FP0906 Series Datasheet by Eaton - Electronics Division

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Technical Data 4407 Effective June 2015
Supersedes March 2014
FP0906
High frequency, high current power inductors
Product Description
High current carrying capacity
Low core loss
Controlled DCR for sensing circuits
Frequency range up to 2MHz
Inductance Range from 100nH to 300nH
Current range from 32.5 to 94 amps
9.6x6.45mm footprint surface mount
package in a 8.0mm height
Ferrite core material
Halogen free, lead free, RoHS compliant
Applications
Multi-phase and Vcore regulators
Voltage Regulator Modules (VRMs)
Desktop and server VRMs and EVRDs
Data networking and storage systems
Graphics cards and battery power systems
Point-of-Load modules
DCR Sensing circuits
Environmental Data
Storage temperature range (Component):
-40°C to +125°C
Operating temperature range: -40°C to +125°C
(ambient + self-temperature rise)
Solder reflow temperature: J-STD-020D
compliant
Pb
HALOGEN
HF
FREE
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2
Technical Data 4407
Effective June 2015
FP0906
High frequency, high current power inductors
www.eaton.com/elx
Product specifications
Part Number7
OCL1
(nH) ±10%
FLL2
(nH) minimum
Irms
3
(amps)
Isat14
(amps)
Isat25
(amps)
DCR (mΩ) ±5%
@ 20°C K-factor6
FP0906R1-R10-R 100 72 51 94 81 0.29 451
FP0906R1-R12-R 120 86 51 79 68 0.29 451
FP0906R1-R15-R 150 108 51 65 55 0.29 451
FP0906R1-R18-R 180 129 51 55 45 0.29 451
FP0906R1-R22-R 220 155 51 44 37.5 0.29 451
FP0906R1-R28-R 280 200 51 34 29 0.29 451
FP0906R1-R30-R 300 216 51 32.5 27.5 0.29 451
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, +25°C
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0Vrms, Isat1, +25°C
3. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat
generating components will affect the temperature rise. It is recommended that the temperature
of the part not exceed 125°C under worst case operating conditions verified in the end application.
4. Isat1 : Peak current for approximately 20% rolloff @ +25°C
5. Isat2: Peak current for approximately 20% rolloff @ +125°C
6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * I * 10-3. Bpp :(Gauss), K: (K-
factor from table), L: (Inductance in nH), I (Peak to peak ripple current in Amps).
7. Part Number Definition: FP0906Rx-Rxx-R
FP0906 = Product code and size
Rx= DCR indicator
Rxx= Inductance value in uH, R= decimal point
-R suffix = RoHS compliant
Recommended Pad Layout Schematic
0906Rx
Rxx
wwllyy R
1
2
4.00
2.54
10.40
2.3
±0.2
2.14
±0.2
0.3 ref
b
a
8.0
max
6.2
±0.2
1
2
Dimensions–mm
Part marking: 0906Rx (Rx=DCR indicator), Rxx=Inductance value in uH (R=decimal point),
www=date code R=revision level
The nominal DCR is measured between point “a” and point “b”
Soldering surfaces to be coplanar within 0.1 millimeters
Do not route traces or vias underneath the inductor
Packaging–mm
Supplied in tape and reel packaging , 600 parts per 13” diameter reel
User direction of feed
1.5 dia
1.5 dia
4.0
2.0
1.75
12.0
6.5
11.5
24.00
±0.3
9.7
8.0
6.. 5E EEE-nE-h 1.0MHZ :5. 8a.. .30 1 % of OCL vs. °/.oll 483$
3
Technical Data 4407
Effective June 2015
FP0906
High frequency, high current power inductors
www.eaton.com/elx
0
5
10
15
20
25
30
35
40
45
50
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
Temperature Rise (°C)
Total Loss (W)
Temperature rise vs. total loss
Core loss vs Bp-p
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
10000
Core Loss (W)
B
p-p
(Gauss)
1.0MHz
500kHz
300kHz
100kHz
30%
40%
50%
60%
70%
80%
90%
100%
110%
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
120%
130%
140%
% of OCL
% of I
sat
1
% of OCL vs. % of I
sat
1
+125C +85C
+25C
-40C
30%
40%
50%
60%
70%
80%
90%
100%
110%
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
120%
130%
140%
% of OCL
% of I
sat
1
% of OCL vs. % of Isat1
+125C+85C
+25C
-40C
FP0906R1-R22 to R30
FP0906R1-R10 to R18
Inductance characteristics
1E \fl‘h % nme 4.
Eaton
Electronics Division
1000 Eaton Boulevard
Cleveland, OH 44122
United States
www.eaton.com/elx
© 2015 Eaton
All Rights Reserved
Printed in USA
Publication No. 4407 BU-SB14111
June 2015
Eaton is a registered trademark.
All other trademarks are property
of their respective owners.
FP0906
High frequency, high current power inductors
Technical Data 4407
Effective June 2015
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
Temperature
t
tP
ts
TC -5°C
Time 25°C to Peak Time
°C
Tsmin
Tsmax
TL
TP
Preheat
A
Max. Ramp Up Rate = C/s
Max. Ramp Down Rate = C/s
Solder reflow profile
Reference JDEC J-STD-020D
Profile Feature Standard SnPb Solder Lead (Pb) Free Solder
Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C
• Temperature max. (Tsmax) 150°C 200°C
• Time (Tsmin to Tsmax) (ts)60-120 Seconds 60-120 Seconds
Average ramp up rate Tsmax to Tp3°C/ Second Max. 3°C/ Second Max.
Liquidous temperature (Tl)
Time at liquidous (tL)
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)* Table 1 Table 2
Time (tp)** within 5 °C of the specified classification temperature (Tc)20 Seconds** 30 Seconds**
Average ramp-down rate (Tp to Tsmax)6°C/ Second Max. 6°C/ Second Max.
Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350
<2.5mm) 235°C 220°C
2.5mm 220°C 220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
350 - 2000
Volume
mm3
>2000
<1.6mm 260°C 260°C 260°C
1.6 – 2.5mm 260°C 250°C 245°C
>2.5mm 250°C 245°C 245°C

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