TS391, NCV391 Datasheet by ON Semiconductor

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0N Semiconductor“g TS SN 5 CAS KING W W 391A E u u Ana = Speci = Assam = Year = wmk = FbiF 1mm, Micmdat may A: WWW
© Semiconductor Components Industries, LLC, 2015
October, 2017 − Rev. 5 1Publication Order Number:
TS391/D
TS391, NCV391
Low Power Single Voltage
Comparator
Description
The TS391 is an open collector, low−power voltage comparator
designed specifically to operate from a single supply over a wide range
of voltages. Operation from split power supplies is also possible.
This comparator also has a unique characteristic in that the input
common−mode voltage range includes ground, even though operated
from a single power supply voltage.
Features
Wide Single Supply Voltage Range or Dual Supplies
Low Supply Current (0.5 mA) Independent of Supply Voltage
(1 mW/Comparator at +5 V)
Low Input Bias Current: 25 nA TYP
Low Input Offset Current: ±5 nA TYP
Low Input Offset Voltage: ±1 mV TYP
Input Common Mode Voltage Range includes Ground
Low Output Saturation Voltage: 250 mV TYP at IO = 4 mA
Differential Input Voltage Range Equal to the Supply Voltage
TTL, DTL, ECL, CMOS Compatible Devices
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
VEE VEE
VCC
IN+
IN−
VEE
Vout
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1
5
TSOP−5
SN SUFFIX
CASE 483
391 = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= Pb−Free Package
1
5
391AYWG
G
Analog
(Note: Microdot may be in either location)
Device Package Shipping
ORDERING INFORMATION
TS391SN2T1G TSOP−5
(Pb−Free) 3000 / Tape &
Reel
MARKING DIAGRAM
1
2
3
5
4IN+
VCC
OUT
VEE
IN−
PIN CONNECTIONS
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
NCV391SN2T1G* TSOP−5
(Pb−Free) 3000 / Tape &
Reel
* NCV Prefix for Automotive and Other Applications
Requiring Unique Site and Control Change Require
-
ments; AEC−Q100 Qualified and PPAP Capable
TS391, NCV391
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2
Table 1. ABSOLUTE MAXIMUM RATINGS (Over operating free−air temperature, unless otherwise stated)
Parameter Symbol Limit Unit
Supply Voltage (VCC − VEE) VS 36 V
INPUT AND OUTPUT PINS
Input Voltage VIN −0.3 to 36 V
Differential Input Voltage VID ±36 V
Output Short Circuit Current (Note 1) ISC 20 mA
TEMPERATURE
Storage Temperature TSTG −65 to +150 °C
Junction Temperature TJ+150 °C
ESD RATINGS
Human Body Model HBM 1500 V
Charged Device Model CDM 2000 V
Machine Model MM 200 V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Short circuits from the output to VCC can cause excessive heating and potential destruction. The maximum short circuit current is independent
of the magnitude of VCC.
Table 2. THERMAL INFORMATION (Note 2)
Thermal Metric Symbol Limit Unit
Junction to Ambient – SOIC8 qJA 238 °C/W
2. Short−circuits can cause excessive heating and destructive dissipation. These values are typical.
Table 3. OPERATING CONDITIONS
Parameter Symbol Limit Unit
Operating Supply Voltage VS2 to 36 V
Specified Operating Range TA−40 to +125 °C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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TS391, NCV391
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Table 4. ELECTRICAL CHARACTERISTICS (Vs=+5.0 V, At TA = +25°C)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
Parameter Symbol Test Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Offset Voltage VOS Vo = 1.4 V, RS =
0 W, VS = 5 V to
30 V
VCM = 0 to VCC −1.5 V 1 5 mV
VCM = 0 to VCC −2 V 9 mV
Input Bias Current IIB 25 250 nA
400 nA
Input Offset Current IOS 5 50 nA
150 nA
Input Common Mode
Range (Note 3) VICR 0 VCC – 1.5 V
0 VCC – 2 V
Differential Input Voltage
(Note 4) VID VCC V
OUTPUT CHARACTERISTICS
Output Voltage Low VOL VID = 1 V, IO = 4 mA 250 400 mV
700 mV
Output Sink Current IOVID = −1, VO = 1.5 V 6 16 mA
Output Leakage Current IOH VID = 1 V, VCC = VO = 5 V 0.1 nA
VID = 1 V, VCC = VO = 30 V 1mA
DYNAMIC PERFORMANCE
Open Loop Voltage Gain AVOL VCC = 15 V, RPU = 15 kW94 106 dB
Propagation Delay L−H tPLH 5 mV overdrive, RPU = 5.1 kW850 ns
20 mV overdrive, RPU = 5.1 kW490 ns
100 mV overdrive, RPU = 5.1 kW300 ns
TTL Input, Vref = +1.4 V,
RPU = 5.1 kW
220 ns
Propagation Delay H−L tPHL 5 mV overdrive, RPU = 5.1 kW620 ns
20 mV overdrive, RPU = 5.1 kW400 ns
100 mV overdrive, RPU = 5.1 kW250 ns
TTL Input, Vref = +1.4 V,
RPU = 5.1 kW
350 ns
POWER SUPPLY
Quiescent Current ICC VCC = 5 V 0.5 − mA
VCC = 30 V 0.5 1.25 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. The input common mode voltage of either input signal should not be allowed to go negative by more than 0.3 V. The upper end of the common
mode voltage range is VCC – 1.5 V, but either or both inputs can go to +30 V without damage.
4. Positive excursions of the input voltage may exceed the power supply level. As long as the other voltage remains within the common mode
range, the comparator will provide a proper output stage. The low input voltage state must not be less than 0.3 V below the negative supply
rail.
t25°C 7 26‘0
TS391, NCV391
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4
TYPICAL CHARACTERISTICS
Figure 1. Supply Current vs. Supply Voltage Figure 2. Input Bias Current vs. VCC
SUPPLY VOLTAGE (V) VCC (V)
35302520151050
200
300
400
500
700
800
900
1000
35302520151050
0
10
20
30
Figure 3. Low Level Output Voltage vs. Output
Current Figure 4. Propagation Delay L−H vs. Overdrive
LOW LEVEL OUTPUT CURRENT (mA) TIME (200 ns/div)
1001010.10.01
0.001
0.01
0.1
1
10
Figure 5. Propagation Delay H−L vs. Overdrive
SUPPLY CURRENT (mA)
INPUT BIAS CURRENT (nA)
LOW LEVEL OUTPUT VOLTAGE (V)
INPUT VOLTAGE (100 mV/div)
40
600
−55°C
0°C
25°C
70°C
125°C
40
−55°C
0°C
25°C70°C
125°C
VIN = 0 V
−55°C
25°C
125°C
OUTPUT VOLTAGE (500 mV/div)
VS = 5 V
RPU = 5.1 kW
CL = 20 pF
TA = 25°C
Input
100 mV 20 mV 5 mV
TIME (100 ns/div)
INPUT VOLTAGE (100 mV/div)
OUTPUT VOLTAGE (500 mV/div)
VS = 5 V
RPU = 5.1 kW
CL = 20 pF
TA = 25°C
Input
100 mV 20 mV 5 mV
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TSOP5
CASE 483
ISSUE N
DATE 12 AUG 2020
SCALE 2:1
1
5
XXX MG
G
GENERIC
MARKING DIAGRAM*
1
5
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
XXX = Specific Device Code
A = Assembly Location
Y = Year
W = Work Week
G= PbFree Package
1
5
XXXAYWG
G
Discrete/Logic
Analog
(Note: Microdot may be in either location)
XXX = Specific Device Code
M = Date Code
G= PbFree Package
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A
B
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
A
G
B
D
H
C
J
__
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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