AVR Series Datasheet by TDK Corporation

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Voltage Protection Devices
February 2020
Voltage Protection Devices
February 2020
AVRM/AVR-M : Standard Type
AVRL : Low Capacitance Type
AVRH : High reliability Type
SGNE : Low Clamp Type
Chip varistors
ESD/Voltage protection devices
AVR/SGNE series
REACH
SVHC-Free
Lead
Free
RoHS
Pb
Halogen
Free
Br
Cl
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Voltage Protection Devices
Chip varistors
CHARACTERISTICS OF CHIP VARISTOR
Varistors are voltage dependent nonlinear resistive elements with
a resistance that decreases rapidly when the voltage is over the
constant value.
Varistors become zener diode of 2 serial connection and equiva-
lent, and does not have polarity.
CURRENT vs. VOLTAGE CHARACTERISTICS
THE EFFECT OF THE VARISTOR
Without varistor
A malfunction and failure of electronic equipment
With Varistor
Suppress abnormal voltage by inserting varistor in a circuit
EQUIVALENT CIRCUIT OF CHIP VARISTORS
CHIP VARISTORS FEATURE
IEC61000-4-2 LEVEL4 compliant.
Reliability characteristics evaluated based on AEC-Q200 con-
dition. (Automotive products)
High ESD withstanding voltage
Small-sized products are available
125°C, 150°C Supported
Fig.1 Internal structure of multilayer chip varistors
Overview of the AVR/SGNE series
RoHS Directive Compliant Product
Compatible with lead-free solders
Chip varistor
/V1mA:12V
Zener diode
/Vz:6.8V
Positive direction
Negative direction
Voltage(V)
Current(A)
10–1
10–2
10–3
10–4
10–5
–10–1
–10–2
–10–3
–10–4
–10–5
22661010 1414 1818
ESD, Surge voltage
Power line
Signal line
IC
ESD, Surge voltage
Power line
Signal line
Insert a varistor between
a line and ground
: Chip varistor
IC
No. Name
(1) Semiconductor ceramics
(2) Internal electrode(Pd)
(3)
Terminal electrode
Ag
(4) Ni
(5) Sn
2 Zener Diodes
A capacitance content
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Voltage Protection Devices
Chip varistors
PART NUMBER CONSTRUCTION
Overview of the AVR/SGNE series
AVRM 1608 C 390 K T 271 N
Series name
L x W
dimensions Structure code
Varistor
voltage
Varistor voltage
tolerance Packaging style Capacitance Capacitance
tolerance
(%)
(mm) (V) (%) (pF)
0402 0.4x0.2 C General structure 390=39×100K ±10 T Taping 271=27×10110
0603 0.6x0.3 6R8 6.8 M ±20 B Bulk 221 220 M ±20
1005 1.0x0.5 270 27 N ±30 271 270 N ±30
1608 1.6x0.8 390 39
2012 2.0×1.2
AVR-M 1608 C 270 M T AAB
Series name
L x W
dimensions Structure code
Varistor
voltage
Varistor voltage
tolerance Packaging style Company
special symbol
(mm) (V) (%)
0603 0.6x0.3 C General structure 270=27×100K ±10 T Taping
1005 1.0x0.5 G Conductive paste compatible 080 8 M ±20 B Bulk
1608 1.6x0.8 120 12 N ±30
2012 2.0×1.2 270 27
AVRL 10 1A 3R3 F T A
Series name
L x W
dimensions
Maximum
continuous voltage Capacitance Capacitance
tolerance Packaging style Company
special symbol
(mm) (V) (pF) (pF)
04 0.4x0.2 1A 10 R50 0.5 F ±1 T Taping
06 0.6x0.3 1D 20 1R1 1.1 G ±2 B Bulk
10 1.0×0.5 1E 25 3R3 3.3 N ±0.3
16 1.6×0.8 6R8 6.8
AVRH 10 C 270 K T 150 N A 8
Series name
L x W
dimensions Structure
code
Varistor
voltage
Varistor
voltage
tolerance
Packaging
style
Capacitance Capacitance
tolerance
ESD voltage
amount
IEC61000-4-2
Operating
temperature
limit
(°C)
(mm) (V) (%) (pF) (kV)
1005 1.0x0.5 C General
structure 270=27×100K ±10 T Taping 150=15×100K ±10% A 25 8 150
270 27 B Bulk 4R7 4.7 M ±20% E 8
390 39 150 15 N ±30%
101 100 500 50 Y ±0.13pF
SGNE 04 C 080 M T 150 N 25
Series name
L x W
dimensions Structure
code
Varistor
voltage
Varistor
voltage
tolerance
Packaging
style
Capacitance Capacitance
tolerance
ESD clamping voltage
Average voltage
(IEC61000-4-2, 8kV)
(mm) (V) (%) (pF)
04 0.4x0.2 C General structure 080=8×100K ±10 T Taping 150=15×100N ±30%
06 0.6x0.3 080 8 B Bulk 6R8 4.7 Y ±0.13pF
10 1.0×0.5 270 27 150 15
Shape symbol (JIS) L W T B
0402 0.40±0.02 0.20±0.02 0.20±0.02 0.07min.
0603 0.60±0.03 0.30±0.03 0.30±0.03 0.1min.
1005 1.00±0.05 0.50±0.05 0.50±0.05 0.1min.
1608 1.60±0.10 0.80±0.10 0.80±0.10 0.2min.
2012 2.00±0.20 1.25±0.20 0.70±0.20 0.2min.
RoHS Directive Compliant Product
Compatible with lead-free solders
W
T
L
B
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Voltage Protection Devices
Chip varistors
TERMINOLOGY
1 8/20µs test waveform 2 10/1000µs test waveform
Overview of the AVR/SGNE series
Item Unit Description
Varistor voltage
(Breakdown voltage)
V1mA
(V) Chip varistor-terminal voltage when DC1mA was flowed
Maximum continuous voltage Vdc
(V)
DC voltage that is continuously applied between chip varistor terminals
Terminal chip varistors leakage current-value: 50µA max.
Voltage appearing across the varistor when a pulse current (8/20µs?1) of specified peak value is
applied.
Clamping voltage Vcl
(V)
Voltage between terminal chip varistors of the Specified peak current value of the impulse current (8/
20µs1) is applied
Maximum energy E
(Joule)
When applied specified peak impulse current-value current (10/1000µs2) once, maximum energy that
electrical property of chip varistors be not deteriorated
Maximum peak current Ip
(A)
When applied impulse current (8/20µs1) once, maximum current that electrical property of chip varis-
tors be not deteriorated
Capacitance C
(pF)
Oscillator frequency 1kHz or 1MHz, capacitance between chip varistor-terminal in oscillator voltage
1Vrms
RoHS Directive Compliant Product
Compatible with lead-free solders
20µs
50%
90%
100%
Current
Time
8µs
1000µs
50%
90%
100%
10µs
Current
Time
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Voltage Protection Devices
Chip varistors
PRODUCT CHARACTERISTICS LIST
AVR/SGNE series
Product characteristics list
Item V (1mA) C1kHz
*C1MHz
Vdc Clamping
voltage
8/20µs
Maximum
energy
10/1000µs
Maximum
peak current
8/20µs
Operating
temperature
range
IEC61000-4-2
(Contact)
AEC-Q200
(V) (pF) DC (V) Vcl (V) E (J) Ip (A) (°C) 150pF/330
AVRL041E1R1NTA 39(31.2 to 46.8) 1.1(0.8 to 1.4)* 25 –40 to +85 4kV (Level2)
AVRM0402C120MT330N 12(9.6 to 14.4) 33(23.1 to 42.9) 5.5 20(1A) 0.005 1–40 to +85 8kV (Level4)
AVRM0402C6R8NT101N 6.8(4.76 to 8.84) 100(70 to 130) 3.5 15(1A) 0.01 4 –40 to +85 8kV (Level4)
SGNE04C080MT150N25 8(6.4 to 9.6) 15(10.5 to 19.5) 5.5 21(1A) 0.005 1–40 to +85 8kV (Level4)
AVRL061E1R1NTA 39(35.0 to 43.0) 1.1(0.8 to 1.4)* 25 –40 to +85 4kV (Level2)
AVRL061FR50ETA 140(112 to 168) 0.5(0.3 to 0.7)* 30 —— —–40 to +85 4kV (Level2)
AVRM0603C080MT101N 8(6.4 to 9.6) 100(70 to 130) 5.5 17(1A) 0.01 4 –40 to +85 8kV (Level4)
AVRM0603C120MT101N 12(9.6 to 14.4) 100(70 to 130) 5.5 20(1A) 0.01 5–40 to +85 8kV (Level4)
AVRM0603C120MT150N 12.8(10.0 to 15.6) 15(10.5 to 19.5) 5.5 35(1A) 0.003 1 –40 to +85 8kV (Level4)
AVR-M0603C120MTAAB 12(9.6 to 14.4) 33(23.1 to 42.9) 7.5 23(1A) 0.01 1–40 to +85 8kV (Level4)
AVRM0603C200MT150N 20(16 to 24) 15(10.5 to 19.5)* 12 40(1A) 0.01 1 –40 to +85 8kV (Level4)
AVRM0603C6R8NT101N 6.8(4.76 to 8.84) 100(70 to 130) 3.5 14(1A) 0.01 10 –40 to +85 8kV (Level4)
AVRM0603C6R8NT331N 6.8(4.76 to 8.84) 330(231 to 429) 3.5 14(1A) 0.02 16 –40 to +85 8kV (Level4)
SGNE06C080MT150N25 8(6.4 to 9.6) 15(10.5 to 19.5) 5.5 21(1A) 0.005 1–40 to +85 8kV (Level4)
SGNE06C270MT6R8G60 27(21.6 to 32.4) 6.8(4.8 to 8.8)* 15 54(1A) 0.005 1 –40 to +85 8kV (Level4)
AVRL101A1R1NTA 90(79.6 to 110.4) 1.1(0.8 to 1.4)* 10 —— —–40 to +85 8kV (Level4)
AVRL101E1R1NTB 39(31.2 to 46.8) 1.1(0.8 to 1.4)* 25 –40 to +85 4kV (Level2)
AVRL101D3R3FTA 27(21.6 to 32.4) 3.3(2.3 to 4.3)* 20 62(0.5A) 0.01 0.5 –40 to +125 8kV (Level4)
AVRL101D6R8GTA 27(21.6 to 32.4) 6.8(4.8 to 8.8)* 20 58(1A) 0.01 1 –40 to +125 8kV (Level4)
AVR-M1005C080MTAAB 8(6.4 to 9.6) 650(520 to 780) 5.5 14(1A) 0.04 25 –40 to +85 8kV (Level4)
AVR-M1005C080MTABB 8(6.4 to 9.6) 100(55 to 145) 5.5 15(1A) 0.02 3 –40 to +85 8kV (Level4)
AVR-M1005C080MTACB 8(6.4 to 9.6) 33(14 to 52) 5.5 19(1A) 0.01 1–40 to +85 8kV (Level4)
AVR-M1005C080MTADB 8(6.4 to 9.6) 480(384 to 576) 5.5 14(1A) 0.04 25 –40 to +85 8kV (Level4)
AVR-M1005C120MTAAB 12(9.6 to 14.4) 130(104 to 156) 7.5 20(1A) 0.05 10 –40 to +85 8kV (Level4)
AVR-M1005C120MTACC 12(9.6 to 14.4) 460(276 to 644)* 7.5 21(1A) 0.01 24 –40 to +85 8kV (Level4)
AVR-M1005C180MTAAB 18(14.4 to 21.6) 120(72 to 168)* 11 30(1A) 0.06 16 –40 to +85 8kV (Level4)
AVRM1005C270KT101N 27(24.0 to 30.0) 100(70 to 130) 19 44(1A) 0.06 4 –40 to +85 8kV (Level4)
AVR-M1005C270MTAAB 27(21.6 to 32.4) 40(30 to 48) 15 47(1A) 0.04 47 –40 to +85 8kV (Level4)
AVR-M1005C270MTABB 27(21.6 to 32.4) 15(10.5 to 19.5) 15 49(1A) 0.05 1 –40 to +85 8kV (Level4)
AVRM1005C6R8NT101N 6.8(4.76 to 8.84) 100(70 to 130) 3.5 14(1A) 0.02 10 –40 to +85 8kV (Level4)
AVRM1005C6R8NT331N 6.8(4.76 to 8.84) 330(231 to 429) 3.5 15(1A) 0.008 24 –40 to +85 8kV (Level4)
SGNE10C080MT150N28 8(6.4 to 9.6) 15(10.5 to 19.5) 5.5 21V(1A) 0.01 19 –40 to +85 8kV (Level4)
AVRH10C270KT150NA8 27(24.0 to 30.0) 15(10.5 to 19.5) 19 52(2A) 0.02 2 –55 to +150 25kV
AVRH10C270KT350NA8 27(24.0 to 30.0) 35(24.5 to 45.5) 19 52(2A) 0.02 8–55 to +150 25kV
AVRH10C390KT500NA8 39(35.0 to 43.0) 50(35 to 65) 28 72(2A) 0.02 15 –55 to +150 25kV
AVRH10C101KT4R7FA8 100(90 to 110) 4.7(3.7 to 5.7)* 70 190(1A) 0.03 1–55 to +150 25kV
AVRH10C101KT1R1NE8 110(100 to 120) 1.1(0.8 to 1.4)* 70 190 (0.3A) 0.01 0.3 –55 to +150 8kV (Level4)
AVRH10C221KT1R5YA8 220 (198 to 242) 1.5(1.37 to 1.63)* 70 400 (0.5A) 0.01 0.5 –55 to +150 25kV
AVRL161A1R1NTA 90(79.6 to 110.4) 1.1(0.8 to 1.4)* 10 –40 to +85 8kV (Level4)
AVRL161A1R1NTB 39(31.2 to 46.8) 1.1(0.8 to 1.4)* 10 —— —–40 to +85 4kV (Level2)
AVRL161D3R3FTA 27(21.6 to 32.4) 3.3(2.3 to 4.3)* 20 62(0.5A) 0.01 0.5 –40 to +125 8kV (Level4)
AVRL161D6R8GTA 27(21.6 to 32.4) 6.8(4.8 to 8.8)* 20 58(1A) 0.01 1–40 to +125 8kV (Level4)
AVR-M1608C080MTAAB 8(6.4 to 9.6) 650(520 to 780) 5.5 15(2A) 0.09 30 –40 to +85 8kV (Level4)
AVR-M1608C120MT2AB 12(9.6 to 14.4) 400(320 to 480) 7.5 20(2A) 0.06 15 –40 to +85 8kV (Level4)
AVR-M1608C120MT6AB 12(9.6 to 14.4) 1050(840 to 1260) 7.5 20(2A) 0.09 50 –40 to +85 8kV (Level4)
AVR-M1608C180MT6AB 18(14.4 to 21.6) 600(480 to 720) 11 30(2A) 0.10 30 –40 to +85 8kV (Level4)
AVR-M1608C220KT2AB 22(19.8 to 24.2) 210(147 to 273) 16 37(2A) 0.03 10 –40 to +125 25kV
AVR-M1608C220KT6AB 22(19.8 to 24.2) 560(392 to 728) 16 34(2A) 0.10 30 –40 to +125 25kV
AVR-M1608C270MTABB 27(21.6 to 32.4) 15(10.5 to 19.5) 17 52(2A) 0.05 2 –55 to +150 25kV
AVR-M1608C270MTAAB 27(21.6 to 32.4) 30(21 to 39) 17 52(2A) 0.05 2–55 to +150 25kV
AVR-M1608C270KTACB 27(24.0 to 30.0) 60(42 to 78) 19 54(2A) 0.05 10 –55 to +150 25kV
AVRM1608C270KT800M 27(24.0 to 30.0) 80(64 to 96) 19 53(2A) 0.02 28 –55 to +150 25kV
AVR-M1608C270KT2AB 27(24.0 to 30.0) 160(112 to 208) 19 42(2A) 0.10 20 –55 to +150 25kV
AVRM1608C270KT221M 27(24.0 to 30.0) 220(176 to 264) 19 52(2A) 0.10 40 –55 to +150 25kV
AVR-M1608C270KT6AB 27(24.0 to 30.0) 430(301 to 559) 19 42(2A) 0.10 48 –55 to +150 25kV
AVR-M1608G270KT6AB 27(24.0 to 30.0) 430(301 to 559) 19 42(2A) 0.10 48 –55 to +150 25kV
AVRM1608C390KT271N 39(35.0 to 43.0) 270(189 to 351) 28 69(2A) 0.10 78 –55 to +150 25kV
AVRM1608C560KT101M 56(50.4 to 61.6) 100(80 to 120) 40 113(2A) 0.10 60 –55 to +150 25kV
AVRM1608C720KT750M 72(64.8 to 79.2) 75(60 to 90) 53 135(2A) 0.10 40 –55 to +150 25kV
AVR-M2012C120MT6AB 12(9.6 to 14.4) 1000(550 to 1450) 7.5 20(5A) 0.20 60 –40 to +85 8kV (Level4)
AVR-M2012C220KT6AB 22(19.8 to 24.2) 800(560 to 1040) 16 38(5A) 0.30 100 –40 to +125 25kV
AVRM2012C330KT801N 33(29.7 to 36.3) 800(560 to 1040) 24 59(5A) 0.50 240 –55 to +150 25kV
AVR-M2012C390KT6AB 39(35.0 to 43.0) 430(387 to 483) 28 62(5A) 0.30 100 –55 to +150 25kV
AVRM2012C560KT251M 56(50.4 to 61.6) 250(200 to 300) 40 113(5A) 0.30 150 –55 to +150 25kV
AVRM2012C720KT201M 72(64.8 to 79.2) 200(160 to 240) 53 142(5A) 0.30 100 –55 to +150 25kV
RoHS Directive Compliant Product
Compatible with lead-free solders
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(6/12)
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Voltage Protection Devices
Chip varistors
DISCHARGE VOLTAGE WAVEFORM (EXAMPLE)
WITHOUT VARISTOR, WAVEFORM AT VARISTOR INSTALLATION
WAVEFORM AT VARISTOR INSTALLATION
Test conditions
150pF/330 (IEC61000-4-2)
Contact discharge, Charged voltage 8kV
TEST CIRCUIT DIAGRAM
AVR/SGNE series
Electrostatic absorption characteristics
RoHS Directive Compliant Product
Compatible with lead-free solders
–50 0 50 100 150 200 250 300
Time(ns)
Voltage(V)
1600
1200
1000
800
400
600
200
–200
1800
1400
0
Without Varistor
AVRH10C270KT150NA8
AVR-M1608C270KT6AB
AVR-M1608C220KT6AB
–50 0 50 100 150 200 250 300
Time(ns)
Voltage(V)
160
120
100
80
40
60
20
–20
180
140
0
AVRH10C270KT150NA8
AVR-M1608C270KT6AB
AVR-M1608C220KT6AB
50Ω
Discharge gun
ESD
simulator
Test
sample
Oscilloscope
60dB attenuator
I/O impedance: 50Ω
ESD Simulator
Discharge
Point
Chip
Varistor
PCB
SMA
Connector
Coaxial
Cable
Attenuator(60dB)
50Ω
Oscilloscope
50Ω
Shield
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Voltage Protection Devices
Chip varistors
Board design
When attached to chip varistors, amount of silver used (fillet size)
has direct impact on chip varistors after mounting. Thus, sufficient
consideration is necessary.
Set of land dimensions
(1) As the stress rises in the chip varistors owing to the increase in
silver, breakage and cracks will occur. Cause including crack, as
caution on board land design, configure the shape and dimensions
so that the amount of silver is appropriate. If you installed 2 or
more parts in the Common Land, separated by a solder resist and
special land of each component.
(2) When peak levels panning-at soldering is excessive, by solder
contraction stress, mechanical-thermal stress causes a Yasuku
chip crack. In addition, when the peak level is underestimated, ter-
minal electrode fixed strength is insufficient. This causes chip
dropouts and may affect circuit reliability. Representative example
of the panning of peak levels is shown in the following.
Recommended silver dose
Case and suggested protocol want to avoid
Attention on a circuit board design
RoHS Directive Compliant Product
Compatible with lead-free solders
Dimensions shape Symbol
ABC
0402 0.20 Nom. 0.15 to 0.21 0.18 to 0.20
0603 0.25 to 0.35 0.20 to 0.30 0.25 to 0.35
1005 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60
1608 0.60 to 0.80 0.60 to 0.80 0.60 to 0.80
2012 0.90 to 1.20 0.70 to 0.90 0.90 to 1.20
AB
C
Solder volume
overload
Solder stress is increased,
and it is easy for a crack to
form.
Decent solder
volume
Solder volume
deficit
Fixed strength is weak, and
there is connection a prob-
lem and risk of loss.
Example Cases to avoid Improvement example
(land division)
Lead wire and land
of part discrete
doubles up
Arrangements in
the vicinity
Arrangements of
chip component's
companion
Most large serving amount
Minimum prime amount
Solder
Chip
Leads
PCB
Solder resist
Leads
Solder
(ground solder)
Chassis
L1
Solder resist
L2 L2>L1
Land
Land
Excess solder
Missing solder
Solder resist
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Voltage Protection Devices
Chip varistors
Arrangements of components
(1) I was based on camber of substrate and suggested protocol of
chip varistors arrangement, as stress does not join to the utmost is
shown in following.
(2) In payment near by board, depending on mount position of chip
varistors, as mechanical stress varies, please refer to the following
diagram.
The order of A > B = C > D > E eases the stress.
Attention on a circuit board design
RoHS Directive Compliant Product
Compatible with lead-free solders
Substrate for flexural stress
Adverse events
Substrate for flexural stress
Good example
Direction of
surface solderSolder the mountain fold as a
top.
Solder the mountain fold as a
bottom. [Please review the
italicized portion, as I am
unsure what you mean to con-
vey here.]
Chip
arrangements
(direction)
Mounted vertically to the per-
foration and slit.
Mounted horizontally to the
perforation and slit.
Distance from
perforation
and slit
portion
Close location is disadvanta-
geous of perforation and slit.
It is an advantage so distant
location away places the perfo-
ration and slit.
Perforation or slit
Perforation or slit
Perforation or slit
Perforation or slit
L1
(L1<L2)
L2
(L1<L2)
B
ED
A
C
Slit
Perforation
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Voltage Protection Devices
Chip varistors
Application to board
Mounting head pressure
Under suction nozzle if dead point too, during implementation,
excessive force joins of chip varistors low, as cause causes of crack,
please use with reference to something about following.
1) Being set to top surface of substrate so that under suction nozzle
as for dead center, substrate does not bend back, and adjust,
please.
2) Nozzle pressure at implementation is 0.1 to 0.3N in static load,
please.
3) Substrate fixes up back surface of substrate with support pin in
impact of suction nozzle to wely deflection to the utmost, and
substrate hold deflection, please. A representative example is
shown in the following.
Mechanical shock that, if positioning your nail to wear, ragged edge
of positionings, participates in chip varistors are locally, and chip
varistors, as there is possibility of crack generated, cut the closed
positioning, and maintenance and inspection, and, exchange of
manage dimensions and position nail periodically, please.
Soldering
Significant impact is possible on the performance of chip varistors,
flux checks something about follow, please use.
(1) Flux uses one with 0.1wt % (Cl conversion) or less halide sub-
stance contains amounts, please. In addition, do not do this with
strongly acidic objects.
Flux during is soldered (2) Chip varistors is applied the smalleset
amount necessary, please.
(3) If Used soluble flux, perform thorough wash particularly, please.
Reflow temperature profile
Soldering iron
The tip temperature and also by (1) types of soldering irons, the size
of the substrate, and the geometry of the land pattern. Being earlier,
but when as there is possibility that crack occurs in the heat ander-
son impaction, point soldering iron temperature is high, please do
solder work within the following conditions.
Direct iron tip is in contact with the (2) chip varistors body, and the
strain owing to thermal shock in particular grows even if a crack is
generated. Therefore, please do not touch it directly to the terminal
electrodes.
Local precautions
RoHS Directive Compliant Product
Compatible with lead-free solders
Cases to avoid Recommended case
Single-sided
mounting
Double-sided
mounting
Crack
Support pin
Solder peeling Crack
Support pin
Item
Specification
For eutectic mixture
solder
Use of lead-free
solder
Preheating temperature 160 to 180°C 150 to 180°C
Solder melting temperature 200°C 230°C
Maximum temperature 240°C max260°C max.
Preheating time 100s max. 120s max.
Time to reach higher than the
solder melting temperature 30s max. 40s max.
number of possible reflow cycles 2 max. 2 max.
Temperature
of iron tips
(°C)
Wattage
W
Pallet point
shape (mm)
Soldering time
(Second) Frequency
350max. 30max. ø3.0max. 5 max.
Within each
terminal once
(Within total of
twice)
Natural
cooling
t3
t1
Preheating
t2
Soldering
T3 T3
T4
T2
T1
t:
Time
Peak
T:
Temperature
{ibTDK
(10/12)
20200217 / vpd_varistors_avr_en.fm
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
Voltage Protection Devices
Chip varistors
Cleaning
(1) If cleaning liquid is inappropriate, residues and other foreign
body of fluxes builds up on chip varistors, and can degrade the per-
formance of chip varistors (particularly the insulation resistance).
(2) Wash conditions may compromise performance of chip varistors
if they are improper (wash due, wash excess).
2-1) For wash due
(a) By substance of a system in flux residue halide, metal including
terminal electrodes may experience corrosion.
(b) Substance of a system in flux residue halide builds up on chip
varistors, and reduces the insulation resistance.
(c) Soluble flux makes comparisons of colophony series flux, and
there is event with trends of significant (1) and(2).
2-2) For excess wash
(1) Owing to lavage, chip varistors deteriorates, and reduces perfor-
mance of chip varistors.
(2) In ultrasonography, when output is passed, substrate resonates
size, and crack occurs in body and sprang of chip varistors in
vibration of substrate. Since this may reduce the strength of the
terminal electrode, please note the following conditions. [Please
review the italicized portion, as I am unsure what you mean to
convey here.]
Ultrasound output
Ultrasonic frequency
Ultrasound cleaning time
2-3) Concentration including halogen that when cleaning liquid to
pollution, when you released is higher, and may cause similar of
results into wash due.
Substrate handling after component mounting
(1) When substrate is divided, a flexible so that show in following dia-
gram to substrate, and is given by stress including twist, as there is
possibility that crack occurs of chip varistors, please check that
stress is within acceptable limits.
(2) During each substrate operational check, push pressure with
contact failure of check pin of boards checkers of check pin may be
toned up to be prevented. As substrate is bent under loading, chip
varistors is broken owing to stress. There is also the possibility that
solder on the terminal electrode will peel off. Follow the diagram for
reference, and check that the substrate bends, please.
Single-part component handling
To drop impact, as there is possibility that breakage and crack is
entered, do not chip varistors that(1) chip varistors falls.
(2) At stacking storage after implementation and treatment of sub-
strate, corner of boards is regarded as chip varistors. Please be
careful, as there is the possibility that breakage and cracks will
occur on impact.
Attention after implementation
RoHS Directive Compliant Product
Compatible with lead-free solders
BendsTwist
Item Cases to avoid Recommended case
Substrate sags
Peeling
Check pin Check pin
Support pin
Floor
Crack
Board
Crack
@TDK : H u \LPLfoLPLPLPLPLPHK awn D m D {9-D DMD [I
(11/12)
20200217 / vpd_varistors_avr_en.fm
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
Voltage Protection Devices
Chip varistors
REEL DIMENSIONS PACKAGE QUANTITY / INDIVIDUAL WEIGHT
TAPE DIMENSIONS
Packaging style
RoHS Directive Compliant Product
Compatible with lead-free solders
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
Dimensions in mm
0.8
ø60min.
14.0max.
9.0max.
Type Package quantity Individual weight
(pieces/reel) mg
AVRM0402/AVRL04/SNGE04 20,000 0.1
AVRM0603/AVR-M0603/AVRL06/
SGNE06 15,000 0.2
AVRM1005/AVR-M1005/AVRL10/
AVRH10 10,000 1.2
AVRM1608/AVR-M1608/AVRL16 4,000 5
AVRM2012/AVR-M2012 2,000 13
Dimensions in mm
Ty p e A B P1 T
0402 0.26±0.04 0.46±0.04 2.0±0.05 0.40max.
0603 0.38±0.05 0.68±0.05 2.0±0.05 0.45max.
1005 0.65+0.05/–0.1 1.15+0.05/–0.1 2.0±0.05 0.65max.
1608 1.1±0.2 1.9±0.2 4.0±0.1 1.1max.
2012 1.5±0.2 2.3±0.2 4.0±0.1 1.1max
4.0±0.12.0±0.05
B
A P1
8.0±0.3
1.75±0.1
3.5±0.05
T
1.5 +0.1
0
Dimensions in mm
160min. Taping 200min.
300min.
Drawing direction
@TDK
(12/12)
20200217 / vpd_varistors_avr_en.fm
Please be sure to request delivery specifications that provide further details on the features and specifications of the products for proper and safe use.
Please note that the contents may change without any prior notice due to reasons such as upgrading.
Voltage Protection Devices
REMINDERS FOR USING THESE PRODUCTS
Before using these products, be sure to request the delivery specifications.
SAFETY REMINDERS
Please pay sufficient attention to the warnings for safe designing when using this products.
Please pay careful attention to the precautions and follow safe designing practices when using these products.
Please observe the following precautions in order to avoid problems with chip varistors such as characteristic degradation and element
destruction
Please store these products in an environment with a temperature of 5 to 40°C and humidity level of 20 to 70%RH, and use them
within six months.
Poor storage conditions may lead to the deterioration of the solderability of the edge electrodes, so please be careful to avoid contact
with humidity, dew condensation, dust, toxic gas (hydrogen, hydrogen sulfide, sulfurous acid, chlorine, ammonia, etc.), direct sunlight,
and so on.
Please do not use products that have been dropped or detached when mounting.
Please solder with the reflow soldering method, and not the flow (dip) soldering method.
Please observe the following precautions to avoid problems with varistors such as characteristic degradation and element destruction,
which ultimately lead to the generation of heat and smoke with the elements.
Do not use in locations where the temperatures exceed the operating temperature range such as under direct sunlight or near
sources of heat.
Do not use in locations where there are high levels of humidity such as under direct exposure to weather and areas where steam is
released.
Do not use in locations such as dusty areas, high-saline environments, places where the atmosphere is contaminated with corrosive
gas, etc.
Avoid powerful vibrations, impact (such as by dropping), pressure, etc. that may lead to splitting in the products.
Do not use with a voltage that exceeds the maximum allowable circuit voltage.
When resin coating (including modular) a varistor, do not use a resin that will cause deterioration of the varistor. Be sure never to use
resin that generates hydrogen as palladium is used for the inner electrode.
Avoid attachment near combustible materials.
Please contact our sales offices when considering the use of the products listed on this catalog for applications, whose performance
and/or quality require a more stringent level of safety or reliability, or whose failure, malfunction or trouble could cause serious damage
to society, person or property ('specific uses' such as automobiles, airplanes,medical instruments, nuclear devices, etc.) as well as
when considering the use for applications that exceed the range and conditions of this catalog.
Please also contact us when using these products for automotive applications.
As range of catalog, conditions are transcended, or for damage that generated by was used in application specific, etc, accept no the
responsibility, wish.
Please take appropriate measures such as acquiring protective circuits and devices that meet the uses, applications, and conditions of
the instruments and keeping backup circuits.
REMINDERS

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