MC74VHC1G126, MC74VHC1GT126 Datasheet by onsemi

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© Semiconductor Components Industries, LLC, 2011
November, 2018 Rev. 19
1Publication Order Number:
MC74VHC1G126/D
MC74VHC1G126,
MC74VHC1GT126
Noninverting 3-State Buffer
The MC74VHC1G126 / MC74VHC1GT126 is a single gate
noninverting 3state buffer in tiny footprint packages. The
MC74VHC1G126 has CMOSlevel input thresholds while the
MC74VHC1GT126 has TTLlevel input thresholds.
The internal circuit is composed of three stages, including a buffered
3state output which provides high noise immunity and stable output.
The input structures provide protection when voltages up to 5.5 V
are applied, regardless of the supply voltage. This allows the device to
be used to interface 5 V circuits to 3 V circuits. The output structures
also provide protection when VCC = 0 V and when the output voltage
exceeds VCC. These input and output structures help prevent device
destruction caused by supply voltage input/output voltage mismatch,
battery backup, hot insertion, etc.
Features
Designed for 2.0 V to 5.5 V VCC Operation
3.5 ns tPD at 5 V (typ)
Inputs/Outputs OverVoltage Tolerant up to 5.5 V
IOFF Supports Partial Power Down Protection
Source/Sink 8 mA at 3.0 V
Available in SC88A, SC74A, TSOP5, SOT553, SOT953 and
UDFN6 Packages
Chip Complexity < 100 FETs
NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECQ100
Qualified and PPAP Capable
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
AY
EN
OE
Figure 1. Logic Symbol
See detailed ordering, marking and shipping information in the
package dimensions section on page 8 of this data sheet.
ORDERING INFORMATION
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SC88A
DF SUFFIX
CASE 419A
SOT553
XV5 SUFFIX
CASE 463B
XX MG
G
XX = Specific Device Code
M = Date Code*
G= PbFree Package
XX MG
G
1
5
XX MG
G
TSOP5
DT SUFFIX
CASE 483
1
5
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
UDFN6
1.0 x 1.0
CASE 517BX
X M
1
SOT953
P5 SUFFIX
CASE 527AE
X M
1
XXX MG
G
SC74A
DBV SUFFIX
CASE 318BQ
XM
UDFN6
1.45 x 1.0
CASE 517AQ
1
MARKING
DIAGRAMS
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Figure 2. Pinout (Top View)
VCC
OE
A
Y
GND
1
2
34
5
(SC88A/SOT553/
TSOP5/ SC74A)
VCC
OE
A
Y
GND
1
2
3
5
4
SOT953
VCC
OE
A
YGND
1
2
3
5
4
6
NC
UDFN6
PIN ASSIGNMENT
(SC88A/SOT553/ TSOP5/SC74A)
Pin
1
2
3
4
5
Function
OE
A
GND
Y
VCC
Input
FUNCTION TABLE
OE
H
H
L
Output
Y
L
H
Z
A
L
H
X
PIN ASSIGNMENT (SOT953)
Pin
1
2
3
4
5
Function
A
GND
OE
Y
VCC
X = Don’t Care
PIN ASSIGNMENT (UDFN)
Pin
1
2
3
4
5
Function
OE
A
GND
Y
NC
6V
CC
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3
MAXIMUM RATINGS
Symbol Characteristics Value Unit
VCC DC Supply Voltage TSOP5, SC88A (NLV)
SC74A, SC88A, UDFN6, SOT553, SOT953
0.5 to +7.0
0.5 to +6.5
V
VIN DC Input Voltage TSOP5, SC88A (NLV)
SC74A, SC88A, UDFN6, SOT553, SOT953
0.5 to +7.0
0.5 to +6.5
V
VOUT DC Output Voltage ActiveMode (High or Low State)
TSOP5, SC88A (NLV) TriState Mode (Note 1)
PowerDown Mode (VCC = 0 V)
0.5 to VCC + 0.5
0.5 to +7.0
0.5 to +7.0
V
DC Output Voltage ActiveMode (High or Low State)
SC74A, SC88A, UDFN6, SOT553, SOT953 TriState Mode (Note 1)
PowerDown Mode (VCC = 0 V)
0.5 to VCC + 0.5
0.5 to +6.5
0.5 to +6.5
V
IIK DC Input Diode Current VIN < GND 20 mA
IOK DC Output Diode Current VOUT < GND ±20 mA
IOUT DC Output Source/Sink Current ±25 mA
ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±50 mA
TSTG Storage Temperature Range 65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 secs 260 °C
TJJunction Temperature Under Bias +150 °C
qJA Thermal Resistance (Note 2) SC88A
SC74A
TSOP5
SOT553
SOT953
UDFN6
659
555
555
562
560
382
°C/W
PDPower Dissipation in Still Air SC88A
SC74A
TSOP5
SOT553
SOT953
UDFN6
190
225
225
222
223
327
mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
VESD ESD Withstand Voltage (Note 3) Human Body Model
Charged Device Model
2000
1000
V
ILatchup Latchup Performance (Note 4) $100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tristated.
2. Measured with minimum pad spacing on an FR4 board, using 10mmby1inch, 2 ounce copper trace no air flow.
3. HBM tested to ANSI/ESDA/JEDEC JS0012017. CDM tested to EIA/JESD22C101F. JEDEC recommends that ESD qualification to
EIA/JESD22A115A (Machine Model) be discontinued per JEDEC/JEP172A.
4. Tested to EIA/JESD78 Class II.
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RECOMMENDED OPERATING CONDITIONS
Symbol Characteristics Min Max Unit
VCC Positive DC Supply Voltage 2.0 5.5 V
VIN DC Input Voltage 0 5.5 V
VOUT DC Output Voltage TSOP5, SC88A (NLV) 0 VCC V
DC Output Voltage SC74A, SC88A, UDFN6, SOT553, SOT953
ActiveMode (High or Low State)
TriState Mode (Note 1)
PowerDown Mode (VCC = 0 V)
0
0
0
VCC
5.5
5.5
TAOperating Temperature Range 55 +125 °C
tr , tfInput Rise and Fall Time TSOP5, SC88A (NLV)
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
100
20
ns/V
Input Rise and Fall Time SC74A, SC88A, UDFN6, SOT553, SOT953
VCC = 1.65 V to 1.95 V
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
VCC = 4.5 V to 5.5 V
0
0
0
0
20
20
10
5
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS (MC74VHC1G126)
Symbol Parameter
Test
Conditions
VCC
(V)
TA = 25°C40°C TA 85°C55°C TA 125°C
Unit
Min Typ Max Min Max Min Max
VIH HighLevel Input
Voltage
2.0 1.5 − − 1.5 1.5 V
3.0 2.1 − − 2.1 2.1
4.5 3.15 − − 3.15 3.15
5.5 3.85 − − 3.85 3.85
VIL LowLevel Input
Voltage
2.0 0.5 0.5 0.5 V
3.0 0.9 0.9 0.9
4.5 1.35 1.35 1.35
5.5 1.65 1.65 1.65
VOH HighLevel Output
Voltage
VIN = VIH or VIL
IOH = 50 mA
IOH = 50 mA
IOH = 50 mA
IOH = 4 mA
IOH = 8 mA
2.0
3.0
4.5
3.0
4.5
1.9
2.9
4.4
2.58
3.94
2.0
3.0
4.5
1.9
2.9
4.4
2.48
3.80
1.9
2.9
4.4
2.34
3.66
V
VOL LowLevel Output
Voltage
VIN = VIH or VIL
IOL = 50 mA
IOL = 50 mA
IOL = 50 mA
IOL = 4 mA
IOL = 8 mA
2.0
3.0
4.5
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.36
0.36
0.1
0.1
0.1
0.44
0.44
0.1
0.1
0.1
0.52
0.52
V
IIN Input Leakage
Current
VIN = 5.5 V or
GND
1.65
to 5.5
±0.1* ±1.0 $1.0 mA
IOZ 3State Output
Leakage Current
VOUT = 0 V to
5.5 V
5.5 ±0.25 $2.5 $2.5 mA
IOFF Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0 1.0 10 10 mA
ICC Quiescent Supply
Current
VIN = VCC or
GND
5.5 1.0 20 40 mA
*Guaranteed by design.
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DC ELECTRICAL CHARACTERISTICS (MC74VHC1GT126)
Symbol Parameter
Test
Conditions
VCC
(V)
TA = 25°C40°C TA 85°C55°C TA 125°C
Unit
Min Typ Max Min Max Min Max
VIH HighLevel Input
Voltage
2.0 1.0 − − 1.0 1.0 V
3.0 1.4 − − 1.4 1.4
4.5 2.0 − − 2.0 2.0
5.5 2.0 − − 2.0 2.0
VIL LowLevel Input
Voltage
2.0 0.28 0.28 0.28 V
3.0 0.45 0.45 0.45
4.5 0.8 0.8 0.8
5.5 0.8 0.8 0.8
VOH HighLevel Output
Voltage
VIN = VIH or VIL
IOH = 50 mA
IOH = 50 mA
IOH = 50 mA
IOH = 4 mA
IOH = 8 mA
2.0
3.0
4.5
3.0
4.5
1.9
2.9
4.4
2.58
3.94
2.0
3.0
4.5
1.9
2.9
4.4
2.48
3.80
1.9
2.9
4.4
2.34
3.66
V
VOL LowLevel Output
Voltage
VIN = VIH or VIL
IOL = 50 mA
IOL = 50 mA
IOL = 50 mA
IOL = 4 mA
IOL = 8 mA
2.0
3.0
4.5
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.36
0.36
0.1
0.1
0.1
0.44
0.44
0.1
0.1
0.1
0.52
0.52
V
IIN Input Leakage Cur-
rent
VIN = 5.5 V or
GND
1.65
to 5.5
±0.1* ±1.0 $1.0 mA
IOZ 3State Output
Leakage Current
VOUT = 0 V to
5.5 V
5.5 ±0.25 $2.5 $2.5 mA
IOFF Power Off Leakage
Current
VIN = 5.5 V or
VOUT = 5.5 V
0 1.0 10 10 mA
ICC Quiescent Supply
Current
VIN = VCC or
GND
5.5 1.0 20 40 mA
ICCT Increase in Quies-
cent Supply Current
per Input Pin
One Input: VIN
= 3.4 V; Other
Input at VCC or
GND
5.5 1.35 1.5 1.65 mA
*Guaranteed by design.
Outpm En Txme‘ 6E Outpm D. Txme‘ 6E PD
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AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Symbol Parameter Conditions VCC (V)
TA = 25°C40°C TA 85°C55°C TA 125°C
Unit
Min Typ Max Min Max Min Max
tPLH,
tPHL
Propagation Delay,
A to Y
(Figures 3 and 4)
CL = 15 pF 3.0 to 3.6 4.5 8.0 9.5 12.0 ns
CL = 50 pF 6.4 11.5 13.0 16.0
CL = 15 pF 4.5 to 5.5 3.5 5.5 6.5 8.5
CL = 50 pF 4.5 7.5 8.5 10.5
tPZL,
tPZH
Output Enable
Time, OE to Y
(Figures 3 and 4)
CL = 15 pF 3.0 to 3.6 4.5 8.0 9.5 11.5 ns
CL = 50 pF 6.4 11.5 13.0 15.0
CL = 15 pF 4.5 to 5.5 3.5 5.1 6.0 8.5
CL = 50 pF 4.5 7.1 8.0 10.5
tPLZ,
tPHZ
Output Disable
Time, OE to Y
(Figures 3 and 4)
CL = 15 pF 3.0 to 3.6 6.5 9.7 11.5 14.5 ns
CL = 50 pF 8.0 13.2 15.0 18.0
CL = 15 pF 4.5 to 5.5 4.8 6.8 8.0 10.0
CL = 50 pF 7.0 8.8 10.0 12.0
CIN Input Capacitance 4.0 10 10 10 pF
COUT Output Capacitance Output in
High
Impedance
State
6.0 − − − − pF
CPD Power Dissipation Capacitance (Note 5)
Typical @ 25°C, VCC = 5.0 V
pF
8.0
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the noload dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
DUT ? I cL mcludes probe and pg capamla RT Is 20m of pulse generator uyp. f: 1 MHz Figure a. Test Circu
MC74VHC1G126, MC74VHC1GT126
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Figure 3. Test Circuit
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
CL*
RL
OUTPUT
RT
VCC
DUT
GND
OPEN Test Switch
Position
CL, pF RL, W
tPLH / tPHL Open See AC Characteristics Table X
tPLZ / tPZL VCC 1 k
tPHZ / tPZH GND 1 k
X = Don’t Care
tr = 3 ns
tPZH tPHZ
tPZL tPLZ
Vmo
Vmo
Vmi
Figure 4. Switching Waveforms
90%
10%
90%
10%
INPUT
OUTPUT
OUTPUT
~0 V
INPUT
OUTPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
VOH
VOL
Vmo
Vmo
Vmi
tPHL tPLH
tPLH tPHL
Vmo
Vmo
Vmi Vmi
VCC
GND
VOL
VOH
VOH VY
VOL + VY
~VCC
VCC, V Vmi, V
Vmo, V
VY
, V
tPLH, tPHL tPZL, tPLZ, tPZH, tPHZ
3.0 to 3.6 VCC/2 (VOH VOL)/2 VCC/2 0.3
4.5 to 5.5 VCC/2 (VOH VOL)/2 VCC/2 0.3
Direction of Feed nse
MC74VHC1G126, MC74VHC1GT126
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ORDERING INFORMATION
Device Packages Specific Device Code
Pin 1 Orientation
(See below) Shipping
M74VHC1G126DFT1G SC88A W2 Q2 3000 / Tape & Reel
M74VHC1G126DFT2G SC88A W2 Q4 3000 / Tape & Reel
NLVVHC1G126DFT1G* SC88A W2 Q2 3000 / Tape & Reel
NLVVHC1G126DFT2G* SC88A W2 Q4 3000 / Tape & Reel
M74VHC1GT126DF1G SC88A W3 Q2 3000 / Tape & Reel
M74VHC1GT126DF2G SC88A W3 Q4 3000 / Tape & Reel
NLVVHC1GT126DF2G* SC88A W3 Q4 3000 / Tape & Reel
NLVVHC1GT126DF1G* SC88A W3 Q2 3000 / Tape & Reel
MC74VHC1G126DBVT1G
(In Development)
SC74A TBD Q4 3000 / Tape & Reel
MC74VHC1GT126DBVT1G
(In Development)
SC74A TBD Q4 3000 / Tape & Reel
M74VHC1G126DTT1G TSOP5 W2 Q4 3000 / Tape & Reel
M74VHC1GT126DT1G TSOP5 W3 Q4 3000 / Tape & Reel
NLVVHC1GT126DT1G* TSOP5 W3R Q4 3000 / Tape & Reel
MC74VHC1G126XV5T2G
(In Development)
SOT553 TBD Q4 3000 / Tape & Reel
MC74VHC1GT126XV5T2G
(In Development)
SOT553 TBD Q4 3000 / Tape & Reel
MC74VHC1G126P5T5G
(In Development)
SOT953 TBD Q2 4000 / Tape & Reel
MC74VHC1GT126P5T5G
(In Development)
SOT953 TBD Q2 4000 / Tape & Reel
MC74VHC1G126MU1TCG
(In Development)
UDFN6, 1.45 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel
MC74VHC1GT126MU1TCG
(In Development)
UDFN6, 1.45 x 1.0, 0.5P TBD Q4 3000 / Tape & Reel
MC74VHC1G126MU3TCG
(In Development)
UDFN6, 1.0 x 1.0, 0.35 TBD Q4 3000 / Tape & Reel
MC74VHC1GT126MU3TCG
(In Development)
UDFN6, 1.0 x 1.0, 0.35 TBD Q4 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ100 Qualified and PPAP
Capable.
Pin 1 Orientation in Tape and Reel
i—Te
MC74VHC1G126, MC74VHC1GT126
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PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A01 OBSOLETE. NEW STANDARD
419A02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
B
SC88A (SC705/SOT353)
CASE 419A02
ISSUE L
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT*
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
% MD TOP VIEW A @i i u m T “ SIDE VIEW Wl-III 52mg; mi'fi www.cnsemi.com
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10
PACKAGE DIMENSIONS
SC74A
CASE 318BQ
ISSUE B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
\wr— gimg 3% 4 i i@ lfigfi TE T J + 1,9 0.95 ‘0" o q nnnnnn in“ age
MC74VHC1G126, MC74VHC1GT126
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PACKAGE DIMENSIONS
TSOP5
CASE 48302
ISSUE M
0.7
0.028
1.0
0.039
ǒmm
inchesǓ
SCALE 10:1
0.95
0.037
2.4
0.094
1.9
0.074
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
DIM MIN MAX
MILLIMETERS
A
B
C0.90 1.10
D0.25 0.50
G0.95 BSC
H0.01 0.10
J0.10 0.26
K0.20 0.60
M0 10
S2.50 3.00
123
54 S
A
G
B
D
H
C
J
__
0.20
5X
CAB
T0.10
2X
2X T0.20
NOTE 5
CSEATING
PLANE
0.05
K
M
DETAIL Z
DETAIL Z
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
mches ,,,+ 7""? p A \ \ \ 7774, if ”,in7 \i\ i\ ‘ifi‘fl T r www.cnsemi.com
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PACKAGE DIMENSIONS
SOT553, 5 LEAD
CASE 463B
ISSUE C
1.35
0.0531
0.5
0.0197
ǒmm
inchesǓ
SCALE 20:1
0.5
0.0197
1.0
0.0394
0.45
0.0177
0.3
0.0118
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
eM
0.08 (0.003) X
b5 PL
A
c
X
Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
D
E
Y
12 3
45
L
HEDIM
A
MIN NOM MAX MIN
MILLIMETERS
0.50 0.55 0.60 0.020
INCHES
b0.17 0.22 0.27 0.007
c
D1.55 1.60 1.65 0.061
E1.15 1.20 1.25 0.045
e0.50 BSC
L0.10 0.20 0.30 0.004
0.022 0.024
0.009 0.011
0.063 0.065
0.047 0.049
0.008 0.012
NOM MAX
1.55 1.60 1.65 0.061 0.063 0.065
HE
0.08 0.13 0.18 0.003 0.005 0.007
0.020 BSC
j ‘k 4 L A «BM l‘l‘V—I u www.cnsemi.com
MC74VHC1G126, MC74VHC1GT126
www.onsemi.com
13
PACKAGE DIMENSIONS
SOT953
CASE 527AE
ISSUE E
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
D
C
A
HE
123
45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM MIN NOM MAX
MILLIMETERS
A0.34 0.37 0.40
b0.10 0.15 0.20
C0.07 0.12 0.17
D0.95 1.00 1.05
E0.75 0.80 0.85
e0.35 BSC
L
0.95 1.00 1.05
HE
X
Y
PIN ONE
INDICATOR
b
5X
X0.08 Y
L
5X
L3
L2
e
5X
5X
L2 0.05 0.10 0.15
L3 −−− −−− 0.15
0.175 REF
TOP VIEW
SIDE VIEW
BOTTOM VIEW 1.20
DIMENSIONS: MILLIMETERS
0.20
5X
1
PACKAGE
OUTLINE
0.35
PITCH
0.35
5X
EEK) {é E E r) BOTTOM VIEW
MC74VHC1G126, MC74VHC1GT126
www.onsemi.com
14
PACKAGE DIMENSIONS
UDFN6, 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L6X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10 C
6X
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
13
46
DIM MIN MAX
MILLIMETERS
A0.45 0.55
A1 0.00 0.05
b0.20 0.30
D1.45 BSC
E1.00 BSC
e0.50 BSC
L0.30 0.40
L1 −−− 0.15
DIMENSIONS: MILLIMETERS
0.30
6X
1.24
0.53
PITCH
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTIONS
A2 0.07 REF
6X
A2
DETAIL B
DETAIL A
1D W0 \ El: ”M 3‘23 ’32“ W LI_U sED Cu ¢ ‘3ng ALTERNA‘IE Q 1105 c V + J: ¢ cousmumou A1 52mm; mm: uzu um Emma‘s» u. U26 as: SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT“ EX L 5X 5X 0.25 ‘1 r“ 052 1] ‘ [:5 r 7 7 1.20 mas/+4] ‘EQ ‘ ‘ 4 F035 PITCH DIMENSION M‘LUMETERS {9 OO "01:: BOTTOM VIEW 'Fer addmonal mmrmamn on our Pb-Free s1ra1egy and so‘denng delafls‘ p‘ease download me ON Semiconduclov Somering and Meummg Techmques Reference Manual, SOLDEHRM/D. u a e Mama“ at Semnam Campunems In wwmm cumysueygumem WW gm
MC74VHC1G126, MC74VHC1GT126
www.onsemi.com
15
PACKAGE DIMENSIONS
UDFN6, 1x1, 0.35P
CASE 517BX
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
6X
6X
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIMENSION: MILLIMETERS
RECOMMENDED
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTION
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
0.52
1.20
0.25
0.35
PITCH
PACKAGE
OUTLINE 1
DIM MIN MAX
MILLIMETERS
A0.50 0.65
A1 0.00 0.05
A3 0.13 REF
b0.17 0.23
D1.00 BSC
E1.00 BSC
e0.35
L0.20 0.40
L1 −−− 0.15
L3
L3 0.26 0.33
A B
E
D
BOTTOM VIEW
b
e
6X
L6X
NOTE 3
0.08 C
PIN ONE
REFERENCE
TOP VIEW
0.08 C
A
A1
0.05 C
0.05 C
CSEATING
PLANE
SIDE VIEW
13
46
2X
2X
A3
DETAIL B
A
M
0.07 BC
M
0.05 C
DETAIL A
MC74VHC1G126/D
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