EVPAD Datasheet by Panasonic Electronic Components

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Panasonic DDDDIIDDD
Light Touch Switches/EVPAD
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Product Code Type Height
E
1
V
2
P
3456789
AD
6th
K
Terminal
6 Terminals
Specifi cations
Features
The open center space allows for fl exibility in choosing a LED
Up to a 4.2-mm diameter chip LED can be mounted.
Provides an excellent operational feel.
• Crisp tactile feedback
• Long stroke (1 mm)
Supports auto refl ow soldering.
Explanation of Part Numbers
10 mm Square Center Space Long Travel SMD
Light Touch Switches
Type:
EVPAD
Recommended Applications
Control switches for automotive electronic equipment,
such as car audio systems and heater control panels
Type Snap action / Push-on type SPST
Electrical
Rating 10 µA 2 Vdc to 50 mA 12 Vdc (Resistive load)
Contact Resistance 100 m max.
Insulation Resistance 100 M min. (at 100 Vdc)
Dielectric With stand ing Voltage 250 Vac for 1 minute
Bouncing 10 ms max. (ON, OFF)
Mechanical Operating Force4.0 N±0.8 N
Travel 1.0 mm±0.15 mm
EnduranceOperating Life 100000 cycles min.
Operating Temperature 40 °C to +85 °C
Storage Temperature 40 °C to +85 °C (Bulk)
–20 °C to +60 °C (Taping)
Minimum Quantity/Packing Unit 1000 pcs. Embossed Taping (Reel Pack)
Quantity/Carton 5000 pcs.
Oct. 201200
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Light Touch Switches/EVPAD
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
180
260
MAX.
150
230
90 to 30 40 to 10
(Normal Temp.)
Operation Top (°C)
Soldering Time (s)
Fan or Normal Temp.
T
WA
B
E
C
D
r
t
P2P0
P1
t2
t1
φD0
A
B
F
W
E
Feeding hole
Chip component Tape running direction
Chip pocket
Tape width=16.0 mm
t3
t2
1
The delivered carrier tape shape is either 1or 2.
Dimension t3only applies to shape 2.
2
0.5 max.
–0.4
+0
10.35
3.2
0.8
φ7
9.8
9.8
10.15
φ4.2
φ4.5
–0.1
+0.2
3.2
0.8
0.8
0.8
1.2±0.1
11.3±0.1
8.4±0.1
1.2±0.1
3.2±0.1
1.2±0.1
A4
A3
B2
A2
B1
A1
0.7
A1
B1
A2
A3
B2
A4
B1,B2
A1,A2,A3,A4
PWB land pattern for reference
4.7
LED implementation position
(Plastic projection)
LED implementation area
Circuit Diagram
(Precautions for pattern design)
Note that the terminals are exposed at the sections shaded with " "
Establish electrical connection at A1, A2, A3, and A4 to improve the contact performance.
Embossed Carrier Tap ing
Recommended Refl ow Soldering Conditions
Unit: mm
Standard Reel Dimensions in mm (not to scale)
Item A B C D E
Rate (mm)
φ380.0±2.0 φ80.0±1.0 φ13.0±0.5 φ21.0±1.0 2.0±0.5
Item W T t r
Rate (mm)
17.5±0.5 21.5±1.0
Part No. Height A B W F E P1P2P0D0 Dia t1t2t3
EVPAD 4.6 10.7±0.2 10.7±0.2 16.0±0.3 7.5±0.1 1.75±0.10 12.0±0.1 2.0±0.1 4.0±0.1 1.5+0.1 0.40±0.05 4.8±0.2 5.8±2.0
_0
Dimensions in mm (not to scale)
EVPADK04K
(Embossed Taping)
Oct. 201200

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