA
Set-up time for a repeated START
condition
fSCL 100kHz 4.7
fSCL 400kHz 0.6
fSCL 1MHz 0.26
tHD;DAT Data hold time
fSCL 100kHz 03.45
fSCL 400kHz 00.9
fSCL 1MHz 00.45
tSU;DAT Data setup time
fSCL 100kHz 250
nsfSCL 400kHz 100
fSCL 1MHz 50
tSU;STO Setup time for STOP condition
fSCL 100kHz 4
µs
fSCL 400kHz 0.6
fSCL 1MHz 0.26
tBUF
Bus free time between a STOP
and START condition
fSCL 100kHz 4.7
fSCL 400kHz 1.3
fSCL 1MHz 0.5
Symbol Parameter Condition Min. Typ. Max. Units
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 100
ATxmega32E5/16E5/8E5
37. Typical Characteristics
37.1 Current Consumption
37.1.1 Active Mode Supply Current
Figure 37-1. Active Mode Supply Current vs. Frequency
fSYS = 0 – 1MHz external clock, T = 25°C
Figure 37-2. Active Mode Supply Current vs. Frequency
fSYS = 0 – 32MHz external clock, T = 25°C
ICC [mA]
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.0 0.2 0.4 0.6 0.8 1.0
Frequency [MHz]
V_CC_ 1.6
1.8
2.2
2.7
3
3.6
ICC [mA]
0
1
2
3
4
5
6
7
8
9
04812 16 20 24 28 32
Frequency [MHz]
V_CC_ 1.6
1.8
2.2
2.7
3
3.6
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 101
ATxmega32E5/16E5/8E5
Figure 37-3. Active Mode Supply Current vs. VCC
fSYS = 32.768kHz internal oscillator
Figure 37-4. Active Mode Supply Current vs. VCC
fSYS = 1MHz external clock
ICC [uA]
27.0
28.0
29.0
30.0
31.0
32.0
33.0
34.0
35.0
36.0
37.0
38.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
ICC [mA]
0.10
0.15
0.20
0.25
0.30
0.35
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 102
ATxmega32E5/16E5/8E5
Figure 37-5. Active Mode Supply Current vs. VCC
fSYS = 8MHz internal oscillator prescaled to 2MHz
Figure 37-6. Active Mode Supply Current vs. VCC
fSYS = 8MHz internal oscillator
ICC [mA]
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
ICC [mA]
0.5
1.0
1.5
2.0
2.5
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 103
ATxmega32E5/16E5/8E5
Figure 37-7. Active mode Supply Current vs. VCC
fSYS = 32MHz internal oscillator prescaled to 8MHz
Figure 37-8. Active Mode Supply Current vs. VCC
fSYS = 32MHz internal oscillator
ICC [mA]
1.0
1.5
2.0
2.5
3.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
ICC [mA]
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Vcc [V]
Temperature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 104
ATxmega32E5/16E5/8E5
37.1.2 Idle Mode Supply Current
Figure 37-9. Idle Mode Supply Current vs. Frequency
fSYS = 0 - 1MHz external clock, T = 25
C
Figure 37-10. Idle Mode Supply Current vs. Frequency
fSYS = 1 - 32MHz external clock, T = 25
C
ICC [uA]
0
25
50
75
100
125
150
0.0 0.2 0.4 0.6 0.8 1.0
Frequency [MHz]
V_CC_ 1.600
1.800
2.200
2.700
3.000
3.600
ICC [mA]
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
04812 16 20 24 28 32
Frequency [MHz]
V_CC_ 1.6
1.8
2.2
2.7
3
3.6
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 105
ATxmega32E5/16E5/8E5
Figure 37-11. Idle Mode Supply Current vs. VCC
fSYS = 32.768kHz internal oscillator
Figure 37-12. Idle Mode Supply Current vs. VCC
fSYS = 1MHz external clock
ICC [uA]
25
26
27
28
29
30
31
32
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
ICC [uA]
45.0
46.5
48.0
49.5
51.0
52.5
54.0
55.5
1.6 1.8 1.700 2.2 2.4 2.6 2.8 1.800 3.2 3.4 3.6
Vcc [V]
Tem perature -40
25
85
105
svs svs
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 106
ATxmega32E5/16E5/8E5
Figure 37-13. Idle Mode Supply Current vs. VCC
fSYS = 8MHz internal oscillator prescaled to 2MHz
Figure 37-14. Idle Mode Supply Current vs. VCC
fSYS = 8MHz internal oscillator
ICC [mA]
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
ICC [mA]
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
svs svs
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 107
ATxmega32E5/16E5/8E5
Figure 37-15. Idle Mode Supply Current vs. VCC
fSYS = 32MHz internal oscillator prescaled to 8MHz
Figure 37-16. Idle Mode Supply Current vs. VCC
fSYS = 32MHz internal oscillator
ICC [mA]
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
ICC [mA]
2.5
3.0
3.5
4.0
4.5
2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6
Vcc [V]
Temperature -40
25
85
105
I —v— ‘‘‘‘‘‘
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 108
ATxmega32E5/16E5/8E5
37.1.3 Power-down Mode Supply Current
Figure 37-17. Power-down Mode Supply Current vs. Temperature
All functions disabled
Figure 37-18. Power-down Mode supply Current vs. VCC
All functions disabled
ICC [uA]
0.00
0.30
0.60
0.90
1.20
1.50
1.80
2.10
2.40
2.70
3.00
-30 -15 015 30 45 60 75 90 105
Temperature [°C]
V_CC_ 1.6
1.8
2.2
2.7
3
3.6
ICC [uA]
0.00
0.30
0.60
0.90
1.20
1.50
1.80
2.10
2.40
2.70
3.00
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Tem perature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 109
ATxmega32E5/16E5/8E5
Figure 37-19. Power-down Mode Supply Current vs. Temperature
Sampled BOD with Watchdog Timer running on ULP oscillator
37.1.4 Power-save Mode Supply Current
Figure 37-20. Power-save Mode Supply Current vs. VCC
Real Time Counter enabled and running from 1.024kHz output of 32.768kHz TOSC
Idd [µA]
0.725
0.730
0.735
0.740
0.745
0.750
0.755
0.760
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Idd [µA]
0.800
0.850
0.900
0.950
1.000
1.050
1.100
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 110
ATxmega32E5/16E5/8E5
37.1.5 Standby Mode Supply Current
Figure 37-21. Standby Supply Current vs. VCC
Standby, fSYS =1MHz
Figure 37-22. Standby Supply Current vs. VCC
25°C, running from different crystal oscillators
ICC [uA]
1
2
3
4
5
6
7
8
9
10
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Tem perature -40
25
85
105
Vcc [V]
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Idd [µA]
150
200
250
300
350
400
450
500
Crystals
0.455MHz
12.0MHz
16.0MHz
2.0MHz
8.0MHz
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 111
ATxmega32E5/16E5/8E5
37.2 I/O Pin Characteristics
37.2.1 Pull-up
Figure 37-23. I/O pin pull-up Resistor Current vs. Input Voltage
VCC = 1.8V
Figure 37-24. I/O Pin Pull-up Resistor Current vs. Input Voltage
VCC = 3.0V
IPIN [uA]
-70
-60
-50
-40
-30
-20
-10
0
10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VPIN [V]
Tem perature -40
25
85
105
IPIN [uA]
-120
-100
-80
-60
-40
-20
0
20
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
VPIN [V]
Tem perature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 112
ATxmega32E5/16E5/8E5
Figure 37-25. I/O Pin Pull-up Resistor Current vs. Input Voltage
VCC = 3.3V
37.2.2 Output Voltage vs. Sink/Source Current
Figure 37-26. I/O Pin Output Voltage vs. Source Current
VCC = 1.8V
IPIN [uA]
-150
-100
-50
0
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
VPIN [V]
Temperature -40
25
85
105
VPIN [V]
1.55
1.60
1.65
1.70
1.75
1.80
-2.0 -1.8 -1.6 -1.4 -1.2 -1.0 -0.8 -0.6 -0.4 -0.2 0.0
IPIN [mA]
Temperature 25
85
105
-40
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 113
ATxmega32E5/16E5/8E5
Figure 37-27. I/O Pin Output Voltage vs. Source Current
VCC = 3.0V
Figure 37-28. I/O Pin Output Voltage vs. Source Current
VCC = 3.3V
VPIN [V]
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
-10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0
IPIN [mA]
Temperature 25
85
105
-40
VPIN [V]
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
-10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0
IPIN [mA]
Temperature 25
85
105
-40
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 114
ATxmega32E5/16E5/8E5
Figure 37-29. I/O Pin Output Voltage vs. Source Current
Figure 37-30. I/O Pin Output Voltage vs. Sink Current
VCC = 1.8V
,
VPIN [V]
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-18 -15 -12 -9 -6 -3 0
IPIN [mA]
V_CC_ 1.6
1.8
2.7
3
3.3
3.6
VPIN [V]
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
IPIN [mA]
Temperature 25
85
105
-40
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 115
ATxmega32E5/16E5/8E5
Figure 37-31. I/O Pin Output Voltage vs. Sink Current
VCC = 3.0V
Figure 37-32. I/O Pin Output Voltage vs. Sink Current
VCC = 3.3V
VPIN [V]
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0246810 12 14 16 18 20
IPIN [mA]
Temperature 25
85
105
-40
VPIN [V]
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0246810 12 14 16 18 20
IPIN [mA]
Temperature 25
85
105
-40
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 116
ATxmega32E5/16E5/8E5
Figure 37-33. I/O Pin Output Voltage vs. Sink Current
37.2.3 Thresholds and Hysteresis
Figure 37-34. I/O Pin Input Threshold Voltage vs. VCC
T = 25°C
VPIN [V]
0.00
0.20
0.40
0.60
0.80
1.00
1.20
1.40
1.60
0246810 12 14 16 18 20
IPIN [mA]
V_CC_ 1.6
1.8
2.7
3
3.3
3.6
VTHRESHOLD [V]
0.75
0.90
1.05
1.20
1.35
1.50
1.65
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Test Info VIH
VIL
Vcc M
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 117
ATxmega32E5/16E5/8E5
Figure 37-35. I/O Pin Input Threshold Voltage vs. VCC
VIH I/O pin read as “1”
Figure 37-36. I/O Pin Input Threshold Voltage vs. VCC
VIL I/O pin read as “0”
VTHRESHOLD [V]
0.60
0.80
1.00
1.20
1.40
1.60
1.80
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
VTHRESHOLD [V]
0.60
0.80
1.00
1.20
1.40
1.60
1.80
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 118
ATxmega32E5/16E5/8E5
Figure 37-37. I/O Pin Input Hysteresis vs. VCC
37.3 ADC Characteristics
Figure 37-38. ADC INL vs. VREF
T = 25
C, VCC = 3.6V, external reference
VHYSTERESIS [V]
0.02
0.03
0.04
0.05
0.06
0.07
0.08
0.09
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Tem perature -40
25
85
105
INL [LSB]
0.25
0.50
0.75
1.00
1.25
1.50
1.75
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Vref [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
REF cc
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 119
ATxmega32E5/16E5/8E5
Figure 37-39. ADC INL Error vs. VCC
T = 25
C, VREF = 1.0V
Figure 37-40. ADC DNL Error vs. VREF
SE Unsigned mode, T=25
C, VCC = 3.6V, external reference
INL [LSB]
0.60
0.80
1.00
1.20
1.40
1.60
1.80
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
DNL [LSB]
0.45
0.50
0.55
0.60
0.65
0.70
0.75
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Vref [V]
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 120
ATxmega32E5/16E5/8E5
Figure 37-41. ADC Gain Error vs. VCC
T = 25
C, VREF = 1.0V, ADC sample rate = 300ksps
Figure 37-42. ADC Gain Error vs. VREF
T = 25
C, VCC = 3.6V, ADC sample rate = 300ksps
Gain error [mV]
-5.0
-4.0
-3.0
-2.0
-1.0
0.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
Gain error [mV]
-14.0
-12.0
-10.0
-8.0
-6.0
-4.0
-2.0
0.0
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Vref [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 121
ATxmega32E5/16E5/8E5
Figure 37-43. ADC Gain Error vs. Temperature
VCC = 3.6V, VREF = 1.0V, ADC sample rate = 300ksps
Figure 37-44. ADC Offset Error vs. VCC
T = 25
C, VREF = 1.0V, ADC sample rate = 300ksps
Gain error [mV]
-7.0
-6.0
-5.0
-4.0
-3.0
-2.0
-1.0
0.0
-40 -20 0 20 40 60 80 100
Temperature [°C]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
Offset [mV]
0.0
5.0
10.0
15.0
20.0
25.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
cc cc REF
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 122
ATxmega32E5/16E5/8E5
Figure 37-45. ADC Offset Error vs. VREF
T = 25
C, VCC = 3.6V, ADC sample rate = 300ksps
Figure 37-46. ADC Gain Error vs. Temperature
VCC = 3.6V, VREF = external 1.0V, sample rate = 300ksps
Offset [mV]
5.0
10.0
15.0
20.0
25.0
30.0
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Vref [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
Gain error [mV]
-7.0
-6.0
-5.0
-4.0
-3.0
-2.0
-1.0
0.0
-40 -20 0 20 40 60 80 100
Temperature [°C]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 123
ATxmega32E5/16E5/8E5
37.4 DAC Characteristics
Figure 37-47. DAC INL Error vs. External VREF
T = 25
C, VCC = 3.6V
Figure 37-48. DNL Error vs. VREF
T = 25
C, VCC = 3.6V
INL [LSB]
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2
2.1
2.2
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Vref [V]
DNL [LSB]
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Vref [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 124
ATxmega32E5/16E5/8E5
Figure 37-49. DNL Error vs. VCC
T = 25
C, VREF = 1.0V
37.5 AC Characteristics
Figure 37-50. Analog Comparator Hysteresis vs. VCC
Small hysteresis
DNL [LSB]
0.30
0.40
0.50
0.60
0.70
0.80
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Mode
Differential mode
Single-ended signed mode
Single-ended unsigned mode
Vcc [V]
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vhyst [mV]
4
6
8
10
12
14
16
Temperature (°C)
-40
25
85
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 125
ATxmega32E5/16E5/8E5
Figure 37-51. Analog Comparator Hysteresis vs. VCC
Large hysteresis
Figure 37-52. Analog Comparator Propagation Delay vs. VCC
Vcc [V]
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vhyst [mV]
14
16
18
20
22
24
26
28
30
32
34
Temperature (°C)
-40
25
85
Vcc [V]
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
tPD [ns]
10
12
14
16
18
20
22
24
26
Temperature (°C)
-40
25
85
CC
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 126
ATxmega32E5/16E5/8E5
Figure 37-53. Analog Comparator Propagation Delay vs. Temperature
Figure 37-54. Analog Comparator Current Consumption vs. VCC
Temperature [°C]
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
tPD [ns]
10
12
14
16
18
20
22
24
26
Vcc (V) 1.6
2
2.7
3
3.3
3.6
Module current consumption [uA]
150
160
170
180
190
200
210
220
230
240
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
Temperature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 127
ATxmega32E5/16E5/8E5
Figure 37-55. Analog Comparator Voltage Scaler vs. SCALEFAC
T = 25
C, VCC = 3.0V
Figure 37-56. Analog Comparator Offset Voltage vs. Common Mode Voltage
25°C
-0.150
-0.125
-0.100
-0.075
-0.050
-0.025
0
0.025
0.050
0 10203040506070
SCALEFAC
INL [LSB]
Vcm [V]
0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6
Voffset [mV]
0
5
10
15
20
25
30
35
Temperature (°C) -40
25
85
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 128
ATxmega32E5/16E5/8E5
Figure 37-57. Analog Comparator Source vs. Calibration Value
VCC = 3.0V
Figure 37-58. Analog Comparator Source vs. Calibration Value
T = 25
C
CALIB [3..0]
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
I [uA]
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
Temperature (°C) -40
25
85
CALIB [3..0]
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
I [uA]
2.0
3.0
4.0
5.0
6.0
7.0
8.0
Vcc [V]
1.8
2.2
3
3.6
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 129
ATxmega32E5/16E5/8E5
37.6 Internal 1.0V Reference Characteristics
Figure 37-59. ADC/DAC Internal 1.0V Reference vs. Temperature
37.7 BOD Characteristics
Figure 37-60. BOD Thresholds vs. Temperature
BOD level = 1.6V
Bandgap Voltage [V]
0.980
0.985
0.990
0.995
1.000
1.005
1.010
1.015
-40 -30 -20 -10 010 20 30 40 50 60 70 80 90 100 110
Temperature [°C]
Vcc 1.6
1.8
2.2
2.7
3
3.3
3.6
VBOT [V]
1.61
1.62
1.63
1.64
1.65
1.66
1.67
1.68
1.69
1.70
-30 -15 015 30 45 60 75 90 105
Temperature [°C]
Test Info fall
rise
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 130
ATxmega32E5/16E5/8E5
Figure 37-61. BOD Thresholds vs. Temperature
BOD level = 3.0V
37.8 External Reset Characteristics
Figure 37-62. Minimum Reset Pin Pulse Width vs. VCC
VBOT [V]
2.95
3.00
3.05
3.10
-30 -15 015 30 45 60 75 90 105
Temperature [°C]
Test Info fall
rise
t_RST_ [ns]
80
90
100
110
120
130
140
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
T [°C] -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 131
ATxmega32E5/16E5/8E5
Figure 37-63. Reset Pin Pull-up Resistor Current vs. Reset Pin Voltage
VCC = 1.8V
Figure 37-64. Reset Pin Pull-up Resistor Current vs. Reset Pin Voltage
VCC = 3.0V
IRESET [uA]
-80
-70
-60
-50
-40
-30
-20
-10
0
10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VRESET [V]
Tem perature -40
25
85
105
IRESET [uA]
-125
-100
-75
-50
-25
0
25
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0
VRESET [V]
Tem perature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 132
ATxmega32E5/16E5/8E5
Figure 37-65. Reset Pin Pull-up Resistor Current vs. Reset Pin Voltage
VCC = 3.3V
Figure 37-66. Reset Pin Input Threshold Voltage vs. VCC
VIH - Reset pin read as “1”
IRESET [uA]
-150
-125
-100
-75
-50
-25
0
0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3
VRESET [V]
Tem perature -40
25
85
105
,
V_threshold_ [V]
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
T [°C] -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 133
ATxmega32E5/16E5/8E5
Figure 37-67. Reset Pin Input Threshold Voltage vs. VCC
VIL - Reset pin read as “0”
37.9 Power-on Reset Characteristics
Figure 37-68. Power-on Reset Current Consumption vs. VCC
BOD level = 3.0V, enabled in continuous mode
V_threshold_ [V]
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
T [°C] -40
25
85
105
ICC [uA]
0
100
200
300
400
500
600
700
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
V_CC_ [V]
T [°C] -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 134
ATxmega32E5/16E5/8E5
Figure 37-69. Power-on Reset Current Consumption vs. VCC
BOD level = 3.0V, enabled in sampled mode
ICC [uA]
0
65
130
195
260
325
390
455
520
585
650
0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
V_CC_ [V]
T [°C] -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 135
ATxmega32E5/16E5/8E5
37.10 Oscillator Characteristics
37.10.1 Ultra Low-Power Internal Oscillator
Figure 37-70. Ultra Low-Power Internal Oscillator Frequency vs. Temperature
37.10.2 32.768KHz Internal Oscillator
Figure 37-71. 32.768kHz Internal Oscillator Frequency vs. Temperature
Frequency [kHz]
28
29
30
31
32
33
34
35
36
37
-45 -30 -15 015 30 45 60 75 90 105
Temperature [°C]
V_CC_ 1.6
1.8
2.2
2.7
3
3.6
Frequency [kHz]
32.60
32.70
32.80
32.90
33.00
-45 -30 -15 015 30 45 60 75 90 105
Temperature [°C]
V_CC_ 1.6
1.8
2.2
2.7
3
3.6
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 136
ATxmega32E5/16E5/8E5
Figure 37-72. 32.768kHz Internal Oscillator Frequency vs. Calibration Value
VCC = 3.0V
Figure 37-73. 32.768kHz Internal Oscillator Calibration Step Size
VCC = 3.0V, T = 25°C to 105°C
Frequency [kHz]
20.00
25.00
30.00
35.00
40.00
45.00
50.00
024 48 72 96 120 144 168 192 216 240 264
CAL
Temperature -40
25
85
105
Frequency Step Size [%]
-5.00
-4.00
-3.00
-2.00
-1.00
0.00
1.00
032 64 96 128 160 192 224 256
CAL
Temperature -40
25
85
105
xv
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 137
ATxmega32E5/16E5/8E5
37.10.3 8MHz Internal Oscillator
Figure 37-74. 8MHz Internal Oscillator Frequency vs. Temperature
Normal mode
Figure 37-75. 8MHz Internal Oscillator Frequency vs. Temperature
Low power mode
Frequency [MHz]
7.960
7.980
8.000
8.020
8.040
8.060
8.080
8.100
8.120
8.140
8.160
-45 -30 -15 015 30 45 60 75 90 105
Temperature [°C]
V_CC_[V] 1.6
1.8
2.2
2.7
3
3.6
Frequency [MHz]
7.980
8.000
8.020
8.040
8.060
8.080
8.100
8.120
8.140
8.160
-45 -30 -15 015 30 45 60 75 90 105
Temperature [°C]
V_CC_ 1.6
1.8
2.2
2.7
3
3.6
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 138
ATxmega32E5/16E5/8E5
Figure 37-76. 8MHz Internal Oscillator CAL Calibration Step Size
VCC = 3.0V
Figure 37-77. 8MHz Internal Oscillator Frequency vs. Calibration
VCC = 3.0V, normal mode
Frequency Step Size [%]
0.00
0.25
0.50
0.75
1.00
1.25
1.50
032 64 96 128 160 192 224 256
CAL
Temperature -40
25
85
105
Frequency [MHz]
2.000
4.000
6.000
8.000
10.000
12.000
14.000
16.000
032 64 96 128 160 192 224 256
CAL
Tem perature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 139
ATxmega32E5/16E5/8E5
37.10.4 32MHz Internal Oscillator
Figure 37-78. 32MHz Internal Oscillator Frequency vs. Temperature
DFLL disabled
Figure 37-79. 32MHz Internal Oscillator Frequency vs. Temperature
DFLL enabled, from the 32.768kHz internal oscillator
Frequency [MHz]
30.00
30.50
31.00
31.50
32.00
32.50
33.00
33.50
34.00
-40 -30 -20 -10 010 20 30 40 50 60 70 80 90 100 110
Temperature [°C]
V_CC_[V] 1.6
1.8
2.2
2.7
3
3.6
Frequency [MHz]
31.88
31.90
31.92
31.94
31.96
31.98
32.00
32.02
32.04
32.06
32.08
32.10
-45 -30 -15 015 30 45 60 75 90 105
Temperature [°C]
V_CC_ [V] 1.6
1.8
2.2
2.7
3
3.6
cc cc
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 140
ATxmega32E5/16E5/8E5
Figure 37-80. 32MHz Internal Oscillator CALA Calibration Step Size
VCC = 3.0V
Figure 37-81. 32MHz Internal Oscillator Frequency vs. CALA Calibration Value
VCC = 3.0V
Frequency Step Size [%]
0.15
0.16
0.17
0.18
0.19
0.20
0.21
0.22
0.23
0.24
0.25
016 32 48 64 80 96 112 128
CALA
Tem perature -40
25
85
105
Frequency [MHz]
38
40
42
44
46
48
50
52
54
016 32 48 64 80 96 112 128
CALA
Temperature -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 141
ATxmega32E5/16E5/8E5
Figure 37-82. 32MHz internal Oscillator Frequency vs. CALB Calibration Value
VCC = 3.0V
37.11 Two-wire Interface Characteristics
Figure 37-83. SDA Fall Time vs. Temperature
Frequency [MHz]
20.00
30.00
40.00
50.00
60.00
70.00
0 8 16 24 32 40 48 56 64
CALB
Temperature -40
25
85
105
Temperature [°C]
-40 -20 0 20 40 60 80 100 120
Fall Time [ns]
10
20
30
40
50
60
70
80
Mode
FAST
FAST +
STD
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 142
ATxmega32E5/16E5/8E5
Figure 37-84. SDA Fall Time vs. VCC
37.12 PDI Characteristics
Figure 37-85. Maximum PDI Frequency vs. VCC
Vcc [V]
1.6 1.8 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6
Fall Time [ns]
10
20
30
40
50
60
70
Mode
FAST
FAST +
STD
Maximum Frequency [MHz]
6
9
12
15
18
21
24
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6
Vcc [V]
T [°C] -40
25
85
105
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 143
ATxmega32E5/16E5/8E5
38. Errata – ATxmega32E5 / ATxmega16E5 / ATxmega8E5
38.1 Rev. B
DAC: AREF on PD0 is not available for the DAC
ADC: Offset correction fails in unsigned mode
EEPROM write and Flash write operations fails under 2.0V
TWI Master or slave remembering data
TWI SM bus level one Master or slave remembering data
Temperature Sensor not calibrated
Automatic port override on PORT C
Sext timer is not implemented in slave mode
Issue: DAC: AREF on PD0 is not available for the DAC
The AREF external reference input on pin PD0 is not available for the DAC.
Workaround:
No workaround. Only AREF on pin PA0 can be used as external reference input for the DAC.
Issue: ADC: Offset correction fails in unsigned mode
In single ended, unsigned mode, a problem appears in low saturation (zero) when the offset correction is activated.
The offset is removed from result and when a negative result appears, the result is not correct.
Workaround:
No workaround, but avoid using this correction method to cancel V effect.
Issue: EEPROM write and Flash write operations fails under 2.0V
EEPROM write and Flash write operations are limited from 2.0V to 3.6V. Other functionalities operates from 1.6V to
3.6V.
Workaround:
None.
Issue: TWI master or slave remembering data
If a write is made to Data register, prior to Address register, the TWI design sends the data as soon as the write to
Address register is made. But the send data will be always 0x00.
Workaround:
None.
2018 Microchip Technology Inc. Data Sheet Complete DS40002059A-page 144
ATxmega32E5/16E5/8E5
Issue: TWI SM bus level one Master or slave remembering data
If a write is made to Data register, prior to Address register, the TWI design sends the data as soon as the write to
Address register is made. But the send data will be always 0x00.
Workaround:
Since single interrupt line is shared by both timeout interrupt and other TWI interrupt sources, there is a possibility in
software that data register will be written after timeout is detected but before timeout interrupt routine is executed. To
avoid this, in software, before writing data register, always ensure that timeout status flag is not set.
Issue: Temperature sensor not calibrated
Temperature sensor factory calibration is not implemented on devices before date code 1324.
Workaround:
None.
Issue: Automatic port override on PORT C
When Waveform generation is enabled on PORT C Timers, Automatic port override of peripherals other than Tc may
not work even though the pin is not used as waveform output pin.
Workaround:
No workaround.
Issue: Sext timer is not implemented in slave mode
In slave mode, only Ttout timer is implemented. Sext timer is needed in slave mode to release the SCL line and to
allow the master to send a STOP condition. If only master implements Sext timer, slave continues to stretch the SCL
line (up to the Ttout timeout in the worse case). Sext = Slave cumulative timeout.
Workaround:
No workaround.
2018 Microchip Technology Inc. Data Sheet Complete