Tputty™ 502 Series

Gap filler material from Laird Thermal

Tputty™ 502 Series Laird Thermal's Tputty 502 series is the best material for applications where large tolerance differences create the need for compression of interface material beyond 50 percent of its original thickness. Tputty 502 flows to ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, Tputty 502 has a high thermal conductivity that results in very low thermal resistance. Tputty 502 is naturally tacky and requires no further adhesive coating, which would inhibit thermal performance. Tputty 502 has a hardness of 5 (Shore OO), is electrically insulating, and is stable from -45°C to +200°C.

  • Soft and ultra high compressibility for low stress applications
  • 3 W/mK thermal conductivity
  • Available in sheets 0.020" to 0.200" (0.5 mm to 5.0 mm) thick and in bulk
  • Naturally tacky needing no further adhesive coating
  • Cooling components to the chassis or frame
  • Entire large panel PCB cooling
  • Semiconductor automated test equipment (ATE)
  • Any high compression low stress application

Tputty 502 Series

ImageManufacturer Part NumberDescriptionUsageTypeShapeAvailable Quantity
THERM PAD 228.6MMX228.6MM WHITEA10233-30THERM PAD 228.6MMX228.6MM WHITE-SheetSquare78 - ImmediateView Details
THERM PAD 228.6MMX228.6MM WHITEA10235-31THERM PAD 228.6MMX228.6MM WHITE-SheetSquare99 - ImmediateView Details
THERM PAD 228.6MMX228.6MM WHITEA10237-21THERM PAD 228.6MMX228.6MM WHITE-SheetSquare47 - ImmediateView Details
THERM PAD 228.6MMX228.6MM WHITEA10241-09THERM PAD 228.6MMX228.6MM WHITE-SheetSquare24 - ImmediateView Details
Published: 2012-06-29