molex 0.635mm E‘y¥§4fifi§4fifil3 $7 9
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TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
REVISED
J2015-0948
2015/01/20 Y.SATO06
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
J
STATUS
WRITTEN
BY:
N.AIDA
CHECKED
BY:
K.TOJO
APPROVED
BY:
M.SASAO
DATE: YR/MO/DAY
2004/03/01
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
1 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
【1.適用範囲 SCOPE
本仕様書は、 殿 に納入する
0.635mm ピッチ基板対基板用コネクタ について規定する。
This specification covers the 0.635mm PITCH BOARD TO BOARD CONNECTOR series.
【2.製品名称及び型番 PRODUCT NAME AND PART NUMBER
Product Name
Material Number
リセプタクル アッセンブリ
Receptacle Assembly
嵌合高さ
Stacking Height
H=5-10mm
吸着カバー無し
Without Cover
無鉛
LEAD FREE
52760-**70
吸着カバー付き
With Cover
無鉛
LEAD FREE
52885-**72
嵌合高さ
Stacking Height
H=11-16mm
吸着カバー無し
Without Cover
無鉛
LEAD FREE
52837-**70
吸着カバー付き
With Cover
無鉛
LEAD FREE
52901-**72
プラグ アッセンブリ
Plug Assembly
嵌合高さ
Stacking Height
H=6,12mm
吸着カバー無し
Without Cover
無鉛
LEAD FREE
55091-**71
吸着カバー付き
With Cover
無鉛
LEAD FREE
55091-**72
molex -LEAD FREE- flufizttfil
LANGUAGE
JAPANESE
ENGLISH
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TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
SEE SHEET 1 OF 13
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
2 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Product Name
Material Number
プラグ アッセンブリ
Plug Assembly
嵌合高さ
Stacking Height
H=7,13mm
吸着カバー無し
Without Cover
無鉛
LEAD FREE
53481-**67
吸着カバー無し
Without Cover
無鉛
LEAD FREE
53481-**77
吸着カバー付き
With Cover
無鉛
LEAD FREE
53625-**72
嵌合高さ
Stacking Height
H=8,14mm
吸着カバー無し
Without Cover
無鉛
LEAD FREE
53551-**77
吸着カバー付き
With Cover
無鉛
LEAD FREE
53647-***9
嵌合高さ
Stacking Height
H=9,15mm
吸着カバー付き
With Cover
無鉛
LEAD FREE
53649-**72
嵌合高さ
Stacking Height
H=10,16mm
吸着カバー無し
Without Cover
無鉛
LEAD FREE
53553-**77
吸着カバー付き
With Cover
無鉛
LEAD FREE
53627-**72
* : 図面参照 Refer to the drawing
-**68:吸着カバー無しエンボス梱包
EMBOSSED PACKAGING OF PRODUCT WITHOUT COVER
-**74:吸着カバー付きエンボス梱包
EMBOSSED PACKAGING OF PRODUCT WITH COVER
-**75:吸着カバー付きステイック梱包
STICK PACKAGING OF PRODUCT WITH COVER
-**76:吸着カバー無しトレー梱包
TRAY PACKAGING OF PRODUCT WITHOUT COVER
53551-**77のトレー梱包品は、53936-**76です
-**78:吸着カバー無しエンボス梱包
EMBOSSED PACKAGING OF PRODUCT WITHOUT COVER
52760-**70のエンボス梱包品は、54914-**78です。
-**79:吸着カバー無しステイック梱包
STICK PACKAGING OF PRODUCT WITHOUT COVER
-**94:吸着カバー付きエンボス梱包
EMBOSSED PACKAGING OF PRODUCT WITH COVER
molex 4 — 1 . ififlmfifié Electrical Performance -LEAD FREE- flufizttfil
LANGUAGE
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TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
SEE SHEET 1 OF 13
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
【3.定格 RATINGS
Item
Standard
最大許容電圧
Rated Voltage (MAXIMUM)
100 V
[AC(実効値 rms)/DC]
最大許容電流
Rated Current (MAXIMUM)
0.5 A
使用温度範囲
Ambient Temperature Range
(Operating and Non-operating)
-55 +105 *1
1:通電による温度上昇分を含む。
Including terminal temperature rise
【4.性 PERFORMANCE
-1.電気的性能 Electrical Performance
Item
Test Condition
嵌合高さ
Stacking Height
Requirement
4-1-1
Contact
Resistance
適合するコネクタを嵌合させ、開放電圧 20mV
以下、短絡電流 10mA以下 にて測定する。
(JIS C5402 5.4)
Mate applicable connectors, measure by dry
circuit, 20mV MAXIMUM, 10mA MAXIMUM.
(JIS C5402 5.4)
H= 4 - 7mm
40 milliohm
MAXIMUM
H= 8 -10mm
50 milliohm
MAXIMUM
H= 11 -13mm
60 milliohm
MAXIMUM
H= 14 -16mm
70 milliohm
MAXIMUM
4-1-2
Insulation
Resistance
適合するコネクタを嵌合させ、隣接するターミ
ナル間及びターミナル、アース間に、DC 250V
を印加し測定する。
(JIS C5402 5.2/MIL-STD-202 験法 302)
Mate applicable connectors together and apply
250V DC between adjacent terminal and
ground.
(JIS C5402 5.2/MIL-STD-202 Method 302)
1000 Megohm MINIMUM
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TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
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SEE SHEET 1 OF 13
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REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
4 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
嵌合高さ
Stacking Height
Requirement
4-1-3
Dielectric
Strength
適合するコネクタを嵌合させ、隣接するターミ
ナル間及びターミナル、アース間に、AC 250V
(実効値)を 1分間 印加する。
(JIS C5402 5.1/MIL-STD-202 験法 301)
Mate applicable connectors, apply 250V AC for
1 minute between adjacent terminal or ground.
(JIS C5402 5.1/MIL-STD-202 Method 301)
異状なきこと
No Breakdown
-2. 械的性 Mechanical Performance
Item
Test Condition
Requirement
4-2-1
挿入・抜去力
Insertion Force/
Withdrawal Force
毎分 25±3 mm の速さで挿入、
抜去を行う。
Insert and withdraw connectors,
at a rate of 25±3mm/minute.
挿入力
Insertion Force
0.690N {70gf} / CIRCUIT
MAXIMUM
抜去力
Withdrawal
Force
0.118N {12gf} / CIRCUIT
MINIMUM
4-2-2
ターミナル保持
Terminal Pull-out
Force
ハウジングに装着されたターミナルを
毎分 25±3mm の速さで引っ張る
Apply axial pull out force on the terminal
assembled in the housing at a rate of 25±3mm/
minute.
52760-**70
52885-**72
52837-**70
52901-**72
55091-**71
55091-**72
53481-**67
53481-**77
53625-**72
53551-**77
53647-***9
53649-**72
53553-**77
53627-**72
1.96 N { 0.2kgf }
MINIMUM
molex 4 — 3. f 0) 1m Environmental Performance and Others -LEAD FREE- flufizttfil
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TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
SEE SHEET 1 OF 13
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
5 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
-3. Environmental Performance and Others
Item
Test Condition
Requirement
4-3-1
繰返し挿抜
Repeated
Mate / Un-mate
1分間 10回以下 の速さで挿入、抜去を
50 繰り返す。
When mate / un-mated up to 50 cycles
repeatedly at a rate of 10 cycles / minute.
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
4-3-2
Temperature Rise
適合するコネクタを嵌合させ、最大許容電
を通電し、コネクタの温度上昇分を測定する。
(UL 498)
Mate applicable connectors and measure the
temperature rise of contact when the
maximum AC rated current is passed.
(UL 498)
温度上昇
Temperature
Rise
30 MAXIMUM
4-3-3
Vibration
DC 1mA 通電状態にて、嵌合軸を含む互い
垂直3方向に掃引割合 105510Hz/分、
全振幅 1.5mm の振動を 2時間 加える。
(MIL-STD-202試験法 201)
Mate connectors and subject to the following
vibration conditions, for a period of 2 hours in
each of 3 mutually perpendicular axes,
passing DC 1mA during the test.
Amplitude : 1.5mm P-P
Frequency : 10-55-10Hz
(MIL-STD-202, Method 201)
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
Discontinuity
0.1 microsecond
MAXIMUM
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TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
SEE SHEET 1 OF 13
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
6 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-4
Shock
DC 1mA 通電状態にて、嵌合軸を含む互いに
垂直な 6方向 に、パルス幅 11ms 衝撃波形が
正弦半波 490m/s2 {50G} の衝撃を 3
える。
(JIS C60068-2-27/MIL-STD-202 試験法 213)
Mate applicable connectors and subject to the
following shock conditions. 3 times of shocks
shall be applied for each 6 directions along 3
mutually perpendicular axes, passing DC 1mA
current during the test.
(Total of 18 shocks)
Test pulse : Half Sine
Peak value : 490m/s2 {50G}
Duration : 11ms
(JIS C60068-2-27/MIL-STD-202 Method 213)
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
Discontinuity
0.1 microsecond
MAXIMUM
4-3-5
Heat Resistance
適合するコネクタを嵌合させ、105±2
雰囲気中に 96時間 放置後取り出し、12
室温に放置する。
(JIS C60068-2-2/MIL-STD-202 試験法 108 )
Mate applicable connectors and expose to
105±2 for 96 hours. Upon completion of
the exposure period, the test specimens shall
be conditioned at ambient room conditions for
1 to 2 hours, after which the specified
measurements shall be performed.
(JIS C60068-2-2/MIL-STD-202 Method 108)
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
4-3-6
Cold Resistance
適合するコネクタを嵌合させ、-55±3
雰囲気中に 96時間 放置後取り出し、12
室温に放置する
( JIS C60068-2-1 )
Mate applicable connectors and expose to
55±3 for 96 hours. Upon completion of
the exposure period, the test specimens shall
be conditioned at ambient room conditions for
1 to 2 hours, after which the specified
measurements shall be performed.
( JIS C60068-2-1 )
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
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TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
SEE SHEET 1 OF 13
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
7 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-7
耐湿性
Humidity
適合するコネクタを嵌合させ、60±2℃、相
対湿度 9095% の雰囲気中に 96時間
置後、取り出し12時間 室温に放置する。
(JIS C60068-2-3/MIL-STD-202 試験法103)
Mate applicable connectors and expose to
60±2, relative humidity 90 to 95% for
96 hours. Upon completion of the exposure
period, the test specimens shall be
conditioned at ambient room conditions for
1 to 2 hours, after which the specified
measurements shall be performed.
(JIS C60068-2-3/MIL-STD-202 Method 103)
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
Dielectric
Strength
4-1-3
満足のこと
Must meet 4-1-3
絶縁抵抗
Insulation
Resistance
100 Megohm
MINIMUM
4-3-8
温度サイクル
Temperature
Cycling
適合するコネクタを嵌合させ、-55±3
30分、+85±2 30分、これを 1イク
ルとし、5サイクル り返す。し、度移
行時間は、3分以内 とする。試験後 12
室温に放置する
(JISC0025)
Mate applicable connectors and subject to
the following conditions for 5 cycles. Upon
completion of the exposure period, the test
specimens shall be conditioned at ambient
room conditions for 1 to 2 hours, after which
the specified measurements shall be
performed.
1 cycle
a) 55±3 30 minutes
b) +85±2 30 minutes
(Transit time shall be within 3 minutes)
(JISC0025)
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
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TITLE: 0.635 mm PITCH B TO B CONN.
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THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
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EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-9
塩水噴霧
Salt Spray
適合するコネクタを嵌合させ、35±2
て、重量比 5±1% の塩水を 48±4時間
霧し、試験後常温で水洗いした後室温で乾
燥させる。
(JIS C60068-2-11/MIL-STD-202 試験法101)
Mate applicable connectors and expose to
the following salt mist conditions. Upon
completion of the exposure period, salt
deposits shall be removed by a gentle wash
or dip in running water, after which the
specified measurements shall be performed.
NaCl solution
Concentration: 5±1 %
Spray time: 48±4 hours
Ambient temperature:35±2
(JIS C60068-2-11/MIL-STD-202 Method 101)
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
4-3-10
亜硫酸ガス
SO2 Gas
適合するコネクタを嵌合させ40±2
て、50±5ppm の亜硫酸ガス中に 24時間
置する。
Mate applicable connectors and expose to
50±5ppm SO2 gas, ambient temperature
40±2 for 24 hours.
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
初期規格値から
変化量:
20 milliohm以下
Change from initial
requirement :
20 milliohm
MAXIMUM
4-3-11
半田付け性
Solder-ability
端子先端より 0.5mm 位置まで 245±3
の半田に 3±0.5 浸す
Dip soldertails into the molten solder {held at
245±3} up to 0.5mm from the bottom of
the housing for 3±0.5 seconds.
Solder
Wetting
浸漬面積の
95%以上
95% of immersed
area must show no
voids, pin holes
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TITLE: 0.635 mm PITCH B TO B CONN.
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MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
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9 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
Item
Test Condition
Requirement
4-3-12
半田耐熱性
Resistance to
Soldering Heat
(リフロー時)
6項の条件にて、2回リフローを行う。
(When reflowing)
Repeat paragraph 6, two times.
Appearance
端子ガタ
割れ等
異状無きこと
No Damage
(手半田)
端子先端より 0.5mm、金具先端より 0.5mm
の位置まで 370400 半田ゴテにて
最大5 加熱する。
(Soldering iron method)
0.5mm from terminal tip and fitting nail tip.
Soldering time : 5 seconds MAX.
Solder temperature : 370400
( )参考規格 Reference Standard
{ }:参考単 Reference Unit
【5.外観形状、寸法及び材 PRODUCT SHAPE, DIMENSIONS AND MATERIALS
図面参照 Refer to the drawing.
molex 90~ 120 sec. TEMPERATURE CONDITION GRAPH -LEAD FREE- flufizttfil
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TITLE: 0.635 mm PITCH B TO B CONN.
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MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
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10 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
【6.赤外線リフロー条件 INFRARED REFLOW CONDITION
250+5
-0 (ピーク温)
250+5
-0 (PEAK TEMP.)
230℃以上
230 MIN.
2040
2040 sec.
90120
90120 sec.
(予熱:150200)
(Pre-heat150200)
温度条件グラフ
(温度は基板パターン面)
TEMPERATURE CONDITION GRAPH
(TEMPERATURE ON THE SURFACE OF P.C.BOARD PATTERN)
注記; 本リフロー条件に関しては、リフロー装置及び基板などにより条件が異なりますので、
事前にリフロー評価の確認をお願い致します。
NOTE ; Please check the reflow soldering condition by your own devices beforehand.
Because the condition changes by the soldering devices, P.C.Boards, and so on.
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TITLE: 0.635 mm PITCH B TO B CONN.
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11 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
【7.取り扱いの注意事項 INSTRUCTION UPON USAGE
1.実装性能(平坦度)は、実装基板の反りの影響を含まないものと致します。基板の反りはコネクタ両端部を基準とし、
コネクタ中央部にて Max0.02mmして下さい。
The mounting specification for coplanarity does not include the influence of warpage of the printed circuit board.
The warpage of the printed circuit board should be a maximum of 0.02mm if measuring from one connector edge
to the other.
2.本製品の一般性能確認はリジット基板にて実施おります。フレキシブル基板等の特殊な基板へ実装する場合は、
事前に実装確認等を行った上でご使用願います。
The product performance was tested using rigid printed circuit board. In case the product needs to be reflowed
onto flexible circuit board, please conduct a reflow test on the flexible circuit board in advance.
3.フレキシブル基板に実装する場合は、基板の変形を防止するため、補強板をご使用願います。
Please add a stiffener on the flexible printed circuit (FPC) when you mount the connector onto FPC in order to
prevent deformation of the FPC.
4.リフロー条件によっては、樹脂部の変色や端子めっき部にヨリが発生する場合がありますが、
製品性能に影響はございません。
Depending on the reflow conditions, there may be the possibility of a color change in the housing.
However, this color change does not have any effect on the products performance.
5. 半田実装部の未半田は、ターミナル脱落、ピン間ショート、ターミナル座屈、またコネクタの基板からの外れが懸念されま
す。従って全てのターミナルテール部及び、ネイル部に半田付けを行って下さい
If you leave any soldering area on this product open, there may be the possibility of a missing terminal short circuiting
between pins, terminal buckling or the potential for the connector to come off of the printed circuit board.
Therefore, please solder all of the terminals and fitting nails on the printed circuit board.
6.コネクタの性能を損なう恐れがある為、コネクタの洗浄は、行わないで下さい。
Please do not conduct any washing process on the connector because it may damage the products function.
7.実装後において半田ごてによる手修正を行う際は、必ず仕様書掲載の条件以内で行って下さい。
条件を超えて実施した場合、端子の抜け、接点ギャップの変化、モールドの変形、溶融等、破損の原因になります。
When conducting manual repairs using a soldering iron, please follow the soldering conditions shown in the product
specification. If the conditions in the product spec are not followed, it may cause the terminals to fall off, a change in the
contact gap, a deformation of the housing, melting of the housing, and damage the connector.
molex o :I My; F‘g.1 Parallel manner Mating/unimating V <21 vufi‘ju=""> Fig.3 Excess twist extraction -LEAD FREE- flflttfil
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
SEE SHEET 1 OF 13
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
12 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
8.半田こてによる手修正を行なう際、過度の半田やフラックスを使用しないで下さい。半田上がりやフラックス上がりにより
接触、機能不良に至る場合があります
When conducting manual repairs using a soldering iron, please do not use more solder and flux than needed.
This may cause solder wicking and flux wicking issues, and it will eventually cause a contact defect and functional issues.
9. 本製品のエンボス梱包品は紙リールのものがあります。取扱いにご注意下さい。
In embossed package, paper reel product exists. Please be very careful upon usage.
10. 抜去は極力嵌合軸に沿って平行に行って下さい。(図1または、左右に少しづつ振りながら行って下さい。(図2
過度のこじり抜去には注意して下さい。過度のこじり抜去ではコネクタが破壊する可能性があります。(図3
Please mate the connector horizontally along the mating direction shown below. (See figure 1)
Please align the connector by lightly shaking it from side to side. (See figure 2)
Please be very careful when extracting the connector at an angle. This may cause damage to the connector.
Fig.1 Parallel manner Mating/un-mating
Plug
Receptacle
<Span
-direction>
<Pitch
-direction>
Fig.2 Extraction
1 平行状態での挿抜
2 抜去
3 こじり抜去
Fig.3 Excess twist extraction
molex -LEAD FREE- fiflfifil
LANGUAGE
JAPANESE
ENGLISH
REVISE ON PC ONLY
TITLE: 0.635 mm PITCH B TO B CONN.
HOUSING ASSEMBLY
-LEAD FREE- 製品仕様書
K
SEE SHEET 1 OF 13
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX INC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DOCUMENT NUMBER
PS-52760-015
FILE NAME
PS-52760-015.docx
SHEET
13 OF 13
EN-037(2013-04 rev.1)
PRODUCT SPECIFICATION
REV.
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED BY :
A
RELEASED
04/03/01
J2004-2758
N.AIDA
K.TOJO
B
REVISED
04/04/23
J2004-3983
E.SUZUKI
K.TOJO
C
REVISED
05/01/19
J2005-2076
N.AIDA
K.TOJO
D
REVISED
05/02/24
J2005-2773
N.AIDA
K.TOJO
E
REVISED
07/10/16
J2008-1357
R.TSURUOKA
T.HARUYAMA
F
REVISED
11/10/27
J2012-0609
T.KAIHO
T.ASAKAWA
G
REVISED
13/09/20
J2014-0524
Y.SATO06
T.ASAKAWA
H
REVISED
14/08/04
J2015-0176
N.NAITO
T.ASAKAWA
J
REVISED
14/08/14
J2015-0230
N.NAITO
T.ASAKAWA
K
REVISED
2015/01/20
J2015-0948
Y.SATO06
T.ASAKAWA