NCL30160 Datasheet by ON Semiconductor

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© Semiconductor Components Industries, LLC, 2012
April, 2019 Rev. 2
1Publication Order Number:
NCL30160/D
NCL30160
1.0A Constant-Current
Buck Regulator for Driving
High Power LEDs
The NCL30160 is an NFET hysteretic stepdown, constantcurrent
driver for high power LEDs. Ideal for industrial and general lighting
applications utilizing minimal external components. The NCL30160
operates with an input voltage range from 6.3 V to 40 V. The hysteretic
control gives good power supply rejection and fast response during
load transients and PWM dimming to LED arrays of varying number
and type. A dedicated PWM input (DIM/EN) enables wide range of
pulsed dimming and a high switching frequency up to 1.4 MHz allows
the use of smaller external components minimizing space and cost.
Protection features include resistorprogrammed constant LED
current, shorted LED protection, undervoltage and thermal
shutdown. The NCL30160 is available in a SOIC8 package.
Features
Integrated 1.0A MOSFET
VIN Range 6.3 V to 40 V
Short LED Shutdown Protection
Up to 1.4 MHz Switching Frequency
No Control Loop Compensation Required
Adjustable LED Current
Single Pin Brightness and Enable/Disable Control Using PWM
Supports AllCeramic Output Capacitors and Capacitorless Outputs
Thermal Shutdown Protection
Capable of 100% Duty Cycle Operation
This is a PbFree Device
Typical Application
LED Driver
Constant Current Source
General Illumination
Industrial Lighting
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Device Package Shipping
ORDERING INFORMATION
NCL30160DR2G SOIC8
(PbFree)
2500 / Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SOIC8 NB
CASE 751
MARKING DIAGRAM
30160
ALYWX
G
1
8
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G= PbFree Package
1
8
PIN CONNECTIONS
CS
CS
GND
VCC
LX
VIN
ROT
DIM/ENABLE
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Figure 1. Typical Application Circuit
D1
NCL30160
ROT
CIN
VIN
VIN
VCC
CS
LX
L1
CVCC
RSENSE
GND
ROT
DIM/Enable
LED LED
PIN FUNCTION DESCRIPTION
Pin Pin Name Description Application Information
1, 2 CS Current Sense feedback pin Set the current through the LED array by connecting a resistor from this pin to
ground.
3 GND Ground Pin Ground. Reference point for all voltages
4 VCC Output of Internal 5 V linear
regulator
The VCC pin supplies the power to the internal circuitry. The VCC is the
output of a linear regulator which is powered from VIN. A 2 uF ceramic
capacitor is recommended for bypassing and should be placed as close as
possible to the VCC and AGND pins. Do not connect to an external load.
5 ROT OffTime Setting Resistor Resistor ROT from this pin to VCC sets the OffTime range for the hysteretic
controller.
6 DIM/EN PWM Dimming Control &
ENABLE
Connect a logiclevel PWM signal to this pin to enable/disable the power
MOSFET and LED array
7 VIN Input Voltage Pin Nominal operating input range is 6.3 V to 40 V. Input supply pin to the internal
circuitry and the positive input to the current sense comparators. Due high
frequency noise, a 10 mF ceramic capacitor is recommended to be placed as
close as possible to VIN and power ground.
8 LX Drain of Internal Power
MOSFET
The LX pin connects to the inductor and provides the switching current
necessary to operate in hysteretic mode.
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MAXIMUM RATINGS
Rating Symbol Min Max Unit
VIN to GND VIN 0.3 40 V
MOSFET Drain Voltage to GND LX 40 V
VCC to GND VCC 6 V
DIM/EN to GND DIM 0.3 6 V
CS to GND CS 0.3 6 V
ROT to GND ROT 0.3 6 V
Absolute Maximum Junction Temperature TJ(MAX) 150 °C
Operating Junction Temperature Range TJ40 125 °C
Maximum LED Drive Current ILIM 1.5 A
Storage Temperature Range Tstg 55 to +125 °C
Thermal Characteristics
SOIC8 Plastic Package
Maximum Power Dissipation @ TA = 25°C (Note 1)
Thermal Resistance JunctiontoAir (Note 2)
PD
RqJA
1.11
111.7
W
°C/W
Lead Temperature Soldering (10 sec):
Reflow (SMD styles only) PbFree (Note 3)
TL260 peak °C
Moisture Sensitivity Level (Note 4) MSL 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The maximum package power dissipation limit must not be exceeded.
PD+
TJ(max) *TA
RqJA
2. When mounted on a multilayer board with 35 mm2 copper area, using 1 oz Cu.
3. 60180 seconds minimum above 237°C.
4. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: JSTD020A.
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ELECTRICAL CHARACTERISTICS (Unless otherwise noted: VIN = 12 V, TA = 25°C, unless otherwise specified.)
Symbol Characteristics Min Typ Max Unit
SYSTEM PARAMETERS
VIN Input Supply Voltage Range Normal Operation 8.0 40 V
Functional (Note 5) 6.3
IQ_IN Quiescent Current into VIN 1.5 mA
VCC Internal Regulator Output (Note 6) 5.0 V
VUV+ UnderVoltage Lockout Threshold
(VIN Rising)
5.5 6.0 6.5 V
VUVUnderVoltage Lockout Threshold
(VIN Falling)
5.2 5.6 6.3 V
CURRENT LIMIT AND REGULATION
VCS_UL CS Regulation Upper Limit
(CS Increasing, FET TurnsOFF)
25°C 213 220 226 mV
40 to 125°C 209 231
VCS_LL CS Regulation Lower Limit
(CS Decreasing, FET TurnsON)
25°C 174 180 186 mV
40 to 125°C 171 189
VOCP Over Current Protect Limit
(Reference to CS Pin)
500 mV
FSW Switching Frequency Range (Note 7) 1400 kHz
DIM INPUT
VPWMH/L PWM (DIM/EN) high level input voltage 1.4 V
VPWML PWM (DIM/EN) low level input voltage 0.4 V
IDIMPU DIM/EN Pullup Current 50 mA
fpwm PWM (DIM/EN) dimming frequency range 0.1 20 kHz
dmax Maximum Duty Cycle (Note 7) 100 %
POWER MOSFET
VBRDSS DraintoSource Breakdown Voltage 40 V
IDSS DraintoSource Leakage Current
(VGS = 0 V, VDS = 40 V)
10 mA
RDS(on) On Resistance
(Id = 500 mA)
55 mW
VSD SourceDrain Body Diode
(Forward OnVoltage)
0.8 1.1 V
tPD_Off Propagation Delay VCS_UL LX_High 35 ns
THERMAL SHUTDOWN
TSD Thermal Shutdown 165 °C
THyst Thermal Hysteresis 40 °C
OFF TIMER
tOFFMIN Minimum Offtime 137 ns
5. The functional range of VIN is the voltage range over which the device will function. Output current and internal parameters may deviate from
normal values for VIN and VCC voltages between 6.3 V and 8 V, depending on load conditions
6. VCC should not be driven from a voltage higher than VIN or in the absence of a voltage at VIN.
7. Guaranteed by design.
NCL30160
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Figure 2. Simplified Block Diagram
S
RQ
Q
Timer (toff)
&
Thermal
Shutdown
5 V Regulator
(6.3 V to 40 Vmax)
Peak Current
Comparator
Valley Current
Comparator
220 mV
180 mV
Gate Driver
LX
CS
VIN
VCC
ROT
500 mV
Short Circuit Protection
Comparator
DIM / Enable
VCC
GND
Enable PullUp
Resistor
TYPICAL APPLICATION CIRCUITS AND WAVEFORMS
(TJ = 25°C, Unless Otherwise Specified)
Figure 3. Typical Application Circuit To Drive One LED (Buck)
PWM
D1
NCL30160
ROT
CIN
VIN
VIN
VCC
CS
LX
LED
L1
CVCC
RSENSE
GND
ROT
DIM/Enable
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Figure 4. Typical Operation Waveforms
(VCC = 12 V, VLED = 6.5 V, RSENSE = 0.68 W, L = 100 mH)
THEORY OF OPERATION
This switching power supply is comprised of an inverted
buck regulator controlled by a current mode, hysteretic
control circuit. The buck regulator operates exactly like a
conventional buck regulator except the power device
placement has been inverted to allow for a low side power
FET. Referring to Figure 1, when the FET is conducting,
current flows from the input,through the inductor, the LED
and the FET to ground.
When the FET shuts off, current continues to flow through
the inductor and LED, but is diverted through the diode
(D1). This operation keeps the current in the LED
continuous with a continuous current ramp.
The control circuit controls the current hysteretically.
Figure 2 illustrates the operation of this circuit. The CS
comparator thresholds are set to provide a 10% current
ripple. The peak current comparator threshold of 220 mV
sets Ipeak at 10% above the average current while the valley
current comparator threshold of 180 mV sets Ivalley at 10%
below the average current.
When the FET is conducting, the current in the inductor
ramps up. This current is sensed by an external sense resistor
that is connected from CS to ground. When the CS pin
reaches 220 mV, the peak current comparator turns off the
power FET. A conventional hysteretic controller would
monitor the load current and turn the switch back on when
the CS pin reaches 180 mV. But in this topology, the current
information is not available to the control circuit when the
FET is off. To set the proper FET off time, the CS voltage is
sensed when the FET is turned back on and a correction
signal is sent to the off time circuit to adjust the off time as
necessary.
Figure 5. Typical Current Waveforms
The current waveshape is triangular, and the peak and
valley currents are controlled. The average value for a
triangular waveshape is halfway between the peak and
valley, so even with changes in duty cycle due to input
voltage variations or load changes, the average current will
remain constant.
In the event there is a shortcircuit across the LEDs, a
large amount of current could potentially flow through the
circuit during startup. To protect against this, the NCL30160
comes with a short circuit protection feature. If the voltage
on the CS pin is detected to be greater than 500 mV
(equating to 2.5 times the intended average output current),
the NCL31060 will turn off the FET, and prevent the FET
from turning on again until power is recycled to NCL30160.
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NCL30160
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Figure 6. Short-Circuit Protection
When VIN rises above the UVLO threshold voltage,
switching operation of the FET will begin. However, until
the VIN voltage reaches 8 V, the VCC regulator may not
provide the expected gate drive voltage to the FET. This
could result in the RDS(on) of the FET being higher than
expected or there not being enough gate drive capability to
operate at the maximum rated switching frequency. For
optimal performance, it is recommended to operate the part
at a VIN voltage of 8 V or greater.
Setting The Output Current
The average output current is determined as being the
middle of the peak and valley of the output current, set by the
CS comparator thresholds. The nominal average output
current will be the current value equivalent to 200 mV at the
CS pin. The proper RSENSE value for a desired average
output current can be calculated by:
RSENSE +
200 mV
ILED
PWM Dimming
For a given RSENSE value, the average output current, and
therefore the brightness of the LED, can be set to a lower
value through the DIM/EN pin. When the DIM/EN pin is
brought low, the internal FET will turn off and switching
will remain off until the DIM/EN pin is brought back into its
high state.
Figure 7. Dimming Waveforms
By applying a pulsed signal to DIM/EN, the average
output current can be adjusted to the duty ratio of the pulsed
signal. It is recommended to keep the frequency of the
DIM/EN signal above 100 Hz to avoid any visible flickering
of the LED.
Figure 8. Dimming Performance
Inductor Selection
The inductor that is used directly affects the switching
frequency the driver operates at. The value of the inductor
sets the slope at which the output current rises and falls
during the switching operation. The slope of the current, in
turn, determines how long it takes the current to go from the
valley point of the current ripple to the peak when the FET
is on and the current and rising, and how long it takes the
current to go from the peak point of the current to the valley
when the FET is off and the current is falling. These times
can be approximated from the following equations:
+L DI
VIN *VLED *IOUT ǒFETRDS
(on) )DCRL)RSENSEǓ
tON
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tOFF +L DI
VLED )Vdiode )IOUT DCRL
Where DCRL is the dc resistance of the inductor, VLED is
the forward voltages of the LEDs, FETRDS(ON) is the
on-resistance of the power MOSFET, and Vdiode is the
forward voltage of the catch diode.
The switching frequency can then be approximated from
the following:
fSW +1
tON )tOFF
Higher values of inductance lead to slower rates of rise
and fall of the output current. This allows for smaller
discrepancies between the expected and actual output
current ripple due to propagation delays between sensing at
the CS pin and the turning on and off of the power MOSFET.
However, the inductor value should be chosen such that the
peak output current value does not exceed the rated
saturation current of the inductor.
Catch Diode Selection
The catch diode needs to be selected such that average
current through the diode does not exceed the rated average
forward current of the diode. The average current through
the diode can be calculated as:
Iavg_diode +IOUT
tOFF
tON )tOFF
It is also important to select a diode that is capable of
withstanding the peak reverse voltage it will see in the
application. It is recommended to select a diode with a rated
reverse voltage greater than VIN. It is also recommended to
use a low-capacitance Schottky diode for better efficiency
performance.
Selecting The Off-Time Setting Resistor
The off-time setting resistor (ROT) programs the
NCL30160 with the initial time duration that the MOSFET
is turned off when the switching operation begins. During
subsequent switching cycles, the voltage at the CS pin is
sensed every time the MOSFET is turned on, and the
off-time will be adjusted depending on how much of a
discrepancy exists between the sensed value and the CS
lower limit threshold value. The ROT value can be calculated
using the following equation:
ROT +tOFF 1011 W
Where tOFF is the expected off time during normal
switching operation, calculated in the Inductor Selection
section above.
Input Capacitor
A decoupling capacitor from VIN to ground should be
used to provide the current needed when the power
MOSFET turns on. A 4.7 mF ceramic capacitor is
recommended.
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Figure 9. Efficiency, 350 mA, Vf_LED = 3.5 V Figure 10. Efficiency, 700 mA, Vf_LED = 3.5 V
Figure 11. Efficiency, 1 A, Vf_LED = 3.5 V Figure 12. IQIN vs. VIN
Figure 13. LED Current vs. Dimming Duty
Ratio
100
95
90
85
80
75
70
65
60
0 5 10 15 20 25 30 35 40
VIN (V)
EFFICIENCY (%)
100
95
90
85
80
75
70
65
60
0 5 10 15 20 25 30 35 40
VIN (V)
EFFICIENCY (%)
100
95
90
85
80
75
70
65
60
0 5 10 15 20 25 30 35 40
VIN (V)
EFFICIENCY (%)
1.70
1.65
1.60
1.55
1.50
1.45
1.40
1.35
1.30
5 10 15202530 3540
VIN (V)
IQIN (mA)
DIMMING DUTY RATIO (%)
LED CURRENT (mA)
020406080100
700
600
500
400
300
200
100
100 Hz
10 kHz
40 20 0 20 40 60 80 100 120
240
220
200
180
160
140
120
100100
SWITCHING FREQUENCY (kHz)
Figure 14. Switching Frequency vs.
Temperature (12 V VIN, 3 LEDs, 0.7 A, 0.47 mH)
TEMPERATURE (°C)
H’H’H’H
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PACKAGE DIMENSIONS
SOIC8 NB
CASE 75107
ISSUE AK
SEATING
PLANE
1
4
58
N
J
X 45 _
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 75101 THRU 75106 ARE OBSOLETE. NEW
STANDARD IS 75107.
A
BS
D
H
C
0.10 (0.004)
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B3.80 4.00 0.150 0.157
C1.35 1.75 0.053 0.069
D0.33 0.51 0.013 0.020
G1.27 BSC 0.050 BSC
H0.10 0.25 0.004 0.010
J0.19 0.25 0.007 0.010
K0.40 1.27 0.016 0.050
M0 8 0 8
N0.25 0.50 0.010 0.020
S5.80 6.20 0.228 0.244
X
Y
G
M
Y
M
0.25 (0.010)
Z
Y
M
0.25 (0.010) ZSXS
M
____
1.52
0.060
7.0
0.275
0.6
0.024
1.270
0.050
4.0
0.155
ǒmm
inchesǓ
SCALE 6:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
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