CPDU24V0U-HF Datasheet by Comchip Technology

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CPDU24V0U-HF
SMD ESD Protection Diode
Page 1
QW-G7032
REV:B
Features
- Uni-directional ESD protection.
- Surface mount package.
- High component density.
Mechanical data
- Case: 0603/SOD-523F standard package,
molded plastic.
- Terminals: Gold plated, solderable per
MIL-STD-750,method 2026.
- Mounting position: Any.
- Weight: 0.003 grams(approx.).
Comchip Technology CO., LTD.
RoHS Device
Halogen Free
0.071(1.80)
0.063(1.60)
0.018(0.45)
0.039(1.00)
0.031(0.80)
0.033(0.85)
0.027(0.70)
Dimensions in inches and (millimeter)
0603/SOD-523F
0.014(0.35)
0.030(0.75)
0.012(0.30)
0.011(0.28)
0.026(0.65)
Circuit Diagram
Company reserves the right to improve product design , functions and reliability without notice.
Maximum Rating And Electrical Characteristics (at TA=25°C unless otherwise noted)
Symbol Typ
Parameter Min
Max
Unit
Conditions
Forward voltage VFV
IF = 10mA
0.8
Junction capacitance
Diode breakdown voltage VBD V
IR = 1mA
35
CTpF
VR = 0V,f = 1MHz
26.5
Leakage current ILuA
VR = 24V 0.25
Peak pulse power PPP W
150
Operation temperature range TJ125 °C
Clamping voltage VCV
50
Storage temperature range TSTG -55 150 °C
ESD kV
IEC 61000-4-2(air)
IEC 61000-4-2(contact)
20
ESD capability 15
1.2
-55
IPP = 3A,TP=8/20us
IPP = 1A,TP=8/20us 38
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Comchip Technology CO., LTD.
RATING AND CHARACTERISTIC CURVES (CPDU24V0U-HF)
SMD ESD Protection Diode
Page 2
Power Rating (%)
Ambient Temperature, (°C)
Mounting on glass epoxy PCBs
0
20
40
60
80
100
120
25 50 75 100 1500 125
Fig.2 - Power Rating Derating Curve
REV:B
QW-G7032
f=1MHz
TA=25°C
0
10
20
30
40
60
0 4 8 12 24
16
50
Capacitance Between Terminals, (PF)
Reverse Voltage, (V)
Fig.5 - Capacitance Bbetween
Terminals Characteristics
Clamping Voltage, (V)
Fig.3 - Clamping Voltage Vs.
Peak Pulse Current
Peak Pulse Current,(A)
3.5
10
0
30
40
50
60
20
31.5
1
0
8/20us waveform
Voltage, (V)
Fig.4 - Voltage Vs. Clamping Forward
P Currenteak Pulse
Forward Current, (A)Peak Pulse
18
2
1
5
6
3
4
96
3
0
8/20us waveform
0.5 2.5
2
0
12 15
20
t-Time, (us)
Percentage of Ipp
Fig.1 - 8/20us Peak Pulse Current Wave
Form Acc. IEC 61000-4-5
0%
20%
40%
60%
80%
100%
0 5 15 25 3010 20
120%
Ta=25°C Peak Valur Ipp
Test Waveform
parameters
tf=8us
td=20us
e
-t
td= t Ipp/2
Company reserves the right to improve product design , functions and reliability without notice.
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Comchip Technology CO., LTD.
Page 3
SMD ESD Protection Diode
D1
D2
D
W1
T
C
Reel Taping Specification
REV:B
QW-G7032
o
120
Index hole
d
E
F
B W
P
P0
P1
A
Company reserves the right to improve product design , functions and reliability without notice.
B C dD D2
D1
E F P P0P1T
SYMBOL
A
W W1
(mm)
(inch) 0.046 ± 0.004 0.075 ± 0.004 7.008 ± 0.039 2.362 ± 0.020 0.531 0.008
±
SYMBOL
(mm)
(inch) 0.069 ± 0.004 0.138 ± 0.002 0.157 ± 0.004 0.079 ± 0.002 0.315 ± 0.008
1.16 ± 0.10 1.90 ± 0.10
3.50 ± 0.051.75 ± 0.10
60.0 ± 0.50 13.50 ± 0.20
4.00 ± 0.10 2.00 ± 0.05 8.00 ± 0.20
178.00 ± 1.00
0603
(SOD-523)
0603
(SOD-523)
1.50 + 0.10
- 0
0.037 ± 0.004
0.95 ± 0.10
0.059 + 0.004
- 0
12.00 + 0.50
- 0
0.472 + 0.020
- 0
0.22 + 0.10
- 0.05
0.009 + 0.004
- 0.002
0.157 ± 0.004
4.00 ± 0.10
Trailer Device Leader
400mm (min)160mm (min)
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End Start
Direction of Feed
C a
Comchip Technology CO., LTD.
SMD ESD Protection Diode
Page 4
E24
REV:B
Marking Code
QW-G7032
Suggested PAD Layout
SIZE
(inch)
0.067
(mm)
1.70
0.60
0.80
0.024
0.031
0603/SOD-523F
2.30 0.091
E1.10 0.043
A
B
C
D
A
C
B
E
D
Standard Packaging
Case Type
4,000
REEL
( pcs )
Reel Size
(inch)
7
REEL PACK
0603/SOD-523F
Part Number
CPDU24V0U-HF
Marking Code
E24
Company reserves the right to improve product design , functions and reliability without notice.

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