HF115TAAC-54, 58
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HF115TAAC-54, 58
TO-220_58

HF115AC-0.0055-AC-58

Digi-Key Part Number
BER168-ND
Manufacturer
Manufacturer Product Number
HF115AC-0.0055-AC-58
Description
THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time
10 Weeks
Detailed Description
Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Customer Reference
Datasheet Datasheet
Product Attributes
Type
Description
Select
Category
Mfr
Bergquist
Series
Package
Bulk
Part Status
Active
Usage
TO-220
Type
Pad, Sheet
Shape
Rectangular
Outline
19.05mm x 12.70mm
Thickness
0.0055" (0.140mm)
Material
Phase Change Compound
Adhesive
Adhesive - One Side
Backing, Carrier
Fiberglass
Color
Gray
Thermal Resistivity
0.35°C/W
Thermal Conductivity
0.8W/m-K
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
-
Base Product Number
Environmental & Export Classifications
AttributeDescription
RoHS StatusROHS3 Compliant
Moisture Sensitivity Level (MSL)1 (Unlimited)
ECCNEAR99
HTSUS3919.90.5060
All prices are in JPY
Bulk
QtyUnit PriceExt Price
1¥107.00000¥107
10¥95.30000¥953
50¥85.44000¥4,272
100¥75.57000¥7,557
500¥65.71200¥32,856
1,000¥49.28400¥49,284
5,000¥42.71220¥213,561
Additional Resources
AttributeDescription
Other Names
HF115TAAC-58
BER168
HF115AC-58
2191182
HF115-0.0055-AC-58
BG426642
HF115AC00055AC58
Standard Package100