MMSD914T(1,3) Datasheet by ON Semiconductor

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© Semiconductor Components Industries, LLC, 2012
November, 2012 Rev. 11
1Publication Order Number:
MMSD914T1/D
MMSD914, SMMSD914
Switching Diode, High
Speed, 100 V
Features
SOD123 Surface Mount Package
High Breakdown Voltage
Fast Speed Switching Time
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECQ101 Qualified and
PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
Continuous Reverse Voltage VR100 Vdc
Peak Forward Current IF200 mAdc
Peak Forward Surge Current IFM(surge) 500 mAdc
Nonrepetitive Peak
Forward Surge Current
Pulse Width =1 second
Pulse Width =1 micro second
IFSM
1.0
2.0
A
A
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation FR5 Board
(Note 1)
TA = 25°C
Derate above 25°C
PD425
3.4
mW
mW/°C
Thermal Resistance,
JunctiontoAmbient
RqJA
290
°C/W
Junction and Storage Temperature Range TJ, Tstg 55 to
+150
°C
1. FR5 = 1.0oz Cu, 1.0inz pad
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
http://onsemi.com
SOD123
CASE 425
PLASTIC
1
CATHODE
2
ANODE
Device Package Shipping
ORDERING INFORMATION
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MMSD914T1G SOD123
(PbFree)
3,000 / Tape & Reel
MMSD914T3G SOD123
(PbFree)
10,000 / Tape & Reel
MARKING DIAGRAM
5D M G
G
5D = Specific Device Code
M = Date Code
G= PbFree Package
(Note: Microdot may be in either location)
12
SMMSD914T1G SOD123
(PbFree)
3,000 / Tape & Reel
SMMSD914T3G SOD123
(PbFree)
10,000 / Tape & Reel
MMSD914, SMMSD914
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Reverse Breakdown Voltage (IBR = 100 mAdc) V(BR) 100 Vdc
Reverse Voltage Leakage Current
(VR = 20 Vdc)
(VR = 75 Vdc)
IR
25
5.0
nAdc
mAdc
Forward Voltage (IF = 10 mAdc) VF1000 mVdc
Diode Capacitance (VR = 0 Vdc, f = 1.0 MHz) CD4.0 pF
Reverse Recovery Time (IF = IR = 10 mAdc) (Figure 1) trr 4.0 ns
Notes: 1. A 2.0 kW variable resistor adjusted for a Forward Current (IF) of 10 mA.
Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
Notes: 3. tp » trr
+10 V 2 k
820 W
0.1 mF
DUT
VR
100 mH
0.1 mF
50 W OUTPUT
PULSE
GENERATOR
50 W INPUT
SAMPLING
OSCILLOSCOPE
trtpt
10%
90%
IF
IR
trr t
iR(REC) = 1 mA
OUTPUT PULSE
(IF = IR = 10 mA; measured
at iR(REC) = 1 mA)
IF
INPUT SIGNAL
Figure 1. Recovery Time Equivalent Test Circuit
\ /
MMSD914, SMMSD914
http://onsemi.com
3
IR, REVERSE CURRENT (A)μ
100
0.2 0.4
VF, FORWARD VOLTAGE (VOLTS)
0.6 0.8 1.0 1.2
10
1.0
0.1
TA = 85°C
10
0
VR, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001 10 20 30 40 50
0.68
0
VR, REVERSE VOLTAGE (VOLTS)
0.64
0.60
0.56
0.52
CD, DIODE CAPACITANCE (pF)
246 8
IF, FORWARD CURRENT (mA)
TA = 25°C
TA = -40°C
TA = 150°C
TA = 125°C
TA = 85°C
TA = 55°C
TA = 25°C
Figure 2. Forward Voltage Figure 3. Leakage Current
Figure 4. Capacitance
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SOD123
CASE 42504
ISSUE G
DATE 07 OCT 2009
SCALE 5:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
b
DA
L
C
1
2
A1
DIM MIN NOM MAX
MILLIMETERS INCHES
A0.94 1.17 1.35 0.037
A1 0.00 0.05 0.10 0.000
b0.51 0.61 0.71 0.020
c
1.60
0.15
0.055D1.40 1.80
E2.54 2.69 2.84 0.100
---
3.68 0.140
L0.25
3.86
0.010
HE
0.046
0.002
0.024
0.063
0.106
0.145
0.053
0.004
0.028
0.071
0.112
0.152
MIN NOM MAX
3.56
HE
---
--- ---
0.006
--- ---
--- ---
GENERIC
MARKING DIAGRAM*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
*This information is generic. Please refer to device data
sheet for actual part marking. PbFree indicator, “G” or
microdot “ G”, may or may not be present.
XXX = Specific Device Code
M = Date Code
G= PbFree Package
XXXMG
G
1
STYLE 1:
PIN 1. CATHODE
2. ANODE
1.22
0.048
0.91
0.036
2.36
0.093
4.19
0.165
ǒmm
inchesǓ
SCALE 10:1
q
--- ---
q00
10 10
°°° °
(Note: Microdot may be in either location)
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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SOD123
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www.onsemi.com
1
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