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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
35
In Stock
1 : ¥1,772.00000
Bulk
-
Bulk
ActiveSMD to DIP------
9
In Stock
1 : ¥3,545.00000
Box
-
Box
ActiveSMD to DIPDPW-5, DCN-8, DDF-8, DSG-8, RUG-10, RUC-14, RGY-14, RTE-1616----
DIP-ADAPTER-EVM
DIP-ADAPTER-EVM
MODULE EVAL DIP ADAPTER
Texas Instruments
91
In Stock
1 : ¥1,772.00000
Box
-
Box
ActiveSMD to Plated Through HoleMSOP, SC70, SOIC, SOT23, SOT563, TSSOP6----
21
In Stock
1 : ¥1,772.00000
Bulk
-
Bulk
ActiveSMD to DIP------
19
In Stock
1 : ¥1,772.00000
Box
-
Box
ActiveSMD to Plated Through HoleSC-70, SOT-23, SOT-583, SSOP, VSSOP8----
3
In Stock
1 : ¥1,772.00000
Box
-
Box
ActiveSMD to DIPQFN16----
14-24-LOGIC-EVM
14-24-LOGIC-EVM
DEVELOPMENT SPECIALIZED
Texas Instruments
0
In Stock
1 : ¥1,772.00000
Box
-
Box
ActiveSMD to Plated Through HoleSOIC, TSSOP-----
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Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.