STTH2003 Datasheet by STMicroelectronics

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KK
A1 A1
A2 A2
D2PAK
A1
K
A2
A1 K
A2
TO-220AB
A1
K
A2
TO-220FPAB
A1K
A2
I2PAK
K
K
Features
Combines highest recovery and reverse voltage performance
Ultra-fast, soft and noise-free recovery
Insulated package: TO-220FPAB
Insulating voltage = 2000 VRMS sine
• ECOPACK®2 compliant component for D²PAK on demand
Applications
Secondary rectification
Switching diode
Telecom power supply
DC/DC converter
Description
The STTH2003 is a dual center tap fast recovery epitaxial diodes suited for switch
mode power supply and high frequency DC/DC converters.
Packaged in TO-220AB, TO-220FPAB, I²PAK or D²PAK, this device is especially
intended for secondary rectification.
Product status
STTH2003
Product summary
IF(AV) 2 x 10 A
VRRM 300 V
Tj (max.) 175 °C
VF (typ.) 0.85 V
trr (max.) 25 ns
300 V ultrafast rectifier
STTH2003
Datasheet
DS1213 - Rev 12 - August 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 300 V
IF(RMS) Forward rms current 30 A
IF(AV) Average forward current δ = 0.5, square
wave
TO-220AB, D²PAK, I²PAK TC = 140 °C
Per diode 10
A
TO-220FPAB TC = 115 °C
All types Per device 20
IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 110 A
Tstg Storage temperature range -65 to +175 °C
TjMaximum operating junction temperature 175 °C
Table 2. Thermal resistance parameters
Symbol Parameter Value Unit
Rth(j-c) Junction to case
TO-220AB, D²PAK, I²PAK
Per diode
2.5
°C/W
TO-220FPAB 4.6
TO-220AB, D²PAK, I²PAK
Total
1.3
TO-220FPAB 4.0
Rth(c) Coupling
TO-220AB, D²PAK, I²PAK 0.1
°C/W
TO-220FPAB 3.5
For more information, please refer to the following application note:
AN5088: Rectifiers thermal management, handling and mounting recommendations
When the diodes 1 and 2 are used simultaneously:
ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c)
Table 3. Static electrical characteristics (per diode)
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR (1) Reverse leakage current
Tj = 25 °C
VR = 300 V
- 20
µA
Tj = 125 °C - 30 300
VF (2) Forward voltage drop
Tj = 25 °C
IF = 10 A
- 1.25
V
Tj = 125 °C - 0.85 1.0
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.75 x IF(AV) + 0.025 x IF 2 (RMS)
For more information, please refer to the following application notes related to the power losses:
STTH2003
Characteristics
DS1213 - Rev 12 page 2/16
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses in a power diode
Table 4. Recovery characteristics (per diode)
Symbol Parameter Test conditions Min. Typ. Max. Unit
trr Reverse recovery time Tj = 25 °C
IF = 0.5 A, Irr = 0.25 A, IR = 1 A - 25
ns
IF = 1 A, VR = 30 V,dIF/dt = -50 A/µs - 35
tfr Forward recovery time Tj = 25 °C IF = 10 A, VFR = 1.1 x VFmax, dIF/dt = 100 A/µs - 230 ns
VFP Peak forward voltage Tj = 25 °C IF = 10 A, dIF/dt = 100 A/µs - 3.5 V
IRM Reverse recovery current Tj = 125 °C IF = 10 A, VCC = 200 V, dIF/dt = -200 A/µs - 8 A
S factor Softness factor - 0.3 -
1.1 Characteristics (curves)
Figure 1. Conduction losses versus average forward
current (per diode)
0 2 4 6 8 10 12
0
2
4
6
8
10
12
14
P1(W)
T
δ=tp/T tp
δ = 0.05
δ = 1
I (A)
F(AV)
δ = 0.1 δ = 0.2 δ = 0.5
Figure 2. Forward voltage drop versus forward current
(maximum values, per diode)
0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00
1
10
100
200
I (A)
FM
V (V)
FM
T =25°C
j
T =75°C
j
T =125°C
j
Figure 3. Relative variation of thermal impedance junction
to case versus pulse duration (TO-220AB, D²PAK, I²PAK)
1E-3 1E-2 1E-1 1E+0
0.0
0.2
0.4
0.6
0.8
1.0
Z /R
th(j-c) th(j-c)
t (s)
p
Single pulse
Figure 4. Relative variation of thermal impedance junction
to case versus pulse duration (TO-220FPAB)
1E-2 1E-1 1E+0 1E+1
0.0
0.2
0.4
0.6
0.8
1.0
Z /R
th(j-c) th(j-c)
t (s)
p
Single pulse
STTH2003
Characteristics (curves)
DS1213 - Rev 12 page 3/16
Figure 5. Peak reverse recovery current versus dIF/dt
(typical values, per diode)
0 50 100 150 200 250 300 350 400 450 500
0
2
4
6
8
10
12
14
16
I (A)
RM
dI /dt(A/µs)
F
I =2 x I
F F(AV)
I =I
F F(AV)
I =0.5 x I
F F(AV)
V =200V
T =125°C
R
j
Figure 6. Reverse recovery time versus dIF/dt (typical
values, per diode)
0 50 100 150 200 250 300 350 400 450 500
0
20
40
60
80
100
t (ns)
rr
dI /dt(A/µs)
F
I =2 x I
F F(AV)
I =I
F F(AV)
I =0.5 x I
F F(AV)
V =200V
T =125°C
R
j
Figure 7. Softness factor versus dIF/dt (typical values, per
diode)
0 50 100 150 200 250 300 350 400 450 500
0.00
0.10
0.20
0.30
0.40
0.50
0.60
S factor
dI /dt(A/µs)
F
V =200V
T =125°C
R
j
Figure 8. Relative variation of dynamic parameters versus
junction temperature (reference: Tj = 125 °C)
25 50 75 100 125
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
T (°C)
j
S factor
IRM
Figure 9. Transient peak forward voltage versus dIF/dt
(typical values, per diode) (TO-220AB)
0 50 100 150 200 250 300 350 400 450 500
0
2
4
6
8
10
V (V)
FP
dI /dt(A/µs)
F
I =I
T =125°C
F F(AV)
j
Figure 10. Forward recovery time versus dIF/dt (typical
values, per diode)
0 50 100 150 200 250 300 350 400 450 500
0
100
200
300
400
500
t (ns)
fr
dI /dt(A/µs)
F
I =I
T =125°C
F F(AV)
j
V =1.1 x V max.
FR F
STTH2003
Characteristics (curves)
DS1213 - Rev 12 page 4/16
Figure 11. Thermal resistance, junction to ambient, versus
copper surface under tab (epoxy printed board FR4, eCu =
35µm) (D²PAK)
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
Rth(j-a)(°C/W)
SCu(cm²)
Figure 12. Average forward current versus ambient
temperature (δ = 0.5, per diode)
0
1
2
3
4
5
6
7
8
9
10
11
12
0 25 50 75 100 125 150 175
I (A)
F(AV)
T (°C)
amb
R = R
th(j-a) th(j-c)
TO-220AB / I²PAK / D²PAK
TO-220FPAB
STTH2003
Characteristics (curves)
DS1213 - Rev 12 page 5/16
951A [2 02 THERMAL PAD s? GAUGE PLANE LI A1 17 J_ 025
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 D²PAK package information
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Figure 13. D²PAK package outline
STTH2003
Package information
DS1213 - Rev 12 page 6/16
Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are
guaranteed.
Table 5. D²PAK package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A 4.36 4.60 0.172 0.181
A1 0.00 0.25 0.000 0.010
b 0.70 0.93 0.028 0.037
b2 1.14 1.70 0.045 0.067
c 0.38 0.69 0.015 0.027
c2 1.19 1.36 0.047 0.053
D 8.60 9.35 0.339 0.368
D1 6.90 8.00 0.272 0.311
D2 1.10 1.50 0.043 0.060
E 10.00 10.55 0.394 0.415
E1 8.10 8.90 0.319 0.346
E2 6.85 7.25 0.266 0.282
e 2.54 typ. 0.100
e1 4.88 5.28 0.190 0.205
H 15.00 15.85 0.591 0.624
J1 2.49 2.90 0.097 0.112
L 1.90 2.79 0.075 0.110
L1 1.27 1.65 0.049 0.065
L2 1.30 1.78 0.050 0.070
R 0.4 typ. 0.015
V2 0° 8° 0° 8°
Figure 14. D²PAK recommended footprint (dimensions in mm)
16.90
12.20
9.75 3.50
5.08
1.60
2.54
STTH2003
D²PAK package information
DS1213 - Rev 12 page 7/16
L2 , __ || 1] LI AI _. <—b {3x}="" +97.—="">
2.2 I²PAK package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Figure 15. I²PAK package outline
STTH2003
I²PAK package information
DS1213 - Rev 12 page 8/16
Table 6. I²PAK package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
A1 2.40 2.72 0.094 0.107
b 0.61 0.88 0.024 0.035
b1 1.14 1.70 0.044 0.067
c 0.49 0.70 0.019 0.028
c2 1.23 1.32 0.048 0.052
D 8.95 9.35 0.352 0.368
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
E 10.00 10.40 0.394 0.409
L 13.00 14.00 0.512 0.551
L1 3.50 3.93 0.138 0.155
L2 1.27 1.40 0.050 0.055
STTH2003
I²PAK package information
DS1213 - Rev 12 page 9/16
\ 31 w ‘ V b10024 L‘ L +J1 T 7 Jl i a e k a *0 L 4 k b ()0) 914‘
2.3 TO-220AB package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 16. TO-220AB package outline
Table 7. TO-220AB package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.240 0.035
b1 1.14 1.55 0.045 0.061
STTH2003
TO-220AB package information
DS1213 - Rev 12 page 10/16
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
c 0.48 0.70 0.019 0.028
D 15.25 15.75 0.600 0.620
D1 1.27 typ. 0.050 typ.
E 10.00 10.40 0.394 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.195 0.203
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.260
J1 2.40 2.72 0.094 0.107
L 13.00 14.00 0.512 0.551
L1 3.50 3.93 0.138 0.155
L20 16.40 typ. 0.646 typ.
L30 28.90 typ. 1.138 typ.
θP 3.75 3.85 0.148 0.152
Q 2.65 2.95 0.104 0.116
STTH2003
TO-220AB package information
DS1213 - Rev 12 page 11/16
L7 47A!» ‘5 L6 mm J .51. «i6 L2 L3 L4
2.4 TO-220FPAB package information
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Recommended torque value: 0.55 N·m
Maximum torque value: 0.70 N·m
Figure 17. TO-220FPAB package outline
STTH2003
TO-220FPAB package information
DS1213 - Rev 12 page 12/16
Table 8. TO-220FPAB package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A 4.40 4.60 0.1739 0.1818
B 2.50 2.70 0.0988 0.1067
D 2.50 2.75 0.0988 0.1087
E 0.45 0.70 0.0178 0.0277
F 0.75 1.00 0.0296 0.0395
F1 1.15 1.70 0.0455 0.0672
F2 1.15 1.70 0.0455 0.0672
G 4.95 5.20 0.1957 0.2055
G1 2.40 2.70 0.0949 0.1067
H 10.00 10.40 0.3953 0.4111
L2 16.00 typ. 0.6324 typ.
L3 28.60 30.60 1.1304 1.2095
L4 9.80 10.60 0.3874 0.4190
L5 2.90 3.60 0.1146 0.1423
L6 15.90 16.40 0.6285 0.6482
L7 9.00 9.30 0.3557 0.3676
Dia 3.00 3.20 0.1186 0.1265
STTH2003
TO-220FPAB package information
DS1213 - Rev 12 page 13/16
3Ordering information
Table 9. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STTH2003CT STTH2003CT TO-220AB 1.95 g 50 Tube
STTH2003CG STTH2003CG D2PAK 1.38 g 50 Tube
STTH2003CG-TR STTH2003CG D2PAK 1.38 g 1000 Tape and reel
STTH2003CFP STTH2003CFP TO-220FPAB 1.90 g 50 Tube
STTH2003CR STTH2003CR I2PAK 1.50 g 50 Tube
STTH2003
Ordering information
DS1213 - Rev 12 page 14/16
Revision history
Table 10. Document revision history
Date Revision Changes
Aug-2003 7G Previous release
26-Mar-2007 8 Removed ISOWATT package
11-Feb-2011 9 Updated base quantity for tape and reel delivery.
Corrected temperature in Table 1. Added warning paragraph above Table 7.
06-Sep-2011 10 Updated Table 2. Added Figure 12.
28-May-2015 11
Updated features, Table 1: "Device summary" and packages silhouette in
cover page.
Updated Section 1: "Characteristics".
Updated Section 2.2: "D²PAK package information".
07-Aug-2018 12 Updated I²PAK package information.
Minor text changes to improve readability.
STTH2003
DS1213 - Rev 12 page 15/16
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© 2018 STMicroelectronics – All rights reserved
STTH2003
DS1213 - Rev 12 page 16/16

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