23A1024-E/P-ND, 23A1024-E/SN-ND Datasheet by Microchip Technology

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G MICRDCHIP
www.microchip.com/memory
Serial Memory Products
Serial EEPROM
Serial SRAM
Serial Memory Products
I Serial EEPROM I Serial SRAM I MAG Ghlps I 1.5V EEPROM
2 Serial Memory Products
Serial Memory Products
A broad portfolio of high performance, best-in-class Serial Memory Products
to meet all your design requirements.
Microchip offers the broadest range of Serial EEPROM devices (from 128 bits to 1 Mbit) over the widest operating
voltage (1.7to 5.5V) and temperature ranges (up to 150ºC). Innovative low-power designs and extensive testing
have ensured industry leading endurance and best-in-class quality at low costs.
SPI-compatible Serial SRAM devices are available in 64 and 256 Kbit options and up to 20 MHz. These low power
devices provide additional external serial RAM with high-speed performance and are available in standard 8-pin
packages.
Microchip Supports Your Designs Throughout The Product Life Cycle
Serial Memory Products 3
Key Benefi ts
Lower system costs – innovative products, tiny packages,
low power consumption, fewer I/O pins, small form factor
Save I/O pins on the MCU – more compact designs, add
additional features
Secure data with write-protect options
Highest quality EEPROMs
Zero PPM initiatives – Triple-test fl ow
>1M cycles E/W endurance
Faster time to market
Short lead times
Complete tools support
Robust designs – broad operating conditions
Long product life cycles
Global sales & engineering support
Key Features
Serial architecture – I2C, SPI, UNI/O, Microwire
Broad range of densities
Tiny 3, 5, 6 and 8-pin packages, die & wafer
Innovative, low power designs
Industry leading endurance
Wide temperature and voltage range
Fast read and write times
Flexible:
Byte write capability
Package options
Custom programming options
Application-specifi c serial memory
Microchip owned fabs, In-house testing
Automotive fl ow on all products
Serial EEPROM
SPI, I2C™, Microwire, UNI/ Bus
Non-Volatile Memory
128 bits-1Mbit
1.7V-5.5V
1M Cycles E/W Endurance
Fast Read/Write Times
Low Power Consumption
Serial SRAM
SPI Bus, 20 MHz
Volatile Memory
8, 32 Kbytes
1.5V-1.95V; 2.7V-3.6V
Infinite Endurance
Zero Write Speeds
Low Power
Outstanding Quality
Innovative Products
Reliable Supply
Serial Memory Advantages
Serial Memory Products
Serial EEPROM Bus Comparison
Parameter I2CMicrowireUNI/OSPI
Density Range 128b-1 Mbit 1 Kb-16 Kb 1 Kb-16 Kbit 1Kb-1 Mbit
Speed Up to 1 MHz Up to 3 MHz Up to 100 KHz Up to 20 MHz
I/O Pins 2: Clock, Data 4: Clock, CS, DI, DO 1: Clock/Data 4: SCK, CS, DI, DO
Package Options
PDIP, SOIC, SOIJ, TSSOP,
MSOP, 2x3 T-DFN, 6x5 DFN,
SOT-23, SC70, WLCSP
PDIP, SOIC, TSSOP,
MSOP, 2x3 T-DFN,
SOT-23
PDIP, SOIC, TSSOP,
MSOP, 2x3 T-DFN,
SOT-23, TO92, WLCSP
PDIP, SOIC, SOIJ, TSSOP,
MSOP, 2x3 T-DFN,
6x5 DFN, SOT-23
Security Options HW HW SW HW, SW
Pricing Least Expensive Most Expensive
I‘C'" mam Mb‘ 1,7V75.5V UNI/0" Bus I Khrls Kb: LEVVS 5V MAC Address Chips EUHBW & Eursw Nada Address Microwire I K1746 Kb: 1.3v75.5v SPI t Km Mb: 1.3v755v Partial Array Write Protect ya, :4 and Who‘s Array WP Optmns . 5-3070 aesor (LT) (TU 2x2mm 3x25mm a‘soxc (SN) 8-DFN (MF) 5 x 6 mm 5 x 5 mm a .;.;. a Q -l 5 & 6-SOT B-TDFN B-MSOP 8~TSSOP (OT) (MC/MNV) (MS) (ST) Examm 2x3mm 3x5mm 3x65mm 8- SO\C[ (SM) 8- PDIP (P) Dre/Water 5x8mm Bxgfimm WL-CSP DIMM-DDR2I3 Raverswb‘a S/W Wnta Pruiect: I’C Extended Temperature 755“C to ‘50“0 VESA Monitors DDCt W/uuczw Imam-ma Very Low Voltage 1.5V EEPROM
4 Serial Memory Products
Serial EEPROM
Robust Design
ESD Protection
> 4000V Human Body Model (HBM)
> 400V Machine Model (MM)
> 1000V Charged Device Model
Latch-up protection > 200 mA on all pins
ESD Induced Latch-up > 100V (MM) on VDD; >400V on all I/O
> 1M cycles Endurance and > 200 years data retention
Up to 150°C Operation (reads and writes)
Power-On Reset (POR) and Brown-Out Reset (BOR)
Effective protection against noisy automotive environments
Eliminates false writes
Schmitt Trigger input filters for noise reduction
Complete traceability including die location on wafer
Innovative designs combined with in-house fabrication and outstanding testing
methodology has helped create the industry’s highest quality Serial EEPROM.
Microchip offers a broad selection of standard and application specifi c Serial EEPROM devices that are available in
all the standard serial busses – I2C, SPI, Microwire and the new single I/O UNI/ bus.
Quality
Microchip delivers highest quality
EEPROMs in the world
World-class line yields (over 99%)
ISO/TS16949-compliant
Industry leader with triple test flow
every cell of every part is tested
three times
Near zero PPM field bit fails
Statistical process control and
continuous improvement procedures
in all facilities
Robustness and reliability designed in
Automotive grade/flow
MAC Address Chips
EUI-48™ & EUI-64™ Node Address
Partial Array Write Protect
½, ¼ and Whole Array WP Options
DIMM-DDR2/3
Reversible S/W Write Protect; I2C
Extended Temperature
-55ºC to 150ºC
VESA Monitors
DDC1™/DDC2™ Interface
Very Low Voltage
1.5V EEPROM
UNI/O® Bus
1 Kb-16 Kb; 1.8V-5.5V
SPI
1 Kb-1 Mb; 1.8V-5.5V
8-SOIC (SN)
5 x 6 mm 8-DFN (MF)
5 x 6 mm 8-SOIC (SM)
5 x 8 mm 8-PDIP (P)
8 x 9.5 mm Die/Wafer
WL-CSP
.
5-SC70
(LT)
2 x 2 mm
.
3-SOT
(TT)
3 x 2.5 mm
5 & 6-SOT
(OT)
3 x 3 mm
.
8-TDFN
(MC/MNY)
2 x 3 mm
.
8-MSOP
(MS)
3 x 5 mm
.
8-TSSOP
(ST)
3 x 6.5 mm
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Specialty/Application
Specific EEPROMs
Standard
EEPROMs
I2C™
128b-1 Mb; 1.7V-5.5V
Microwire
1 Kb-16 Kb; 1.8V-5.5V
Packages
Serial EEPROMs
- I! 3 fl II 5 a 5.307 a
Serial Memory Products 5
Memory Package Matrix
Memory Packages – more memory in less space!
Serial EEPROM devices from Microchip are available in a wide variety of tiny, innovative packages to help minimize
your design – save board space and cost!
WLCSP – die-sized package – smallest form factor EEPROM package in the world!
SC70 – smallest 5-lead EEPROM package!
5-SOT-23 available up to 64 Kbit; 8-TDFN up to 128 Kbit, 8-SOIC up to 1 Mbit (I2C)
Density Max
Speed
SOIC
SN
SOT-23
OT/TT
TSSOP
TS
TDFN
MNY/MC
PDIP
P
MSOP
MS
SOIJ
SM
DFN
MF
SC70
LT
TO92
TO
Wafer
W/S/WF
WLCSP
CS
5x6 3x3 3x6.5 2x3 8x9.5 3x5 5x8 5x6 2x2 Die Die
I2CBus 1.7V-5.5V
128bit-2K 400 KHz X5XXXX 5X
4K-32K 400 KHz X5XXXX X X
64K 1 MHz X5XXXXX X X
128K 1 MHz XXXXXXX XX
256K 1 MHz XX XXXX XX
512K 1 MHz XX XXX XX
1 Mbit 1 MHz XXX
Microwire Bus 1.8V-5.5V
1K-16K 3 MHz X6XXXX X
SPI Bus 1.8V-5.5V
1K-4K 10 MHz X6XXXX X
8K-64K 10 MHz XXXXX X
128K, 256K 10 MHz XX XXX X
512K 20 MHz X14 XXX X
1 Mbit 20 MHz XXX X
UNI/O® Single-Wire Bus 1.8V-5.5V
1K-16K 100 KHz X3XXX X X X
Package Sizes
8-SOIC (SN)
5 x 6 mm
8-DFN (MF)
5 x 6 mm
8-SOIC (SM)
5 x 8 mm
8-PDIP (P)
8 x 9.5 mm
Die/Wafer
WL-CSP
.
5-SC70
(LT)
2 x 2 mm
.
3-SOT
(TT)
3 x 2.5 mm
. .
5 & 6-SOT
(OT)
3 x 3 mm
.
8-TDFN
(MC/MNY)
2 x 3 mm
.
8-MSOP
(MS)
3 x 5 mm
.
8-TSSOP
(ST)
3 x 6.5 mm
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WLCSP – World’s Smallest EEPROM Package
WLCSP from Microchip is bumped die with a redistribution layer to route
the bond pads to the bumps.
True ‘die-sized’ packages
Industry’s smallest package, form factor
Lowest profi le package
Available in I2C, UNI/O buses
Compatible with standard surface mount assembly lines
Fit a large density into a small space
Applications: mobile phones, security cameras, sensors, servers,
networking, RF, medical, portable electronics
WLCSP 4 Kbit I2C
<1 x 1 mm
Actual Size Enlarged to Show
Detail
Wafer Level
Chip Scale Packaging
6 Serial Memory Products
Application-Specific EEPROMs
Innovative EEPROM options to help you get to market faster and deliver the highest
performance at lowest costs.
Serial Memory Products – Application Examples
Microchip Strengths Applications
Automotive
Quality, PPAP, long product life
cycles, AEC Q-100 & TSO-16949
compliant, in-house testing,
triple-test ow
Transmission, ABS, Power Train, Airbag,
Entertainment System, Mirror Controllers,
GPS, Steering Control
Medical
Outstanding quality, and reliability,
tiny packages, low power, Microchip
owned fabs
Blood Glucose Meters, Hearing Aid,
Medical Imaging Devices, XRAY, Oxygen
Concentrator,
ECG
Industrial
Robust designs, high endurance,
wide operating range, custom part
options
Metering, Industrial Control, Security
Systems, Alarm Systems, Sensor
Networks, Battery Chargers
Consumer
Short lead times, excellent supply,
innovative packages, application
specifi c options, low power
LCD TV, Set Top Box, Printers, Blue Tooth,
Wireless, Laptop, Mouse, Networking,
DDR2/3, Camera, POS, Appliances
Specialty EEPROM Applications
Application/Market Design Challenge Solution Products Benefi ts
Monitors, Projectors,
Flat Panel Display
DDC1™ & DDC2™, EDID
& E-EDID specifi cation Vesa products 24LCS21A,
24LCS22A Quick, easy plug & play options
Networking, Ethernet,
Wi-Fi, ZigBee®
EUI-48™/EUI-64™ MAC
Address MAC address chips
24AA02E48,
11AA02E48,
25AA02E48
Easy access, Low-cost,
Plug & play, Additional EEPROM
PCs and Laptops –
DRAM DIMM Modules DDR1/2/3 Specifi cation DIMM SPD products,
Temp sensor with EEPROM
24LCS52, 34XX02,
MCP98242 Customizable software enabled WP
Industrial, Consumer
Electronics
Systems that require
locked and/or
re-writeable memory
Write-protect options
I2C, SPI, UNI/O and
Microwire Options
available
One lower cost device replace two
stand-alone parts
HDCP Chipset (TV) Adding HDCP keys to
your chipset
Secure wafer
programming service
4K/8K – I2C, SPI,
Microwire
Secure, No code duplication, Lower
overall costs, Factory-programmed
serialization
Industrial Need devices to operate
beyond -40C to +125C
High temp. EEPROMs:
up to 150°C
Low temp EEPROMs:
down to -55°C
1 Kbit, I2C and
1-256 Kbit SPI
Robust design, Reduce chances of
eld failures
Automotive Automotive Qualifi cation Special manufacturing fl ow All Robust design, Hassle-free solution
Consumer Electronics,
Medical Need Very Low Voltage Very Low Voltage EEPROMs 24VL014, 24VL024,
34VL02
Low power operation, Reduced
system voltage
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Serial Memory Products 7
Flexibility and Low Cost Access
Quickly add EUI-48 to your networking application
and get to market faster
Buy code only when needed.
No added programming and serialization cost –
Reduce System Costs
Come with no volume restrictions.
Additional EEPROM to store confi guration settings
Unique ID
Plug-and-Play Devices
EUI-48 address embedded in a 2K-bit Serial EEPROM
Quick and easy access to IEEE MAC addresses –
Read code directly off Serial EEPROM
Available in SPI, I2C and UNI/O bus
At least 1.5 Kb of Serial EEPROM memory
Available in SOIC and SOT-23 packages
Write-protected codes
EUI-48 and EUI-64 compatible
EUI-48: Networking, Ethernet, Wi-Fi (IEEE 802.11),
Bluetooth
EUI-64: ZigBee (IEEE802.15.4), MiWi™, FireWire, IPv6
EUI-48™/EUI-64™ MAC Address Chips
Need fast, easy and inexpensive access to MAC
addresses? Use pre-programmed MAC address chips
from Microchip. No serialization needed; unique ID.
EUI-48 Programmed Serial EEPROMs provide low cost and easy access
to IEEE MAC Addresses. These plug-and-play devices allow you to quickly
add a MAC address to your networking application eliminating the need for
programming and serialization on the MCU – helping you save cost and get
to market quicker. For more information visit: www.microchip.com/MAC
24AA02E48
100 KHz
I
2
C
25AA02E48
10 MHz
SPI
11AA02E48
100 KHz
UNI/O
More Speciality EEPROMs
I2C and SPI Serial EEPROMs with Optional Range from -55°C to +150°C
Automotive turbo chargers and exhaust gas recirculation
Automotive fan motors, air valves, flaps and spark plugs
Aerospace
Mining (certifications for use in explosive atmospheres available)
150oC
Partial Array Write-Protect I2C EEPROMs
Microchip’s family of partial array write-protect (WP) EEPROMs offers hardware write-protect capability for only a part of the
memory array. These I2C EEPROM devices are available from 1 Kb-64 Kbit.
32 & 64 Kbit
1/4 Array WP1/2 Array WP
User data, real-time updates,
data that changes
1 Kbit-16 Kbit
Calibration parameters, unique ID,
data that never changes
Can be custom programmed in any memory density. Contact Microchip sales for more information.
PCT" UNI/0‘9 Vcc Van Van Single no. No pull-up R2 reslstors needed. -I ‘—’ -I -I Van Van v - Save board space - Save plus an the mcu . Add addltlonzl ieaims
8 Serial Memory Products
11AA010
1 Kb
11AA020
2 Kb
11AA040
4 Kb
11AA080
8 Kb
11AA160
16 Kb
11LC010
11LC020
11LC040
11LC080
11LC160
2.5-5.5V
1.8-5.5V
UNI/
EEPROM
Using UNI/O EEPROM can free up MCU pins for new features.
Microchip’s new UNI/O Serial EEPROM uses only ONE connection to the
host microcontroller. This compares to two or three pins for I2C, and three
to six pins for Microwire or SPI buses. This new, proprietary bus offers
advanced features like a status register and write-protection on demand,
along with all I/O and memory array and command functions through a
single pin.
Save I/
O Pins
A single I/O EEPROM can simplify your design and
reduce system cost
Free up pins on the MCU
Add new features to your application
Move to a smaller MCU – reduce cost
Free up pins on your connector
Smaller connector – lower cost
Single I/O interface – more compact design
Single I/
O EEPROM
One I/O for clock, data & control
Single I/O interface
1-16 Kbit memory densities
1.8-5.5V operating voltage
10-100 KHz operating frequency
Status register, SW write-protect
3-pin SOT-23, 8-pin SOIC, MSOP & TDFN
1M Erase/Write cycles
UNI/O software drivers available for many popular microcontrollers See Ap Note section for more information.
Convert UNI/O from 3-pins to 2-pins – check out Ap Note AN1213.
V
CC
MCU
UNI/O
®
V
CC
I
2
C™ UNI/O
®
V
CC
V
CC
R1 R2
I
2
C™
SDA
SCL
WP
Single I/O, No pull-up
resistors needed.
Save board space
Save pins on the MCU
Add additional features
V
CC
MCU
SDA
SCL
WP
www.microchip.com/unio
The UNI/O Advantage
lg 7% lg 7% """"""""""" Parallel """""‘ SP‘ Serial MCU MCU . MCU 7 “M """""" 16-20 I/O llnes Sland»alone senal SRAM offering grealer design flexibility and the opponunily (or RAM expansmn
Serial Memory Products 9
The Serial Advantage – Not Just Price
Feature Traditional Parallel SRAM Microchip Serial SRAM
I/O Connection to MCU 16-20 4
Standby Current 3 mA 1 μA
Active Current 50 mA 1-10 mA
Lowest Operating Voltage 3.0V 1.7V
Footprint 100 mm220 mm2
Smallest Packages 28-TSSOP, 28-SOIC 8-TSSOP, 8-SOIC
Do you need a simple, inexpensive way to add RAM to
your application? Microchip offers external RAM where
you need it.
Microchip’s new serial SRAM family provides a way to easily and
inexpensively add external RAM to almost any application. These serial
devices use less power and fewer I/O connections than traditional parallel
SRAM. And, they allow designers to use a smaller microcontroller rather than
moving to a larger microcontroller just to get more on-board RAM.
Serial SRAM
Flexible RAM Expansion
Quickly and easily add external high-speed SRAM
8 and 32 Kbyte options
20 MHz clock speed
Low standby and operating currents
Fast writes with zero latency
Unlimited endurance
8-SOIC, 8-TSSOP, 8-PDIP
Increased Performance
Add features to your current microcontroller
and get to market faster
Add functionality to your current design
No need to buy a large microcontroller just for the RAM
Familiar 4-pin SPI interface
Cost reduce your current design
Scratchpad, buffering, high endurance applications
Applications: metering, POS terminals, printers, internet radio,
ethernet, Wi-Fi
Replace parallel RAM
Any application needing low cost RAM
23A640
16 MHz
1.5V-1.95V
23K640
20 MHz
2.7V-3.6V
64 Kb
23A256
16 MHz 23K256
20 MHz
256 Kb
Parallel
SRAM
www.microchip.com/sram
lam-ma by can um
10 Serial Memory Products
Wafer-Level Burn-In
Main Goals – Zero Defects
Full verification of data sheet parameters for
functional compliance at die and package
level.
Removal of manufacturing defects to ensure
highest quality and reliability.
Screening out of functional devices that may
fail in the future.
1: Wafer Probe
Full functional
tests on 100% of
die and bits;
85ºC or 125ºC
5000 erase/write
cycles on all bits
Key Aspects:
Endurance Testing
MAVERICK
HVST
TVPP
250ºC up to 24 hours
Equivalent to 100
years at 85ºC
Key Aspects:
Functional Test
Verify Margins
GBN
EDIO
LVHF
SBY
2: Wafer Probe
2nd 100% bit
test (25ºC)
full-functional
screen
Any die with charge loss in
any cell between the
2 probes is rejected to
prevent infant mortality
Retention Bake
3:
Assembly
& Final
Test
Microchips Triple Test and
Wafer-level Burn-in Procedure
Moving beyond traditional burn-in to wafer level burn-in with the Triple
Test Flow specifically targeted for memory cells has helped create the
industry’s most reliable memory products.
Extensive Testing – Every cell in every die is tested three times,
including specific endurance and data retention tests to ensure
highest quality.
HVST, LVHF and TVPP tests target specific defects.
Maverick, SBY and GBN target overall failure patterns and trends.
Insight into failure modes along with flexible test flow ensures
continues improvement.
Traditional Burn-in
(Old Technology)
General purpose non-specific testing procedure
for random logic cells
Non-specific and untargeted testing
mechanism – Increases failure rates.
Expensive, time consuming and inefficient.
Introduces defect modes like bent leads
and EOS that sometimes go undetected.
Triple Test Flow
Microchip tests every cell in wafer form twice, then performs a final test after assembly.
Microchip’s best-in-class field performance is the combined result of world class
manufacturing, wafer level burn-in and wafer probe quality screens.
Microchips Triple Test Flow is currently the most robust testing procedure for serial EEPROM devices in the
industry. It tests each cell of each die three times and also performs extensive endurance and data retention tests
to ensure quality and reliability.
Infant mortality of Microchip serial EEPROMs is among the lowest in the industry due to this extensive testing,
excellent fabrication and highly reliable memory cell design.
Good Die in a Bad Neighborhood (GBN) and
Edge Die Ink Out (EDIO)
Special algorithms target devices that function, but are
suspect because of their proximity to clusters of failing
devices or edge die.
Wafer Probe Quality Screens
Microchip performs additional in-house testing during wafer
probe to ensure quality and eliminate any devices that are
outside the normal distribution or might possibly fail in the
future.
High Voltage Stress Test (HVST)
HVST targets weak devices with oxide defects in RAM and logic
circuits by stressing the oxides at higher than normal voltages.
Time at Vpp (TVPP)
TVPP targets oxide defects in EEPROM cells, charge pumps
and other high-voltage circuits. Programming voltages (VPP) are
applied to the memory array for an extended period of time in
order to highlight any weak devices.
Low Voltage High Frequency (LVHF)
LVHF targets signal paths that are partially blocked and therefore
more resistive than normal. LVHF eliminates these devices by
requiring them to operate faster than specified and at voltages
lower than specified.
What Does All of This Mean?
<<1 PPM Field Failures
Best-in-class endurance
Industry-leading data retention
Failing Die
Passing Die Rejected by
GBN screen
Rejected by
EDIO screen
Rejected by
EDIO screen
(Concept)
Serial Memory Products 11
Consistent, Reliable Supply of the Highest Quality Products
Perfected testing mechanisms along with streamlined
in-house fabrication ensures the highest effi ciency,
shortest lead times and lowest costs.
Quality Comes First” is at the top of the list of
Guiding Values for Microchip Technology. As an
ISO/TS-16949 certified supplier since 2003,
Microchips Aggregate System uniquely supports our
commitment to exceptional quality. In an environment
where enterprise-wide commitment to continuous
improvement is demonstrated and every employee is
responsible for quality.
With more than 20 years of experience in serving the demanding requirements of customers worldwide, Microchip
Technology has a proven track record of success in delivering the total product solution to our valued customers
that is cost effective and reliable.
Corporate Headquarters
Chandler, Arizona Fab 2
Tempe, Arizona
Fab 4
Gresham, Oregon Product Assembly/Test
Bangkok, Thailand
www.microchip.com/quality
EEPROMs built at Microchip owned fabs (Gresham,
OR, Tempe, AZ)
No obsolescence policy – industry’s longest product
life cycles
100% in-house testing on all of our products
AECQ100, TS19649 and automotive grade compliant
Industry’s shortest lead times
Excellent global sales and technical support
Microchip: A leader in non-volatile memory for over 20 years.
12 Serial Memory Products
MPLAB® Starter Kit for Serial Memory Products
(DV243003)
Reduce time to market and
create a rock-solid design using
the MPLAB Starter Kit for Serial
Memory Products. It includes
everything necessary to quickly
develop a robust and reliable
Serial EEPROM design, and greatly reduces the time
required for system integration and hardware/software
fine-tuning.
3.3V and 5.0V on-board voltage selection
Supports Microchip UNI/O bus, I²C, SPI and
Microwire Serial EEPROMs
1.8V to 5.5V external voltage support
Includes free copy of MPLAB IDE
USB interconnect
Total Endurance™ Software
Total Endurance Software provides a comprehensive
model that helps estimate the endurance and reliability
of Microchip Serial EEPROM devices. By providing
operating conditions based on your application, all
design trade-offs affecting reliability can be accurately
estimated both graphically and numerically in PPM,
FIT and MTBF modes, saving time and ensuring a truly
robust design.
Resources to Get You Started Quickly
Reduce development time and cost with our development tools.
Competitive market conditions force businesses to examine every aspect of their product life cycle to maximize
productivity and minimize expense. Easy-to-learn, low-cost common development tools are one way to reduce risk
and get to market quicker.
UNI/ Bus Parasitic Power Demo Board
(AC243004)
The UNI/O Bus Parasitic Power
Demo Board is designed to
illustrate how a standard
half-wave rectifier and
capacitor circuit can be used
to parasitically extract power
for a UNI/O device from the
SCIO signal as described in application note, AN1213
“Powering a UNI/O® Bus Device Through SCIO”. This
reduces the number of connections necessary for
adding a UNI/O device to your application down to two:
SCIO and VSS.
Serial EEPROM PIM PICtail™ Pack (AC243003)
The Serial EEPROM PIM PICtail
Modules are a series of boards
designed around Microchip
Serial EEPROM devices. The
boards are designed to interface
with the PICtail Plus connector
as well as the MPLAB Starter Kit
for Serial Memory Products and
the PICkit 3, allowing you to get
started right out of the box.
Plug-and-play with PICtail Plus connector and PICkit 3
connector
Test points for oscilloscope connections for firmware
debugging (I²C and UNI/O only)
Microwire Buses are included for maximum flexibility
in developing your application
www.microchip.com/devtools
Serial Memory Products 13
Reference Code Resources
Looking for reference code to interface with our serial memory?
Select your serial protocol, microcontroller and preferred implementation below.
Memory Application Notes – PIC® MCUs
Protocol Memory
Type
Recommended
Usage Implementation PIC10 PIC12 PIC16 PIC18 PIC24/
dsPIC33 PIC32
UNI/O Bus EEPROM
AN1194
(General Usage) Assembly – Firmware Delay AN11741AN11741
AN11882
AN11741
AN11882AN1183
AN1213
(Parasitic Power)
Assembly – Hardware Delay AN11962AN11962AN1187
C – Hardware Delay AN12512AN12512AN1191 AN1236
I²C EEPROM AN1028
Assembly – Bit Bang AN982 AN982 AN974 AN979
Assembly – Hardware Port AN976 AN989
C – Bit Bang AN997 AN1100
C – Hardware Port AN991 AN1079
Microwire EEPROM AN1029
Assembly – Bit Bang AN993 AN999
Assembly – Hardware Port AN975 AN1020
C – Bit Bang AN1004
C – Hardware Port AN1023
SPI
EEPROM AN1040
Assembly – Bit Bang AN909 AN1006
Assembly – Hardware Port AN966 AN1000
C – Bit Bang AN1018 AN1096
C – Hardware Port AN1040 AN1069
SRAM AN1245 AN1287 AN1269 AN1262 AN1277
All
EEPROMs
AN1019 EEPROM Endurance Tutorial
AN536 Basic Serial EEPROM Operation
AN603 Continuous Improvement
Note 1: Written for baseline (12-bit program word) cores.
2: Written for mid-range (14-bit program word) cores.
Memory Application Notes – Third-Party MCUs
Protocol Implementation 8051 MSP430
UNI/O Bus
Assembly – Hardware Delay AN1184
C – Hardware Delay AN1185 AN1186
I²C
Assembly – Bit Bang AN1147
Assembly – Hardware Port AN1190
C – Bit Bang AN1195
C – Hardware Port AN1113
SPI
Assembly – Bit Bang AN1198
Assembly – Hardware Port AN1197
C – Bit Bang AN1193
C – Hardware Port AN1073
www.microchip.com/appnotes
14 Serial Memory Products
Product Specifications
I2C™ Memory Products
Device Density
(Organization)
Max
Clock
Frequency
Operating
Voltage
(AA, LC, C)
Temperature
(I, E, H)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Hardware)
Packages
24XX00 128 bits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years No PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN
24XX01/014 1 Kbit (x8) 400 kHz 1.7V-5.5V -40°C to +150ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70
24XX02/024 2 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, SC70
24XX04 4 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX08 8 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
24XX16 16 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ½ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX32 32 Kbits (x8) 400 kHz 1.7V-5.5V -40°C to +125ºC 1M 200 years W, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX64/65 64 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M/10M 200 years W, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, WLCSP
24XX128 128 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 2x3 T-DFN, 6x5 DFN, MSOP, WLCSP
24XX256 256 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 6x5 DFN, MSOP, WLCSP
24XX512 512 Kbits (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, TSSOP, 6x5 DFN, WLCSP
24XX1025 1 Mbit (x8) 1 MHz 1.7V-5.5V -40°C to +125ºC 1M 200 years Yes PDIP, SOIC, SOIJ, 6x5 DFN
SPI EEPROM Products
Device Density
(Organization)
Max Clock
Frequency
Operating
Voltage
(AA, LC)
Temperature
(I, E, H)
Endurance
(E/W
Cycles)
Data
Retention
Write Protect
(Software) Packages
25XX010A 1 Kbit (x8) 10 MHz 1.8V-5.5V -40°C to +15C 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX020A 2 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX040A 4 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP, SOT-23
25XX080C/D 8 Kbits (x8) 10 MHz 1.8V-5.5V -4C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX160C/D 16 Kbits (x8) 10 MHz 1.8V-5.5V -4C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX320A 32 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX640A 64 Kbits (x8) 10 MHz 1.8V-5.5V -4C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, MSOP, 2x3 T-DFN
25XX128 128 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +150ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 6x5 DFN
25XX256 256 Kbits (x8) 10 MHz 1.8V-5.5V -40°C to +15C 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, 6x5 DFN
25XX512 512 Kbits (x8) 20 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼
PDIP, SOIC, 6x5 DFN
25XX1024 1 Mbit (x8) 20 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIJ, 6x5 DFN
1. Voltage Range: AA = 1.7- 5.5V; LC = 2.5-5.5V; C = 4.5-5.5V
2. I = -40ºC to 85ºC; E = -40ºC to 125ºC; H = -40ºC to 150ºC
3. Pb-Free, Halogen Free and RoHS Compliant
4. Write Protect: W = Whole Array, ½ = Half Array, ¼ = Quarter Array
5. ESD protection > 4 kV (HBM); > 400V (MM) on all pins
6. H Temp is SOIC only
Microwire EEPROM Products
Device Density
(x8 or x16)
Max
Clock
Frequency
Operating
Voltage
(AA, LC, C)
Temperature
(I, E)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Hardware)
Read
Current Packages
93XX46A/B/C 1 Kbit 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX56A/B/C 2 Kbits 3 MHz 1.8V-5.5V -4C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX66A/B/C 4 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years No 1 mA PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP
93XX76A/B/C 8 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years Yes 1 mA PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP
93XX86A/B/C 16 Kbits 3 MHz 1.8V-5.5V -40°C to +125ºC 1M 200 years Yes 1 mA PDIP, SOIC, TSSOP, 2x3 T-DFN, MSOP
A: x8 Organization, B: x16 Organization, C: Selectable x8 or x16 Organization
UNI/
O® Bus EEPROM Products
Device Density
(Organization)
Max
Clock
Frequency
Operating
Voltage
(AA, LC)
Temperature
(I, E)
Endurance
(E/W
Cycles)
Data
Retention
Write
Protect
(Software)
Packages
11XX010 1 Kbit (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
11XX020 2 Kbits (x8) 100 kHz 1.8V-5.5V -4C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
11XX040 4 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
11XX080 8 Kbits (x8) 100 kHz 1.8V-5.5V -40°C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
11XX160 16 Kbits (x8) 100 kHz 1.8V-5.5V -4C to +125ºC 1M 200 years W, ½, ¼ PDIP, SOIC, TSSOP, SOT-23, 2x3 T-DFN, MSOP, TO92, WLCSP
Serial SRAM Products
Device Density
Organization)
Max
Clock Frequency
Operating
Voltage (A, K)
Temperature
(I, E)
Read Current
(mA)
Max Standby
Current Packages
23x640 8KB (64 Kbits) 20 MHz 1.8V, 3V -40°C to +125ºC 3 mA 4 μA PDIP, SOIC, TSSOP
23X256 32 KB (256 Kbits) 20 MHz 1.8V, 3V -40°C to +125ºC 3 mA 4 μA PDIP, SOIC, TSSOP
1. Voltage Range: A = 1.5- 1.95V; K = 2.7V-3.6V
2. All Devices are Pb-Free, RoHS Compliant and Halogen Free
For up to date product information visit: www.microchip.com/memory
| F
Serial Memory Products 15
Package Type:
SN 8-SOIC (150 mil)
TT/OT 3/5/6 SOT-23
ST 8-TSSOP
P 8-PDIP
SM 8-SOIJ (208 mil)
MS 8-MSOP
Operating Temperature Range:
I: Industrial (-40°C to +85°C)
E: Extended Industrial Range (-40°C to +125°C)
H: Extended (-40°C to +150°C)
Tape and Reel
T: Tape and Reel
blank: Standard (bulk)
Density:
00: 128 bits
01/010/014: 1 Kbit
02/020/024: 2 Kbit
04/040: 4 Kbit
08/080: 8 Kbit
16/160: 16 Kbit
Voltage Range:
AA 1.8V-5.5V
LC 2.5V-5.5V
C 4.5V-5.5V
K 1.8-3.6V
A 1.5-1.95V
VL 1.5V-3.6V
Bus Type:
24/34: I2C
25: SPI
93: Microwire
11: UN
I/O Bus
23: SRAM (SPI)
Part Number Suffix Designations
Ordering information for Microchip SEEPROM products.
24 AA 02 T - I /SN
Serial Memory Ordering Information
We can pre-program your EEPROMs before they ship.
Microchip offers custom programming options in package
and die:
QTP – All devices are programmed with same data
SQTP – Each device is programmed with unique data
Do you have special product requirements?
Microchip offers customized versions of existing products:
Lower VDD (<1.5V in some cases)
Extreme temperature (< -55ºC to >+150ºC)
More endurance, up to 10M cycles
Lower current specs (read, write, standby)
Higher speed
Customer design modifi cations:
Different I2C and UNI/O addresses
Custom voltage ranges
Get started today… additional resources at:
www.microchip.com/memory
Datasheets and application notes (with code)
Verilog, IBIS models
Usage recommendation ap notes
Webinars at www.microchip.com/webinars
Samples at www.microchip.com/samples
Tools and demo boards
MNY/MC/MF 8-TDFN/DFN
LT 5-SC70
W/WF/S Wafer/Die
CS WLCSP – die size
TO TO92
32/320: 32 Kbit
64/640: 64 Kbit
128: 128 Kbit
256: 256 Kbit
512: 512 Kbit
1024/1025: 1 Mbit
Programming & Special Services
MICROCHIP Microcontrollers - Digital Signal Controllers - Analog - Serial EEPROMS
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