STTH102 Datasheet by STMicroelectronics

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SMA
A
K
K
A
DO-41
K
A
Features
Very low conduction losses
Negligible switching losses
Low forward voltage drop
High junction temperature
ECOPACK®2 compliant
Applications
Switching diode
LED Lighting
Auxiliary power supply
Flyback diode
Description
The STTH102 uses ST's new 200 V planar Pt doping technology, and it is specially
suited for switching mode base drive and transistor circuits.
Packaged in SMA and DO-41, the STTH102 is ideal for use as a free wheeling diode
in power supplies and other power switching applications.
Product status
STTH102
Product summary
Symbol Value
IF(AV) 1 A
VRRM 200 V
T j(max.) 175 °C
VF(typ.) 0.68 V
trr(typ.) 12 ns
200 V - 1 A high efficiency ultrafast diode
STTH102
Datasheet
DS2448 - Rev 6 - December 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 200 V
IF(AV) Average forward current δ = 0.5, square wave
SMA TL = 145 °C
1 A
DO-41 TL = 130 °C
IFSM Surge non repetitive forward current
SMA tp = 10 ms sinusoidal 40
A
DO-41 50
Tstg Storage temperature range -65 to +175 °C
TjOperating junction temperature +175 °C
Table 2. Thermal resistance parameter
Symbol Parameter Max. value Unit
Rth(j-l)
Junction to lead SMA 30
°C/W
Junction to lead Lead length = 10 mm DO-41 50
For more information, please refer to the following application note :
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ. Max. Unit
IR(1) Reverse leakage current
Tj = 25 °C
VR = VRRM
- 1
µA
Tj = 125 °C - 1 25
VF(2) Forward voltage drop
Tj = 25 °C
IF = 1 A
- 0.97
V
Tj = 125 °C - 0.68 0.78
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.65 x IF(AV) + 0.130 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
AN604: Calculation of conduction losses in a power rectifier
AN4021: Calculation of reverse losses on a power diode
STTH102
Characteristics
DS2448 - Rev 6 page 2/12
Table 4. Dynamic characteristics (Tj = 25 °C unless otherwise stated)
Symbol Parameters Test conditions Min. Typ. Max. Unit
trr Reverse recovery time IF = 0.5 A, Irr = 0.25 A, IR = 1 A - 12 20 ns
tfr Forward recovery time IF = 1 A, dIF/dt = 50 A/ms, VFR = 1.1 VF(max.) - 50 ns
VFP Forward recovery voltage IF = 1 A, dIF/dt = 50 A/µs - 1.8 V
STTH102
Characteristics
DS2448 - Rev 6 page 3/12
1.1 Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current (SMA)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2
P (W)
F(AV)
I (A)
F(AV)
T
δ=tp/T tp
δ = 1
δ = 0.5
δ = 0.05 δ = 0.1 δ = 0.2
Figure 2. Average forward power dissipation versus
average forward current (DO-41)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.00 0.25 0.50 0.75 1.00 1.25
P (W)
F(AV)
I (A)
F(AV)
T
δ=tp/T tp
δ = 1
δ = 0.5
δ = 0.05 δ = 0.1 δ = 0.2
Figure 3. Average forward current versus ambient
temperature (δ = 0.5) (SMA)
I (A)
F(AV)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 7 5 100 125 150 175
R =120°C/W
th(j-a)
R =R
th(j-a) t h(j-I)
T
d=tp/T tp T (°C)
amb
Figure 4. (DO-41)Average forward current versus ambient
temperature (δ = 0.5) (DO-41)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 7 5 100 125 150 175
I (A)
F(AV)
R =110°C/W
th(j-a)
R =R
th(j-a) t h(j-I)
T
d=tp/T tp T (°C)
amb
STTH102
Characteristics (curves)
DS2448 - Rev 6 page 4/12
Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (epoxy printed circuit
board, e(Cu) = 35 μm,recommended pad layout) (SMA)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z /R
th(j-a) th(j-a)
t (s)
p
Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (DO-41)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Single pulse
Z /R
th (j-c) t h(j-c)
t ( s )
p
Figure 7. Forward voltage drop versus forward current
0.1
1.0
10.0
100.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
I (A)
F
V ( V)
F
T =125°C
(maximum values)
j
T =125°C
(typical values)
j
T =25°C
(maximum values)
j
Figure 8. Junction capacitance versus reverse voltage
applied (typical values)
1
10
100
1 1 0 100 1000
C (pF)
F=1MHz
V =30mV
T =25°C
OSC RMS
j
V (V)
R
Figure 9. Relative variations of dynamic parameters
versus junction temperature
1.0
1.5
2.0
2.5
3.0
3.5
25 50 75 100 125 150 175
I ; t ; Q [T ] /
R M rr rr j I ; t ; Q [T =25°C ]
R M rr rr j
T (°C)
j
IRM
trr
QRR
I =I
dI /dt=200A/µs
F F(AV)
F
V =100V
R
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (typical values)
Rth(j-a)(°C/W)
0
50
100
150
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMA
SCu (cm²)
Epoxy printed board FR4, eCu = 35 µm
STTH102
Characteristics (curves)
DS2448 - Rev 6 page 5/12
Figure 11. Thermal resistance versus lead length (DO-41)
Rth(°C/W)
0
20
40
60
80
100
120
5 10 15 25
Lleads(mm)
Rth(j-I)
Rth(j-a)
20
STTH102
Characteristics (curves)
DS2448 - Rev 6 page 6/12
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1 DO-41 package information
Epoxy meets UL 94, V0
Figure 12. DO-41 package outline
ØB
ØD
AC C
Table 5. DO-41 package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Typ. Max. Min. Typ. Max.
A 4.07 - 5.20 0.160 - 0.205
B 2.04 - 2.71 0.080 - 0.107
C 25.40 - 1.000 -
D 0.71 - 0.86 0.028 - 0.0034
STTH102
Package information
DS2448 - Rev 6 page 7/12
2.2 SMA package information
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 13. SMA package outline
E1
E
D
C
L
A1
A2
b
Table 6. SMA package mechanical data
Ref.
Dimensions
Millimeters Inches (for reference only)
Min. Max. Min. Max.
A1 1.90 2.45 0.074 0.097
A2 0.05 0.20 0.001 0.008
b 1.25 1.65 0.049 0.065
c 0.15 0.40 0.005 0.016
D 2.25 2.90 0.088 0.115
E 4.80 5.35 0.188 0.211
E1 3.95 4.60 0.155 0.182
L 0.75 1.50 0.029 0.060
STTH102
SMA package information
DS2448 - Rev 6 page 8/12
Figure 14. SMA recommended footprint in mm (inches)
2.63
(0.104)
5.43
(0.214)
1.4
1.64
(0.065)
1.4
)550.0()550.0(
STTH102
SMA package information
DS2448 - Rev 6 page 9/12
3Ordering information
Table 7. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
STTH102A U12 SMA 0.068 g 5000 Tape and reel
STTH102 STTH102 DO-41 0.34 g 2000 Ammopack
STTH102RL STTH102 DO-41 0.34 g 5000 Tape and reel
STTH102
Ordering information
DS2448 - Rev 6 page 10/12
Revision history
Table 8. Document revision history
Date Revision Changes
Jul-2003 2A Last update.
Aug-2004 3 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm
(0.080). SMA and DO-41 datasheets merged.
27-Jun-2005 4 Corrected error in title.
21-Nov-2006 5 Reformatted to current standards. Added Table 4. Dynamic electrical characteristics. Updated
dimensions table for DO-41 plastic package. Added cathode bands to package illustrations.
05-Dec-2018 6 Add electrical schematics of single diode and ECOPACK®2 compliant.
STTH102
DS2448 - Rev 6 page 11/12
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2018 STMicroelectronics – All rights reserved
STTH102
DS2448 - Rev 6 page 12/12

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