UClamp1201H Datasheet by Semtech Corporation

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PROTECTION PRODUCTS
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PROTECTION PRODUCTS - MicroClampTM
uClamp1201H
µClampTM
1-Line ESD Protection
Description Features
Dimensions Schematic & PIN Configuration
Revision 03/08/2005
The µClampTM series of TVS arrays are designed to protect
sensitive electronics from damage or latch-up due to ESD.
It is designed to replace multilayer varistors (MLVs) in por-
table applications such as cell phones, notebook comput-
ers, and PDAs. It features large cross-sectional area junc-
tions for conducting high transient currents. It offers
superior electrical characteristics such as lower clamp-
ing voltage and no device degradation when compared
to MLVs. They offer desirable characteristics for board
level protection including fast response time, low oper-
ating and clamping voltage, and no device degradation.
The µClampTM1201H is in a 2-pin, RoHS compliant,
SOD-523 package. The leads are finished with lead-
free matte tin. Each device will protect one line oper-
ating at 12 volts. It gives the designer the flexibility to
protect single lines in applications where arrays are not
practical. They may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV
contact discharge). The combination of small size and
high ESD surge capability makes them ideal for use in
portable applications such as cellular phones, digital
cameras, and MP3 players.
Applications
Mechanical Characteristics
Cellular Handsets & Accessories
Personal Digital Assistants (PDAs)
Notebooks & Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
Cable Discharge Event (CDE)
Ultra-small SOD-523 package (1.7 x 0.9 x 0.7mm)
Protects one I/O or power line
Low clamping voltage
Working voltage: 12V
Low leakage current
Solid-state silicon-avalanche technology
EIAJ SOD-523 package
Molding compound flammability rating: UL 94V-0
Marking: Marking code, cathode band
Packaging: Tape and Reel per EIA 481
Lead Finish: Matte tin
RoHS Compliant
SOD-523 (Top View)
0.9
1.70
1.30
0.35
0.70
Maximum Dimensions (mm)
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22005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp1201H
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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PROTECTION PRODUCTS
uClamp1201H
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve
Clamping Voltage vs. Peak Pulse Current Forward Voltage vs. Forward Current
Junction Capacitance vs. Reverse Voltage ESD Clamping
(8kV Contact per IEC 61000-4-2)
0
5
10
15
20
25
012345678910
Peak Pulse Current - IPP (A)
Clamping Voltage - VC (V)
Waveform
Parameters:
tr = 8µs
td = 20µs
0.01
0.1
1
10
0.1 1 10 100 1000
Pulse Duration - tp (us)
Peak Pulse Power - PPP (kW)
0
10
20
30
40
50
60
70
80
90
100
110
0 25 50 75 100 125 150
Ambient Temperature - TA (oC)
% of Rated Power or IPP
0
0.5
1
1.5
2
2.5
3
3.5
012345678
Forward Current - IF (A)
Forward Voltage - VF (V)
Waveform
Parameters:
tr = 8µs
td = 20µs
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
012345
Reverse Voltage - VR (V)
Normalized Capacitance
f = 1 MHz
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PROTECTION PRODUCTS
uClamp1201H
Circuit Diagram
Device Connection Options
These TVS diodes are designed to protect one data,
I/O, or power supply line. The device is unidirectional
and may be used on lines where the signal polarity is
above ground. The cathode band should be placed
towards the line that is to be protected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
Applications Information
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2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp1201H
Applications Information - Spice Model
Figure 1 - uClamp1201H Spice Model
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62005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp1201H
Outline Drawing - SOD-523
Land Pattern - SOD-523
DIMENSIONS
DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
1.
2.
.027
MAX
.019
MIN
DIM
A.023
NOM
INCHES
0.60
NOM
MILLIMETERS
0.50
MIN
0.70
MAX
E1
E
B
2X b
aaa C A B
A
c
C
A
SEATING
PLANE
0.10
.003
c-.008 0.20
-
0.70
D.027 .035
.031 0.90
0.80
1.50E .059 .063 .067 1.70
1.60
1.10E1 .043 .051
.047 1.301.20
0.25
b.009 -.013 0.35
-
aaa .008 0.20
D
L1
L
L.003 .008 .011 0.10 0.20 0.30
L1 .003 .005 .008 0.10 0.15 0.20
NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
DIM
Y
Z
G
X
C
MILLIMETERSINCHES
(1.45)
.033
.090
.018
.024
(.057)
0.85
2.30
0.45
0.60
DIMENSIONS
Z
C
G
Y
X
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2005 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
uClamp1201H
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Marking Code Ordering Information
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Tape and Reel Specification
Tape Specifications
Device Orientation in Tape
2H MicroClamp, uClamp and µClamp are marks of Semtech
Corporation
Note: Devices are lead-free

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